Patent application number | Description | Published |
20090105485 | HISTONE DEACETYLASE INHIBITORS - Compounds, pharmaceutical compositions, kits and methods are provided for use with HDAC that comprise a compound selected from the group consisting of: | 04-23-2009 |
20090111996 | HISTONE DEACETYLASE INHIBITORS - Compounds, pharmaceutical compositions, kits and methods are provided for use with HDAC that comprise a compound selected from the group consisting of: | 04-30-2009 |
20100063054 | cMET INHIBITORS - Compounds of the following formula are provided for use with cMET: | 03-11-2010 |
20100093767 | Mitotic Kinase Inhibitors - The invention relates to inhibitors of enzymes that disrupt the assembly and function of the mitotic spindle, compositions comprising the inhibitors of Formula (I), kits and articles of manufacture comprising the inhibitors and inhibitor compositions, and methods of using the inhibitors and inhibitor compositions. The inhibitors and inhibitor compositions are useful for treating, preventing or modulating diseases in which mitotic kinesins, including kinesin-like spindle protein (KSP), may be involved; symptoms of such diseases; or the effect of other physiological events mediated by mitotic kinesins, including KSP. | 04-15-2010 |
Patent application number | Description | Published |
20090122310 | METHOD OF MAKING MICROARRAYS - Provided is a method of making microarrays that includes providing a substrate with discrete first microfeatures that have a first profile, and depositing vapor-coated materials onto the first microfeatures to form second microfeatures having a second profile that is substantially different from the first profile. Also provided is a method of adding a replication material to the vapor-coated microfeatures to form a mold. Microarrays made by this method can be used as substrates for surface-enhanced Raman spectroscopy (SERS). | 05-14-2009 |
20090162799 | METHOD AND SYSTEM FOR FABRICATING THREE-DIMENSIONAL STRUCTURES WITH SUB-MICRON AND MICRON FEATURES - A method and system are provided for fabricating three-dimensional (3D) structures having micron or submicron features. The method includes providing a continuously-formed relief structured material, the relief structured material having a first layer comprising a material having a pattern of relief structures formed on a first surface thereof. The structured material includes second layer comprising a photosensitive material that is disposed on the first layer. The relief structured material is exposed to radiation through the first layer, where the pattern of relief structures formed on the first surface of the first layer generates a 3-dimensional light intensity pattern of the radiation that is incident on the second layer. The exposed material is developed, where the developed material comprises a plurality of 3D structures having micron or submicron features. | 06-25-2009 |
20110240476 | FABRICATION OF CONDUCTIVE NANOSTRUCTURES ON A FLEXIBLE SUBSTRATE - Provided is a method of fabricating a continuous nanostructured material having an electrodeposited surface layer. A conductive master drum having a relief pattern on its surface that exposes only a portion of the master drum surface is immersed into a plating bath. An electrodepositable material is coated onto the exposed surface of the drum. A support material is coated over the deposited layer and the relief structure. Removal from the drum yields the nanostructured material. | 10-06-2011 |
20130230061 | FIBER LASER CAVITY OPTICAL ENGINE PACKAGE AND METHOD OF MAKING THE SAME - Embodiments of the invention include a fiber laser cavity package having improved fiber management and thermal management capability and methods of making such fiber laser cavity package. Each element of the fiber laser cavity is grouped into plurality of sections and each section is placed onto a heat conducting surface within the fiber laser cavity package to dissipate unwanted heat from the elements. When the fiber laser cavity is stored in the package, the fiber laser cavity is arranged such that fiber crossings are substantially reduced or eliminated within the package. | 09-05-2013 |