Yasushi Takahashi
Yasushi Takahashi, Iwate JP
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20090122422 | WIDE-ANGLE LENS AND IMAGE CAPTURING APPARATUS - A wide-angle lens is disclosed that includes a front lens group and a rear lens group that are arranged in order from an object side to an image side with an aperture being arranged between the front lens group and the rear lens group. The front lens group includes at least two lenses arranged toward the object side that have positive powers, and at least one lens arranged toward the image side that has a negative positive power. One of the lenses of the front lens group arranged second in order from the object side has a lens face that is arranged into an aspheric surface. The front lens group, the aperture, and the rear lens group make up an image forming system having an angle of view greater than 180 degrees. | 05-14-2009 |
Yasushi Takahashi, Takasaki JP
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20080211082 | Semiconductor device and a method of manufacturing the same - A semiconductor device and method having high output and having reduced external resistance is reduced and improved radiating performance. A MOSFET ( | 09-04-2008 |
Yasushi Takahashi, Amagasaki-Shi Hyogo JP
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20090084200 | EXHAUST GAS DILUTION DEVICE - An exhaust gas dilution device | 04-02-2009 |
Yasushi Takahashi, Takasaki-Shi JP
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20110298020 | SEMICONDUCTOR DEVICE - A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body containing a second precious metal. | 12-08-2011 |
Yasushi Takahashi, Nishiyokote-Machi JP
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20120217556 | SEMICONDUCTOR DEVICE - A semiconductor device featuring a semiconductor chip having a first main surface and a second, opposing main surface and including a MOSFET having source and gate electrodes formed on the first main surface and a drain electrode thereof formed on the second main surface, first and second conductive members acting as lead terminals for the source and gate electrodes, respectively, are disposed over the first main surface, each of the first and second conductive members has a part overlapped with the chip in a plan view, a sealing body sealing the chip and parts of the first and second conductive members such that a part of the first conductive member is projected outwardly from a first side surface of the sealing body and parts of the first and second conductive members are projected outwardly from the opposing second side surface of the sealing body in a plan view. | 08-30-2012 |
Yasushi Takahashi, Kyoto-Shi JP
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20120266687 | EXHAUST GAS SAMPLING DEVICE - An engine gas sample device which can set a dilution rate of a sample gas without being restricted by warranty flow ranges of first and second flowmeters. The device makes it possible to dilute the sample gas at a low dilution rate, and is provided with a downstream-side dilution tunnel in which a part of exhaust gas flowing through an exhaust pipe is introduced as sample gas into a mixing part. A dilution gas flow path which is connected to an upstream side of the downstream-side dilution tunnel and includes the first flowmeter FM | 10-25-2012 |
Yasushi Takahashi, Niigata JP
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20130027903 | POINTER-TYPE METER - Disclosed is a pointer-type meter with good uniformity of illumination of a display section even when there are few light sources, and with little or no displacement of each member when positioning is performed. A circuit board provided in the pointer-type meter comprises a first light-emitting element ( | 01-31-2013 |
Yasushi Takahashi, Kanagawa JP
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20130228907 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - Conventional surface roughening plating technology cannot always improve the adhesion between a leadframe and a plating film and it depends on the material used for surface roughening plating. Conventional surface roughening technology by etching can only be used for leadframes made of limited materials. Improved adhesion cannot therefore be achieved between a metal member such as leadframe and a sealing resin. | 09-05-2013 |
20140084436 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - To enhance the reliability of connection between a semiconductor chip and a metal plate by ensuring sufficiently the thickness of a conductive material interposed between the semiconductor chip and the metal plate. A lead frame is arranged over a jig and a clip frame is arranged over protruding portions provided on the jig. In this state, a heating process (reflow) is performed. In this case, high melting point solders filling first spaces are melted in a state in which the first space is formed between a High-MOS chip and a High-MOS clip and the first space is formed between a Low-MOS chip and a Low-MOS clip. At this time, even when the high melting point solder is melted in the first space, the size (in particular, the height) of the first space does not change and the first space is maintained. | 03-27-2014 |
Yasushi Takahashi, Takasaki-Chi JP
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20130264696 | SEMICONDUCTOR DEVICE - A semiconductor device featuring a semiconductor chip including a MOSFET and having a first main surface and a second, opposing main surface, a source electrode pad and a gate electrode pad over the first main surface, a drain electrode over the second main surface, a source external terminal and a gate external terminal, each having a first main surface electrically connected to the source electrode pad and gate electrode pad of the chip, respectively, and a drain external terminal having a first main surface and a second, opposing main surface and being electrically connected to the second main surface of the chip, each of the source, gate and drain external terminals having second main surfaces thereof in a same plane, and, in a plan view of the external terminals, the gate external terminal has a portion located between the source and drain external terminals in at least one direction. | 10-10-2013 |
Yasushi Takahashi, Sakai-Shi JP
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20140355630 | RAMAN SCATTERING PHOTOENHANCEMENT DEVICE, METHOD FOR MANUFACTURING RAMAN SCATTERING PHOTOENHANCEMENT DEVICE, AND RAMAN LASER LIGHT SOURCE USING RAMAN SCATTERING PHOTOENHANCEMENT DEVICE - A Raman scattered light enhancement device including a waveguide provided in a photonic crystal ( | 12-04-2014 |