Hsuan-Chih Lin
Hsuan-Chih Lin, Taipei County TW
Patent application number | Description | Published |
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20100315815 | LIGHT-EMITTING UNIT ADAPTER MODULE - A light-emitting unit adapter module includes a mounting base for mounting, a circuit board accommodated in the mounting base and having electrode pins connectable to an external power source, a light-emitting unit mountable in the mounting base, and a holding-down device fastenable to the mounting base to hold down the light-emitting unit, keeping the tubular electrodes of the light-emitting unit in positive contact with the electrode pins of the circuit board for power input and the heat sink of the light-emitting unit suspending outside the mounting base for quick dissipation of waste heat during operation of the light-emitting devices of the light-emitting unit. | 12-16-2010 |
20100315823 | LIGHT-EMITTING DEVICE PRESSURE RING STRUCTURE - A light-emitting device pressure ring structure includes a mounting base for mounting, a circuit board accommodated in the mounting base and having electrode pins connectable to an external power source, a holder member insertable in the mounting base, a light-emitting unit fixedly mounted in the holder member with a bottom heat sink thereof suspending outside the holder member and tubular electrodes thereof connectable to the electrode pins of the circuit board for power input, and a pressure ring cap detachably threaded onto the mounting base to hold down the holder member and to keep the heat sink of the light-emitting unit outside the mounting base for quick dissipation of waste heat from the light-emitting devices of the light-emitting unit. | 12-16-2010 |
Hsuan-Chih Lin, Yonghe City TW
Patent application number | Description | Published |
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20100270922 | LED HEAT SINK MODULE, LED MODULE FOR LED HEAT SINK MODULE - A LED head sink module includes a LED module, which comprises a circuit substrate, a LED chip installed in the circuit substrate, a packing cup molded on the circuit substrate around the LED chip and a lens molded on the packing cup over the LED chip, a heat sink, which has a base and a flat mounting block located on the bottom side of the base for stopping against the circuit substrate of the LED module for absorbing waste heat, a bracket, which has a center opening that receives the circuit substrate of the LED module, first retaining members for fastening to a retaining portion at the periphery of the packing cup and second retaining members for fastening to the flat mounting block of the heat sink, and a water seal sandwiched between the LED module and the bracket to seal off outside moisture and dust. | 10-28-2010 |
20100311193 | LED MODULE FABRICATION METHOD - A method of fabricating a LED module by: bonding one or multiple LED chips and multiple conducting terminals to a circuit substrate, and then molding a packing cup on the circuit substrate over by over molding for enabling the LED chip(s) and the conducting terminals to be exposed to the outside of the packing cup, and then molding a lens on the packing cup and the LED chip(s) by over-molding. By means of directly molding the lens on the packing cup and the LED chip(s), no any gap is left in the lens, avoiding deflection, total reflection or light attenuation and enhancing luminous brightness and assuring uniform distribution of output light. | 12-09-2010 |
Hsuan-Chih Lin, Taipei TW
Patent application number | Description | Published |
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20090038777 | HEAT SINK AND MANUFACTURING METHOD THEREOF - In a heat sink and the manufacturing method thereof, the heat sink includes heat dissipation fins and heat pipes, and the heat dissipation fins have through holes for the heat pipes to pass through. The heat dissipating fins also have a notch formed at the peripheral of the through hole and communicating with the through hole, and openings formed at two sides of the notch, respectively. According to the manufacturing method, after the heat pipe is assembled with the heat dissipating fin, press strips pass through the openings and are pressed inwardly to reduce the notch to make the notch and the heat pipe plastically deformed. Finally the press strips are removed. | 02-12-2009 |
20090040760 | ILLUMINATION DEVICE HAVING UNIDIRECTIONAL HEAT-DISSIPATING ROUTE - An illumination device having an unidirectional heat-dissipating route, includes a heat sink and a LED light module. The heat sink includes a heat plate, a heat pipe and a heat-dissipating body. The heat pipe has a heat absorbing portion and a heat dissipating portion with a horizontal position different to that of the heat absorbing portion. The heat absorbing portion is connected to the heat plate, and a plurality of grooves is formed in the heat pipe to be communicated with the heat absorbing portion and the heat dissipating portion. The heat absorbing portion is lower than the heat dissipating portion. The heat-dissipating body is connected to the heat dissipating portion. The LED light module is connected to the heat plate. Thus the LEDs are protected and prevented from being destroyed by the heat, and the working life thereof is increased greatly. | 02-12-2009 |
20090313827 | METHOD AND A TOOL FOR MANUFACTURING HEAT RADIATOR - A method and a tool for manufacturing heat radiators are used to assemble a plurality of radiating fins to a heat transferring base. The method includes the steps of putting the radiating fins on the heat transferring base, putting blades between the radiating fins from at least one side of the heat transferring base, and pressing the blades to deform the heat transferring base to make the heat transferring base tightly fitted with the radiating fins. The tool includes a group of cutters and a pressing part. The cutter has blades having edges and pressing portions opposite to the edges. When the radiating fins are connected to the heat transferring base, the cutter may move between the radiating fins in a direction parallel to the heat transferring base. The pressing part is used for pressing the pressing portion to make the edges deform the heat transferring base, which forces the heat transferring base to be tightly fitted with the radiating fins. | 12-24-2009 |
Hsuan-Chih Lin, Peitou District TW
Patent application number | Description | Published |
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20090038782 | HEAT-CONDUCTING MODULE - In a heat-conducting module and a method for manufacturing the same, the heat-conducting module includes a heat-conducting base and a heat pipe. The surface of the heat-conducting base is formed with a groove. Both sides of the groove protrude upwards to form two side walls respectively. Both of the side walls are provided with hooks respectively that are engaged with each other. The heat pipe is accommodated in the groove of the heat-conducting base and is thus covered and sandwiched by the two side walls. Via this arrangement, the connection between the heat pipe and the heat-conducting base can be firm and steady. In this way, the tight contact between the heat pipe and the heat-conducting base can be increased and the heat-conducting efficiency of the heat-conducting module can be enhanced. | 02-12-2009 |
Hsuan-Chih Lin, New Taipei City TW
Patent application number | Description | Published |
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20160061425 | LIGHT EMITTING DIODE LAMP STRUCTURE - A light emitting diode (LED) lamp structure ( | 03-03-2016 |
20160061435 | ELECTRONIC IMPLEMENT REPLACEMENT STRUCTURE - An electronic implement replacement structure includes a housing body ( | 03-03-2016 |
20160066447 | ELECTRONIC DEVICE REPLACEMENT STRUCTURE - An electronic device replacement structure ( | 03-03-2016 |