Bargerhuff
Richard Bargerhuff, Spring, TX US
Patent application number | Description | Published |
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20090103414 | COOLING IN HIGH-DENSITY STORAGE SYSTEMS - In one embodiment an enclosure for a high-density storage system, comprises a backplane to which a plurality of data storage devices may be coupled, a front panel opposite the backplane and defining a first airflow channel adjacent a front side of the data storage devices, a back panel opposite the front panel and comprising a second airflow channel adjacent the backplane, a floor panel and a top panel, a first side panel comprising an array of air flow inlets, a second side panel comprising at least one air flow outlet, and a fan assembly to expel air from the at least one air outlet. | 04-23-2009 |
Richard A. Bargerhuff, Spring, TX US
Patent application number | Description | Published |
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20100097758 | FLEXIBLE AIRFLOW BAFFLE FOR AN ELECTRONIC SYSTEM - A baffle manages airflow through optionally mounted electronic components by using flexible members formed to extend to empty connectors and flex away from the connectors to accommodate electronic components mounted to the connectors. | 04-22-2010 |
Richard A. Bargerhuff, Houston, TX US
Patent application number | Description | Published |
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20090034187 | PRESSURE-BASED FAN SPEED ADJUSTMENT - A system comprising a container adapted to house an electronic device. The system also comprises a fan adapted to transfer air between different portions of the container and pressure sensing logic adapted to determine a difference between air pressures at the different portions. The system further comprises control logic adapted to adjust a speed of the fan in accordance with the difference. | 02-05-2009 |
20110130891 | HEATSINK WITH A PLURALITY OF FANS - In at least some embodiments, an apparatus comprises an electronic component and a heatsink for the electronic component. The apparatus further comprises a plurality of fans mounted to the heatsink. The plurality of fans comprises a first fan that provides an airflow for the heatsink and a second fan that selectively modifies the airflow. | 06-02-2011 |