Patent application number | Description | Published |
20090039550 | IMPRINT METHOD AND IMPRINT APPARATUS - An imprint method, includes the steps of: preparing a substrate; placing an uncured resin material on the substrate; preparing a mold having a first end and a second end; placing the mold to oppose the substrate at a position not sandwiching the resin material, wherein a first gap between the first end and the substrate and a second gap between the second end and the substrate are different from each other; imparting a relative movement between the substrate and the mold so that the resin material approaches the first end of the mold and enters through the first gap and fills at least a part of a space between the mold and the substrate; and changing at least one of the first and second gaps in the state that the resin material is present between the mold and the substrate. | 02-12-2009 |
20090098688 | IMPRINT METHOD, CHIP PRODUCTION PROCESS, AND IMPRINT APPARATUS - An imprint method is constituted by a step of curing a resin material formed on a substrate in a state in which an imprint pattern of a mold is in contact or proximity with the resin material, and a step of parting the mold from the cured resin material. The parting is effected while irradiating an entire area in which the imprint pattern of the mold is formed and the cured resin material with an electromagnetic wave for ionizing gaseous molecules in an atmosphere in which the mold and the cured resin material are placed. | 04-16-2009 |
20090152239 | PROCESS FOR PRODUCING A CHIP USING A MOLD - A mold capable of a highly accurate alignment with a member to be processed in such a state that a photocurable resin material is disposed between the mold and the member to be processed, and is constituted by a substrate | 06-18-2009 |
20090152753 | MOLD, IMPRINT METHOD, AND PROCESS FOR PRODUCING A CHIP - A mold capable of a highly accurate alignment with a member to be processed in such a state that a photocurable resin material is disposed between the mold and the member to be processed, and is constituted by a substrate | 06-18-2009 |
20090166317 | METHOD OF PROCESSING SUBSTRATE BY IMPRINTING - A method of processing a substrate includes applying a resin on the substrate, imprinting a pattern of a mold onto the resin, the pattern including protrusions and recesses, forming a protective layer over the resin, etching the protective layer so that the protrusions of the pattern imprinted in the resin are exposed and the protective layer in the recesses of the pattern in the resin remains, etching the exposed protrusions of the pattern, to expose the substrate, while using the protective layer as a mask to prevent areas covered by the protective layer from being etched, so that a reverse pattern is formed on the protective layer, which has a structure reversed from the pattern imprinted on the resin, and etching the exposed substrate, to etch a pattern in the substrate, while using the reverse pattern as a mask to prevent areas covered by the protective layer from being etched. | 07-02-2009 |
20090189306 | MANUFACTURING METHOD OF STRUCTURE BY IMPRINT - A manufacturing method of a structure by an imprint process includes a first imprint step of forming a first resin material layer by applying a first resin material onto a substrate and then transferring an imprint pattern of a mold onto the first resin material layer, a second imprint step of forming a second resin material layer by applying a second resin material onto the first resin material layer formed in the first imprint step and onto an area of the substrate adjacent to the first resin material layer and then transferring the imprint pattern of the mold onto the second resin material layer, and a step of forming a pattern by etching the first and second resin material layers. | 07-30-2009 |
20100173032 | IMPRINT METHOD AND IMPRINT APPARATUS - An imprint apparatus in which a mold having a processing surface on which a predetermined imprint is formed is provided and an uncured resin material placed on a substrate is filled and cured in a space between the mold and the substrate and is subjected to imprint of the predetermined imprint formed on the processing surface of the mold. The imprint apparatus includes an attitude control mechanism for controlling attitudes of the mold and the substrate so that a first gap between a first end of the mold and the substrate and a second gap between a second end of the mold and the substrate are different from each other, and a measuring mechanism for measuring attitudes and positions of the mold and the substrate. Also provided is a mechanism for imparting a relative movement between the substrate and the mold so that the resin material approaches the first end of the mold and enters through the first gap and fills at least a part of the space between the mold and the substrate. | 07-08-2010 |
20100233432 | IMPRINT METHOD AND PROCESSING METHOD OF SUBSTRATE - An imprint method in which imprinting of a pattern of a mold onto a resin material on a substrate is repeated multiple times. The imprint method includes the steps of preparing the mold including a light blocking member at a position where the pattern is not formed, forming a pattern for the first time by bringing the mold into contact with a photocurable resin material provided on the substrate, forming a first processed area by curing the photocurable resin material by light irradiation, and removing a part of the photocurable resin material extruded from the first processed area into an outside area at a periphery of the first processed area. | 09-16-2010 |
20100270705 | IMPRINT METHOD AND IMPRINT APPARATUS - An imprint method for imprinting an imprint pattern provided to a mold onto a pattern forming layer formed on a substrate is constituted by a first step of effecting alignment between the substrate and the mold with feedback control; a second step of bringing the mold and the pattern forming layer into contact with each other; a third step of curing the pattern forming layer; and a fourth step of increasing a gap between the substrate and the mold. The imprint method further includes a step of stopping the feedback control between the first step and the second step and/or between the second step and the third step. | 10-28-2010 |
20110042352 | IMPRINT METHOD AND PROCESSING METHOD OF SUBSTRATE USING THE IMPRINT METHOD - An imprint method for imprinting a pattern of a mold onto a resin material on a substrate. The imprint method includes a step of forming a processed area in which an imprint pattern corresponding to the pattern of the mold is formed, and an outside area formed of a periphery of the processed area, by bringing the mold into contact with the resin material formed on the substrate, so that a portion of the resin material is extruded from the processed area into the outside area, a step of forming a protection layer for protecting the processed area, and a step of removing a layer of the resin material in the outside area, while the imprint pattern formed on a layer of the resin material in the processed area, is protected by the protection layer, so as not to be removed. | 02-24-2011 |
20110278259 | PROCESS FOR PRODUCING A CHIP USING A MOLD - A mold capable of a highly accurate alignment with a member to be processed in such a state that a photocurable resin material is disposed between the mold and the member to be processed, and is constituted by a substrate | 11-17-2011 |
20130196016 | IMPRINT APPARATUS IN WHICH ALIGNMENT CONTROL OF A MOLD AND A SUBSTRATE IS EFFECTED - An imprint apparatus performs alignment control of a mold and a substrate. A pattern formed on the mold is transferred onto a pattern forming layer on the substrate. A mold holding portion holds the mold, a substrate holding portion holds the substrate, and a control portion effects control so that the mold and the substrate are brought near to each other during the alignment control. The mold and the pattern forming layer are brought into contact with each other and then the pattern forming layer is cured. The control portion changes a driving profile for the alignment control after the alignment control is started and at least one of before and after the mold contacts the pattern forming layer. The driving profile used to move at least one of the mold holding portion and the substrate holding portion to a target position, and includes at least one of acceleration, speed, driving voltage, and driving current. | 08-01-2013 |
20140120199 | MOLD, IMPRINT METHOD, AND PROCESS FOR PRODUCING CHIP - A mold capable of a highly accurate alignment with a member to be processed in such a state that a photocurable resin material is disposed between the mold and the member to be processed, and is constituted by a substrate | 05-01-2014 |