Patent application number | Description | Published |
20080210604 | ARTICLE HAVING A CIRCUIT SOLDERED WITH PARTS AND METHOD FOR RECYCLING WASTES OF THE SAME - The disclosure provides an article having a circuit mounted with parts characterized by comprising an electronic part soldered with a lead free solder and having an identification marking indicating no inclusion of lead and an electrical appliance including the same. The present invention also provides a recycling method of wastes of the same. The present invention can offer an article having a circuit mounted with parts and an electrical appliance including the same both of which facilitate identification whether lead which is poisonous to human body is contained or not. | 09-04-2008 |
20090032293 | Electroconductive Bonding Material and Electric/Electronic Device Using the Same - A conductive bonding material having an improved preservation stability, and hardens when desired, preferably immediately hardens at a low temperature is provided. In one invention, the conductive bonding material comprises a conductive particle ingredient, an epoxy resin ingredient, and a hardening agent ingredient for said epoxy resin and the hardening agent ingredient for said epoxy resin further comprise a reforming agent having a thiol group. In another invention, a conductive bonding material comprising an epoxy resin hardening ingredient, wherein said epoxy resin hardening ingredient contains a sulfur-containing compound having an end group which can coordinate with a surface of the metallic particles, and the sulfur-containing compound comes to perform as a hardening agent for the epoxy resin by dissociating from the surface of the metallic particles. The conductive bonding material may contain fragrance. | 02-05-2009 |
20090070994 | METHOD FOR MANUFACTURING CIRCUIT BOARD ON WHICH ELECTRONIC COMPONENT IS MOUNTED - A method for manufacturing a circuit board on which an electronic component is mounted, includes at least the steps of (a) supplying a liquid photo-polymerizable adhesive containing conductive particles dispersed therein to a surface of a printed board, to form an adhesive layer on the board surface; (b) irradiating the photo-polymerizable adhesive with ultraviolet light to turn into a gel, to provide adhesiveness to the adhesive layer; and (c) pressing the electronic component against the component mounting portion of the printed board from an upper surface side of the adhesive layer, to form an electrical connection between the electronic component and the component mounting portion, and in the method, the photo-polymerizable adhesive is a delayed reactive adhesive. | 03-19-2009 |
20090114885 | ELECTRICALLY CONDUCTIVE ADHESIVE - The present invention provides an electrically conductive adhesive which prevents migration and sulfuration of a metal component in electronic component mounting. The electrically conductive adhesive includes a thermosetting resin and metal filler particles dispersed in the thermosetting resin. It is possible to use, as the metal filler particles, metal filler particles having a composition including an alloy of Ag with at least one metal selected from the group consisting of Sn, Cu, In, Bi and Ni, a mixture of such metal filler particles and Ag filler particles, and metal filler particles including Ag filler particles and a coating layer formed on the surface of the Ag filler particles using a metal such as Sn. | 05-07-2009 |
20090116205 | MOUNTED STRUCTURE - A plurality of semiconductor elements is adjacently mounted on a substrate by a solder with a melting point of 200° C. or lower, an electronic part other than the semiconductor elements is mounted on the substrate between the adjacently mounted semiconductor elements by a solder with a melting point of 200° C. or lower, and spaces between the plurality of semiconductor elements and the substrate, spaces between the electronic part and the substrate, and spaces between the plurality of semiconductor elements and the electronic part are integrally molded with a molding resin. | 05-07-2009 |
20090120675 | MOUNTED STRUCTURAL BODY AND METHOD OF MANUFACTURING THE SAME - Including a wiring board having an electronic component mounted at least on a first surface, a resin applied at least between the electronic component and the wiring board, and a through-hole provided in a region corresponding to the mounting position of the electronic component in the wiring board, a protrusion is formed on the wiring board so as to overlap at least with the electronic component, around a region corresponding to the mounting position of the electronic component. | 05-14-2009 |
20090146045 | IMAGING APPARATUS WITH AUTOFOCUS FUNCTION, IMAGING METHOD, STORAGE MEDIUM, AND INTEGRATED CIRCUIT - An imaging apparatus executes AF control without affecting a video signal and prevents video signal qualities in an in-focus state from decreasing. An optical path separation unit | 06-11-2009 |
20090236036 | HEAT CURABLE RESIN COMPOSITION, AND MOUNTING METHOD AND REPARING PROCESS FOR CIRCUIT BOARD USING THE HEAT CURABLE COMPOSITION - A resin composition is provided that makes it possible to prevent low-heat resistant components from being damaged when heated in a process of mounting electronic components on a circuit board. There are also provided a method for easily repairing circuit boards that are determined to be off-specification products in the mounting process, and a method for separating and recovering useful circuit boards and/or electronic components from the circuit boards that are determined to be off-specification products in the mounting process. The resin composition comprises (A) 100 parts by weight of an epoxy resin, (B) 30 to 200 parts by weight of a thiol-based curing agent, (C) 5 to 200 parts by weight of an organic-inorganic composite insulating filler and (D) 0.5 to 20 parts by weight of an imidazole-based curing accelerator. According to the recovering method, the resin composition is softened by heating a part or whole of the circuit board in the mounting process, to a temperature in range not lower than the glass transition point of the resin composition and not higher than 110° C., and separating and recovering the electronic components from the circuit board. | 09-24-2009 |
20090269598 | CONDUCTIVE PASTE AND MOUNTING STRUCTURE USING THE SAME - A conductive paste includes a filler component and a flux component; the filler component including a first conductive filler and a second conductive filler having different melting points, and the melting point of the first conductive filler being higher than the melting point of the second conductive filler by 20° C. or more; the flux component including a first flux and a second flux having different melting points, the melting point of the first flux being higher than the melting point of the second flux, and the melting point of the first flux being higher than the melting point of the second conductive filler by 15° C. to 45° C.; and the melting point of the second flux being equal to or less than the melting point of the second conductive filler. | 10-29-2009 |
20090277678 | SURFACE MOUNT ADHESIVE, MOUNTING STRUCTURE INCLUDING THE SAME, AND METHOD FOR PRODUCING MOUNTING STRUCTURE - A surface mount adhesive includes an epoxy resin, a curing agent, an accelerator, a first filler, and a second filler. The second filler has a specific gravity 1.1 to 3 times that of the first filler, and the second filler has a hardness higher than that of the first filler. The first filler has a largest particle size of 1 to 100 μm, and the second filler has a largest particle size of 1 to 100 μm, a specific gravity of 1.7 to 4.5, and a revised Mohs hardness of to 12. The weight ratio of the first filler to the second filler is from 1:3 to 3:1, and the surface mount adhesive has a specific gravity of 1.2 to 1.5. When the surface mount adhesive is dispensed, dispensing failures are suppressed, and dispensing stability is improved. | 11-12-2009 |
20100002401 | ELECTRONIC COMPONENT PACKAGING STRUCTURE HAVING TWO-LAYER MOISTURE-PROOF COATING AND METHOD FOR MANUFACTURING THE SAME - The electronic component packaging structure having, as the moisture-proof coating layer, a polymer material that has sufficient moisture-proof performance and can be relatively easily peeled off from a circuit board and/or electronic components when repairing can be provided. | 01-07-2010 |
20100006329 | SEALING MATERIAL AND MOUNTING METHOD USING THE SEALING MATERIAL - A sealing material is provided, upon mounting semiconductor devices and/or electronic components which are relatively weak on a circuit board, which shows sealing characteristics that enables itself to seal the semiconductor devices and/or electronic components and connections therebetween with low stress and high reliability; and suitable repairability that enables merely semiconductor devices and/or electronic components which were determined to be off-specification after being sealed to be repaired with ease. The sealing material contains at least (a) a heat-curable resin component and (b) a hardener component therefor, and is characterized in that, once the sealing material is cured by being heated, the cured material has a glass transition temperature (Tg) in a temperature range of from −80° C. to 50° C. | 01-14-2010 |
20100032190 | MOUNTING STRUCTURE AND ELECTRONIC EQUIPMENT - A mounting structure formed by bonding the electrodes of a substantially planar electronic component to the electrodes provided on the mounting surface of a circuit board includes a sealing body 5 formed between one main surface of the electronic component and the circuit board and/or on the other main surface of the electronic component. The sealing body 5 is composed of a plurality of layers having different adhesive strengths and thermal conductivities, wherein a layer having a relatively high adhesion strength is arranged in a region being in contact with either one of the electronic component and the circuit board, and a layer having a relatively high thermal conductivity is arranged in a region being in contact with none of the electronic component and the circuit board. | 02-11-2010 |
20100084174 | SEALING MATERIAL AND MOUNTING METHOD USING THE SEALING MATERIAL - A sealing material is provided which has sealing characteristics with low stress and high reliability upon mounting electronic parts on a board, and good repairablity after the sealing. The sealing material contains a heat-curable resin component and is characterized by ΔE/ΔT in a range of from 0.5 MPa/° C. to 30 MPa/° C. wherein ΔE/ΔT represents a ratio of change (ΔE) in storage elastic modulus (E) relative to a temperature change (ΔT) when the storage elastic modulus (E) is determined as the temperature is raised within a temperature range including a glass transition point (Tg) of the cured sealing material. | 04-08-2010 |
20100101845 | Electronic Device and Manufacturing Method for Electronic Device - An electronic device manufacturing method includes: setting a solder material on electrodes of a first circuit assembly; setting a resin having a flux action on one surface of a second circuit assembly so as to entirely cover solder bumps formed on the one surface of the second circuit assembly; setting the second circuit assembly on the first circuit assembly via the resin so that the solder material set on the electrodes of the first circuit assembly and the solder bumps of the second circuit assembly are put into contact with each other; and applying thermal energy to connecting portions between the solder material and the solder bumps and to the resin. By carrying out these processes, an electronic device in which the first circuit assembly and the second circuit assembly are joined together and in which their junction portions are sealed by the resin is manufactured. As a result, in the electronic device, junction reliability can be improved. | 04-29-2010 |
20100147567 | Thermosetting Resin Composition, Method of Manufacturing the Same and Circuit Board - The object of the invention is to provide a thermosetting resin composition which, in packaging an electronic circuit containing components incapable of withstanding elevated temperatures, employs low-melting solder particles, thereby enabling batch ref lowing and enabling packaging of components with excellent strength and toughness. | 06-17-2010 |
20100159257 | BONDING MATERIAL, BONDED PORTION AND CIRCUIT BOARD - Disclosed is a solder material which enables to realize a lower mounting temperature when an electronic component is mounted. Also disclosed are a solder paste and a conductive adhesive. Specifically disclosed is a solder material having a basic composition composed of Sn, Bi and In. This solder material may further contain at least one metal selected from the group consisting of Cu, Ge and Ni. A solder paste which enables to realize a low-temperature mounting can be obtained by blending a flux component into the solder material. A conductive adhesive which enables to realize a low-temperature mounting can be obtained by blending a resin component into the solder material. | 06-24-2010 |
20100159719 | PACKAGE STRUCTURE - A package structure includes a first printed wiring board having mounted on a top surface a plurality of electronic components including at least one first electronic component, a second printed wiring board stacked on the top surface side of the first printed wiring board, and a plurality of connecting members for mechanically connecting the first and second printed wiring boards while maintaining a constant gap therebetween, the connecting members including a first cured resin for bonding a top surface of the at least one first electronic component to a bottom surface of the second printed wiring board. | 06-24-2010 |
20100224398 | MOUNTING STRUCTURE - In order to easily inject underfill resin and perform molding with reliability, groove sections are formed on a surface of a circuit board such that the ends of the groove sections extend to semiconductor elements. Low-viscosity underfill resin applied dropwise is guided by the groove sections and flows between the circuit board and the semiconductor elements. The underfill resin hardly expands to regions outside the semiconductor elements. | 09-09-2010 |
20100316794 | ELECTROCONDUCTIVE BONDING MATERIAL AND ELECTRIC/ELECTRONIC DEVICE USING THE SAME - A conductive bonding material having an improved preservation stability, and hardens when desired, preferably immediately hardens at a low temperature is provided. In one invention, the conductive bonding material comprises a conductive particle ingredient, an epoxy resin ingredient, and a hardening agent ingredient for said epoxy resin and the hardening agent ingredient for said epoxy resin further comprise a reforming agent having a thiol group. In another invention, a conductive bonding material comprising an epoxy resin hardening ingredient, wherein said epoxy resin hardening ingredient contains a sulfur-containing compound having an end group which can coordinate with a surface of the metallic particles, and the sulfur-containing compound comes to perform as a hardening agent for the epoxy resin by dissociating from the surface of the metallic particles. The conductive bonding material may contain fragrance. | 12-16-2010 |
20110049439 | ELECTRICALLY CONDUCTIVE PASTE, AND ELECTRICAL AND ELECTRONIC DEVICE COMPRISING THE SAME - Disclosed is an electrically conductive paste which enables to reduce the level of void growth in a conducting pathway formed in a joint part produced after curing the electrically conductive paste in the implementation of an electronic component on a circuit board by using the electrically conductive paste, and which contains a reduced amount of a viscosity-adjusting/thixotropy-imparting additive. Two Sn-containing low-melting-point alloy particles having different melting points and different average particle diameters are selected as electrically conductive filler components to be used in an electrically conductive paste, and the two alloy particles are mixed at a predetermined ratio for use. | 03-03-2011 |
20110095423 | SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD - A semiconductor device mounted structure includes a semiconductor device having a plurality first electrodes, a circuit board having a plurality of second electrodes, a plurality of bumps respectively formed on the plurality of first electrodes, a plurality of bonding members respectively positioned between the bumps and the second electrodes to electrically connect the first electrodes to the second electrodes via the bumps, and a plurality of reinforcing resin members respectively positioned around the bonding members so as to cover at least the bonding members and bonding regions between the bonding members and the bumps. Adjacent reinforcing resin members are spaced away from each other so as not to have contact with each other without being in contact with the semiconductor device. This semiconductor device mounted structure enhances the reliability of joints in impact resistance and makes it easy to repair it. | 04-28-2011 |
20110108997 | MOUNTING METHOD AND MOUNTING STRUCTURE FOR SEMICONDUCTOR PACKAGE COMPONENT - A semiconductor package component ( | 05-12-2011 |
20110110050 | STRUCTURE WITH ELECTRONIC COMPONENT MOUNTED THEREIN AND METHOD FOR MANUFACTURING SUCH STRUCTURE - A structure with electronic component mounted therein includes a wiring board on which an electronic component is mounted at least on its first face, resin provided at least between the electronic component and the wiring board, and a plurality of holes formed in the wiring board at region corresponding to a mounting position of the electronic component. The holes are filled with the resin. This suppresses warpage of the structure with electronic component mounted therein, and also improves reliability by reducing a stress applied to a bonding section between the wiring board and the electronic component. | 05-12-2011 |
20110252911 | Work Vehicle - There are provided a forward/reverse switchover lever pivotally operably about, as a pivotal center, a position which is inwardly of an outer periphery of a steering wheel and laterally outer side of vehicle body of a rotational axis of the steering wheel as seen in a direction along the rotational axis and a pivotal support shaft pivotally supporting the forward/reverse switchover lever at a position lower than the steering wheel such that a pivotal end of the forward/reverse switchover lever projects to the laterally outer side beyond the outer periphery of the steering wheel. | 10-20-2011 |
20120073869 | CONDUCTIVE ADHESIVE, AND CIRCUIT BOARD AND ELECTRONIC COMPONENT MODULE USING THE SAME - A conductive adhesive includes 10 to 90 wt % of Sn—Bi system solder powder and the remainder of an adhesive containing organic acid, and the Sn—Bi system solder powder is composed of solder particles having a particle size L | 03-29-2012 |
20120299202 | MOUNTING STRUCTURE OF SEMICONDUCTOR PACKAGE COMPONENT AND MANUFACTURING METHOD THEREFOR - A manufacturing method for a mounting structure of a semiconductor package component, including: applying a first adhesive with viscosity η | 11-29-2012 |
20120320539 | PACKAGE STRUCTURE, METHOD FOR MANUFACTURING SAME, AND METHOD FOR REPAIRING PACKAGE STRUCTURE - A package structure including an electronic component | 12-20-2012 |
20130037314 | BONDING MATERIAL, BONDED PORTION AND CIRCUIT BOARD - Disclosed is a solder material which enables to realize a lower mounting temperature when an electronic component is mounted. Also disclosed are a solder paste and a conductive adhesive. Specifically disclosed is a solder material having a basic composition composed of Sn, Bi and In. This solder material may further contain at least one metal selected from the group consisting of Cu, Ge and Ni. A solder paste which enables to realize a low-temperature mounting can be obtained by blending a flux component into the solder material. A conductive adhesive which enables to realize a low-temperature mounting can be obtained by blending a resin component into the solder material. | 02-14-2013 |
20130215106 | CURSOR MERGING DEVICE AND CURSOR MERGING METHOD - With a cursor merging device, an image parallax detector detects subject-use parallax information about a subject-use stereoscopic image indicated by cursor position information. A proper parallax range determination component sets a proper parallax range, which is the range of proper parallax. A cursor parallax production component sets cursor parallax information so that the parallax of a cursor is included in a proper parallax range. A cursor stereoscopic image production component produces a cursor-use stereoscopic image on the basis of cursor parallax information. A cursor stereoscopic image merging component | 08-22-2013 |
20130237645 | THERMOSETTING RESIN COMPOSITION, METHOD OF MANUFACTURING THE SAME AND CIRCUIT BOARD - The invention relates to a thermosetting resin composition which includes a metal filler component, a fluxing component and a thermosetting resin binder. The metal filler component includes at least one of bismuth (Bi) and indium (In), and tin (Sn). The fluxing component, which at least one of a compound of structural formula (1) below and a compound of structural formula (2) below, is used. | 09-12-2013 |
20140049930 | MOUNTED STRUCTURE AND MANUFACTURING METHOD OF MOUNTED STRUCTURE - In a case where a first mounted substrate to which a semiconductor element is bounded by solder is mounted on a second substrate, connection strength becomes low, when the first mounted substrate is bonded to the second substrate by using a solder having a low melting point. A mounted structure, in which a first mounted substrate on which a semiconductor element is bonded by using a first solder having a melting point of 217° C. or more, is mounted on a second substrate, includes plural bonding parts bonding the first mounted substrate to the second substrate; and a reinforcing member formed around the bonding part. Each of the bonding parts contains a second solder having a melting point, that is lower than the melting point of the first solder, and a space exists, in which the reinforcing members do not exist, between the bonding parts neighboring each other. | 02-20-2014 |
20140120663 | MOUNTING METHOD AND MOUNTING STRUCTURE FOR SEMICONDUCTOR PACKAGE COMPONENT - A semiconductor package component ( | 05-01-2014 |