Shih-Hsiung
Shih-Hsiung Chen, Yongkand City TW
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20100320626 | ENERGY-SAVING AND WIND-POWERED AERATOR - An energy-saving and wind-powered aerator includes a floating carrier ( | 12-23-2010 |
Shih-Hsiung Chen, Tainan City TW
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20140353973 | POWER GENERATION APPARATUS USING WAVE ENERGY CONVERSION BY GRAVITY - A power generation apparatus ( | 12-04-2014 |
20140353974 | POWER GENERATING DEVICE UTILIZING OSCILLATING WATER FOR CONVERTING INTO WAVE POWER - A power generating device utilizing oscillating water for converting into wave power ( | 12-04-2014 |
Shih-Hsiung Hsieh, Yilan County TW
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20150144473 | BUTTON STRUCTURE FOR ELECTRONIC DEVICE - A button structure is provided for installing to a casing of an electronic device having a button opening. The button structure is flexible and comprises an engaging portion, a button portion, a first alignment portion, a second alignment portion and a hollow sleeve. The engaging portion is disposed at a fixing end of the button structure. The button structure is connected to the inward side of the casing through the engaging portion. The button portion is disposed at a free end of the button structure for aligning with the button opening of the casing. The button portion has a light guiding portion for neighboring to a light emitting diode. The first alignment portion and the second alignment portion are mounted on a first protrusion portion and a second protrusion portion of the casing respectively. The hollow sleeve is disposed axially movably to the fixing sleeve of the casing. | 05-28-2015 |
20150145675 | PROGRAMMABLE WIRELESS ALARM DEVICE AND THE ALARM SYSTEM HAVING THE SAME - The present disclosure provides a programmable wireless alarm device comprising a detecting and input unit, a central processing unit, an output unit, an indicating unit and a wireless transmission unit. The central processing unit receives a detecting signal and an input signal from the detecting and input unit, and generates an alarm signal according to at least one of the detecting signal, the input signal and a control signal. The output unit receives the alarm signal. The indicating unit generates an indicating signal corresponding to the alarm signal according to the driving signal of the output unit. The wireless transmission unit has an UART interface for receiving the control signal which is used for redefining the indicating signal corresponding to the alarm signal by the central processing unit. Accordingly, the programmable wireless alarm device has more flexible functions, and the design and manufacturing cost could be saved. | 05-28-2015 |
Shih-Hsiung Hsu, Tu-Cheng TW
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20090102637 | SYSTEM AND METHOD FOR MANAGING AGENDAS IN A MOBILE DEVICE - A system for managing agendas in a mobile device including a GPS is provided. The system includes various software modules to remind a user about agendas when all alarm conditions of the agendas have been satisfied. The alarm conditions of the agenda include an alarm active vicinity and an alarm active time period. | 04-23-2009 |
Shih-Hsiung Hsu, New Taipei City TW
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20140114368 | DEVICE FOR BONE FIXATION - A device for bone fixation is comprised of an expansion part and a covering part. The expansion part has a fixing end and a top end and provides an expandable structure for being adjusted in a state of expansion or contraction. The covering part has a front end and a joining end, wherein the front end thereof is joined to the top end of the expansion part, and the joining end thereof is attached to the fixing end of the expansion part. The covering part is employed to cover the expandable structure. After the expansion part and the covering part being added to the bone, the covering part is unfurled to spread to the expansion state, and the medical filler is stuffed or poured into the covering part. | 04-24-2014 |
Shih-Hsiung Huang, Hsin-Chu TW
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20130033440 | AUTOSTEREOSCOPIC DISPLAY DEVICE HAVING TOUCH SENSING MECHANISM AND DRIVING METHOD THEREOF - An autostereoscopic display device having touch sensing mechanism includes a display panel for illustrating images, a touch sensing panel for detecting touch events, a 2D/3D switching panel disposed between the display panel and the touch sensing panel, and a control unit. The 2D/3D switching panel has a substrate, a first electrode disposed on the substrate, a counter substrate, and a second electrode disposed on the counter substrate. The control unit is employed to provide a first control signal and a second control signal furnished to the first electrode and the second electrode respectively. The first control signal is switched between a first high voltage and a first low voltage in a gradual-shift manner. The second control signal is switched between a second high voltage and a second low voltage in a gradual-shift or rapid-shift manner. | 02-07-2013 |
Shih-Hsiung Huang, Taichung City TW
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20130294797 | DEVELOPER SUPPLY CONTAINER - A developer supply container includes a cover plate mounted on an outer surface of a container body and provided with an opening corresponding to a developer supply port of the container body, which is sealed by a seal tape. The seal tape has a folded section extending through a gap between the container body and the cover plate and a through hole of the cover plate such that an end portion of the seal tape is exposed. A seal piece is mounted on an outer surface of the cover plate. On the outer surface of the container body a door member is slidably mounted. The developer supply container can prevent developer from leak out and has a good manufacturing yield rate. | 11-07-2013 |
20140041476 | DRIVING GEAR PHOTOSENSITIVE DRUM - A driving gear includes a shell for fixed connection with a photosensitive roller, a coupling member detachably mounted inside the shell, and a driving member for being driven by a driving shaft located inside a printer. The shell includes two convexities and a rib for engaging two hook pieces and a fitting slot of the coupling member respectively. The coupling member includes a tunnel and a limiting portion located inside the tunnel. The driving member includes a first end portion located between the limiting portion and a bottom portion of the shell, a second end portion extending out of the coupling member, and a protrusion protruding from the first end portion and located in a limiting slot of the coupling member. Therefore, it will be not difficult for the user to install or detach the driving gear to or from the photosensitive roller. | 02-13-2014 |
Shih-Hsiung Lee, Taipei Hsien TW
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20150156237 | Video Streaming System, Computer Device, and Video Streaming Method - A video streaming system includes a mobile device and a computer device. The mobile device includes a camera module, a mobile network module, and a client module. The camera module captures the video data. The client module is electrically connected the camera module and the mobile network module, controls the operation of the camera module, compresses the video data into the streaming data, and transmits the streaming data through the mobile network module. The computer device includes a computer network module and a virtual device. The computer network module is connected to the mobile network module. The virtual device is electrically connected to the computer network module. When the computer network module network is connected to the mobile network module through the network, the computer network module receives the streaming data transmitted by the client module and decompresses the streaming data to restore the video data. | 06-04-2015 |
Shih-Hsiung Lin, Hsin-Chu TW
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20080211105 | Method of assembling chips - A method of assembling chips. A first chip and a second chip are provided. At least one conductive pillar is formed on the first chip, and a conductive connecting material is formed on the conductive pillar. The second chip also comprises at least one conductive pillar. The first chip is connected to the second chip via the conductive pillars and the conductive connecting material. | 09-04-2008 |
20080227237 | Method of assembling chips - A method of assembling chips. A first chip and a second chip are provided. At least one conductive pillar is formed on the first chip, and a conductive connecting material is formed on the conductive pillar. The second chip also comprises at least one conductive pillar. The first chip is connected to the second chip via the conductive pillars and the conductive connecting material. | 09-18-2008 |
20080241992 | Method of assembling chips - A method of assembling chips. A first chip and a second chip are provided. At least one conductive pillar is formed on the first chip, and a conductive connecting material is formed on the conductive pillar. The second chip also comprises at least one conductive pillar. The first chip is connected to the second chip via the conductive pillars and the conductive connecting material. | 10-02-2008 |
20110215476 | METHOD FOR FABRICATING CIRCUIT COMPONENT - A cylindrical bonding structure and its method of manufacture. The cylindrical bonding structure is formed over the bonding pad of a silicon chip and the chip is flipped over to connect with a substrate board in the process of forming a flip-chip package. The cylindrical bonding structure mainly includes a conductive pillar and a solder cap. The conductive pillar is formed over the bonding pad of the silicon chip and the solder cap is attached to the upper end of the conductive pillar. The solder cap has a melting point lower than the conductive pillar. The solder cap can be configured into a cylindrical, spherical or hemispherical shape. To fabricate the cylindrical bonding structure, a patterned mask layer having a plurality of openings that correspond in position to the bonding pads on the wafer is formed over a silicon wafer. Conductive material is deposited into the openings to form conductive pillars and finally a solder cap is attached to the end of each conductive pillar. | 09-08-2011 |
20110291275 | METHOD OF ASSEMBLING CHIPS - A method of assembling chips. A first chip and a second chip are provided. At least one conductive pillar is formed on the first chip, and a conductive connecting material is formed on the conductive pillar. The second chip also comprises at least one conductive pillar. The first chip is connected to the second chip via the conductive pillars and the conductive connecting material. | 12-01-2011 |
Shih-Hsiung Lin, Hsinchu TW
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20080296761 | Cylindrical Bonding Structure and method of manufacture - A cylindrical bonding structure and its method of manufacture. The cylindrical bonding structure is formed over the bonding pad of a silicon chip and the chip is flipped over to connect with a substrate board in the process of forming a flip-chip package. The cylindrical bonding structure mainly includes a conductive cylinder and a solder block. The conductive cylinder is formed over the bonding pad of the silicon chip and the solder block is attached to the upper end of the conductive cylinder. The solder block has a melting point lower than the conductive cylinder. The solder block can be configured into a cylindrical, spherical or hemispherical shape. To fabricate the cylindrical bonding structure, a patterned mask layer having a plurality of openings that correspond in position to the bonding pads on the wafer is formed over a silicon wafer. Conductive material is deposited into the openings to form conductive cylinders and finally a solder block is attached to the end of each conductive cylinder. | 12-04-2008 |
20090057900 | Stacked Chip Package With Redistribution Lines - A chip package comprises a first chip having a first side and a second side, wherein said first chip comprises a first pad, a first trace, a second pad and a first passivation layer at said first side thereof, an opening in said first passivation layer exposing said first pad, said first trace being over said first passivation layer, said first trace connecting said first pad to said second pad; a second chip having a first side and a second side, wherein said second chip comprises a first pad at said first side thereof, wherein said second side of said second chip is joined with said second side of side first chip; a substrate joined with said first side of said first chip or with said first side of said second chip; a first wirebonding wire connecting said second pad of said first chip and said substrate; and a second wirebonding wire connecting said first pad of said second chip and said substrate. | 03-05-2009 |
20090121302 | Chip Package - A chip package includes a bump connecting said semiconductor chip and said circuitry component, wherein the semiconductor chip has a photosensitive area used to sense light. The chip package may include a ring-shaped protrusion connecting a transparent substrate and the semiconductor chip. | 05-14-2009 |
20110241183 | STACKED CHIP PACKAGE WITH REDISTRIBUTION LINES - A chip package comprises a first chip having a first side and a second side, wherein said first chip comprises a first pad, a first trace, a second pad and a first passivation layer at said first side thereof, an opening in said first passivation layer exposing said first pad, said first trace being over said first passivation layer, said first trace connecting said first pad to said second pad; a second chip having a first side and a second side, wherein said second chip comprises a first pad at said first side thereof, wherein said second side of said second chip is joined with said second side of side first chip; a substrate joined with said first side of said first chip or with said first side of said second chip; a first wirebonding wire connecting said second pad of said first chip and said substrate; and a second wirebonding wire connecting said first pad of said second chip and said substrate. | 10-06-2011 |
20120007237 | CHIP PACKAGE - A chip package includes a bump connecting said semiconductor chip and said circuitry component, wherein the semiconductor chip has a photosensitive area used to sense light. The chip package may include a ring-shaped protrusion connecting a transparent substrate and the semiconductor chip. | 01-12-2012 |
Shih-Hsiung Lin, Hsinchu City TW
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20120026102 | ELECTRONIC APPARATUS AND METHOD OF FABRICATING THE SAME - A method of fabricating an electronic apparatus having an active region and a peripheral region surrounding the active region is described. A first main device and a second main device are provided. An optical clear liquid adhesive (OCLA) is applied between the first main device and the second main device and within the active region. A photo-mask having a transparent region and an opaque region is provided above the second main device, and the transparent region corresponds to the peripheral region. An OCLA diffusion process is performed such that the OCLA diffuses from the active region to the peripheral region. During the OCLA diffusion process, a first irradiating process with the photo-mask is performed, such that the OCLA diffusing to the peripheral region is partially cured. After removing the photo-mask, a second irradiating process is performed, such that the OCLA is completely cured. | 02-02-2012 |
20140104513 | ELECTRONIC APPARATUS - A method of fabricating an electronic apparatus having an active region and a peripheral region surrounding the active region is described. A first main device and a second main device are provided. An optical clear liquid adhesive (OCLA) is applied between the first main device and the second main device and within the active region. A photo-mask having a transparent region and an opaque region is provided above the second main device, and the transparent region corresponds to the peripheral region. An OCLA diffusion process is performed such that the OCLA diffuses from the active region to the peripheral region. During the OCLA diffusion process, a first irradiating process with the photo-mask is performed, such that the OCLA diffusing to the peripheral region is partially cured. After removing the photo-mask, a second irradiating process is performed, such that the OCLA is completely cured. | 04-17-2014 |
Shih-Hsiung Wu, Chu-Nan TW
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20150306841 | DISPLAY PANEL - A display panel is provided. The display panel comprises a first substrate, a second substrate and a sealant. The first substrate has a display area. The second substrate is opposite to the first substrate. The sealant is disposed between the first substrate and the second substrate, and surrounds and encloses the display area. The sealant comprises a plurality of node portions and a plurality of strip portions. The maximum width of the node portion is larger than the width of the strip portion. The node portions include a first node portion. The first node portion and two strip portions adjacent thereto form a first angle facing the display area. The first angle is larger than 90 degree. | 10-29-2015 |
Shih-Hsiung Wu, Taipei TW
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20090298945 | Aqueous Extracts from Monocotyledon Plants and Their Use in Cardioprotection - Method of treating hypertension with a trans-aconitic acid containing composition (e.g., a water extract derived from a monocotyledon plant). | 12-03-2009 |
20090305023 | Preparation of Porous Carbon Materials Using Agricultural Wastes - A method of preparing porous carbon materials using agriculture wastes derived from plants. | 12-10-2009 |
20150284355 | USE OF POLYENYLPYRROLE DERIVATIVES FOR TREATING INFLAMMATION - The preset invention relates to a method for treating inflammation comprising administering a subject in need thereof with a therapeutically effective amount of polyenylpyrrole derivatives of formula (I) or a pharmaceutically acceptable salt thereof. | 10-08-2015 |