Patent application number | Description | Published |
20090042926 | Niacin Receptor Agonists, Compositions Containing Such Compounds and Methods of Treatment - The present invention encompasses compounds of Formula (I): as well as pharmaceutically acceptable salts and hydrates thereof, that are useful for treating atherosclerosis, dyslipidemias and the like. Pharmaceutical compositions and methods of use are also included. | 02-12-2009 |
20090170891 | Niacin Receptor Agonists, Compositions Containing Such Compounds and Methods of Treatment - The present invention encompasses compounds of Formula I: | 07-02-2009 |
20090258862 | Niacin receptor agonists, compositions containing such compounds and methods of treatment - Compounds of the formula (I): as well as pharmaceutically acceptable salts and solvates are disclosed. The compounds are useful for treating dyslipidemias, and in particular, reducing serum LDL, VLDL and triglycerides, and raising HDL levels. Pharmaceutical compositions and methods of treatment are also included. | 10-15-2009 |
20100144778 | Niacin Receptor Agonists, Compositions Containing Such Compounds and Methods of Treatment - The present invention encompasses compounds of Formula (I): as well as pharmaceutically acceptable salts and hydrates thereof, that are useful for treating atherosclerosis, dyslipidemias and the like. Pharmaceutical compositions and methods of use are also included. | 06-10-2010 |
20100197691 | SOLUBLE EPOXIDE HYDROLASE INHIBITORS, COMPOSITIONS CONTAINING SUCH COMPOUNDS AND METHODS OF TREATMENT - Compounds of the Formula: (I) as well as pharmaceutically acceptable salts and hydrates thereof, that are useful for treating hypertension, diabetes, inflammation, atherosclerosis, pain, and the like are disclosed. Pharmaceutical compositions and methods of use are also included. | 08-05-2010 |
20110003849 | SOLUBLE EPOXIDE HYDROLASE INHIBITORS, COMPOSITIONS CONTAINING SUCH COMPOUNDS AND METHODS OF TREATMENT - Compounds of the formula: as well as pharmaceutically acceptable salts and hydrates thereof, that are useful for treating diabetes, inflammation, atherosclerosis, hypertension, pain and the like are disclosed. Pharmaceutical compositions and methods of use are also included. | 01-06-2011 |
20120178750 | Niacin Receptor Agonists, Compositions Containing Such Compounds and Methods of Treatment - The present invention encompasses compounds of Formula I: | 07-12-2012 |
20130012511 | SOLUBLE GUANYLATE CYCLASE ACTIVATORS - The invention relates to compounds having the structure of Formula (I) and pharmaceutically acceptable salts thereof, which are soluble guanylate cyclase activators. The compounds are capable of modulating the body's production of cyclic guanosine monophosphate (“cGMP”) and are generally suitable for the therapy and prophylaxis of diseases which are associated with a disturbed cGMP balance. The compounds are useful for treatment or prevention of cardiovascular diseases, endothelial dysfunction, diastolic dysfunction, atherosclerosis, hypertension, pulmonary hypertension, angina pectoris, thromboses, restenosis, myocardial infarction, strokes, cardiac insufficiency, pulmonary hypertonia, erectile dysfunction, asthma bronchiale, chronic kidney insufficiency, diabetes, or cirrhosis of the liver. | 01-10-2013 |
20130023515 | NOVEL SPIROPIPERIDINE PROLYLCARBOXYPEPTIDASE INHIBITORS - Compounds of structural formula (I) are inhibitors of prolylcarboxypeptidase (PrCP). The compounds of the present invention are useful for the prevention and treatment of conditions related to enzymatic activity of PrCP such as abnormal metabolism, including obesity; diabetes; metabolic syndrome; obesity related disorders; and diabetes related disorders. | 01-24-2013 |
20130331419 | MINERALOCORTICOID RECEPTOR ANTAGONISTS - Disclosed are the compounds of the Formula (I) as well as pharmaceutically acceptable salts thereof, which are useful for treating aldosterone-mediated diseases. The processes for preparing compounds of the Formula (I), the use for the therapy and prophylaxis of the abovementioned diseases and for preparing pharmaceuticals for this purpose, and the pharmaceutical compositions which comprise compounds of the formula (I) are disclosed too. | 12-12-2013 |
20140336224 | MINERALOCORTICOID RECEPTOR ANTAGONISTS - Compounds of the Formula (I) as well as pharmaceutically acceptable salts thereof, that may be useful for treating aldosterone-mediated diseases are disclosed. Processes for preparing compounds of the Formula (I), use of the compounds for the therapy and prophylaxis of the abovementioned diseases and for preparing pharmaceuticals for this purpose, and pharmaceutical compositions which comprise compounds of the Formula (I) are disclosed. | 11-13-2014 |
Patent application number | Description | Published |
20090088560 | Process for Nucleic Acid Purification - This invention provides a method of isolating and purifying nucleic acid using a binding buffer comprising a sodium- or potassium-ion-containing solution with the final concentrations of either sodium- or potassium-ion concentration of at least about 500 mM, preferably greater than about 1 M to saturate, and the pH of such solution of being adjusted in the range of about 2.0 to 5.0, for reversible binding of the nucleic acid to a silicon-containing matrix. The invention further provides a method of increasing reversible binding of the nucleic acid to a silicon-containing matrix using the binding buffer of the invention in addition to 20% to 50% (v/v) of a water-soluble organic solvent, e.g., ethanol. Nucleic acid obtained thereof that is free of chaotropes and other toxic chemicals, and nucleic acid purification kits comprising the binding buffer of the invention are also provided. | 04-02-2009 |
20100105656 | TRIAZOLOPYRAZINE DERIVATIVES - The invention relates to compounds of the formula I | 04-29-2010 |
20100324061 | ENANTIOMERICALLY PURE AMINOHETEROARYL COMPOUNDS AS PROTEIN KINASE INHIBITORS - Enantiomerically pure compound of formula 1 | 12-23-2010 |
20120263706 | ENANTIOMERICALLY PURE AMINOHETEROARYL COMPOUNDS AS PROTEIN KINASE INHIBITORS - Enantiomerically pure compound of formula 1 | 10-18-2012 |
20130196952 | HETEROCYCLIC DERIVATIVES FOR THE TREATMENT OF DISEASES - The invention relates to compounds of Formula (1) and to processes for the preparation of intermediates used in the preparation of compositions containing and the uses of such derivatives. The compounds according to the present invention are useful in numerous diseases in which ALK protein is involved or in which inhibition of ALK activity may induce benefit, especially for the treatment of cancer mediated by a mutated EML4-ALK fusion protein. | 08-01-2013 |
20140288086 | ENANTIOMERICALLY PURE AMINOHETEROARYL COMPOUNDS AS PROTEIN KINASE INHIBITORS - Enantiomerically pure compound of formula 1 | 09-25-2014 |
20150291604 | DIHYDROPYRROLOPYRIMIDINE DERIVATIVES - The present invention relates to compounds of formula (X) | 10-15-2015 |
Patent application number | Description | Published |
20080285830 | Computer Aided Lesion Assessment in Dynamic Contrast Enhanced Breast MRI Images - A method for performing computer-assisted lesion assessment includes acquiring contrast enhanced MRI data. A region of interest is identified. Kinetic properties, morphological properties and pattern of enhancement are determined for the identified region of interest. A score is calculated for each of the kinetic properties, morphological properties, pattern of enhancement. A cumulative score is calculated for the identified region of interest. The scores are provided to a medical practitioner to assist in diagnosing the identified region of interest. | 11-20-2008 |
20080287796 | Method and system for spine visualization in 3D medical images - A method and system for visualizing the spine in 3D medical images is disclosed. A spinal cord centerline is automatically determined in a 3D medical image volume, such as a CT volume. A reformatted image volume is then generated based on the spinal cord centerline. The reformatted image volume can be a straightened spine volume or a Multi-planar Reconstruction (MPR) based volume that follows the natural curve of the spine. The reconstructed volume can be displayed as 2D slices or 3D volume renderings. | 11-20-2008 |
20090041328 | Feature Processing For Lung Nodules In Computer Assisted Diagnosis - Feature processing is provided for lung nodules in computer-assisted diagnosis. A feature that may better distinguish nodules from background is extracted using a Hough transform. Rather than relying on a specific boundary shape, the Hough transform accumulates evidence associated with a region, such as a ring region. The accumulated evidence provides a feature score without requiring a nodule to fit a specific shape. In another approach, a background level is determined from extracted features. Rather than attempting to normalize an image prior to extraction, the features are normalized. The feature normalization and generalized Hough transform extraction may be used together or alone. | 02-12-2009 |
20090087072 | Method and system for diaphragm segmentation in chest X-ray radiographs - A method and system for segmenting diaphragm regions in a chest X-ray radiograph is disclosed. The diaphragm regions are segmented based on left and right lung lobe regions and a heart region in the chest X-ray radiograph. A right diaphragm region is segmented in the chest X-ray radiograph based a boundary of the right lung lobe. A left diaphragm region is segmented in the chest X-ray radiograph based on the heart region and a boundary of the left lung lobe. | 04-02-2009 |
20090103797 | Method and system for nodule feature extraction using background contextual information in chest x-ray images - A method and system for nodule feature extract using background contextual information in chest x-ray images is disclosed. In order to detect false positives in nodule candidates for a chest x-ray image, background contextual information, such as contextual vessel tree information, is defined in the chest x-ray image. Features are extracted for each nodule candidate based on the background contextual information, and the extracted features are used to detect whether each nodule candidate is a false positive or a genuine nodule. | 04-23-2009 |
20090116737 | Machine Learning For Tissue Labeling Segmentation - A method for directed machine learning includes receiving features including intensity data and location data of an image, condensing the intensity data and the location data into a feature vector, processing the feature vector by a plurality of classifiers, each classifier trained for a respective trained class among a plurality of classes, outputting, from each classifier, a probability of the feature vector belong to the respective trained class, and assigning the feature vector a label according to the probabilities of the classifiers, wherein the assignment produces a segmentation of the image. | 05-07-2009 |
Patent application number | Description | Published |
20130193573 | METHODS OF STRESS BALANCING IN GALLIUM ARSENIDE WAFER PROCESSING - Systems, apparatuses, and methods related to the design, fabrication, and manufacture of gallium arsenide (GaAs) integrated circuits are disclosed. Copper can be used as the contact material for a GaAs integrated circuit. Metallization of the wafer and through-wafer vias can be achieved through copper plating processes disclosed herein. To avoid warpage, the tensile stress of a conductive layer deposited onto a GaAs substrate can be offset by depositing a compensating layer having negative stress over the GaAs substrate. GaAs integrated circuits can be singulated, packaged, and incorporated into various electronic devices. | 08-01-2013 |
20130193575 | OPTIMIZATION OF COPPER PLATING THROUGH WAFER VIA - Systems, apparatuses, and methods related to the design, fabrication, and manufacture of gallium arsenide (GaAs) integrated circuits are disclosed. Copper can be used as the contact material for a GaAs integrated circuit. Metallization of the wafer and through-wafer vias can be achieved through copper plating processes disclosed herein. To improve the copper plating, a seed layer formed in the through-wafer vias can be modified to increase water affinity, rinsed to remove contaminants, and activated to facilitate copper deposition. GaAs integrated circuits can be singulated, packaged, and incorporated into various electronic devices. | 08-01-2013 |
20130249095 | GALLIUM ARSENIDE DEVICES WITH COPPER BACKSIDE FOR DIRECT DIE SOLDER ATTACH - Systems, apparatuses, and methods related to the design, fabrication, and manufacture of gallium arsenide (GaAs) integrated circuits are disclosed. Copper can be used as the contact material for a GaAs integrated circuit. Metallization of the wafer and through-wafer vias can be achieved through copper plating processes disclosed herein. Direct die solder (DDS) attach can be achieved by use of electroless nickel plating of the copper contact layer followed by a palladium flash. GaAs integrated circuits can be singulated, packaged, and incorporated into various electronic devices. | 09-26-2013 |
20130299985 | PROCESS FOR FABRICATING GALLIUM ARSENIDE DEVICES WITH COPPER CONTACT LAYER - Systems, apparatuses, and methods related to the design, fabrication, and manufacture of gallium arsenide (GaAs) integrated circuits are disclosed. Copper can be used as the contact material for a GaAs integrated circuit. Metallization of the wafer and through-wafer vias can be achieved through copper plating processes disclosed herein. Various protocols can be employed during processing to avoid cross-contamination between copper-plated and non-copper-plated wafers. GaAs integrated circuits can be singulated, packaged, and incorporated into various electronic devices. | 11-14-2013 |
20140002188 | POWER AMPLIFIER MODULES INCLUDING RELATED SYSTEMS, DEVICES, AND METHODS | 01-02-2014 |
20150262902 | INTEGRATED CIRCUITS PROTECTED BY SUBSTRATES WITH CAVITIES, AND METHODS OF MANUFACTURE | 09-17-2015 |
20150318344 | MAKING ELECTRICAL COMPONENTS IN HANDLE WAFERS OF INTEGRATED CIRCUIT PACKAGES - A method for making an integrated circuit package includes providing a handle wafer having a first region defining a cavity. A capacitor is formed in the first region. The capacitor has a pair of electrodes, each coupled to one of a pair of conductive pads, at least one of which is disposed on a lower surface of the handle wafer. An interposer having an upper surface with a conductive pad and at least one semiconductor die disposed thereon is also provided. The die has an integrated circuit that is electroconductively coupled to a redistribution layer (RDL) of the interposer. The lower surface of the handle wafer is bonded to the upper surface of the interposer such that the die is disposed below or within the cavity and the electroconductive pad of the handle wafer is bonded to the electroconductive pad of the interposer in a metal-to-metal bond. | 11-05-2015 |
20150327367 | CIRCUIT ASSEMBLIES WITH MULTIPLE INTERPOSER SUBSTRATES, AND METHODS OF FABRICATION - A combined interposer ( | 11-12-2015 |
20150364538 | MAKING MULTILAYER 3D CAPACITORS USING ARRAYS OF UPSTANDING RODS OR RIDGES - In one embodiment, a method for making a 3D Metal-Insulator-Metal (MIM) capacitor includes providing a substrate having a surface, forming an array of upstanding rods or ridges on the surface, depositing a first layer of an electroconductor on the surface and the array of rods or ridges, coating the first electroconductive layer with a layer of a dielectric, and depositing a second layer of an electroconductor on the dielectric layer. In some embodiments, the array of rods or ridges can be made of a photoresist material, and in others, can comprise bonded wires. | 12-17-2015 |
Patent application number | Description | Published |
20140307289 | DIGITAL PRINTING SYNCHRONOUS CONTROL DEVICE AND CONTROL METHOD THEREOF - The present invention provides a digital inkjet printing synchronous control device, which comprises: a storage unit, for storing data of various colored surfaces; a control unit, for controlling an interactive processing unit to perform data receiving, storage and sending as well as generation of a printing trigger signal; and the interactive processing unit, under the control of the control unit, for receiving from a front-end system of a digital inkjet printing apparatus the data of the colored surfaces, storing the received data into the storage unit, sending the stored data to a back-end system of the digital inkjet printing apparatus, generating, according to a signal from a peripheral encoder and/or color code sensor of the digital inkjet printing apparatus, printing trigger signals of the colored surfaces, and sending the printing trigger signals to the back-end system of the digital inkjet printing apparatus. Correspondingly, the present invention provides a digital inkjet printing synchronous control method. Therefore, continuous printing of pages having different sizes and multiple colored surfaces can be implemented. | 10-16-2014 |
20140313249 | METHOD AND APPARATUS FOR CONTROLLING MULTICOLOR OVERPRINT OF INTERMITTENT PRINT DEVICE - Disclosed are a multicolour overprint control method and device applicable to an intermittent printing apparatus. According to the operating characteristic of the intermittent printing apparatus, the method solves the problems of overlap and inaccurate overprint of various colours during intermittent printing by controlling the relationship between the distance between adjacent colour group modules of different colours and the motion distance between uniform segments of the intermittent printing apparatus. In addition, the method also sets different inkjet printing modes in accordance with whether the detected inkjet printing of the same colour group module is in a first period, thereby solving the problems of printing media waste and discontinuous printing data. The method achieves multicolour digital inkjet printing by combining the unique motion mode of the printing media thereof, and makes printing contents flexible and changeable on the basis of guaranteeing printing efficiency. | 10-23-2014 |
Patent application number | Description | Published |
20150115393 | METHODS OF STRESS BALANCING IN GALLIUM ARSENIDE WAFER PROCESSING - Systems, apparatuses, and methods related to the design, fabrication, and manufacture of gallium arsenide (GaAs) integrated circuits are disclosed. Copper can be used as the contact material for a GaAs integrated circuit. Metallization of the wafer and through-wafer vias can be achieved through copper plating processes disclosed herein. To avoid warpage, the tensile stress of a conductive layer deposited onto a GaAs substrate can be offset by depositing a compensating layer having negative stress over the GaAs substrate. GaAs integrated circuits can be singulated, packaged, and incorporated into various electronic devices. | 04-30-2015 |
20150262928 | INTERPOSERS WITH CIRCUIT MODULES ENCAPSULATED BY MOLDABLE MATERIAL IN A CAVITY, AND METHODS OF FABRICATION - Stacked dies ( | 09-17-2015 |
20150326181 | POWER AMPLIFIER MODULES INCLUDING RELATED SYSTEMS, DEVICES, AND METHODS - A power amplifier module includes a power amplifier including a GaAs bipolar transistor having a collector, a base abutting the collector, and an emitter, the collector having a doping concentration of at least about 3×10 | 11-12-2015 |
20150326182 | POWER AMPLIFIER MODULES INCLUDING RELATED SYSTEMS, DEVICES, AND METHODS - A power amplifier module includes a power amplifier including a GaAs bipolar transistor having a collector, a base abutting the collector, and an emitter, the collector having a doping concentration of at least about 3×10 | 11-12-2015 |
20150326183 | POWER AMPLIFIER MODULES INCLUDING RELATED SYSTEMS, DEVICES, AND METHODS - One aspect of this disclosure is a power amplifier module that includes a power amplifier die including a power amplifier configured to amplify a radio frequency (RF) signal, the power amplifier including a heterojunction bipolar transistor (HBT) and a p-type field effect transistor (PFET), the PFET including a semiconductor segment that includes substantially the same material as a layer of a collector of the HBT, the semiconductor segment corresponding to a channel of the PFET; a load line electrically connected to an output of the power amplifier and configured to provide impedance matching at a fundamental frequency of the RF signal; and a harmonic termination circuit electrically connected to the output of the power amplifier and configured to terminate at a phase corresponding to a harmonic frequency of the RF signal. Other embodiments of the module are provided along with related methods and components thereof. | 11-12-2015 |
20150357272 | INTEGRATED INTERPOSER SOLUTIONS FOR 2D AND 3D IC PACKAGING - An integrated circuit (IC) package includes a first substrate having a backside surface and a top surface with a cavity disposed therein. The cavity has a floor defining a front side surface. A plurality of first electroconductive contacts are disposed on the front side surface, and a plurality of second electroconductive contacts are disposed on the back side surface. A plurality of first electroconductive elements penetrate through the first substrate and couple selected ones of the first and second electroconductive contacts to each other. A first die containing an IC is electroconductively coupled to corresponding ones of the first electroconductive contacts. A second substrate has a bottom surface that is sealingly attached to the top surface of the first substrate, and a dielectric material is disposed in the cavity so as to encapsulate the first die. | 12-10-2015 |
20150364411 | GALLIUM ARSENIDE DEVICES WITH COPPER BACKSIDE FOR DIRECT DIE SOLDER ATTACH - Electronic devices, and methods of manufacturing the electronic devices, utilizing direct die soldering of GaAs integrated circuit dies. In some embodiments, the GaAs integrated circuit die can have a footprint approximately the same size as a die attach pad. Further, the GaAs integrated circuit die can self-align with the die attach pad after reflow of any solder layer used to attach the die. | 12-17-2015 |
20150371938 | BACK-END-OF-LINE STACK FOR A STACKED DEVICE - Apparatus relating generally to a back-end-of-line (“BEOL”) stack. In this apparatus, the BEOL stack is configured to electrically couple at least one first electrical component to at least one second electrical component. First contacts are provided on a first side of the BEOL stack with a first pitch for providing a bondable surface for connection to the at least one first electrical component. Second contacts are provided on a second side of the BEOL stack with a second pitch for providing another bondable surface for connection to the at least one second electrical component. The second pitch may be larger than the first pitch. | 12-24-2015 |
20160049361 | MAKING ELECTRICAL COMPONENTS IN HANDLE WAFERS OF INTEGRATED CIRCUIT PACKAGES - A method for making an integrated circuit package includes providing a handle wafer having a first region defining a cavity. A capacitor is formed in the first region. The capacitor has a pair of electrodes, each coupled to one of a pair of conductive pads, at least one of which is disposed on a lower surface of the handle wafer. An interposer having an upper surface with a conductive pad and at least one semiconductor die disposed thereon is also provided. The die has an integrated circuit that is electroconductively coupled to a redistribution layer (RDL) of the interposer. The lower surface of the handle wafer is bonded to the upper surface of the interposer such that the die is disposed below or within the cavity and the electroconductive pad of the handle wafer is bonded to the electroconductive pad of the interposer in a metal-to-metal bond. | 02-18-2016 |
20160071818 | MULTICHIP MODULES AND METHODS OF FABRICATION - In a multi-chip module (MCM), a “super” chip ( | 03-10-2016 |