Patent application number | Description | Published |
20080210981 | Integrated Circuit Having Gates and Active Regions Forming a Regular Grating - A semiconductor device includes a plurality of repeatable circuit cells connectable to one or more conductors providing at least electrical connection to the circuit cells and/or electrical connection between one or more circuit elements in the cells. Each of the circuit cells are configured having gates and active regions forming a grating, wherein, for a given active layer in the device, a width of each active region is substantially the same relative to one another, a spacing between any two adjacent active regions is substantially the same, a width of each gate is substantially the same relative to one another, and a spacing between any two adjacent gates is substantially the same. | 09-04-2008 |
20080272398 | CONDUCTIVE SPACERS FOR SEMICONDUCTOR DEVICES AND METHODS OF FORMING - A method of forming a conductive spacer on a semiconductor device. The method includes depositing a polysilicon layer on the semiconductor device, selectively implanting dopant ions in the polysilicon layer on a first side of a transistor region of the semiconductor device to define a conductive spacer area, and removing the polysilicon layer except for the conductive spacer area. Optionally, a silicidation process can be performed on the conductive spacer area so that the conductive spacer is made up of metal silicide. | 11-06-2008 |
20080303105 | DUAL GATE DIELECTRIC SRAM - An SRAM cell structure containing a PFET gate dielectric having a thicker effective oxide thickness (EOT) than an NFET gate dielectric and methods of manufacturing the same is provided. The PFET gate dielectric and the NFET gate dielectric may be silicon oxynitride layers, CVD oxide layers, or high-K dielectric layers having different thicknesses. The PFET gate dielectric may be a stack of two dielectric layers and the NFET gate dielectric may be one of the two dielectric layers. The greater EOT of the PFET gate dielectric produces reduction of the on-current of the pull-up PFETs for optimal SRAM performance. | 12-11-2008 |
20090065876 | Metal High-K Transistor Having Silicon Sidewall for Reduced Parasitic Capacitance, and Process to Fabricate Same - A method is disclosed to reduce parasitic capacitance in a metal high dielectric constant (MHK) transistor. The method includes forming a MHK gate stack upon a substrate, the MHK gate stack having a bottom layer of high dielectric constant material, a middle layer of metal, and a top layer of one of amorphous silicon or polycrystalline silicon. The method further forms a depleted sidewall layer on sidewalls of the MHK gate stack so as to overlie the middle layer and the top layer, and not the bottom layer. The depleted sidewall layer is one of amorphous silicon or polycrystalline silicon. The method further forms an offset spacer layer over the depleted sidewall layer and over exposed surfaces of the bottom layer. | 03-12-2009 |
20090072312 | Metal High-K (MHK) Dual Gate Stress Engineering Using Hybrid Orientation (HOT) CMOS - A hybrid orientation technology (HOT) CMOS structure is comprised of a tensile stressed NFET gate stack and a compressively stressed PFET gate stack, where each gate stack is comprised of a high dielectric constant oxide/metal, and where the source of the stress in the tensile stressed NFET gate stack and the compressively stressed PFET gate stack is the metal in the high-k metal gate stack. | 03-19-2009 |
20090096034 | Partially and Fully Silicided Gate Stacks - Metal-oxide semiconductor (MOS) devices and techniques for the fabrication thereof are provided. In one aspect, a metal-oxide semiconductor device is provided comprising a substrate; and at least one n-channel field effect transistor (NFET) having a gate stack over the substrate. The NFET gate stack comprises an NFET gate stack metal gate layer; a first NFET gate stack silicon layer over the NFET gate stack metal gate layer; a second NFET gate stack silicon layer over a side of the first NFET gate stack silicon layer opposite the NFET gate stack metal gate layer, wherein an interface is defined between the first NFET gate stack silicon layer and the second NFET gate stack silicon layer; and an NFET gate stack silicide region that extends through the interface between the first NFET gate stack silicon layer and the second NFET gate stack silicon layer. | 04-16-2009 |
20090108314 | Embedded DRAM Integrated Circuits With Extremely Thin Silicon-On-Insulator Pass Transistors - Integrated circuits having combined memory and logic functions are provided. In one aspect, an integrated circuit is provided. The integrated circuit comprises: a substrate comprising a silicon layer over a BOX layer, wherein a select region of the silicon layer has a thickness of between about three nanometers and about 20 nanometers; at least one eDRAM cell comprising: at least one pass transistor having a pass transistor source region, a pass transistor drain region and a pass transistor channel region formed in the select region of the silicon layer; and a capacitor electrically connected to the pass transistor. | 04-30-2009 |
20090109780 | HYBRID STATIC AND DYNAMIC SENSING FOR MEMORY ARRAYS - A hybrid circuit for a memory includes: a skewed static logic gate circuit; a dynamic pre-discharge device coupled with the skewed static logic gate circuit for operating the static logic gate circuit as a dynamic circuit. | 04-30-2009 |
20090212366 | CONTACT SCHEME FOR FINFET STRUCTURES WITH MULTIPLE FINs - A FINFET-containing structure having multiple FINs that are merged together without source/drain contact pads or a local interconnect is provided. In accordance with the present invention, the inventive structure includes a plurality of semiconducting bodies (i.e., FINs) which extend above a surface of a substrate. A common patterned gate stack surrounds the plurality of semiconducting bodies and a nitride-containing spacer is located on sidewalls of the common patterned gate stack. An epitaxial semiconductor layer is used to merge each of the semiconducting bodies together. | 08-27-2009 |
20090273041 | TRANSISTOR WITH HIGH-K DIELECTRIC SIDEWALL SPACER - A transistor is provided that includes a silicon layer including a source region and a drain region, a gate stack disposed on the silicon layer between the source region and the drain region, and a sidewall spacer disposed on sidewalls of the gate stack. The gate stack includes a first layer of high dielectric constant material, a second layer comprising a metal or metal alloy, and a third layer comprising silicon or polysilicon. The sidewall spacer includes a high dielectric constant material and covers the sidewalls of at least the second and third layers of the gate stack. Also provided is a method for fabricating such a transistor. | 11-05-2009 |
20090273042 | METAL HIGH DIELECTRIC CONSTANT TRANSISTOR WITH REVERSE-T GATE - A transistor is provided. The transistor includes a silicon layer including a source region and a drain region. A gate stack is disposed on the silicon layer between the source region and the drain region. The gate stack comprises a first layer of a high dielectric constant material, a second layer comprising a metal or metal alloy, and a third layer comprising silicon or polysilicon. A lateral extent of the second layer of the gate stack is substantially greater than a lateral extent of the third layer of the gate stack. Also provided are methods for fabricating such a transistor. | 11-05-2009 |
20090275182 | METHOD FOR FABRICATING A METAL HIGH DIELECTRIC CONSTANT TRANSISTOR WITH REVERSE-T GATE - A method is provided for fabricating a transistor. A silicon layer is provided, and a first layer comprising a high dielectric constant material is formed on the silicon layer. A second layer including a metal or metal alloy is formed on the first layer, and a third layer including silicon or polysilicon is formed on the second layer. The first, second, and third layers are etched so as to form a gate stack, and ions are implanted to form source and drain regions in the silicon layer. Source and drain silicide contact areas are formed in the source and drain regions, and a gate silicide contact area is formed in the third layer. After forming these silicide contact areas, the third layer is etched without etching the first and second layers, so as to substantially reduce the width of the third layer. | 11-05-2009 |
20090290439 | HIGH PERFORMANCE METAL GATE POLYGATE 8 TRANSISTOR SRAM CELL WITH REDUCED VARIABILITY - A static random access memory cell includes a metal hi-k layer; a poly-SiON gate stack over the metal hi-k layer; a plurality of inverters disposed within the poly-SiON gate stack; and a plurality of field effect transistors placed in the metal hi-k layer. | 11-26-2009 |
20090298275 | Metal High-K Transistor Having Silicon Sidewall For Reduced Parasitic Capacitance, And Process To Fabricate Same - A method is disclosed to reduce parasitic capacitance in a metal high dielectric constant (MHK) transistor. The method includes forming a MHK gate stack upon a substrate, the MHK gate stack having a bottom layer of high dielectric constant material, a middle layer of metal, and a top layer of one of amorphous silicon or polycrystalline silicon. The method further forms a depleted sidewall layer on sidewalls of the MHK gate stack so as to overlie the middle layer and the top layer, and not the bottom layer. The depleted sidewall layer is one of amorphous silicon or polycrystalline silicon. The method further forms an offset spacer layer over the depleted sidewall layer and over exposed surfaces of the bottom layer. | 12-03-2009 |
20090302400 | METAL HIGH DIELECTRIC CONSTANT TRANSISTOR WITH REVERSE-T GATE - A transistor is provided. The transistor includes a silicon layer including a source region and a drain region. A gate stack is disposed on the silicon layer between the source region and the drain region. The gate stack comprises a first layer of a high dielectric constant material, a second layer comprising a metal or metal alloy, and a third layer comprising silicon or polysilicon. A lateral extent of the second layer of the gate stack is substantially greater than a lateral extent of the third layer of the gate stack. Also provided are methods for fabricating such a transistor. | 12-10-2009 |
20090305471 | THIN SILICON SINGLE DIFFUSION FIELD EFFECT TRANSISTOR FOR ENHANCED DRIVE PERFORMANCE WITH STRESS FILM LINERS - The present invention provides a semiconducting device structure including a thin SOI region, wherein the SOI device is formed with an optional single thin diffusion, i.e., offset, spacer and a single diffusion implant. The device silicon thickness is thin enough to permit the diffusion implants to abut the buried insulator but thick enough to form a contacting silicide. Stress layer liner films are used both over nFET and pFET device regions to enhance performance. | 12-10-2009 |
20090307635 | METAL HIGH DIELECTRIC CONSTANT TRANSISTOR WITH REVERSE-T GATE - A transistor is provided. The transistor includes a silicon layer including a source region and a drain region. A gate stack is disposed on the silicon layer between the source region and the drain region. The gate stack comprises a first layer of a high dielectric constant material, a second layer comprising a metal or metal alloy, and a third layer comprising silicon or polysilicon. A lateral extent of the second layer of the gate stack is substantially greater than a lateral extent of the third layer of the gate stack. Also provided are methods for fabricating such a transistor. | 12-10-2009 |
20090315138 | METHOD AND STRUCTURE FOR SOI BODY CONTACT FET WITH REDUCED PARASITIC CAPACITANCE - In one embodiment, the present invention provides a semiconductor device that includes a substrate including a semiconducting layer positioned overlying an insulating layer the semiconducting layer including a semiconducting body and isolation regions present about a perimeter of the semiconducting body; a gate structure overlying the semiconducting layer of the substrate, the gate structure present on a first portion on an upper surface of the semiconducting body; and a silicide body contact that is in direct physical contact with a second portion of the semiconducting body that is separated from the first portion of the semiconducting body by a non-silicide semiconducting region. | 12-24-2009 |
20100006956 | Metal High-K Transistor Having Silicon Sidewall For Reduced Parasitic Capacitance, And Process To Fabricate Same - A method is disclosed to reduce parasitic capacitance in a metal high dielectric constant (MHK) transistor. The method includes forming a MHK gate stack upon a substrate, the MHK gate stack having a bottom layer of high dielectric constant material, a middle layer of metal, and a top layer of one of amorphous silicon or polycrystalline silicon. The method further forms a depleted sidewall layer on sidewalls of the MHK gate stack so as to overlie the middle layer and the top layer, and not the bottom layer. The depleted sidewall layer is one of amorphous silicon or polycrystalline silicon. The method further forms an offset spacer layer over the depleted sidewall layer and over exposed surfaces of the bottom layer. | 01-14-2010 |
20100032759 | SELF-ALIGNED SOI SCHOTTKY BODY TIE EMPLOYING SIDEWALL SILICIDATION - A self-aligned Silicon on Insulator (SOI) Schottky Body Tie structure includes: a source region comprising a silicide layer disposed on a top surface of the source region; a drain region comprising a silicide layer disposed on a top surface of the drain region; a gate region disposed above a channel formed by the drain and source regions; and a gate oxide layer disposed between the gate region and the channel formed by the drain and source regions, wherein when silicidation is performed on the diffusion region it forms a metal-silicon alloy contact such that the silicide layer extends into and directly touches the channel. | 02-11-2010 |
20100106996 | SerDes double rate bitline with interlock to block precharge capture - An embodiment of the invention provides a method of separating an early clock pulse and a late clock pulse into two different latches, wherein the early clock pulse is generated through a bit line. In response to the early clock pulse rising, a first data waveform is sent to a fourth data waveform. In response to a third data waveform rising, an early precharge is turned off. In response to the turning off of the early precharge and in response to a fifth data waveform dropping, an eighth data waveform rises if the first data waveform has a value of 1. In response to a sixth data waveform rising, a first pulse latch is opened | 04-29-2010 |
20100159684 | Metal High-K (MHK) Dual Gate Stress Engineering Using Hybrid Orientation (HOT) CMOS - A hybrid orientation technology (HOT) CMOS structure is comprised of a tensile stressed NFET gate stack and a compressively stressed PFET gate stack, where each gate stack is comprised of a high dielectric constant oxide/metal, and where the source of the stress in the tensile stressed NFET gate stack and the compressively stressed PFET gate stack is the metal in the high-k metal gate stack. | 06-24-2010 |
20100224940 | Partially and Fully Silicided Gate Stacks - Metal-oxide semiconductor (MOS) devices and techniques for the fabrication thereof are provided. In one aspect, a metal-oxide semiconductor device is provided comprising a substrate; and at least one n-channel field effect transistor (NFET) having a gate stack over the substrate. The NFET gate stack comprises an NFET gate stack metal gate layer; a first NFET gate stack silicon layer over the NFET gate stack metal gate layer; a second NFET gate stack silicon layer over a side of the first NFET gate stack silicon layer opposite the NFET gate stack metal gate layer, wherein an interface is defined between the first NFET gate stack silicon layer and the second NFET gate stack silicon layer; and an NFET gate stack silicide region that extends through the interface between the first NFET gate stack silicon layer and the second NFET gate stack silicon layer. | 09-09-2010 |
20100270676 | ADAPTIVE INTERCONNECT STRUCTURE - An array of contact pads on a semiconductor structure has a pitch less than twice an overlay tolerance of a bonding process employed to vertically stack semiconductor structures. A set of contact pads within the area of overlay variation for a matching contact pin may be electrically connected to an array of programmable contacts such that one programmable contact is connected to each contact pad within the area of overlay variation. One contact pad may be provided with a plurality of programmable contacts. The variability of contacts between contact pins and contact pads is accommodated by connecting or disconnecting programmable contacts after the stacking of semiconductor structures. Since the pitch of the array of contact pins may be less than twice the overlay variation of the bonding process, a high density of interconnections is provided in the vertically stacked structure. | 10-28-2010 |
20100327376 | Metal High-K Transistor Having Silicon Sidewall For Reduced Parasitic Capacitance, And Process To Fabricate Same - A method forms a metal high dielectric constant (MHK) transistor and includes: providing a MHK stack disposed on a substrate, the MHK stack including a first layer of high dielectric constant material, a second overlying layer, and a third overlying layer; selectively removing only the second and third layers, without removing the first layer, to form an upstanding portion of a MHK gate structure; forming a first sidewall layer on sidewalls of the upstanding portion of the MHK gate structure; forming a second sidewall layer on sidewalls of the first sidewall layer; removing a portion of the first layer to form exposed surfaces; forming an offset spacer layer over the second sidewall layer and over the first layer, and forming in the substrate extensions that underlie the first and second sidewall layers and that extend under a portion but not all of the upstanding portion of the MHK gate structure. | 12-30-2010 |
20110012202 | Selective Floating Body SRAM Cell - A memory cell has N≧6 transistors, in which two are access transistors, at least one pair [say (N−2)/2] are pull-up transistors, and at least another pair [say (N−2)/2] are pull-down transistors. The pull-up and pull-down transistors are all coupled between the two access transistors. Each of the access transistors and the pull-up transistors are the same type, p-type or n-type. Each of the pull-down transistors is the other type, p-type or n-type. The access transistors are floating body devices. The pull-down transistors are non-floating body devices. The pull-up transistors may be floating or non-floating body devices. Various specific implementations and methods of making the memory cell are also detailed. | 01-20-2011 |
20110049627 | EMBEDDED SILICON GERMANIUM N-TYPE FILED EFFECT TRANSISTOR FOR REDUCED FLOATING BODY EFFECT - A method for fabricating a semiconductor device includes forming a gate stack on an active region of a silicon-on-insulator substrate. The active region is within a semiconductor layer and is doped with an p-type dopant. A gate spacer is formed surrounding the gate stack. A first trench is formed in a region reserved for a source region and a second trench is formed in a region reserved for a drain region. The first and second trenches are formed while maintaining exposed the region reserved for the source region and the region reserved for the drain region. Silicon germanium is epitaxially grown within the first trench and the second trench while maintaining exposed the regions reserved for the source and drain regions, respectively. | 03-03-2011 |
20110163379 | Body-Tied Asymmetric P-Type Field Effect Transistor - In one exemplary embodiment of the invention, an asymmetric P-type field effect transistor includes: a source region coupled to a drain region via a channel; a gate structure overlying at least a portion of the channel; a halo implant disposed at least partially in the channel, where the halo implant is disposed closer to the source region than the drain region; and a body-tie coupled to the channel. In a further exemplary embodiment, the asymmetric P-type field effect transistor is operable to act as a symmetric P-type field effect transistor. | 07-07-2011 |
20110163380 | Body-Tied Asymmetric N-Type Field Effect Transistor - In one exemplary embodiment of the invention, an asymmetric N-type field effect transistor includes: a source region coupled to a drain region via a channel; a gate structure overlying at least a portion of the channel; a halo implant disposed at least partially in the channel, where the halo implant is disposed closer to the source region than the drain region; and a body-tie coupled to the channel. In a further exemplary embodiment, the asymmetric N-type field effect transistor is operable to act as a symmetric N-type field effect transistor. | 07-07-2011 |
20110171790 | Selective Floating Body SRAM Cell - A memory cell has N≧6 transistors, in which two are access transistors, at least one pair [say (N−2)/2] are pull-up transistors, and at least another pair [say (N−2)/2] are pull-down transistors. The pull-up and pull-down transistors are all coupled between the two access transistors. Each of the access transistors and the pull-up transistors are the same type, p-type or n-type. Each of the pull-down transistors is the other type, p-type or n-type. The access transistors are floating body devices. The pull-down transistors are non-floating body devices. The pull-up transistors may be floating or non-floating body devices. Various specific implementations and methods of making the memory cell are also detailed. | 07-14-2011 |
20110204445 | Selective Floating Body SRAM Cell - A memory cell has N≧16 transistors, in which two are access transistors, at least one pair [say (N-2)/2] are pull-up transistors, and at least another pair [say (N-2)/2] are pull-down transistors. The pull-up and pull-down transistors are all coupled between the two access transistors. Each of the access transistors and the pull-up transistors are the same type, p-type or n-type. Each of the pull-down transistors is the other type, p-type or n-type. The access transistors are floating body devices. The pull-down transistors are non-floating body devices. The pull-up transistors may be floating or non-floating body devices. Various specific implementations and methods of making the memory cell are also detailed. | 08-25-2011 |
20110233634 | Embedded DRAM Integrated Circuits with Extremely Thin Silicon-On-Insulator Pass Transistors - Integrated circuits having combined memory and logic functions are provided. In one aspect, an integrated circuit is provided. The integrated circuit comprises: a substrate comprising a silicon layer over a BOX layer, wherein a select region of the silicon layer has a thickness of between about three nanometers and about 20 nanometers; at least one eDRAM cell comprising: at least one pass transistor having a pass transistor source region, a pass transistor drain region and a pass transistor channel region formed in the select region of the silicon layer; and a capacitor electrically connected to the pass transistor. | 09-29-2011 |
20110233674 | Design Structure For Dense Layout of Semiconductor Devices - A semiconductor structure, and a method of making, includes: a substrate; and at least one layer of silicon overlying the substrate, the layer of silicon including at least one active region having at least one device, a design layout of the active region in accordance with design layout rules including: a multiple-fingered device is mapped to a symmetric device or an asymmetric body-tied device; a single-fingered device is mapped to an asymmetric device; an active region having a single-fingered device is entirely source-up or source-down; and an active region falls into one of two categories: the active region does not include any symmetric devices or the active region does not include any asymmetric devices. In another exemplary embodiment, a design structure tangibly embodied on a computer readable medium, for use by a machine in the design, manufacture or simulation of an integrated circuit having the above semiconductor structure. | 09-29-2011 |
20110284962 | High Performance Devices and High Density Devices on Single Chip - A CMOS chip comprising a high performance device region and a high density device region includes a plurality of high performance devices comprising n-type field effect transistors (NFETs) and p-type field effect transistors (PFETs) in the high performance device region, wherein the high performance devices have a high performance pitch; and a plurality of high density devices comprising NFETs and PFETs in the high density device region, wherein the high density devices have a high density pitch, and wherein the high performance pitch is about 2 to 3 times the high density pitch; wherein the high performance device region comprises doped source and drain regions, NFET gate regions having an elevated stress induced using stress memorization technique (SMT), gate and source/drain silicide regions, and a dual stressed liner, and wherein the high density device region comprises doped source and drain regions, gate silicide regions, and a neutral stressed liner. | 11-24-2011 |
20110298440 | LOW VOLTAGE SIGNALING - A low voltage signaling system for integrated circuits includes a first voltage domain operating at a nominal integrated circuit (IC) power supply voltage (Vdd) swing level at a signal transmitting end of a first chip, a second voltage domain having one or more transmission interconnect lines operating at a reduced voltage swing level with respect to the first voltage domain, and a third voltage domain at a signal receiving end of a second chip, the third voltage domain operating at the Vdd swing level; wherein an input signal originating from the first voltage domain is down converted to operate at the reduced voltage swing level for transmission over the second voltage domain, and wherein the third voltage domain senses the input signal transmitted over the second voltage domain and generates an output signal operating back up at the Vdd swing level. | 12-08-2011 |
20110309448 | DIFFERENTIALLY RECESSED CONTACTS FOR MULTI-GATE TRANSISTOR OF SRAM CELL - A complementary metal-oxide-semiconductor static random access memory cell that includes a plurality of P-channel multi-gate transistors and a plurality of N-channel multi-gate transistors. Each transistor includes a gate electrode and source and drain regions separated by the at least one gate electrode. The SRAM cell further includes a plurality of contacts formed within the source and drain regions of at least one transistor. A plurality of contacts of at least one transistor are recessed a predetermined recess amount, wherein a resistance of the at least one transistor is varied based upon the predetermined recess amount. | 12-22-2011 |
20120171819 | ADAPTIVE INTERCONNECT STRUCTURE - An array of contact pads on a semiconductor structure has a pitch less than twice an overlay tolerance of a bonding process employed to vertically stack semiconductor structures. A set of contact pads within the area of overlay variation for a matching contact pin may be electrically connected to an array of programmable contacts such that one programmable contact is connected to each contact pad within the area of overlay variation. One contact pad may be provided with a plurality of programmable contacts. The variability of contacts between contact pins and contact pads is accommodated by connecting or disconnecting programmable contacts after the stacking of semiconductor structures. Since the pitch of the array of contact pins may be less than twice the overlay variation of the bonding process, a high density of interconnections is provided in the vertically stacked structure. | 07-05-2012 |
20120175712 | Multiple Vt Field-Effect Transistor Devices - Multiple threshold voltage (Vt) field-effect transistor (FET) devices and techniques for the fabrication thereof are provided. In one aspect, a FET device is provided including a source region; a drain region; at least one channel interconnecting the source and drain regions; and a gate, surrounding at least a portion of the channel, configured to have multiple threshold voltages due to the selective placement of at least one band edge metal throughout the gate. | 07-12-2012 |
20120182793 | ASYMMETRIC SILICON-ON-INSULATOR SRAM CELL - A memory cell having N transistors including at least one pair of access transistors, one pair of pull-down transistors, and one pair of pull-up transistors to form a memory cell, wherein N is an integer at least equal to six, wherein each of the access transistors and each of the pull-down transistors is a same one of an n-type or a p-type transistor, and each of the pull-up transistors is the other of an n-type or a p-type transistor, wherein at least one of the pair of the pull down transistors and the pair of the pull up transistors are asymmetric. | 07-19-2012 |
20120187506 | Metal High-K Transistor Having Silicon Sidewall For Reduced Parasitic Capacitance, and Process to Fabricate Same - A method forms a metal high dielectric constant (MHK) transistor and includes: providing a MHK stack disposed on a substrate, the MHK stack including a first layer of high dielectric constant material, a second overlying layer, and a third overlying layer, selectively removing only the second and third layers, without removing the first layer, to form an upstanding portion of a MHK gate structure; forming a first sidewall layer on sidewalls of the upstanding portion of the MHK gate structure; forming a second sidewall layer on sidewalls of the first sidewall layer; removing a portion of the first layer to form exposed surfaces; forming an offset spacer layer over the second sidewall layer and over the first layer, and forming in the substrate extensions that underlie the first and second sidewall layers and that extend under a portion but not all of the upstanding portion of the MHK gate structure. | 07-26-2012 |
20120190159 | ASYMMETRIC SILICON-ON-INSULATOR SRAM CELL - A memory cell having N transistors including at least one pair of access transistors, one pair of pull-down transistors, and one pair of pull-up transistors to form a memory cell, wherein N is an integer at least equal to six, wherein each of the access transistors and each of the pull-down transistors is a same one of an n-type or a p-type transistor, and each of the pull-up transistors is the other of an n-type or a p-type transistor, wherein at least one of the pair of the pull down transistors and the pair of the pull up transistors are asymmetric. | 07-26-2012 |
20120195102 | NANO-ELECTRO-MECHANICAL DRAM CELL - A DRAM cell and method for storing information in a dynamic random access memory using an electrostatic actuator beam to make an electrical connection between a storage capacitor and a bit line. | 08-02-2012 |
20120212997 | TEST STRUCTURE FOR CHARACTERIZING MULTI-PORT STATIC RANDOM ACCESS MEMORY AND REGISTER FILE ARRAYS - A test structure for characterizing a production static random access memory (SRAM) array. The test structure includes a characterization circuit having multiple memory cell columns connected in series to form a ring configuration. The characterization circuit is fabricated on a wafer substrate in common with and proximate to a production SRAM array. The characterization circuit preferably includes SRAM cells having a circuit topology substantially identical to the circuit topology of memory cells within the production SRAM array. In one embodiment, the test structure is utilized for characterizing a multi-port memory array and includes multiple memory cell columns connected in series to form a ring oscillator characterization circuit. Each cell column in the characterization circuit includes multiple SRAM cells each having a latching node and multiple data path access nodes. Selection control circuitry selectively enables the multiple data path access nodes for the SRAM cells within the characterization circuit. | 08-23-2012 |
20120259804 | RECONFIGURABLE AND CUSTOMIZABLE GENERAL-PURPOSE CIRCUITS FOR NEURAL NETWORKS - A reconfigurable neural network circuit is provided. The reconfigurable neural network circuit comprises an electronic synapse array including multiple synapses interconnecting a plurality of digital electronic neurons. Each neuron comprises an integrator that integrates input spikes and generates a signal when the integrated inputs exceed a threshold. The circuit further comprises a control module for reconfiguring the synapse array. The control module comprises a global final state machine that controls timing for operation of the circuit, and a priority encoder that allows spiking neurons to sequentially access the synapse array. | 10-11-2012 |
20120268985 | RESONANCE NANOELECTROMECHANICAL SYSTEMS - Systems and methods for operating a nanometer-scale cantilever beam with a gate electrode. An example system includes a drive circuit coupled to the gate electrode where a drive signal from the circuit may cause the beam to oscillate at or near the beam's resonance frequency. The drive signal includes an AC component, and may include a DC component as well. An alternative example system includes a nanometer-scale cantilever beam, where the beam oscillates to contact a plurality of drain regions. | 10-25-2012 |
20120276739 | DIFFERENTIALLY RECESSED CONTACTS FOR MULTI-GATE TRANSISTOR OF SRAM CELL - A complementary metal-oxide-semiconductor static random access memory cell includes a plurality of P-channel multi-gate transistors and a plurality of N-channel multi-gate transistors. Each transistor includes a gate electrode and source and drain regions separated by the at least one gate electrode. The SRAM cell further includes a plurality of contacts formed within the source and drain regions of at least one transistor. A plurality of contacts of at least one transistor are recessed a predetermined recess amount, wherein a resistance of the at least one transistor is varied based upon the predetermined recess amount. | 11-01-2012 |
20120289014 | METHOD FOR FABRICATING TRANSISTOR WITH HIGH-K DIELECTRIC SIDEWALL SPACER - A method is provided for fabricating a transistor. The transistor includes a silicon layer including a source region and a drain region, a gate stack disposed on the silicon layer between the source region and the drain region, and a sidewall spacer disposed on sidewalls of the gate stack. The gate stack includes a first layer of high dielectric constant material, a second layer comprising a metal or metal alloy, and a third layer comprising silicon or polysilicon. The sidewall spacer includes a high dielectric constant material and covers the sidewalls of at least the second and third layers of the gate stack. Also provided is a method for fabricating such a transistor. | 11-15-2012 |
20120299062 | EMBEDDED SILICON GERMANIUM N-TYPE FILED EFFECT TRANSISTOR FOR REDUCED FLOATING BODY EFFECT - A method for fabricating a semiconductor device includes forming a gate stack on an active region of a silicon-on-insulator substrate. The active region is within a semiconductor layer and is doped with an p-type dopant. A gate spacer is formed surrounding the gate stack. A first trench is formed in a region reserved for a source region and a second trench is formed in a region reserved for a drain region. The first and second trenches are formed while maintaining exposed the region reserved for the source region and the region reserved for the drain region. Silicon germanium is epitaxially grown within the first trench and the second trench while maintaining exposed the regions reserved for the source and drain regions, respectively. | 11-29-2012 |
20120299107 | High Performance Devices and High Density Devices on Single Chip - A CMOS chip comprising a high performance device region and a high density device region includes a plurality of high performance devices comprising n-type field effect transistors (NFETs) and p-type field effect transistors (PFETs) in the high performance device region, wherein the high performance devices have a high performance pitch; and a plurality of high density devices comprising NFETs and PFETs in the high density device region, wherein the high density devices have a high density pitch, and wherein the high performance pitch is about 2 to 3 times the high density pitch; wherein the high performance device region comprises doped source and drain regions, NFET gate regions having an elevated stress induced using stress memorization technique (SMT), gate silicide and source/drain silicide regions, and a dual stressed liner, and wherein the high density device region comprises doped source and drain regions, gate silicide regions, and a neutral stressed liner. | 11-29-2012 |
20120313174 | METHOD OF MAKING A MOSFET HAVING SELF-ALIGNED SILICIDED SCHOTTKY BODY TIE INCLUDING INTENTIONAL PULL-DOWN OF AN STI EXPOSING SIDEWALLS OF A DIFFUSION REGION - A self-aligned transistor device includes: a source region and drain regions disposed on an oxide layer; a channel with a diffusion region formed between the drain and source regions; a silicide layer over a top surface of the source and drain regions, extending into the diffusion region; and a recess formed on each end of the device to expose sidewalls of the device to a free surface by performing shallow trench isolation on the oxide layer of the device that extends past the silicide layer. | 12-13-2012 |
20120317062 | RECONFIGURABLE AND CUSTOMIZABLE GENERAL-PURPOSE CIRCUITS FOR NEURAL NETWORKS - A reconfigurable neural network circuit is provided. The reconfigurable neural network circuit comprises an electronic synapse array including multiple synapses interconnecting a plurality of digital electronic neurons. Each neuron comprises an integrator that integrates input spikes and generates a signal when the integrated inputs exceed a threshold. The circuit further comprises a control module for reconfiguring the synapse array. The control module comprises a global final state machine that controls timing for operation of the circuit, and a priority encoder that allows spiking neurons to sequentially access the synapse array. | 12-13-2012 |
20120319178 | DOUBLE GATE PLANAR FIELD EFFECT TRANSISTORS - A stacked planar device and method for forming the same is shown that includes forming, on a substrate, a stack of layers having alternating sacrificial and channel layers, patterning the stack such that sides of the stack include exposed surfaces of the sacrificial and channel layers, forming a dummy gate structure over a region of the stack to establish a planar area, forming a dielectric layer around the dummy gate structure to cover areas adjacent to the planar area, removing the dummy gate structure to expose the stack, selectively etching the stack to remove the sacrificial layers from the channel layers in the planar area, and forming a gate conductor over and in between the channel layers to form a transistor device. | 12-20-2012 |
20130026449 | Hybrid CMOS Technology with Nanowire Devices and Double Gated Planar Devices - A substrate includes a first source region and a first drain region each having a first semiconductor layer disposed on a second semiconductor layer and a surface parallel to {110} crystalline planes and opposing sidewall surfaces parallel to the {110} crystalline planes; nanowire channel members suspended by the first source region and the first drain region, where the nanowire channel members include the first semiconductor layer, and opposing sidewall surfaces parallel to {100} crystalline planes and opposing faces parallel to the {110} crystalline planes. The substrate further includes a second source and drain regions having the characteristics of the first source and drain regions, and a single channel member suspended by the second source region and the second drain region and having the same characteristics as the nanowire channel members. A width of the single channel member is at least several times a width of a single nanowire member. | 01-31-2013 |
20130026451 | Hybrid CMOS Technology With Nanowire Devices and Double Gated Planar Devices - A substrate includes a first source region and a first drain region each having a first semiconductor layer disposed on a second semiconductor layer and a surface parallel to {110} crystalline planes and opposing sidewall surfaces parallel to the {110} crystalline planes; nanowire channel members suspended by the first source region and the first drain region, where the nanowire channel members include the first semiconductor layer, and opposing sidewall surfaces parallel to {100} crystalline planes and opposing faces parallel to the {110} crystalline planes. The substrate further includes a second source and drain regions having the characteristics of the first source and drain regions, and a single channel member suspended by the second source region and the second drain region and having the same characteristics as the nanowire channel members. A width of the single channel member is at least several times a width of a single nanowire member. | 01-31-2013 |
20130087882 | LATERAL ETCH STOP FOR NEMS RELEASE ETCH FOR HIGH DENSITY NEMS/CMOS MONOLITHIC INTEGRATION - Structure and method for fabricating a barrier layer that separates an electromechanical device and a CMOS device on a substrate. An example structure includes a protective layer encapsulating the electromechanical device, where the barrier layer may withstand an etch process capable of removing the protective layer, but not the barrier layer. The substrate may be silicon-on-insulator or a multilayer wafer substrate. The electromechanical device may be a microelectromechanical system (MEMS) or a nanoelectromechanical system (NEMS). | 04-11-2013 |
20130092992 | REPLACEMENT GATE MULTIGATE TRANSISTOR FOR EMBEDDED DRAM - A memory cell, an array of memory cells, and a method for fabricating a memory cell with multigate transistors such as fully depleted finFET or nano-wire transistors in embedded DRAM. The memory cell includes a trench capacitor, a non-planar transistor, and a self-aligned silicide interconnect electrically coupling the trench capacitor to the non-planar transistor. | 04-18-2013 |
20130099316 | SELECTIVE FLOATING BODY SRAM CELL - A memory cell has N≧6 transistors, in which two are access transistors, at least one pair [say (N−2)/2] are pull-up transistors, and at least another pair [say (N−2)/2] are pull-down transistors. The pull-up and pull-down transistors are all coupled between the two access transistors. Each of the access transistors and the pull-up transistors are the same type, p-type or n-type. Each of the pull-down transistors is the other type, p-type or n-type. The access transistors are floating body devices. The pull-down transistors are non-floating body devices. The pull-up transistors may be floating or non-floating body devices. Various specific implementations and methods of making the memory cell are also detailed. | 04-25-2013 |
20130105897 | Nanowire FET and FINFET Hybrid Technology | 05-02-2013 |
20130153993 | HYBRID CMOS NANOWIRE MESH DEVICE AND FINFET DEVICE - A method of forming a hybrid semiconductor structure on an SOI substrate. The method includes an integrated process flow to form a nanowire mesh device and a FINFET device on the same SOI substrate. Also included is a semiconductor structure which includes the nanowire mesh device and the FINFET device on the same SOI substrate. | 06-20-2013 |
20130153996 | HYBRID CMOS NANOWIRE MESH DEVICE AND PDSOI DEVICE - A method of forming a hybrid semiconductor structure on an SOI substrate. The method includes an integrated process flow to form a nanowire mesh device and a PDSOI device on the same SOI substrate. Also included is a semiconductor structure which includes the nanowire mesh device and the PDSOI device on the same SOI substrate. | 06-20-2013 |
20130153997 | HYBRID CMOS NANOWIRE MESH DEVICE AND BULK CMOS DEVICE - A method of forming a hybrid semiconductor structure on an SOI substrate. The method includes an integrated process flow to form a nanowire mesh device and a bulk CMOS device on the same SOI substrate. Also included is a semiconductor structure which includes the nanowire mesh device and the bulk CMOS device on the same SOI substrate. | 06-20-2013 |
20130176769 | 8-TRANSISTOR SRAM CELL DESIGN WITH SCHOTTKY DIODES - An 8-transistor SRAM cell which includes two pull-up transistors and two pull-down transistors in cross-coupled inverter configuration to form two inverters for storing a single data bit, wherein each of the inverters includes a Schottky diode; first and second pass gate transistors having a gate terminal coupled to a write word line and a source or drain of each of the pass gate transistors coupled to a write bit line; and first and second read transistors coupled to the two pull-up and two pull-down transistors, one of the read transistors having a gate terminal coupled to a read word line and a source or a drain coupled to a read bit line. In a preferred embodiment, the 8-transistor SRAM cell has column select writing enabled for writing a value to the 8-transistor SRAM cell without inadvertently also writing a value to another 8-transistor SRAM cell. | 07-11-2013 |
20130176770 | 8-TRANSISTOR SRAM CELL DESIGN WITH INNER PASS-GATE JUNCTION DIODES - An 8-transistor SRAM cell which includes two pull-up transistors and two pull-down transistors in cross-coupled inverter configuration for storing a single data bit; first and second pass-gate transistors having a gate terminal coupled to a write word line and a source or drain of each of the pass-gate transistors coupled to a write bit line; inner junction diodes at shared source/drain terminals of the pass-gate and pull-down transistors oriented to block charge transfer from the write bit line into the cell; and first and second read transistors coupled to the two pull-up and two pull-down transistors, one of the read transistors having a gate terminal coupled to a read word line and a source or a drain coupled to a read bit line. The 8-transistor SRAM cell is adapted to prevent the value of the bit stored in the cell from changing state. | 07-11-2013 |
20130176771 | 8-TRANSISTOR SRAM CELL DESIGN WITH OUTER PASS-GATE DIODES - An 8-transistor SRAM cell which includes two pull-up transistors and two pull-down transistors in cross-coupled inverter configuration for storing a single data bit; first and second pass-gate transistors having a gate terminal coupled to a write word line and a source or drain of each of the pass-gate transistors coupled to a write bit line through a series outer diode between the pass-gate and the write bit line oriented to block charge transfer from the write bit line into the cell; and first and second read transistors coupled to the two pull-up and two pull-down transistors, one of the read transistors having a gate terminal coupled to a read word line and a source or a drain coupled to a read bit line. The 8-transistor SRAM cell is adapted to prevent the value of the bit stored in the cell from changing state. | 07-11-2013 |
20130223121 | SENSE SCHEME FOR PHASE CHANGE MATERIAL CONTENT ADDRESSABLE MEMORY - A sensing circuit and method for sensing match lines in content addressable memory. The sensing circuit includes an inverter electrically coupled in a feedback loop to a match line. The inverter includes an inverting threshold of the match line. The match line is charged to substantially a first voltage threshold during a pre-charge phase. An evaluation phase occurs when the match line voltage drops from substantially the first voltage threshold to substantially the second voltage threshold. | 08-29-2013 |
20130256763 | LOW EXTENSION DOSE IMPLANTS IN SRAM FABRICATION - A static random access memory fabrication array includes at least one p-type field effect transistor, including a gate stack and isolating spacers forming a gate having a gate length Lgate and an effective gate length, Leff and a source and drain region adjacent the gate stack, wherein the source and drain regions are formed from a low extension dose implant that decreases a difference between Lgate and Leff. | 10-03-2013 |
20130260525 | LOW EXTENSION DOSE IMPLANTS IN SRAM FABRICATION - A static random access memory fabrication method includes forming a gate stack on a substrate, forming isolating spacers adjacent the gate stack, the isolating spacers and gate stack having a gate length, forming a source and drain region adjacent the gate stack, which generates an effective gate length, wherein the source and drain regions are formed from a low extension dose implant that varies a difference between the gate length and the effective gate length. | 10-03-2013 |
20130306935 | DOUBLE GATE PLANAR FIELD EFFECT TRANSISTORS - A transistor device includes multiple planar layers of channel material connecting a source region and a drain region, where the planar layers are formed in a stack of layers of a channel material; and a gate conductor formed around and between the planar layers of channel material. | 11-21-2013 |
20130328592 | TIME DIVISION MULTIPLEXED LIMITED SWITCH DYNAMIC LOGIC - A method for increasing performance in a limited switch dynamic logic (LSDL) circuit includes precharging a dynamic node during a precharge phase of a first and second evaluation clock signal. The dynamic node is evaluated to a first logic value in response to one or more first input signals of a first evaluation tree during an evaluation phase of the first evaluation clock signal. The dynamic node is evaluated to a second logic value in response one or more second input signals of a second evaluation tree during an evaluation phase of the second evaluation clock signal. A signal of the LSDL circuit is outputted in response to the dynamic node according to an output latch clock signal. | 12-12-2013 |
20130328593 | TIME DIVISION MULTIPLEXED LIMITED SWITCH DYNAMIC LOGIC - A limited switch dynamic logic (LSDL) circuit includes a dynamic logic circuit and a static logic circuit. The dynamic logic circuit includes a precharge device configured to precharge a dynamic node during a precharge phase of a first evaluation clock signal and a second evaluation clock signal. A first evaluation tree is configured to evaluate the dynamic node to a first logic value in response to one or more first input signals during an evaluation phase of the first evaluation clock signal. A second evaluation tree is configured to evaluate the dynamic node to a second logic value in response to one or more second input signals during an evaluation phase of the second evaluation clock signal. A static logic circuit is configured to provide an output of the LSDL circuit in response to the dynamic node according to an output latch clock signal. | 12-12-2013 |
20140027855 | Nanowire FET and FINFET Hybrid Technology - Hybrid nanowire FET and FinFET devices and methods for fabrication thereof are provided. In one aspect, a method for fabricating a CMOS circuit having a nanowire FET and a finFET includes the following steps. A wafer is provided having an active layer over a BOX. A first region of the active layer is thinned. An organic planarizing layer is deposited on the active layer. Nanowires and pads are etched in the first region of the active layer using a first hardmask. The nanowires are suspended over the BOX. Fins are etched in the second region of the active layer using a second hardmask. A first gate stack is formed that surrounds at least a portion of each of the nanowires. A second gate stack is formed covering at least a portion of each of the fins. An epitaxial material is grown on exposed portions of the nanowires, pads and fins. | 01-30-2014 |
20140035037 | EMBEDDED SILICON GERMANIUM N-TYPE FILED EFFECT TRANSISTOR FOR REDUCED FLOATING BODY EFFECT - A semiconductor device includes a gate stack formed on an active region in a p-type field effect transistor (pFET) portion of a silicon-on-insulator (SOI) substrate. The SOI substrate includes a n-type field effect transistor (nFET) portion. A gate spacer is formed over the gate stack. A source region and a drain region are formed within a first region and a second region, respectively, of the pFET portion of the semiconductor layer including embedded silicon germanium (eSiGe). A source region and a drain region are formed within a first region and a second region, respectively, of the nFET portion of the semiconductor layer including eSiGe. The source and drain regions within the pFET portion includes at least one dimension that is different from at least one dimension of the source and drain regions within the nFET portion. | 02-06-2014 |
20140038368 | EMBEDDED SILICON GERMANIUM N-TYPE FILED EFFECT TRANSISTOR FOR REDUCED FLOATING BODY EFFECT - A method for fabricating a semiconductor device includes forming a gate stack on an active region of a silicon-on-insulator substrate. The active region is within a semiconductor layer and is doped with an p-type dopant. A gate spacer is formed surrounding the gate stack. A first trench is formed in a region reserved for a source region and a second trench is formed in a region reserved for a drain region. The first and second trenches are formed while maintaining exposed the region reserved for the source region and the region reserved for the drain region. Silicon germanium is epitaxially grown within the first trench and the second trench while maintaining exposed the regions reserved for the source and drain regions, respectively. | 02-06-2014 |
20140049289 | TIME DIVISION MULTIPLEXED LIMITED SWITCH DYNAMIC LOGIC - A method for increasing performance in a limited switch dynamic logic (LSDL) circuit includes precharging a dynamic node during a precharge phase of a first and second evaluation clock signal. The dynamic node is evaluated to a first logic value in response to one or more first input signals of a first evaluation tree during an evaluation phase of the first evaluation clock signal. The dynamic node is evaluated to a second logic value in response one or more second input signals of a second evaluation tree during an evaluation phase of the second evaluation clock signal. A signal of the LSDL circuit is outputted in response to the dynamic node according to an output latch clock signal. | 02-20-2014 |
20140049934 | SLAB INDUCTOR DEVICE PROVIDING EFFICIENT ON-CHIP SUPPLY VOLTAGE CONVERSION AND REGULATION - A voltage conversion circuit such as a buck regulator circuit has a plurality of switches coupled to a voltage source; a slab inductor having a length, a width and a thickness, where the slab inductor is coupled between the plurality of switches and a load and carries a load current during operation of the plurality of switches. The voltage conversion circuit can also include means to reduce or cancel a detrimental effect of other wires on same chip, such as a power grid, that conduct a return current and thereby degrading the functionality of this slab inductor. In one embodiment the wires can be moved further away from the slab inductor and in another embodiment magnetic materials can be used to shield the slab inductor from at least one such interfering conductor. | 02-20-2014 |
20140053004 | SLAB INDUCTOR DEVICE PROVIDING EFFICIENT ON-CHIP SUPPLY VOLTAGE CONVERSION AND REGULATION - A method is disclosed to operate a voltage conversion circuit such as a buck regulator circuit that has a plurality of switches coupled to a voltage source; a slab inductor having a length, a width and a thickness, where the slab inductor is coupled between the plurality of switches and a load and carries a load current during operation of the plurality of switches; and a means to reduce or cancel the detrimental effect of other wires on same chip, such as a power grid, potentially conducting return current and thereby degrading the functionality of this slab inductor. In one embodiment the wires can be moved further away from the slab inductor and in another embodiment magnetic materials can be used to shield the slab inductor from at least one such interfering conductor. | 02-20-2014 |
20140103422 | STRUCTURE FOR MEMS TRANSISTORS ON FAR BACK END OF LINE - A MEMS transistor for a FBEOL level of a CMOS integrated circuit is disclosed. The MEMS transistor includes a cavity within the integrated circuit. A MEMS cantilever switch having two ends is disposed within the cavity and anchored at least at one of the two ends. A gate and a drain are in a sidewall of the cavity, and are separated from the MEMS cantilever switch by a gap. In response to a voltage applied to the gate, the MEMS cantilever switch moves across the gap in a direction parallel to the plane of the FBEOL level of the CMOS integrated circuit into electrical contact with the drain to permit a current to flow between the source and the drain. Methods for fabricating the MEMS transistor are also disclosed. In accordance with the methods, a MEMS cantilever switch, a gate, and a drain are constructed on a far back end of line (FBEOL) level of a CMOS integrated circuit in a plane parallel to the FBEOL level. The MEMS cantilever switch is separated from the gate and the drain by a sacrificial material, which is ultimately removed to release the MEMS cantilever switch and to provide a gap between the MEMS cantilever switch and the gate and the drain. | 04-17-2014 |
20140106552 | Method Of Fabricating MEMS Transistors On Far Back End Of Line - A MEMS transistor for a FBEOL level of a CMOS integrated circuit is disclosed. The MEMS transistor includes a cavity within the integrated circuit. A MEMS cantilever switch having two ends is disposed within the cavity and anchored at least at one of the two ends. A gate and a drain are in a sidewall of the cavity, and are separated from the MEMS cantilever switch by a gap. In response to a voltage applied to the gate, the MEMS cantilever switch moves across the gap in a direction parallel to the plane of the FBEOL level of the CMOS integrated circuit into electrical contact with the drain to permit a current to flow between the source and the drain. Methods for fabricating the MEMS transistor are also disclosed. In accordance with the methods, a MEMS cantilever switch, a gate, and a drain are constructed on a far back end of line (FBEOL) level of a CMOS integrated circuit in a plane parallel to the FBEOL level. The MEMS cantilever switch is separated from the gate and the drain by a sacrificial material, which is ultimately removed to release the MEMS cantilever switch and to provide a gap between the MEMS cantilever switch and the gate and the drain. | 04-17-2014 |
20140152381 | RECONFIGURABLE SWITCHED-CAPACITOR VOLTAGE CONVERTER CIRCUIT, INTEGRATED CIRCUIT (IC) CHIP INCLUDING THE CIRCUIT AND METHOD OF SWITCHING VOLTAGE ON CHIP - A configurable-voltage converter circuit that may be CMOS and an integrated circuit chip including the converter circuit and method of operating the IC chip and circuit. A transistor totem, e.g., of 6 or more field effect transistors, PFETs and NFETs, connected (PNPNPN) between a first supply (V | 06-05-2014 |
20140153328 | COMPLEMENTARY SOI LATERAL BIPOLAR FOR SRAM IN A CMOS PLATFORM - An example embodiment is a memory array. The memory array includes a SOI substrate and lateral bipolar junction transistors (BJTs) fabricated on the SOI substrate. The BJTs form first and second inverters cross coupled to form a memory cell. A read circuit outputs the binary state of the memory cell. A power supply is configured to supply a Vdd voltage to the read circuit and to supply a Vcc and a Vee voltage to the first set of lateral bipolar transistors and the second set of lateral bipolar transistors, wherein the Vee voltage is at least zero volts and the Vcc voltage is greater than the Vee voltage and is equal to or less than the Vdd voltage. | 06-05-2014 |
20140154845 | COMPLEMENTARY SOI LATERAL BIPOLAR FOR SRAM IN A CMOS PLATFORM - An example embodiment is a memory array. The memory array includes a SOI substrate and lateral bipolar junction transistors (BJTs) fabricated on the SOI substrate. The BJTs form first and second inverters cross coupled to form a memory cell. A read circuit outputs the binary state of the memory cell. A power supply is configured to supply a Vdd voltage to the read circuit and to supply a Vcc and a Vee voltage to the first set of lateral bipolar transistors and the second set of lateral bipolar transistors, wherein the Vee voltage is at least zero volts and the Vcc voltage is greater than the Vee voltage and is equal to or less than the Vdd voltage. | 06-05-2014 |
20140175374 | HYBRID CMOS NANOWIRE MESH DEVICE AND FINFET DEVICE - A semiconductor hybrid structure on an SOI substrate. A first portion of the SOI substrate containing a nanowire mesh device and a second portion of the SOI substrate containing a FINFET device. The nanowire mesh device including stacked and spaced apart semiconductor nanowires located on the substrate, each semiconductor nanowire having two end segments in which one of the end segments is connected to a source region and the other end segment is connected to a drain region; and a gate region over at least a portion of the stacked and spaced apart semiconductor nanowires, wherein each source region and each drain region is self-aligned with the gate region. The FINFET device including spaced apart fins on a top semiconductor layer on the second portion of the substrate; and a gate region over at least a portion of the fins. | 06-26-2014 |
20140175375 | HYBRID CMOS NANOWIRE MESH DEVICE AND PDSOI DEVICE - A semiconductor hybrid structure on an SOI substrate. A first portion of the SOI substrate contains a nanowire mesh device and a second portion of the SOI substrate contains a partially depleted semiconductor on insulator (PDSOI) device. The nanowire mesh device includes stacked and spaced apart semiconductor nanowires located on the SOI substrate with each semiconductor nanowire having two end segments in which one of the end segments is connected to a source region and the other end segment is connected to a drain region. The nanowire mesh device further includes a gate region over at least a portion of the stacked and spaced apart semiconductor nanowires. The PDSOI device includes a partially depleted semiconductor layer on the substrate, and a gate region over at least a portion of the partially depleted semiconductor layer. | 06-26-2014 |
20140180984 | TIME-DIVISION MULTIPLEXED NEUROSYNAPTIC MODULE WITH IMPLICIT MEMORY ADDRESSING FOR IMPLEMENTING A UNIVERSAL SUBSTRATE OF ADAPTATION - Embodiments of the invention relate to a time-division multiplexed neurosynaptic module with implicit memory addressing for implementing a universal substrate of adaptation. One embodiment comprises a neurosynaptic device including a memory device that maintains neuron attributes for multiple neurons. The module further includes multiple bit maps that maintain incoming firing events for different periods of delay and a multi-way processor. The processor includes a memory array that maintains a plurality of synaptic weights. The processor integrates incoming firing events in a time-division multiplexing manner. Incoming firing events are integrated based on the neuron attributes and the synaptic weights maintained. | 06-26-2014 |
20140180987 | TIME-DIVISION MULTIPLEXED NEUROSYNAPTIC MODULE WITH IMPLICIT MEMORY ADDRESSING FOR IMPLEMENTING A NEURAL NETWORK - Embodiments of the invention relate to a time-division multiplexed neurosynaptic module with implicit memory addressing for implementing a neural network. One embodiment comprises maintaining neuron attributes for multiple neurons and maintaining incoming firing events for different time steps. For each time step, incoming firing events for said time step are integrated in a time-division multiplexing manner. Incoming firing events are integrated based on the neuron attributes maintained. For each time step, the neuron attributes maintained are updated in parallel based on the integrated incoming firing events for said time step. | 06-26-2014 |
20140310220 | ELECTRONIC SYNAPSES FOR REINFORCEMENT LEARNING - Embodiments of the invention provide electronic synapse devices for reinforcement learning. An electronic synapse is configured for interconnecting a pre-synaptic electronic neuron and a post-synaptic electronic neuron. The electronic synapse comprises memory elements configured for storing a state of the electronic synapse and storing meta information for updating the state of the electronic synapse. The electronic synapse further comprises an update module configured for updating the state of the electronic synapse based on the meta information in response to an update signal for reinforcement learning. The update module is configured for updating the state of the electronic synapse based on the meta information, in response to a delayed update signal for reinforcement learning based on a learning rule. | 10-16-2014 |