Patent application number | Description | Published |
20090039526 | PACKAGE AND THE METHOD FOR MAKING THE SAME, AND A STACKED PACKAGE - The present invention relates to a package and the method for making the same, and a stacked package. The method for making the package includes the following steps: (a) providing a carrier having a plurality of platforms; (b) providing a plurality of dice, and disposing the dice on the platforms; (c) performing a reflow process so that the dice are self-aligned on the platforms; (d) forming a molding compound in the gaps between the dice, and (e) performing a cutting process so as to form a plurality of packages. Since the dice are self-aligned on the platforms during the reflow process, a die attach machine with low accuracy can achieve highly accurate placement. | 02-12-2009 |
20100052136 | Three-Dimensional Package and Method of Making the Same - A package comprises a first unit including a semiconductor body, a hole, an isolation layer, a conductive layer and a solder. The semiconductor body has a first surface having a pad and a protection layer exposing the pad. The hole penetrates the semiconductor body. The isolation layer is disposed on the side wall of the hole. The conductive layer covers the pad, a part of the protection layer, and the isolation layer. The lower end of the conductive layer extends to below a second surface of the semiconductor body. The solder is disposed in the hole, and is electrically connected to the pad via the conductive layer. A second unit similar to the first unit and stacked thereon includes a lower end of a second conductive layer that extends to below a second surface of a second semiconductor body and contacts the upper end of the first solder. | 03-04-2010 |
20100327442 | Package and the Method for Making the Same, and a Stacked Package - The present invention relates to a package and the method for making the same, and a stacked package. The method for making the package includes the following steps: (a) providing a carrier having a plurality of platforms; (b) providing a plurality of dice, and disposing the dice on the platforms; (c) performing a reflow process so that the dice are self-aligned on the platforms; (d) forming a molding compound in the gaps between the dice, and (e) performing a cutting process so as to form a plurality of packages. Since the dice are self-aligned on the platforms during the reflow process, a die attach machine with low accuracy can achieve highly accurate placement. | 12-30-2010 |
Patent application number | Description | Published |
20100214269 | OPTICAL TOUCH MODULE - An optical touch module is adapted to provide a touch area. At least one sensor is disposed at a corner of the touch area. The optical touch module includes at least one light emitting element and at least one waveguide element. The waveguide element is disposed on at least one side of the touch area, for guiding and emitting light rays provided by the light emitting element to the touch area. Each waveguide element includes a light incident surface and a light emitting surface. The light incident surface faces the light emitting element. The light emitting surface faces the touch area. Thereby, the light rays emitted from the light emitting element are distributed on the touch area through the waveguide element, so as to lower the luminance of the light emitting element and reduce the current consumption. | 08-26-2010 |
20100295822 | Connector of connecting light sensor and substrate and method of fabricating light sensor - A connector of connecting a light sensor and a substrate is utilized for rotating the light sensor so that the light-receiving direction of the light sensor is parallel with the substrate. When the connector is utilized in an optical touch system, the light sensor can be disposed on the substrate of the optical touch system by means of general manufacturing facilities of flat display panels. Meanwhile, the light-receiving direction of the light sensor is parallel with the substrate of the optical touch system. | 11-25-2010 |
20110243541 | Defocus calibration module for light-sensing system and method thereof - A defocus calibration module is applied in a light-sensing system utilized for sensing a measured object for generating a sensed image. The light-sensing system comprises a light-emitting component, a focusing component, and an image sensor. The light-emitting component emits a detecting light to the measured object so that the measured object generates a reflecting light. The focusing component focuses the reflecting light to the image sensor. The image sensor generates the sensed image according to the reflecting light. The defocus calibration module has a calibrating object for blocking a part of the detecting light and the reflecting light for forming images at a first and a second calibration imaging locations in the sensed image. In this way, the defocus calibration module calculates a defocus parameter representing the defocus level of the light-sensing system according to the first and the second calibration imaging locations, and accordingly calibrates the sensed image. | 10-06-2011 |
20140231935 | MULTI-AXIAL ACCELERATION SENSOR AND METHOD OF MANUFACTURING THE SAME - The present invention provides a multi-axial acceleration sensor and a method of manufacturing the multi-axial acceleration sensor. The method includes: providing a substrate having a lead plane; disposing a first sensor chip onto the lead plane, wherein a wire bonding plane of the first sensor chip is perpendicular to the lead plane; and disposing a second sensor chip onto the lead plane, wherein a wire bonding plane of the second sensor chip is in parallel with the lead plane. | 08-21-2014 |
20150064833 | Connector of connecting light sensor and substrate and method of fabricating light sensor - A connector of connecting a light sensor and a substrate is utilized for rotating the light sensor so that the light-receiving direction of the light sensor is parallel with the substrate. When the connector is utilized in an optical touch system, the light sensor can be disposed on the substrate of the optical touch system by means of general manufacturing facilities of flat display panels. Meanwhile, the light-receiving direction of the light sensor is parallel with the substrate of the optical touch system. | 03-05-2015 |
Patent application number | Description | Published |
20100044722 | Sensing Module - A sensing module comprises a carrier, a sensor, a substrate, and a plurality of chips. The carrier has a carrying surface and a back surface opposite to the carrying surface. The sensor and the substrate are disposed on the carrying surface and are electrically connected to the carrier respectively. The chips are disposed on the substrate and are electrically connected to the substrate respectively. The production cost of the sensing module is low. | 02-25-2010 |
20100181466 | Optical Sensing Module and Optical Mouse with the same - In an optical mouse, an optical sensing module includes a printed circuit board and a packaging body. The printed circuit board has an upper surface and a lower surface on opposite sides. The packaging body including a compound, an optical sensing die and a lead frame is disposed on the lower surface. The compound has a transparent surface. The optical sensing die used for receiving light is located inner the compound and has an optical sensing surface facing the transparent surface of the compound. The lead frame with a shoulder portion is electrically connected to the optical sensing die. The shoulder portion extends out from the compound along a direction that is parallel to the optical sensing surface of the optical sensing die. The shoulder portion is fixed on the lower surface. The optical sensing module may be used in an optical mouse. In the above optical sensing module, since the packaging body is positioned on the lower surface of the printed circuit board and the shoulder portion is fixed thereon, a preciseness of assembling the above optical sensing module can be easily improved. | 07-22-2010 |
20110261015 | OPTICAL TOUCH DISPLAY DEVICE - An optical touch device includes a display panel and at least a light emitting and receiving unit. The display panel includes a transparent substrate having a touch surface and a plurality of side surfaces adjacent to the touch surface. At least one of the side surfaces is a first light incidence surface and at least one of the side surfaces is a first light emitting surface. Each light emitting and receiving unit includes a linear light source and a light sensing component. The linear light source is disposed beside the first light incidence surface and is configured for providing optical signals into the transparent substrate. The light sensing component is disposed beside the first light emitting surface. The light sensing component is configured for receiving the optical signals from the linear light source. The optical touch display device has advantages of low cost. | 10-27-2011 |
20110285643 | OPTICAL TOUCH DISPLAY DEVICE - An optical touch display device includes a display unit and at least one light sensing module. The display unit includes a first substrate and a display layer. The first substrate has a display area and a non-display area surrounding the display area. The display layer is disposed on the display area of the first substrate. The light sensing module is disposed on an upper surface of the non-display area of the first substrate. A side surface of the light sensing module has a light sensing window, and at least a portion of the light sensing window is adapted to receive light above the display unit. The optical touch display device has a thin thickness. | 11-24-2011 |
20120168945 | CHIP PACKAGE STRUCTURE AND CHIP PACKAGING PROCESS - A chip package structure includes a silicon substrate, a sensing component, a metal circuit layer, a first insulating layer and a conductive metal layer. The silicon substrate has opposite first and second surfaces. The sensing component is disposed on the first surface. The metal circuit layer is disposed on the first surface and electrically connected to the sensing component. The first insulating layer covers the second surface and has a first through hole to expose a portion of the second surface. The conductive metal layer is disposed on the first insulating layer and includes first leads and a second lead. The first leads are electrically connected to the metal circuit layer. The second lead is filled in the first through hole to electrically connect to the silicon substrate and one of the first leads. A chip packaging process for fabricating the chip package structure is also provided. | 07-05-2012 |
20120176598 | APPARATUS AND METHOD FOR QUANTIFYING RESIDUAL STRESS OF A BIREFRINGENT MATERIAL - An apparatus for quantifying residual stress of a birefringent material comprises a light source generating light; a vertical polarizer converting a beam of light into a beam with vertical polarization; a standard material being mounted in front of the vertical polarizer; a horizontal polarizer converting a beam of light into a beam with horizontal polarization; an applied force unit applying different forces to the standard material; a spectrometer being mounted in front of the horizontal polarizer and recording intensity of light passing through the horizontal polarizer and transmittance of the standard material and a processing module being connected to the spectrometer, deriving a stress formula from the applied forces and transmittances of the standard material and obtaining a stress distribution of the birefringent material. A method for quantifying residual stress of a birefringent material is also disclosed. | 07-12-2012 |
20130070048 | Formation Apparatus Using Digital Image Correlation - The present disclosure uses at least three cameras to monitor even a large-scale area. Displacement and strain are measured in a fast, convenient and effective way. The present disclosure has advantages on whole field, far distance and convenience. | 03-21-2013 |
20150029514 | METHOD AND SYSTEM FOR ON-LINE REAL-TIME MEASURING THE SURFACE TOPOGRAPHY AND OUT-OF-PLANE DEFORMATION BY USING PHASE-SHIFTING SHADOW MOIRE METHOD - The present invention is directed to a system and method for on-line real-time measuring the surface topography and out-of-plane deformation by using phase-shifting shadow moiré method. Digital Phase-Shifting Shadow Moiré Method is applied to a system, which receives the reflected images from the surface of transparent or non-transparent plate projected under a light beam passing through a grating. Next, by image correction program, the skewed interference fringe pattern is recovered to the image as if the image acquisition equipment is placed normal to the surface. Furthermore, the received images are processed with Phase-Shifting to show the surface topography of the plate. | 01-29-2015 |
Patent application number | Description | Published |
20080272486 | CHIP PACKAGE STRUCTURE - A chip package structure includes a carrier, an interposer, a plurality of electrically conductive elements, a first sealant, a chip, and a second sealant. The interposer is disposed on the carrier. The electrically conductive elements electrically connect the interposer and the carrier. The first sealant seals the electrically conductive elements. A plurality of bumps of the chip is connected to the interposer. The second sealant seals the bumps. A first glass transition temperature of the first sealant is higher than a second glass transition temperature of the second sealant. Since glass transition temperatures of the first sealant and the second sealant are different, and the first glass transition temperature of the first sealant is higher than the second glass transition temperature of the second sealant, the inner stress will be lowered and the yield is promoted. | 11-06-2008 |
20080303167 | DEVICE HAVING HIGH ASPECT-RATIO VIA STRUCTURE IN LOW-DIELECTRIC MATERIAL AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a device having a via structure includes the following steps. A seed metallic layer is formed on a substrate. A patterned metallic-trace layer is formed on the seed metallic layer. A positive-type photoresist layer is formed on the patterned metallic-trace layer and seed metallic layer. The photoresist layer is patterned for defining a through hole which exposes a part of the patterned metallic-trace layer, wherein the through hole has a high aspect ratio. A metallic material is electroplated in the through hole so as to form a metallic pillar. The photoresist layer is removed. A part of the seed metallic layer is etched, whereby traces of the patterned metallic-trace layer are electrically isolated from each other. A dielectric material layer is formed on the substrate for sealing the patterned metallic-trace layer and a part of the metallic pillar and exposing a top surface of the metallic pillar. | 12-11-2008 |
20090046436 | MICRO-ELECTRO-MECHANICAL-SYSTEM PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A MEMS package includes a first board, a second board and a laminate material. The first board includes a lower metallic trace, a metallic diaphragm and a through opening. The lower metallic trace is located on the lower surface of the first board, and the metallic diaphragm is disposed on the lower metallic trace. The second board includes an upper metallic trace and a metallic electrode. The upper metallic trace is located on the upper surface of the second board, the metallic electrode is disposed on the upper metallic trace, and the metallic electrode is corresponding to the metallic diaphragm. The laminate material is disposed between the lower and upper metallic traces, and includes a hollow portion for accommodating the metallic electrode and metallic diaphragm, wherein a sensing unit is formed by the metallic electrode, the hollow portion and the metallic diaphragm, and is corresponding to the through opening. | 02-19-2009 |
20090091015 | STACKED-TYPE CHIP PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME - A stacked-type chip package structure including a first package structure, a second package structure, and a first molding compound is provided. The first package structure includes a first substrate, and a first chip stacked thereon and electrically connected thereto. The second package structure is stacked on the first package structure, and includes a second substrate, a second chip, and a plurality of solder blocks. The second chip is electrically connected to the second substrate, and the second substrate is electrically connected to the first substrate. The second chip is fixed on the first chip through an adhesive layer. The solder blocks are disposed on the back of the second substrate. The first molding compound is disposed on the first substrate and encapsulates the first package structure and the second package structure. The first molding compound has a recess for exposing the solder blocks. | 04-09-2009 |
20100000775 | CIRCUIT SUBSTRATE AND METHOD OF FABRICATING THE SAME AND CHIP PACKAGE STRUCTURE - A circuit substrate suitable for being connected to at least one solder ball is provided. The circuit substrate includes a substrate, at least one bonding pad, and a solder mask. The substrate has a surface. The bonding pad is disposed on the surface of the substrate for being connected to the solder ball. The solder mask covers the surface of the substrate and has an opening for exposing a portion of the bonding pad. The opening has a first end and a second end. As compared with the second end, the first end is much farther from the bonding pad, and a diameter of the first end is larger than that of the second end. | 01-07-2010 |