Patent application number | Description | Published |
20080250637 | METHOD FOR MANUFACTURING MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARD - A method for manufacturing a multilayer FPCB includes the steps of: providing a first substrate, a second substrate and a binder layer; defining an opening on the binder layer; defining a first slit in the dielectric layer of the first substrate; laminating the first substrate, the binder layer and the second substrate; forming a second slit in the conductive layer of the first substrate, the second slit is configured to be aligned with the first slit, cutting the first substrate, the binder layer and the second substrate thereby forming a multilayer flexible printed circuit board having different numbers of layers in different areas. | 10-16-2008 |
20080283289 | PRINTED CIRCUIT BOARDS - The present invention relates to a printed circuit board. In one embodiment, a printed circuit board includes a dielectric layer and a conductive trace formed on the dielectric layer. The conductive layer includes a first conductive portion, a connecting portion and a second conductive portion. The connecting portion includes a first end and a second end. The first end is connected to the first conductive portion; the second end is connected to the second conductive portion. A width of the connecting portion gradually decreases from the first end to the second end. Reflection and cross talk of signals transmitted in the presented printed circuit board can be reduced. | 11-20-2008 |
20080302258 | SCREEN PRINTING STENCIL AND METHOD FOR MANUFACTURING THE SAME - An exemplary screen printing stencil includes a frame, a screen mesh and a metal foil. The screen mesh is stretched tightly in the frame. The metal foil is attached on a surface of the screen mesh. A screen printing pattern is defined on the metal foil by a laser machining process. A machining tolerance of the screen printing pattern is either in a range from 0.005 to 0.02 millimeters or in a range from −0.02 to −0.005 millimeters. The screen printing stencil can be used in a screen printing process of manufacturing a printed circuit board, thereby improving quality of the printed circuit board. | 12-11-2008 |
20080308042 | APPARATUS FOR PLASMA-PROCESSING FLEXIBLE PRINTED CIRCUIT BOARDS - The present invention relates to an apparatus for plasma-processing of flexible printed circuit boards (FPCBs). The apparatus includes a plasma-discharging chamber, two electrodes arranged in the chamber for generating plasma in the chamber, a frame, and two elongated holding arms disposed on the frame. The frame includes a number of spaced parallel first bars and a number of spaced parallel second bars. The first bars intersecting with the second bars. The elongated holding arms are substantially parallel with each other. Each of the arms has an inner sidewall. The inner sidewalls of the elongated holding arms are opposite to each other. An elongated recess is defined in each of the inner sidewalls proximate to the frame. The apparatus can ensure uniform plasma-processing and protect FPCBs from being burned. | 12-18-2008 |
20090027072 | APPARATUS FOR TESTING CHIPS WITH BALL GRID ARRAY - An exemplary an apparatus for testing chips with ball grid array comprised of a number of solder balls is provided. The apparatus includes a main printed circuit board, a supporting board and a testing device. The main printed circuit board has a edge connector. The supporting board defines a number of electrically conductive through holes arranged in an array corresponding to the ball grid array. One end of each of the electrically conductive through holes is configured for electrically connection to the main printed circuit board, the other end of the electrically through holes is configured for receiving and electrically connecting the corresponding solder ball of the ball grid array. The testing device has a socket connector for insertion of the edge connector therein. The testing device is configured for testing the chip. | 01-29-2009 |
20090039895 | METHOD OF DETECTING FAULTY VIA HOLES IN PRINTED CIRCUIT BOARDS - A method of detecting faulty via holes of a printed circuit board. The printed circuit board including a number of electric trace segments. The method includes steps of: providing a testing system, the testing system comprising a processor, a storing means and a resistance measuring device, the storing means for storing a function Y | 02-12-2009 |
20090088881 | SIMULATION SYSTEM AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD - An exemplary simulation system for manufacturing a printed circuit board is provided. The simulation system includes at least one simulation sub-system. The simulation sub-system includes an input module, a storing module, a processing module, and an output module. The input module is configured for acquiring a number of processing parameters associated with steps of a process for manufacturing the printed circuit board. The storing module is configured for storing a number of simulation functions relating to the steps of the process for manufacturing the printed circuit board. The processing module is configured for selecting and performing the corresponding simulation function according to the acquired parameters, thereby obtaining a simulation result. The output module is configured for output the simulation result. | 04-02-2009 |
20110247207 | METHOD FOR MANUFACTURING MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARD - A method for manufacturing a multilayer FPCB which includes providing a first substrate, a second substrate and a binder layer; defining an opening on the binder layer; defining a first slit in the dielectric layer of the first substrate; laminating the first substrate, the binder layer and the second substrate; forming a second slit in the conductive layer of the first substrate, the second slit being created so as to align with the first slit, cutting the first substrate, the binder layer and the second substrate thereby forming a multilayer flexible printed circuit board having different numbers of layers in different areas. | 10-13-2011 |