Patent application number | Description | Published |
20090050202 | SOLAR CELL AND METHOD FOR FORMING THE SAME - The invention is directed to a solar cell. The solar cell comprises a silicon layer, a front side electrode and a back side electrode. The silicon layer has a first surface and a second surface. The front side electrode is located on the first surface of the silicon layer. The back side electrode is located on the second surface of the silicon layer. Further, the back side electrode comprises a passivation layer, a first conductive layer and a second conductive layer. The passivation layer is located on the second surface of the silicon layer and has a plurality of holes penetrating through the passivation layer. The first conductive layer is located on the passivation layer and is electrically connected to the silicon layer through the holes. The second conductive layer is located on the first conductive layer. | 02-26-2009 |
20090165855 | PASSIVATION LAYER STRUCTURE OF SOLAR CELL AND FABRICATING METHOD THEREOF - A passivation layer structure of a solar cell, disposed on a substrate, is provided. The passivation layer structure has a first passivation layer and a second passivation layer. The first passivation layer is disposed on the substrate. The second passivation layer is disposed between the substrate and the first passivation layer, and the material of the second passivation layer is an oxide of the material of the substrate. Since the second passivation layer is disposed between the substrate and the first passivation layer, the surface passivation effect and carrier lifetime of a photoelectric device are enhanced, and a photoelectric conversion efficiency of the solar cell is increased as well. | 07-02-2009 |
20090308446 | BACKSIDE ELECTRODE LAYER AND FABRICATING METHOD THEREOF - A backside electrode layer and a fabricating method thereof are applicable for fabricating a solar cell. The backside electrode layer includes a first electrode layer and a second electrode layer. The first electrode layer is formed on a substrate and has a thickness smaller than 15 μm. The second electrode layer having patterns is formed on the first electrode layer. The first and second electrode layers are fabricated by a cofiring process. As the thickness of the first electrode layer is decreased and the second electrode layer is not a full coverage layer, the material usage of each electrode layer is reduced and the fabrication cost thereof is leveled down. Besides, a thinner electrode layer may avoid warp after the cofiring process. | 12-17-2009 |
20090311821 | Method for producing silicon substrate for solar cells - A method for producing a silicon substrate for solar cells is provided. The method includes performing a saw damage removal (SDR) and surface macro-texturing on a silicon substrate with acids solution, so that a surface of the silicon substrate becomes an irregular surface. Thereafter, a metal-activated selective oxidation is performed on the irregular surface with an aqueous solution containing an oxidant and a metal salt, in which the oxidant is one selected from persulfate ion, permanganate ion, bichromate ion, and a mixture thereof. Afterwards, the irregular surface is etched with an aqueous solution containing HF and H | 12-17-2009 |
20100252106 | ANTI-REFLECTIVE AND LIGHT-TRAPPING SOLAR MODULE PACKAGE STRUCTURE - A variety of solar module package structures is obtained by disposing an optical sheet on the top surface of the solar module and/or between the glass plate and the solar cell. Through the optical sheet with surface configurations, anti-reflection and light trapping capability of the solar module package structure is improved and the power output is increased. | 10-07-2010 |
20110143484 | Method of fabricating solar cell - A method of fabricating a solar cell is provided. A saw damage removal process is performed on a silicon substrate. A dry surface treatment is performed to a surface of the silicon substrate on form an irregular surface. A metal-activated selective oxidation is performed to the irregular surface. By using an aqueous solution, the irregular surface is etched to form a nanotexturized surface of the silicon substrate. A dopant diffusion process is performed on the silicon substrate to form a P-N junction. An anti-reflection layer is formed on the silicon substrate. An electrode is formed on the silicon substrate. | 06-16-2011 |
20120138119 | PACKAGE STRUCTURE OF SOLAR PHOTOVOLTAIC MODULE AND METHOD OF MANUFACTURING THE SAME - A package structure of solar photovoltaic module and method of manufacturing the same are provided. The package structure of solar photovoltaic module includes a transparent substrate, a backsheet disposed opposite to the transparent substrate, a plurality of solar cells between the transparent substrate and the backsheet, and several encapsulants sandwiched in between the transparent substrate and the backsheet, wherein the encapsulants encapsulate the solar cells. There is at least one embossing interface between the encapsulants, and the encapsulant having the embossing interface is a thermosetting material. | 06-07-2012 |