Patent application number | Description | Published |
20090049685 | METHODS FOR INSERTION AND RETRACTION OF A CONNECTOR - Methods for inserting and/or removing a connector with a remote connector agent are disclosed. Embodiments may include inserting a connector into a remote connector agent to form a remote connector system and pushing the remote connector into a header of a board to insert the connector into the header. Embodiments may also include pulling the remote connector system to retract the remote connector from the header. In some embodiments, inserting the connector into the remote connector agent further comprises pushing back one or more insertion snap pushers to allow insertion of the connector. In some embodiments, pulling the remote connector system further comprises releasing a snap of the connector with a snap release actuator before retracting the remote connector system from the header. | 02-26-2009 |
20090080165 | Mechanically-Assisted Insertion and Removal of Modular Device - A modular electronic system including a mechanism for releasably securing a modular device within a chassis, and for facilitating insertion and removal of the modular device. One embodiment provides a modular device that includes a handle secured to opposing pivotable lever arms. A follower pin secured to one end of the lever arms rides in a slot defined by the chassis. The slot is arranged so that pulling upward on the handle moves the follower pin in one direction along the slot to urge the modular device in a direction further into the device bay, and pushing downward on the handle urges the modular device in a direction out of the device bay, thereby providing a mechanical advantage to the user. When the modular device is fully inserted, retractable locking members provided on the modular device move into windows provided on the chassis, to releasably lock the modular device in the device bay. A module release mechanism includes a release plate that moves into engagement with a sloped or ramped surface of the locking members in response to squeezing the handle. Engagement of the release plate with the ramped surface moves the locking members inward and out of the windows on the chassis, to unlock the modular device from the device bay. | 03-26-2009 |
20100308189 | Latching System for Multiple Nodes of a Computer System - A method and system to support simultaneous unlatching from a rack of two or more adjacently mounted and vertically aligned hardware components. One interface bracket is secured to one vertical rail of the rack, and a second interface bracket is secured to a second vertical rail of the rack on an opposite side of the rack. A set of latches are provided in communication with each interface bracket, with the number of latches corresponding to the number of hardware components in communication with the interface bracket. Actuation of one of the latches releases fastening of at least one hardware components from the rack, and accommodates removal of the release component from the rack. | 12-09-2010 |
20110225819 | PROCESSOR INSTALLATION AND REMOVAL TOOL - A tool according to one embodiment includes an actuating mechanism including a cam plate; at least one gripper member operatively coupled to the cam plate; and a carriage for supporting the at least one gripper member, wherein the at least one gripper member is actuatable by the cam plate, wherein rotation of the cam plate causes the at least one gripper member to move between a first position and a second position, wherein when the at least one gripper member is in the first position, the tool is able to accept a processor for holding thereof, and wherein when the at least one gripper member is in the second position, the tool securely holds the processor therein. Additional systems and methods are also presented. | 09-22-2011 |
20130120926 | USER-SERVICEABLE LIQUID DIMM COOLING SYSTEM - A cooling system for a memory module comprises a heat conduction assembly for conducting heat from the memory module to liquid-cooled mounting blocks. In one embodiment, each heat conduction assembly includes a frame having opposing first and second supports, first and second heat spreader plates each extending from the first support to the second support, and a pair of flattened heat pipes each extending along a respective one of the heat spreader plates from the first support to the second support. The liquid-cooled mounting blocks releasably support the heat conduction assembly over a memory module socket with the memory module between the heat spreader plates. | 05-16-2013 |
20130135812 | LIQUID-COOLING MEMORY MODULES WITH LIQUID FLOW PIPES BETWEEN MEMORY MODULE SOCKETS - A liquid-cooled computer memory system includes first and second blocks in fluid communication with a chilled liquid source. A plurality of spaced-apart heat transfer pipes extend along a system board between memory module sockets from the first manifold block to the second manifold block. The heat transfer pipes may be liquid flow pipes circulating the chilled liquid between the memory module sockets. Alternatively, the heat transfer pipes may be closed heat pipes that conduct heat from the memory modules to the liquid-cooled blocks. A separate heat spreader is provided to thermally bridge each memory module to the adjacent heat transfer pipes. | 05-30-2013 |