Patent application number | Description | Published |
20100301889 | CIRCUIT BOARD UNIT AND TESTING APPARATUS - Provided is a circuit board unit for connecting a connecting terminal of a testing apparatus to a connected terminal of a device under test, including: a circuit board having, on one surface, a contact corresponding to the connected terminal; and a connector guide provided on the one surface of the circuit board, the connector guide guiding a connector having the connecting terminal to the circuit board, and pulling the connector towards the circuit board. In this circuit board unit, the connector guide may bias the connector on a side of the connecting terminal, towards the circuit board. Moreover in the circuit board unit, the circuit board may further have a substrate frame that is coupled to the connector guide and biases the connector guide towards the circuit board. | 12-02-2010 |
20120212247 | TEST APPARATUS AND TEST METHOD - Provided is a test apparatus for testing a plurality of devices under test formed on a semiconductor wafer, including: a probe card to be connected to respective contacts of the plurality of the devices under test on a connection surface to be overlapped on the semiconductor wafer, the probe card being provided with a plurality of corresponding contacts on a rear surface of the connection surface; and a test head that tests the plurality of devices under test on the semiconductor wafer by sequentially connecting to each part of the plurality of contacts of the probe card. | 08-23-2012 |
20130093453 | CONNECTING DEVICE, SEMICONDUCTOR WAFER TEST APPARATUS COMPRISING SAME, AND CONNECTING METHOD - A connecting device electrically connects a performance board which has PB terminals and a test head, and includes a sub board which is electrically connected to the test head and has sub terminals which face the PB terminals, a sealing mechanism which forms a sealed space between the sub board and the performance board, and a pressure reducing device which reduces the pressure of the sealed space. The pressure reducing device reduces the pressure of the sealed space so that the performance board and the sub board approach each other and the PB terminals and the sub terminals contact. | 04-18-2013 |
Patent application number | Description | Published |
20100147234 | OUTBOARD MOTOR - An outboard motor has an engine, an engine cover forming an engine compartment for holding the engine therein, a ventilation system with an outer outlet ventilation space through which air in the engine compartment flows to the outside of the engine compartment, and a generator. The ventilation system includes a case disposed in the engine compartment and forming an air discharge passage leading to the outer outlet ventilation space. A fan is placed in the air discharge passage to deliver air by pressure from the engine compartment to the outer outlet ventilation space. The air discharge passage has an inlet ventilation passage formed in an upper space in the engine compartment and opening upward. The engine compartment holding the engine therein can be efficiently ventilated, and ventilation air can effectively cool the engine and can effectively suppress temperature rise in the engine compartment. | 06-17-2010 |
20100147257 | OUTBOARD MOTOR - An outboard motor has an internal combustion engine, an engine cover forming an engine compartment for holding the internal combustion engine therein, and a top cover covering the engine cover from above and provided with a carrying grip. An intermediate member is placed in a space between the engine cover and the top cover. First connecting parts for connecting the engine cover and the intermediate member are arranged in a space between the engine cover and the intermediate member, and second connecting parts for connecting the top cover and the intermediate cover are arranged in a space between the top cover and the intermediate cover. The connecting parts arranged in the spaces between the engine cover and the top cover ensure rigid connection, the degree of freedom of arranging the connecting parts is increased, and the engine cover can be manufactured at low cost. | 06-17-2010 |
20100273369 | STEERING APPARATUS FOR OUTBOARD MOTOR - A steering apparatus whereby the steering load is equal even when the left and right steering angles are large when an outboard motor is steered to the left and right via a swivel shaft. A connecting hole of a steering plate is provided at a position spaced from a center line of the steering plate so that equal angles are formed by a first straight line, joining the center of the swivel shaft and the connecting hole, and a second straight line, joining the connecting hole and a link hole formed in a steering rod. | 10-28-2010 |
Patent application number | Description | Published |
20090047539 | SURFACE-TREATED ELECTRO-DEPOSITED COPPER FOIL AND METHOD FOR MANUFACTURING THE SAME - It is an object to provide a surface-treated electro-deposited copper foil which has a low profile at a level equal to or excellent than that of low-profile surface-treated electro-deposited copper foils that have conventionally been supplied to the market and in which waviness affecting the straight line performance of wiring is small, and a method for manufacturing the same. In order to achieve this object, in the surface-treated electro-deposited copper foil, the maximum waviness height (Wmax) of the bonding surface to be bonded with an insulation layer-constituting material to be 0.05 μm to 0.7 μm, the maximum peak to valley height (PV) to be 0.05 to 1.5 μm, and the surface roughness (Rzjis) to be 0.1 μm to 1.0 μm. The electro-deposited copper foil used for the manufacturing of this surface-treated electro-deposited copper foil is manufactured by using a sulfuric acid base copper electrolytic solution obtained by adding 3-mercapto-1-propanesulfonic acid or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine, and using a cathode having small surface roughness, under electrolysis conditions of carrying out continuous first-step electrolysis to n-th-step electrolysis at two or more different levels of electric current density. | 02-19-2009 |
20090166213 | PRODUCTION METHOD OF ELECTRO-DEPOSITED COPPER FOIL, ELECTRO-DEPOSITED COPPER FOIL OBTAINED BY THE PRODUCTION METHOD, SURFACE-TREATED COPPER FOIL OBTAINED BY USING THE ELECTRO-DEPOSITED COPPER FOIL AND COPPER-CLAD LAMINATE OBTAINED BY USING THE ELECTRO-DEPOSITED COPPER FOIL OR THE SURFACE-TREATED COPPER FOIL - An object of the present invention is to provide a production method which enables efficient production of an electro-deposited copper foil with further lower profile when compared to the low-profile electro-deposited copper foils which have been supplied to the market and is excellent in mechanical strength. For the purpose of achieving the object, a production method adopted obtains the electro-deposited copper foil by electrolyzing a sulfuric acid based copper electrolytic solution which contains a quaternary ammonium salt polymer having cyclic structure and chlorine, wherein for the quaternary ammonium salt polymer contained in the sulfuric acid based copper electrolytic solution, a DDAC dimer or higher polymer is used. For the quaternary ammonium salt polymer, a diallyl dimethyl ammonium chloride polymer having a number average molecular weight of 300 to 10000 is preferably used. The sulfuric acid based copper electrolytic solution preferably contains bis(3-sulfopropyl) disulfide or 3-mercapto-1-propanesulfonic acid that is a compound having a mercapto group. | 07-02-2009 |