Patent application number | Description | Published |
20080210375 | Free-radical curable polyesters and methods for use thereof - The invention is based on the discovery that certain polyester compounds bearing are useful as b-stageable and/or liquid adhesives for the microelectronic packaging industry. | 09-04-2008 |
20080257493 | MONOMERS DERIVED FROM PENTACYCLOPENTADECANE DIMETHANOL - The invention is based on the discovery that certain well-defined compounds derived from pentacyclopentadecane dimethanol are useful components in adhesive formulations. In particular, the invention compounds described herein provide high Tg values and low shrinkage. Compounds of the invention are useful as adhesives for use in the semiconductor packaging industry. | 10-23-2008 |
20090061244 | THERMOSETTING POLYETHER OLIGOMERS, COMPOSTIONS AND METHODS FOR USE THEREOF - The invention is based on the discovery that certain polyether oligomers bearing curable moieties are useful as adhesives for the microelectonic packaging industry. Specifically, certain thermoset adhesive compositions containing polyether oligomers of the invention have good adhesion with lower viscosity, lower resistivity, higher conductivity and higher thixotropy when compared to acrylate- and maleimide-based thermoset adhesives. | 03-05-2009 |
20090200013 | WELL TUBULAR, COATING SYSTEM AND METHOD FOR OILFIELD APPLICATIONS - A technique facilitates the use of polymer materials in a downhole environment via utilization of a coating that can be applied to the polymer material. The methodology enables formation of a coating that sufficiently bonds with an underlying base structure of polymer material to withstand the harsh environment encountered in a downhole application. Additionally, the coating may utilize reactive chemistries to further protect the polymer material against the ingress of deleterious fluids while located in the downhole environment. Well tubulars formed of coated polymer are also described. | 08-13-2009 |
20090215940 | SOLUBLE METAL SALTS FOR USE AS CONDUCTIVITY PROMOTERS - The present invention provides conductivity promoters, and in particular soluble conductivity promoters that contain a hydrocarbon moiety or a siloxane moiety and a metal. The present invention also provides methods of making soluble conductivity promoters and adhesive compositions containing the conductivity promoters of the invention. | 08-27-2009 |
20090288768 | DI-CINNAMYL COMPOUNDS AND METHODS FOR USE THEREOF - The invention generally relates to di-cinnamyl compounds useful in a variety of adhesive applications. More specifically, the invention provides chain-extended bismaleimides and methods for generating them by reaction with di-cinnamyl compounds, including particular di-cinnamyl compounds disclosed herein. Invention di-cinnamyl compounds can also be used as co-monomers in a Diels-Alder type cure, and can act as a co-monomer in a thermoset composition with a maleimide monomer. | 11-26-2009 |
20100041803 | THERMOSETTING HYPERBRANCHED COMPOSITIONS AND METHODS FOR USE THEREOF - Hyperbranched polymers and methods for preparing the same are disclosed. The polymers are obtained based on monomers synthesized via reacting a substituted or unsubstituted cyclic anhydride with a bifunctional amine. | 02-18-2010 |
20100041823 | NOVEL SILOXANE MONOMERS AND METHODS FOR USE THEREOF - The invention provides novel siloxane monomers useful in a variety of adhesive applications. In one aspect, the siloxane compounds described herein can be used as Diels-Alder type curatives for bismaleimide or poly-maleimide monomers. The unsaturated resins shown here are attractive for use as maleimide curatives due to their poly-functionality. Each substituted styrenyl reside can react with two maleimide functional groups. Thus, an invention adhesive composition typically contains an excess of bismaleimide monomers. | 02-18-2010 |
20100041832 | FUNCTIONALIZED STYRENE OLIGOMERS AND POLYMERS - The present invention provides functionalized styrene oligomers and polymers prepared by Friedel-Crafts chemistry, as well as epoxidation products thereof. In particular, the invention provides allyl functional TPE. The invention also provides methods for making the functionalized styrene oligomers and polymers of the invention as well as epoxidation products thereof, compositions containing the same, and methods for using the functionalized and epoxified styrene oligomers that take advantage of the unique properties of the compounds and compositions of the invention. | 02-18-2010 |
20100041845 | HETERO-FUNCTIONAL COMPOUNDS AND METHODS FOR USE THEREOF - The invention provides hetero-functional compound compounds useful in a variety of adhesive applications. More particularly, the invention provides compounds bearing at least one electron rich olefinic bond and at least one electron poor olefinic bond, wherein the two olefinic bonds are separated by a C | 02-18-2010 |
20100056671 | POLYFUNCTIONAL EPOXY OLIGOMERS - The present invention provides epoxy functional oligomeric compounds, methods of preparation and uses therefor. In particular, the present invention provides to oligomeric epoxy compounds derived from allyl glycidyl ether. | 03-04-2010 |
20100063184 | LOW TEMPERATURE CURING ACRYLATE AND MALEIMIDE BASED FORMULATIONS AND METHODS FOR USE THEREOF - The present invention is based on the discovery that certain electron poor olefins combined with nucleophiles and a base catalyst are useful as adhesive compositions for the electronic packaging industry. In particular, the adhesive formulations set forth herein are useful as low temperature curing formulations with high adhesion to a variety of substrates. Invention formulations typically cure at about 80° C. and have a potlife of about 24 hours. The formulations cure by the well-known Michael addition reaction. | 03-11-2010 |
20100113643 | CURATIVES FOR EPOXY ADHESIVE COMPOSITIONS - The invention provides epoxy and oxetane compositions including the novel acyloxy and N-acyl curing agents described herein. Use of invention curing agents result in cured adhesive compositions with remarkably increased adhesion and reduced hydrophilicity when compared to resins cured with other types of curing agents. Furthermore, the curatives of this invention do not interfere with free-radical cure and are thus suited for use in hybrid cure thermoset compositions. | 05-06-2010 |
20100144977 | CURING AGENTS FOR EPOXY RESINS - A variety of curing agents for epoxy resins and methods for preparation thereof are disclosed, including compounds having the structures of formulas III and IV: | 06-10-2010 |
20100249276 | CURATIVES FOR EPOXY COMPOSITIONS - The invention provides epoxy and oxetane compositions including the novel acyloxy and N-acyl curing agents described herein. Use of invention curing agents result in cured adhesive compositions with remarkably increased adhesion and reduced hydrophilicity when compared to resins cured with other types of curing agents. Furthermore, the curatives of this invention do not interfere with free-radical cure and are thus suited for use in hybrid cure thermoset compositions. | 09-30-2010 |
20110017400 | ANTI-BLEED COMPOUNDS, COMPOSITIONS AND METHODS FOR USE THEREOF - The invention is based on the discovery that addition of certain carboxylic acid derivatives of siloxanes to thermosetting adhesive compositions and die-attach pastes renders such compositions and pastes extremely resistant to resin bleed. The present invention provides siloxane-carboxylic acid compounds useful as anti-bleed additives. Also provided are adhesive compositions and pastes containing the compounds of the invention, which are particularly useful in applications that require little to no resin bleed prior to curing of the compositions (such as e.g., electronic packaging applications). | 01-27-2011 |
20110049731 | MATERIALS AND METHODS FOR STRESS REDUCTION IN SEMICONDUCTOR WAFER PASSIVATION LAYERS - The present invention provides polyimide polymer materials for passivating semiconductor wafers and methods for fabricating thereof. | 03-03-2011 |
20110130485 | IMIDE-LINKED MALEIMIDE AND POLYMALEIMIDE COMPOUNDS - The invention is directed to maleimide thermosets incorporating imide-extended mono-, bis-, or polymaleimide compounds. These imide-extended maleimide compounds are prepared by the condensation of appropriate anhydrides with appropriate diamines to give amine terminated compounds. These compounds are then condensed with excess maleic anhydride to yield imide-extended maleimide compounds. | 06-02-2011 |
20110152466 | AMIDE-EXTENDED CROSSLINKING COMPOUNDS AND METHODS FOR USE THEREOF - The invention is based on the discovery that a remarkable improvement in the performance of maleimide thermosets can be achieved by incorporating amide-extended maleimides into an adhesive formulation. Amide-extended maleimides described herein can be used to toughen bismaleimide thermosetting materials without sacrificing any thermal stability. Amide-extended maleimides are readily prepared by reacting a bismaleimide with an appropriate amine via the well-known Michael addition reaction. Acylation of the resulting secondary amines provides the amide-extended maleimide. The acylating agent can also be used to introduce polymerizable functional groups into the backbones of these thermoset monomers. Amide-extended acrylate and methacrylate monomers can also be prepared. | 06-23-2011 |
20120065336 | CURABLE COMPOSITION WITH RUBBER-LIKE PROPERTIES - Low viscosity, radiation curable compositions have been developed that produce plastics with silicone rubber-like properties. These compositions have also been shown to give great adhesion to plastics. The combination of an ethylenically unsaturated oligomer with di- or polythiol compound, reactive diluents and a radical initiator will produce these properties. These materials can find use in many areas such as: Electronics packaging, displays, conformal coatings, seals, gaskets, fiber optics coatings, and golf ball coatings. | 03-15-2012 |
20130012620 | CURING AGENTS FOR EPOXY RESINS - The present invention relates to curatives for epoxy resins, and compositions (e.g. adhesives) containing such resins cured using the same methods of preparation and uses therefor. More specifically, the present invention relates to hybrid curatives for epoxy resins comprising both aromatic amine, phenol and/or phenyl ester moieties. A further aspect of the current invention relates to new imidazole catalysts that possess a combination of excellent cure latency as well as low cure temperature onset. | 01-10-2013 |
20130187095 | THERMOSETTING ADHESIVE COMPOSITIONS - The invention is based on the discovery that adhesive compositions containing certain low-viscosity, mono-ethylenically unsaturated monomers have surprisingly good cure parameters, resulting in very little weight loss upon cure. Many of these monofunctional monomers used alone or in combination with other monofunctional monomers described herein have high glass transition temperatures when cured. Moreover, since these monomers are monofunctional the crosslink density of the adhesive composition does not increase (relative to multi-functional monomers), which in turns results in lower stress, lower modulus adhesive compositions. As such, these monomers are useful in a variety of thermoset adhesive compositions, such as for example, die attach adhesive compositions. | 07-25-2013 |
20130199724 | CURATIVES FOR EPOXY COMPOSITIONS - The invention provides epoxy and oxetane compositions including the novel acyloxy and N-acyl curing agents described herein. Use of invention curing agents result in cured adhesive compositions with remarkably increased adhesion and reduced hydrophilicity when compared to resins cured with other types of curing agents. Furthermore, the curatives of this invention do not interfere with free-radical cure and are thus suited for use in hybrid cure thermoset compositions. | 08-08-2013 |
20130203895 | CURING AGENTS FOR EPOXY RESINS - The present invention relates to curatives for epoxy resins, and compositions (e.g. adhesives) containing such resins cured using the same, methods of preparation and uses therefor. More specifically, the present invention relates to hybrid curatives for epoxy resins comprising both aromatic amine, phenol and/or phenyl ester moieties. A further aspect of the current invention relates to new imidazole catalysts that posses a combination of excellent cure latency as well as low cure temperature onset. | 08-08-2013 |
20130228901 | MATERIALS AND METHODS FOR STRESS REDUCTION IN SEMICONDUCTOR WAFER PASSIVATION LAYERS - The present invention provides polyimide polymer materials for passivating semiconductor wafers and methods for fabricating thereof. The present invention further provides a device that includes a semiconductor wafer and a passivating layer disposed on the surface of the wafer, wherein the passivating layer comprises such polyimide polymers. | 09-05-2013 |
20130299747 | CURATIVES FOR EPOXY COMPOSITIONSERS - The invention provides epoxy and oxetane compositions including the novel acyloxy and N-acyl curing agents described herein. Use of invention curing agents result in cured adhesive compositions with remarkably increased adhesion and reduced hydrophilicity when compared to resins cured with other types of curing agents. Furthermore, the curatives of this invention do not interfere with free-radical cure and are thus suited for use in hybrid cure thermoset compositions. | 11-14-2013 |
20130313489 | SOLUBLE METAL SALTS FOR USE AS CONDUCTIVITY PROMOTERS - The present invention provides conductivity promoters, and in particular soluble conductivity promoters that contain a hydrocarbon moiety or a siloxane moiety and a metal. The present invention also provides methods of making soluble conductivity promoters and adhesive compositions containing the conductivity promoters of the invention. | 11-28-2013 |
20130338313 | AMIDE-EXTENDED CROSSLINKING COMPOUNDS AND METHODS FOR USE THEREOF - The invention is based on the discovery that a remarkable improvement in the performance of maleimide thermosets can be achieved by incorporating amide-extended maleimides into an adhesive formulation. Amide-extended maleimides described herein can be used to toughen bismaleimide thermosetting materials without sacrificing any thermal stability. Amide-extended maleimides are readily prepared by reacting a bismaleimide with an appropriate amine via the well-known Michael addition reaction. Acylation of the resulting secondary amines provides the amide-extended maleimide. The acylating agent can also be used to introduce polymerizable functional groups into the backbones of these thermoset monomers. Amide-extended acrylate and methacrylate monomers can also be prepared. | 12-19-2013 |
20140020827 | ANTI-BLEED COMPOUNDS, COMPOSITIONS AND METHODS FOR USE THEREOF - The invention is based on the discovery that addition of certain carboxylic acid derivatives of siloxanes to thermosetting adhesive compositions and die-attach pastes renders such compositions and pastes extremely resistant to resin bleed. The present invention provides siloxane-carboxylic acid compounds useful as anti-bleed additives. Also provided are adhesive compositions and pastes containing the compounds of the invention, which are particularly useful in applications that require little to no resin bleed prior to curing of the compositions (such as e.g., electronic packaging applications). | 01-23-2014 |
20140110101 | Well Tubular, Coating System and Method for Oilfield Applications - A technique facilitates the use of polymer materials in a downhole environment via utilization of a coating that can be applied to the polymer material. The methodology enables formation of a coating that sufficiently bonds with an underlying base structure of polymer material to withstand the harsh environment encountered in a downhole application. Additionally, the coating may utilize reactive chemistries to further protect the polymer material against the ingress of deleterious fluids while located in the downhole environment. Well tubulars formed of coated polymer are also described. | 04-24-2014 |
20140272435 | ANTI-STICK SURFACE COATINGS - The present invention describes anti-stick coatings composed of carboxylic acid, carboxylate salt or thiol functionalized siloxanes. The compounds of this invention can be used as coatings on the surface of wind turbine blades, aircraft wings and fuselage, or on the surface of oil and gas platforms, ships, and other vehicles exposed to harsh weather conditions. These functionalized silicones can bond to the surface and create a new hydrophobic and oleophobic surface that is repellent to ice, oil, dirt and insects that may cause loss of efficiency, or impact the operation of the wind turbine, aircraft, ships, or offshore oil and gas platform that are exposed to the elements. These compounds also serve as anti-graffiti coatings, and as anti-stiction coatings for MEMS devices | 09-18-2014 |
20140275413 | HEAT AND MOISTURE RESISTANT ANAEROBIC ADHESIVES AND SEALANTS - Anaerobic adhesive compositions have been developed that are very thermally stable, and are also extremely hydrophobic to allow for formulations that can withstand extreme harsh temperature, pressure and moisture environments. | 09-18-2014 |