Patent application number | Description | Published |
20090075406 | INTEGRATION MANUFACTURING PROCESS FOR MEMS DEVICE - A method for manufacturing an MEMS device is provided. The method includes steps of a) providing a first substrate having a concavity located thereon, b) providing a second substrate having a connecting area and an actuating area respectively located thereon, c) forming plural microstructures in the actuating area, d) mounting a conducting element in the connecting area and the actuating area, e) forming an insulating layer on the conducting element and f) connecting the first substrate to the connecting area to form the MEMS device. The concavity contains the plural microstructures. | 03-19-2009 |
20090194892 | METHOD OF MANUFACTURING OPTICAL COMPONENTS - A method of manufacturing an optical component is provided. The method comprises steps of providing a first liquid; providing a fluid, disposed above the first liquid, wherein an interface exists between the first liquid and the fluid; providing a polymer precursor at the interface; and solidifying the polymer precursor so as to form the optical component made by a polymer. | 08-06-2009 |
20100253457 | METHOD FOR CONTROLLING MOVABLE INDUCTOR BY USING MAGNETISM AND DEVICE THEREOF - A movable inductor using magnetism is provided. The movable inductor includes a substrate; a first structure layer disposed on the substrate, and having two protruding portions respectively disposed at two sides thereof; at least two fixing elements disposed on the substrate, and connected with the protruding portions; and a thermal bonding layer at least disposed on the fixing elements. | 10-07-2010 |
20110125001 | 3D MICROELECTRODE STRUCTURE AND METHOD FOR ASSEMBLING THE SAME - The present invention discloses a method for assembling a 3D microelectrode structure. Firstly, 2D microelectrode arrays are stacked to form a 3D microelectrode array via an auxiliary tool. Then, the 3D microelectrode array is assembled to a carrier chip to form a 3D microelectrode structure. The present invention uses an identical auxiliary tool to assemble various types of 2D microelectrode arrays having different shapes of probes to the same carrier chip. Therefore, the method of the present invention increases the design flexibility of probes. The present invention also discloses a 3D microelectrode structure, which is fabricated according to the method of the present invention and used to perform 3D measurement of biological tissues. | 05-26-2011 |
20110174058 | INTEGRATION MANUFACTURING PROCESS FOR MEMS DEVICE - A method for manufacturing an MEMS device is provided. The method includes steps of a) providing a first substrate having a concavity located thereon, b) providing a second substrate having a connecting area and an actuating area respectively located thereon, c) forming plural microstructures in the actuating area, d) mounting a conducting element in the connecting area and the actuating area, e) forming an insulating layer on the conducting element and f) connecting the first substrate to the connecting area to form the MEMS device. The concavity contains the plural microstructures. | 07-21-2011 |
20110179870 | DUAL-AXIS ACCELERATION DETECTION ELEMENT - A dual-axis acceleration detection element comprises a first detection element, a second detection element and a stationary unit. The first detection element is movable relative to the second detection element. The second detection element is movable relative to the stationary unit. The relative movements take place on different axes to detect acceleration on two different axes. The first detection element and the second detection element are interposed by corresponding detection electrodes, and the second detection element and the stationary unit also are interposed by other corresponding detection electrodes. Hence when the relative movements occur among the first and second detection elements and the stationary unit, overlapped areas of the detection electrodes change to generate and output a capacitance difference, thereby acceleration alteration can be detected. | 07-28-2011 |
20120025334 | MEMS CAPACITIVE MICROPHONE - The present invention discloses an MEMS capacitive microphone including a rigid diaphragm arranged on an elastic element. When a sound wave acts on the rigid diaphragm, the rigid diaphragm is moved parallel to a normal of a back plate by elasticity of the elastic element. Thereby the variation of the capacitance is obtained between the rigid diaphragm and the back plate. | 02-02-2012 |
20120027235 | MEMS CAPACITIVE MICROPHONE - The present invention discloses an MEMS capacitive microphone, which comprises a supporting portion and a diaphragm, wherein the supporting portion supports the central portion of the diaphragm to facilitate releasing the residual stress of the diaphragm generated in the thermal fabrication process. Thereby is maintained the flatness of the diaphragm and promoted the precision of sensing capacitance. | 02-02-2012 |
20120111096 | INTEGRATION MANUFACTURING PROCESS FOR MEMS DEVICE - A method for manufacturing an MEMS device is provided. The method includes steps of a) providing a first substrate having a concavity located thereon, b) providing a second substrate having a connecting area and an actuating area respectively located thereon, c) forming plural microstructures in the actuating area, d) mounting a conducting element in the connecting area and the actuating area, e) forming an insulating layer on the conducting element and f) connecting the first substrate to the connecting area to form the MEMS device. The concavity contains the plural microstructures. | 05-10-2012 |
Patent application number | Description | Published |
20080197951 | DRIVING METHOD FOR MAGNETIC ELEMENT - A method for driving a magnetic element is provided. The method includes steps of: a) providing a first magnetic field, b) providing a second magnetic field interacting with the first magnetic field to generate a magnetostatic field, c) putting the magnetic element into the magnetostatic field, and d) generating a magnetic torque by modulating the first magnetic field and the second magnetic field so as to drive the magnetic element. | 08-21-2008 |
20090047527 | MAGNETIC ELEMENT AND MANUFACTURING METHOD THEREFOR - A magnetic element and its manufacturing method are provided. A magnetic element includes an actuation part having a first surface and a second surface, a torsion bar connected to the actuation part, and a frame connected to the first torsion bar, wherein the first surface of the actuation part is an uneven surface. The manufacturing method of the magnetic element starts with forming an passivation layer on a substrate and defining a special area by the mask method, then continues with forming the adhesion layer and electroplate-initializing layer on the substrate sequentially. The photoresist layer are formed and the magnetic-inductive material is electroformed on the electroplate area. Finally, the substrate is etched and the passivation layer is removed to obtain the magnetic element. The manufacturing method of magnetic element of the present invention can be applied in the microelectromechanical system field and other categories. | 02-19-2009 |
20090103170 | SOLID TUNABLE MICRO OPTICAL DEVICE AND METHOD - A solid tunable micro optical device for an micro-optical system is provided. The sold tunable micro optical device includes a first annular piece, a micro-lens with a spherical surface configured on the first annular piece, and a deforming device coupled to the first annular piece for deforming the micro-lens. | 04-23-2009 |
20100212425 | 3-Axis Accelerometer With Gap-Closing Capacitive Electrodes - Disclosed is a novel three-axis capacitive-type accelerometer implemented on SOI wafer. The accelerometer consists of four springs, one proof mass, four pairs of gap-closing sensing electrodes (each pair of gap-closing sensing electrode containing one movable electrode and one stationary electrode), and several metal-vias as the electrical interconnections. The movable electrodes are on the proof mass, whereas the stationary electrodes are fixed to the substrate. The three-axis accelerometer has five merits. (1) The sensitivity of the accelerometer is improved since the proof-mass is increased by containing both device and handling silicon layers; (2) The sensitivity is also improved by the gap-closing differential capacitive sensing electrodes design; (3) The parasitic capacitance at bond pad is reduced by the existing of metal-vias between the device Si layer and handling Si layer; (4) The sensing gap thickness is precisely defined by the buried oxide of SOI wafer; (5) The stationary sensing electrodes anchored to the substrate also act as the limit stops to protect the accelerometer. | 08-26-2010 |