Tsai, Taoyuan
Cheng-Hung Tsai, Taoyuan TW
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20130271019 | LED DRIVING SYSTEM AND METHOD - An exemplary light emitting diode (LED) driving system includes a direct current/direct current (DC/DC) converter, a detection circuit, a control circuit, a pulse width modulation (PWM) controller, and a current balance circuit. The DC/DC converter outputs a suitable direct current voltage to drive an LED array. The detection circuit detects cathode voltages of LED strings of the LED array. The control circuit generates and outputs a control signal to the PWM controller, and generates and outputs various adjusting signals. The current balance circuit adjusts current flowing through two of the LED strings, which have a minimum and a maximum detected cathode voltage, respectively. The current balance circuit includes switches. A related LED driving method is also provided. | 10-17-2013 |
Chia-Chung Tsai, Taoyuan TW
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20120226068 | ANHYDRIDE DERIVATIVES OF 2-(S)-(6-METHOXY-2-NAPHTYL)-PROPANOIC ACID, PREPARATION METHOD AND USE THEREOF - The present invention provides a novel anhydride derivative of 2-(S)-(6-methoxy-2-naphtyl)-propanoic acid for preparing nitrooxyalkyl esters of 2-(S)-(6-methoxy-2-naphtyl)-propanoic acid with high purity to meet requirements of the industry. | 09-06-2012 |
Chih-Ming Tsai, Taoyuan TW
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20120109618 | ACCIDENT PARAMETER IDENTIFICATION METHOD FOR SEVERE ACCIDENTS - The present invention discloses an accident parameter identification method, combining optimization algorithm and severe accident analysis software, for severe accidents. The optimization algorithm and severe accident analysis software are compiled into individual applications. The process for parameter identification is decided by the optimization algorithm. The actual accident parameter can be obtained by minimizing the difference between the calculations and the actual signals in the nuclear power plant. | 05-03-2012 |
20130266108 | WATER LEVEL DETERMINING METHOD FOR BOILING WATER REACTOR - The present invention discloses a water level determining method for a boiling water reactor. Thereby, for a boiling water reactor under anticipated transient without scram, risk of sudden power increase due to the uncertain water level raised to a main steam tube can be reduced by installing a thermometer on the top of the reactor or the main steam tube. By controlling flow rate of water and keeping the steam temperature higher than the saturated temperature, the core of the reactor can be sure to cool down properly. | 10-10-2013 |
Chih-Yang Tsai, Taoyuan TW
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20120106770 | EARPHONE ANTENNA, EARPHONE AND ELECTRONIC DEVICE EMPLOYING THE SAME - One or more antennas within an earphone arrangement used in an electronic device includes a plurality of coaxial cables, a first antenna unit, a second antenna unit, and a third antenna unit. The coaxial cables carry radio frequency (RF) signals of different frequency bands. The first antenna unit, the second antenna unit, and the third antenna unit each include a radiating member. Each radiating member can receive and transmit RF signals of at least one frequency band, and the coaxial cables carry the RF signals to the device for processing. | 05-03-2012 |
Ching Jen Tsai, Taoyuan TW
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20130127587 | CO-FIRED MULTI-LAYER STACK CHIP RESISTOR AND MANUFACTURING METHOD - A co-fired multi-layer stack chip resistor is provided. The co-fired multi-layer stack chip resistor includes a ceramic substrate and a multi-layer stack resistance structure monomer. The ceramic substrate is formed by stacking multiple layers of the ceramic membranes, wherein the ceramic membranes is formed of a bearing membrane and a porcelain slurry with the solvent, the binder and the dispersant. The multi-layer stack resistance structure monomer is stacked on the ceramic substrate, and includes multiple bearing membranes and multiple resistive layers, wherein each resistive layer is formed on the surface of the corresponding bearing membrane, the resistive layers are parallel to each other, and the contiguous resistive layers are stacked with the interval of the predetermined distance along the vertical direction. The multi-layer stack resistance structure monomer and the ceramic substrate are sintered and shaped with the predetermined sintering temperature and the predetermined sintering time in a kiln stove. | 05-23-2013 |
Ching-Jung Tsai, Taoyuan TW
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20100163299 | ELECTRONIC DEVICE AND HIGH FREQUENCY CIRCUIT BOARD THEREOF - An electronic device and a high frequency circuit board thereof are disclosed. The high frequency circuit board includes a first dielectric layer, a first signal line formed on the first dielectric layer, a second dielectric layer overlaying the first dielectric layer and covering the first signal line, and a first EMI shielding layer overlaying the second dielectric layer. The first EMI shielding layer has a gap formed thereon. The gap is formed at a position corresponding to the position of the first signal line. | 07-01-2010 |
Ching-Wei Tsai, Taoyuan TW
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20120296068 | Peptide Chromatographic Purification Assisted by Combining of Solubility Parameter and Solution Conformation Energy Calculations - A method of purifying a compound from a mixture through a chromatographic column loaded with a column adsorbent. The method comprises: | 11-22-2012 |
Chung-Lin Tsai, Taoyuan TW
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20110278147 | KEYBOARD DEVICE - A keyboard device includes at least an illuminant element, at least a pressing key element and a light guide element. The pressing key element includes a keycap reciprocating along a first axial direction when being pressed and a recovering component attached to the keycap for supporting and pushing back the keycap when not pressed. The light guide element is located at one side of the recovering component. The light guide element includes at least a light-incident part and a light-emitting part. The light-incident part is used for receiving light emitted from the illuminant element. The light-emitting part emits light along a second axial direction to the recovering component so that the recovering components guide light to the keycap, wherein the second axial direction is different to the first axial direction. | 11-17-2011 |
20110280046 | LIGHT GUIDE APPARATUS FOR BACKLIGHT MODULE - A light guide apparatus for a backlight module is disclosed, which includes a light guide plate, a circuit having a plurality of circuit contacts integrated with the light guide plate, and a light source disposed on the light guide plate and electrically contacted to the plurality of circuit contacts. | 11-17-2011 |
20120163025 | LIGHT GUIDE APPARATUS FOR A BACKLIGHT MODULE AND FABRICATING METHOD THEREOF - A light guide apparatus for a backlight module is provided. The light guide apparatus comprises a light guide plate and a light source module. The light guide plate is configured with a circuit contact. The light source module is integrated with the light guide plate in contact with the circuit contact. Besides, a method of fabricating a light guide apparatus for a backlight module is also provided with simpler process and lower fabrication cost. | 06-28-2012 |
20120163029 | LIGHT GUIDE APPARATUS OF BACKLIGHT MODULE - A light guide apparatus of a backlight module is provided. The light guide apparatus includes a light guide plate and a plurality of LEDs serving as light sources disposed at one lateral side of the light guide plate. The light guide plate includes a circuit configured thereon, and the light sources are welded on the circuit of the light guide plate. | 06-28-2012 |
20120170313 | LIGHT GUIDE APPARATUS FOR A BACKLIGHT MODULE - A light guide apparatus for a backlight module is provided. The light guide apparatus comprises a light guide plate and an electrical component. The light guide plate is configured with a circuit thereon. The electrical component is attached to the light guide plate and electrically coupled to the circuit. The light guide apparatus integrates a light guide panel, a circuit and an electrical component together for obtaining simpler structure and lower cost. | 07-05-2012 |
20120170317 | LIGHT GUIDE APPARATUS FOR BACKLIGHT MODULE - A light guide apparatus for a backlight module is disclosed, which includes a light guide plate, a circuit having a plurality of circuit contacts integrated with the light guide plate, and a light source disposed on the light guide plate and electrically contacted to the plurality of circuit contacts. | 07-05-2012 |
20120170318 | LIGHT GUIDE APPARATUS FOR A BACKLIGHT MODULE - A light guide apparatus for a backlight module is disclosed, which includes a light guide plate, a circuit having a plurality of conductive contacts integrated with the light guide plate, and a light source disposed on the light guide plate and electrically contacted to the plurality of conductive contacts. | 07-05-2012 |
20130265754 | ILLUMINATION APPARATUS - An illumination apparatus including an illumination shell, a circuit and a light source is provided. The illumination shell is formed by a light guide plate. The circuit has a plurality of circuit contacts integrated with the illumination shell. The light source is disposed on the illumination shell and electrically contacted to the plurality of circuit contacts. | 10-10-2013 |
20150131323 | ILLUMINATION APPARATUS, METHOD FOR MANUFATURING LIGHT GUIDE PLATE, BACK LIGHT MODULE AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a light guide apparatus includes the following steps. A first mold and a second mold are provided. The first mold and the second mold respectively include a first molding surface and a second molding surface facing each other. A protrusion is disposed at the first or second molding surfaces. Sheet materials are provided. Each sheet material includes an opening corresponding to the protrusion, a first surface and a circuit layer disposed on the first surface. One of the sheet materials is disposed on the first mold with first surface facing the first mold. The first mold and the second mold are closed. An optical plastic material is injected into the space between the first and second molding surfaces to form a light guide plate having a via corresponding to the protrusion for embedding a light source. The sheet material is laminated on the light guide plate. | 05-14-2015 |
Chun-Huang Tsai, Taoyuan TW
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20150349348 | ANODE ON A PRETREATED SUBSTRATE FOR IMPROVING REDOX-STABILITY OF SOLID OXIDE FUEL CELL AND THE FABRICATION METHOD THEREOF - A double-layer anode structure on a pretreated porous metal substrate and a method for fabricating the same, for improving the redox stability and decreasing the anode polarization resistance of a SOFC. The anode structure includes: a porous metal substrate of high gas permeability; a first porous anode functional layer, formed on the porous metal substrate by a high-voltage high-enthalpy Ar—He—H | 12-03-2015 |
Hsien-Ming Tsai, Taoyuan TW
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20150101847 | RIGID-FLEXIBLE PRINTED CIRCUIT BOARD,METHOD FOR MANUFACTURING SAME,AND PRINTED CIRCUIT BOARD MODULE - A rigid-flexible printed circuit board (PCB) a method for manufacturing the rigid-flexible PCB, and a PCB module having the rigid-flexible PCB are provided. The rigid-flexible printed circuit board (PCB) defines a first area, a second area, and a third area connected in the described order. The rigid-flexible PCB includes a first flexible PCB, a second flexible PCB adhered with the first flexible PCB through a bonding sheet in the third area, and, a first conductive layer and a second conductive layer formed on opposite side of the rigid-flexible PCB in the first area and the third area. The first flexible PCB is apart from the second flexible PCB in the first area and the second area. | 04-16-2015 |
Hsin-Wei Tsai, Taoyuan TW
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20090045900 | CONDUCTIVE WINDING MODULE AND TRANSFORMER HAVING SUCH CONDUCTIVE WINDING MODULE - A conductive winding module includes a plurality of conductive parts and at least one connecting part. Each conductive part includes a conductive body, a first terminal and a second terminal. The conductive body is interconnected between the first terminal and the second terminal and having a hollow portion therein. The connecting part has a first end and a second end for interconnecting any two adjacent conductive parts. A first connecting line is defined between the first end of the connecting part and the first terminal of an adjacent conductive part. A second connecting line is defined between the second end of the connecting part and the second terminal of an adjacent conductive part. The conductive parts are folded with respect to the first connecting line and the second connecting line such that the first hollow portions of the conductive parts are aligned with each other to define a through-hole. | 02-19-2009 |
20090045901 | CONDUCTIVE WINDING MODULE AND TRANSFORMER HAVING SUCH CONDUCTIVE WINDING MODULE - A conductive winding module includes a plurality of conductive parts and at least one connecting part. Each conductive part includes a conductive body, a first terminal and a second terminal. The conductive body is interconnected between the first terminal and the second terminal and having a hollow portion therein. The connecting part has a first end and a second end for interconnecting any two adjacent conductive parts. A first connecting line is defined between the first end of the connecting part and the first terminal of an adjacent conductive part. A second connecting line is defined between the second end of the connecting part and the second terminal of an adjacent conductive part. The conductive parts are folded with respect to the first connecting line and the second connecting line such that the first hollow portions of the conductive parts are aligned with each other to define a through-hole. | 02-19-2009 |
Hua-Chun Tsai, Taoyuan TW
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20110193969 | OBJECT-DETECTING SYSTEM AND METHOD BY USE OF NON-COINCIDENT FIELDS OF LIGHT - The invention provides an object-detecting system and method for detecting information of an object located in an indicating space. In particular, the invention is to capture images relative to the indicating space by use of non-coincident fields of light, and further to determine the information of the object located in the indicating space. The invention also preferably sets the operation times of image-capturing units and the exposure times of light-emitting units in the object-detecting system to improve the quality of the captured images. | 08-11-2011 |
20110199337 | OBJECT-DETECTING SYSTEM AND METHOD BY USE OF NON-COINCIDENT FIELDS OF LIGHT - The invention provides an object-detecting system and method for detecting information of an object located in an indicating space. In particular, the invention is to capture images relative to the indicating space by use of non-coincident fields of light, and further to determine the information of the object located in the indicating space in accordance with the captured images. | 08-18-2011 |
Hung-Ming Tsai, Taoyuan TW
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20090124059 | METHOD FOR FORMING A SEMICONDUCTOR DEVICE - A method for forming a semiconductor device, includes the steps of providing a substrate; forming a patterned stack on the substrate including a first dielectric layer on the substrate, a first conductive layer on the first dielectric layer and a mask layer on the first conductive layer, wherein a width of the mask layer is smaller than a width of the first conductive layer; forming a second dielectric layer on the sidewall of the patterned stack; forming a third dielectric layer on the substrate; forming a second conductive layer over the substrate; and removing the mask layer and a portion of the first conductive layer covered by the mask layer to form an opening so as to partially expose the first conductive layer. | 05-14-2009 |
I-Ta Tsai, Taoyuan TW
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20120104598 | PACKAGE STRUCTURE HAVING EMBEDDED SEMICONDUCTOR COMPONENT AND FABRICATION METHOD THEREOF - A package structure having an embedded semiconductor component, includes: a chip having an active surface with electrode pads and an inactive surface opposite to the active surface; a first insulating protection layer having a chip mounting area for the chip to be mounted thereon via the active surface thereof; a plurality of connection columns disposed in the first insulating protection layer at positions corresponding to the electrode pads and electrically connected to the electrode pads via solder bumps; an encapsulant formed on one surface of the first insulating protection layer having the chip mounted thereon for encapsulating the chip; and a built-up structure formed on the other surface of the first insulating protection layer and the connection columns. Due to the bending resistance of the encapuslant, the warpage of the built-up structure is prevented. | 05-03-2012 |
20130230947 | FABRICATION METHOD OF PACKAGE STRUCTURE HAVING EMBEDDED SEMICONDUCTOR COMPONENT - A package structure having an embedded semiconductor component, includes: a chip having an active surface with electrode pads and an inactive surface opposite to the active surface; a first insulating protection layer having a chip mounting area for the chip to be mounted thereon via the active surface thereof; a plurality of connection columns disposed in the first insulating protection layer at positions corresponding to the electrode pads and electrically connected to the electrode pads via solder bumps; an encapsulant formed on one surface of the first insulating protection layer having the chip mounted thereon for encapsulating the chip; and a built-up structure formed on the other surface of the first insulating protection layer and the connection columns. Due to the bending resistance of the encapsulant, the warpage of the built-up structure is prevented. | 09-05-2013 |
20140035138 | PACKAGE STRUCTURE HAVING EMBEDDED SEMICONDUCTOR COMPONENT AND FABRICATION METHOD THEREOF - A package structure having an embedded semiconductor component, includes: a chip having an active surface with electrode pads and an inactive surface opposite to the active surface; a first insulating protection layer having a chip mounting area for the chip to be mounted thereon via the active surface thereof; a plurality of connection columns disposed in the first insulating protection layer at positions corresponding to the electrode pads and electrically connected to the electrode pads via solder bumps; an encapsulant formed on one surface of the first insulating protection layer having the chip mounted thereon for encapsulating the chip; and a built-up structure formed on the other surface of the first insulating protection layer and the connection columns. Due to the bending resistance of the encapuslant, the warpage of the built-up structure is prevented. | 02-06-2014 |
Kun-Chen Tsai, Taoyuan TW
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20100108345 | LID FOR MICRO-ELECTRO-MECHANICAL DEVICE AND METHOD FOR FABRICATING THE SAME - A lid for a micro-electro-mechanical device and a method for fabricating the same are provided. The lid includes a board with opposite first and second surfaces and a first conductor layer. The first surface has a first metal layer thereon. The first metal layer and the board have a recess formed therein. The recess has a bottom surface and a side surface adjacent thereto. The first conductor layer is formed on the first metal layer and the bottom and side surfaces of the recess. The shielding effect of the side surface of the board is enhanced because of the recess integral to the board, the homogeneous bottom and side surfaces of the recess, and the first conductor layer covering the first metal layer, the bottom and side surfaces of the recess. Hence, the shielding effect upon the micro-electro-mechanical device is enhanced. | 05-06-2010 |
20100187003 | CIRCUIT BOARD STRUCTURE AND FABRICATION METHOD THEREOF - Provided are a circuit board structure and a fabrication method thereof, including the steps of: forming a first circuit layer in a first dielectric layer and exposing the first circuit layer therefrom; forming a second dielectric layer on the first dielectric layer and the first circuit layer, and forming a second circuit layer on the second dielectric layer; forming a plurality of first conductive vias in the second dielectric layer for electrically connecting to the first circuit layer to thereby dispense with a core board and electroplated holes and thus facilitate miniaturization. Further, the first dielectric layer is liquid before being hardened and is formed on the first dielectric layer that enhances the bonding between layers of the circuit board and the structure. | 07-29-2010 |
20120032282 | MICROELECTROMECHANICAL SYSTEM (MEMS) CARRIER AND METHOD OF FABRICATING THE SAME - An MEMS carrier is provided that includes a core board having a first surface and an opposite second surface, a circuit layer formed on the first surface and having a plurality of conductive pads, and a through hole formed through the first and the second surfaces; a carrier layer formed on the second surface of the core board and covering an end of the through hole; a patterned metal layer formed on a portion of the carrier layer that covers the end of the through hole; a solder mask layer formed on the first surface of the core board and the circuit layer, wherein the solder mask layer has a plurality of openings for exposing the conductive pads; and a shielding metal layer disposed on a sidewall of the through hole, the patterned metal layer, and the portion of the carrier layer that covers the end of the through hole. Without the use of a circuit board, the MEMS carrier has reduced height and size. | 02-09-2012 |
20130062100 | CIRCUIT BOARD STRUCTURE - Provided are a circuit board structure and a fabrication method thereof, including the steps of: forming a first circuit layer in a first dielectric layer and exposing the first circuit layer therefrom; forming a second dielectric layer on the first dielectric layer and the first circuit layer, and forming a second circuit layer on the second dielectric layer; forming a plurality of first conductive vias in the second dielectric layer for electrically connecting to the first circuit layer to thereby dispense with a core board and electroplated holes and thus facilitate miniaturization. Further, the first dielectric layer is liquid before being hardened and is formed on the first dielectric layer that enhances the bonding between layers of the circuit board and the structure. | 03-14-2013 |
Ping-Chun Tsai, Taoyuan TW
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20150054017 | LED CHIP PACKAGE - An LED chip package having a topographical glass coating on top surface for enhancing heat dissipation is disclosed. A circular wall is optionally built to surround the LED chip for reflecting light beams from the LED chips; the glass coating further extends to cove the inner wall surface of the circular wall. The larger area the glass coating covers, the more heat the package dissipates in a time unit. The LED chip package according to the present invention exhibits higher thermal dissipation and helps to last longer the life of the LED chip package than a traditional one. | 02-26-2015 |
Ping-Hung Tsai, Taoyuan TW
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20120081962 | LOW VOLTAGE PROGRAMMING IN NAND FLASH - A memory device includes a plurality of memory cells arranged in series in the semiconductor body, such as a NAND string, having a plurality of word lines. A selected memory cell is programmed by hot carrier injection. The program operation is based on metering a flow of carriers between a first semiconductor body region on a first side of the selected cell in the NAND string and a second semiconductor body region on a second side of the selected cell. A program potential higher than a hot carrier injection barrier level is applied to the selected cell, and then the drain to source voltage across the selected cell and the flow of carriers in the selected cell reach a level sufficient to support hot carrier injection, which is controlled by a switch cell adjacent the selected cell. | 04-05-2012 |
20130088920 | LOW VOLTAGE PROGRAMMING IN NAND FLASH WITH TWO STAGE SOURCE SIDE BIAS - A memory device includes a plurality of memory cells arranged in series in the semiconductor body, such as a NAND string, having a plurality of word lines. A selected memory cell is programmed by hot carrier injection. The program operation is based on metering a flow of carriers between a first semiconductor body region on a first side of the selected cell in the NAND string and a second semiconductor body region on a second side of the selected cell. A program potential higher than a hot carrier injection barrier level is applied to the selected cell, and then the drain to source voltage across the selected cell and the flow of carriers in the selected cell reach a level sufficient to support hot carrier injection, which is controlled by a combination of a switch cell adjacent the selected cell and modulation of a source side voltage applied to the NAND string. | 04-11-2013 |
Po-Feng Tsai, Taoyuan TW
Po-Wei Tsai, Taoyuan TW
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20120160648 | KEYSWITCH AND KEYBOARD - A keyswitch includes a cover, a frame, a keycap, two connecting parts, and a base. The cover has an opening. The frame is disposed under the cover. The base is disposed under the frame. The keycap is located in the opening. The keycap has two opposite edges. The two connecting parts are connected between the two opposite edges and the frame. The cover abuts against the two connecting parts to restrain the keycap from moving up. | 06-28-2012 |
20120160652 | KEYBOARD WITH PLATE-TYPE KEYCAP ASSEMBLY - A plate-type keycap assembly is used in a keyboard. A main body, a keycap, and a connecting part of the keycap assembly are integrated monolithically and form a plate structure with substantially equal thickness. When the main body of the keycap assembly is constrained by a cover and a pedestal part, the keycap in the keyboard is formed as a cantilever structure via the connecting part. The cantilever structure enables the keycap for moving up and down steadily, which no longer needs scissors-type structure in the keyboard. Accordingly, the keyboard may be simplified and miniaturized when utilizing such keycap assembly. | 06-28-2012 |
20140204556 | BACK LIGHT STRUCTURE AND KEYBOARD WITH BACK LIGHT - A back light structure for a keyboard with back light includes a supporting plate, a light guiding plate, a flexible circuit board, and a light-emitting component. Keyswitch structures of the keyboard are disposed on the supporting plate. The light guiding plate is disposed under the supporting plate and has a through hole and a lateral surface. The circuit board adheres onto both a lower surface of the light guiding plate and a bottom surface of the supporting plate and covers the lateral surface. The light-emitting component is disposed on the circuit board in the through hole. Thereby, the circuit board also performs as a light shading structure for the lateral surface. A light reflection sheet need not cover both the lateral surface and the circuit board for avoiding light leakage but adheres onto only the lower surface, conducive to reducing the structural thickness of the back light structure. | 07-24-2014 |
Rung-Ywan Tsai, Taoyuan TW
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20110306143 | Apparatus for single-molecule detection - An apparatus for detecting an object capable of emitting light. The apparatus includes a light source and a waveguide. The waveguide includes a core layer and a first cladding layer. At least one nanowell is formed in at least the first cladding layer. The apparatus further includes a light detector. The light detector can detect a light emitted from a single molecule object contained in the at least one nanowell. | 12-15-2011 |
20140367589 | Apparatus For Single-Molecule Detection - An apparatus for detecting an object capable of emitting light. The apparatus includes a light source and a waveguide. The waveguide includes a core layer and a first cladding layer. At least one nanowell is formed in at least the first cladding layer. The apparatus further includes a light detector. The light detector can detect a light emitted from a single molecule object contained in the at least one nanowell. | 12-18-2014 |
Sheng-Nan Tsai, Taoyuan TW
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20090045900 | CONDUCTIVE WINDING MODULE AND TRANSFORMER HAVING SUCH CONDUCTIVE WINDING MODULE - A conductive winding module includes a plurality of conductive parts and at least one connecting part. Each conductive part includes a conductive body, a first terminal and a second terminal. The conductive body is interconnected between the first terminal and the second terminal and having a hollow portion therein. The connecting part has a first end and a second end for interconnecting any two adjacent conductive parts. A first connecting line is defined between the first end of the connecting part and the first terminal of an adjacent conductive part. A second connecting line is defined between the second end of the connecting part and the second terminal of an adjacent conductive part. The conductive parts are folded with respect to the first connecting line and the second connecting line such that the first hollow portions of the conductive parts are aligned with each other to define a through-hole. | 02-19-2009 |
20090045901 | CONDUCTIVE WINDING MODULE AND TRANSFORMER HAVING SUCH CONDUCTIVE WINDING MODULE - A conductive winding module includes a plurality of conductive parts and at least one connecting part. Each conductive part includes a conductive body, a first terminal and a second terminal. The conductive body is interconnected between the first terminal and the second terminal and having a hollow portion therein. The connecting part has a first end and a second end for interconnecting any two adjacent conductive parts. A first connecting line is defined between the first end of the connecting part and the first terminal of an adjacent conductive part. A second connecting line is defined between the second end of the connecting part and the second terminal of an adjacent conductive part. The conductive parts are folded with respect to the first connecting line and the second connecting line such that the first hollow portions of the conductive parts are aligned with each other to define a through-hole. | 02-19-2009 |
Tse-Ming Tsai, Taoyuan TW
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20090138351 | Advertisement selection systems and methods for internet articles - Advertisement selection systems and methods for internet articles are provided. A personal advertisement agent generates an article characteristic value according to an internet article edited by a content editor. An advertisement server selects at least one of the advertisements according to the article characteristic value, a specialty characteristic value, and advertisement characteristic values of respective advertisements, wherein the specialty characteristic value is generated according to historical articles published by the client. The selected advertisement is integrated and published with the internet article. | 05-28-2009 |
Tsung-Ying Tsai, Taoyuan TW
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20090033570 | ANTENNA MODULE AND ELECTRONIC DEVICE USING THE SAME - An antenna module and an electronic device using the same. The antenna module includes a metal body bent from a I strip metal sheet. The metal body includes a first connecting part, a second connecting part and a plurality of bending parts. The first connecting part and the second connecting part are coupled to a circuit board. The bending parts are formed between the first connecting part and the second connecting part. | 02-05-2009 |
Tung-I Tsai, Taoyuan TW
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20090137375 | Mechanism and method for bonding paper sheets on interfolding machine - In a mechanism and method for bonding two paper sheets on an interfolding machine, pre-compressing mechanisms are provided on each of two folding rollers to produce compress-to-bond areas on overlapped portions of two thick or air-impermeable paper sheets transferred to the two folding rollers, so that all plies of the two paper sheets at the compress-to-bond areas are compressed to bond together. Thereby, when the interfolding machine operates at a high speed, a plurality of the locally compressed and bonded paper sheets may still be smoothly folded to form a stack of interfolded paper sheets, such as a tissue paper stack or a paper towel stack. | 05-28-2009 |
20100133312 | Pre-wound sheet cut-off mechanism for thin material sheet winding device and method thereof - Disclosed is a pre-wound sheet cut-off mechanism of a thin material sheet winding device, including a first winding roller, a plurality of curved guide plates arranged at a predetermined distance below the first winding roller and distributed and spaced from each other by a predetermined distance along an axial direction of a shaft of the first winding roller, a plurality of pre-winding plates each coupled between adjacent curved guide plates, a second winding roller, and a rider roller. In a winding operation, a core is conveyed into a curved-guide-plate channel defined between the first winding roller and the curved guide plates to adhere to and pre-wind a thin material sheet that is conveyed to the first winding roller, and is thereafter transported to a winding nip to form a roll with the thin material sheet. The winding speed of the roll is reduced for preparing a next core to reach the pre-winding plates, accordingly, the thin material sheet is slacked, such that the slacked thin material sheet can be pre-wound, thereafter, the thin material sheet pre-wound continuously and the thin material sheet is gradually tensioned on the next core until the thin material sheet is torn apart. | 06-03-2010 |
20100258670 | METHOD AND STRUCTURE FOR CUTTING OFF WEB MATERIAL IN WINDING MACHINE - Disclosed are a method and a structure for cutting off web in a winding machine. The winding machine includes an upper winding roller having a circumferential surface close to and below which a cut-off mechanism is arranged. The cut-off mechanism includes a pivot shaft having an outer circumferential surface and at least one pinch arm having a connecting end mounted to the outer circumferential surface of the pivot shaft and a web engagement end extending outward from the outer circumferential surface of the pivot shaft and forming at least one suction opening. At least one cutting blade is provided on the web engagement end of the pinch arm at a location immediately by the suction opening. When the pinch arm is driven to rotate the web engagement end to an engagement position where the web engagement end opposes the upper winding roller, the suction opening of the web engagement end sucks and holds a web material passing therethrough, whereby the web material is subjected to a pulling force induced by a roll of paper formed in a winding nip and is thus stretched to have the cutting blade set in tight engagement with the web material to cut off the web material. | 10-14-2010 |
20110056797 | WEB PRODUCT SORTING MACHINE - A web product sorting machine includes a first conveyor unit, a second conveyor unit set adjacent to the first conveyor unit, and a screening unit. A gap is defined between the first conveyor unit and the second conveyor unit. The first conveyor unit is adapted for delivering web products and tail wastes and for enabling web products to be sent to the second conveyor unit. The screening unit is set above the first conveyor unit for screening the web products and the tail wastes to cause each passed tail waste to fall onto the first conveyor unit from a standing position and then to fall out of the first conveyor unit through the gap. | 03-10-2011 |
20110309184 | METHOD AND STRUCTURE FOR SEPARATING THE WEB MATERIAL IN A WINDING MACHINE - Disclosed are a method and a structure for separating the web material in a winding machine. The winding machine includes an upper winding roller and a separation mechanism arranged at a location close to and below the upper winding roller. The separation mechanism includes a pivot shaft having an outer circumferential surface and at least one pinch arm having a connecting end coupled to the outer circumferential surface of the pivot shaft and a web engagement end extending outward from the outer circumferential surface of the pivot shaft. When the pinch arm is driven by a driving mechanism to rotate the web engagement end of the pinch arm to an engagement position where the web engagement end opposes the upper winding roller, the web engagement end of the pinch arm sucks and holds or guides a web material passing therethrough, whereby the web material is subjected to a pulling force induced by a roll of paper formed in a winding nip to tear and thus separate. | 12-22-2011 |
20110309185 | METHOD AND STRUCTURE FOR SEPARATING THE WEB MATERIAL IN A WINDING MACHINE - Disclosed are a method and a structure for separating the web material in a winding machine. The winding machine includes an upper winding roller and a separation mechanism arranged at a location close to and below the upper winding roller. The separation mechanism includes a pivot shaft having an outer circumferential surface and at least one pinch arm having a connecting end coupled to the outer circumferential surface of the pivot shaft and a web engagement end extending outward from the outer circumferential surface of the pivot shaft. When the pinch arm is driven by a driving mechanism to rotate the web engagement end of the pinch arm to an engagement position where the web engagement end opposes the upper winding roller, the web engagement end of the pinch arm sucks and holds or guides a web material passing therethrough, whereby the web material is subjected to a pulling force induced by a roll of paper formed in a winding nip to tear and thus separate. | 12-22-2011 |
20130233137 | WEB PRODUCT CUTTING AND SCREENING MACHINE AND METHOD - A web product cutting and screening machine includes a first conveying unit having a first movable roller set, a second conveying unit having a second movable roller set movable relative to the first movable roller set and defining with the first movable roller set a first gap therebetween, and a cutter movable across the first gap to cut off a web product, producing a head cut piece, normal cut pieces and a tail cut piece. During screening operation, the second movable roller set can be moved away from the first movable roller set to screen the heat cut piece and the first movable roller set can be moved away from the second movable roller set to screen the tail cut piece, and therefore the web product cutting and screening efficiency is improved. | 09-12-2013 |
20150105233 | FOLDING ROLLER MODULE WITH COMBINED BEARING UNIT - A folding roller module with combined bearing unit is disclosed. The folding roller module of the present invention comprises a folding roller and a plurality of combined bearing unit. In the present invention, a plurality of combined bearing unit are used to support the folding roller at suitable locations for enhancing the strength of the folding roller module, reducing the deformation of the folding roller, and reducing the vibration during operation. | 04-16-2015 |
20150114197 | COMPOSITE BLADE MODULE AND CUTTING MEANS USING THE SAME - The present invention provides a composite blade module and cutting means using the same. The composite blade module comprises a blade and at least one elastic layer. The elastic layers are adhered to a part of cutting edge and/or a back of the blade selectively. The composite blade module is used by the cutting means to cut an object to be cut. The elastic layers may be used as a shock absorber to absorb the collision force acting on the blade, thus reducing the probability of breaking blade, during the cutting process. Furthermore, if the blade is broken unfortunately, the broken blade is still adhered to the elastic layers, in such a way that the broken blade is prevented from either being drawn into the cutting means and then damaging the means, or being ejected and then endangering the operator, leading to safety guarantee during cutting. | 04-30-2015 |
Wen Yu Tsai, Taoyuan TW
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20100021222 | MEMBRANE CABLE AND KEYBOARD - The invention discloses a membrane cable including several metal wires, a cover body and a reinforcement plate. The cover body covers the metal wires, and the reinforcement plate is adhered to an external surface of the cover body. The cover body and the metal wires are bended toward the reinforcement plate, and the reinforcement plate can prevent the cover body and the metal wires from being over-bended. | 01-28-2010 |
Yung Cheng Tsai, Taoyuan TW
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20130127587 | CO-FIRED MULTI-LAYER STACK CHIP RESISTOR AND MANUFACTURING METHOD - A co-fired multi-layer stack chip resistor is provided. The co-fired multi-layer stack chip resistor includes a ceramic substrate and a multi-layer stack resistance structure monomer. The ceramic substrate is formed by stacking multiple layers of the ceramic membranes, wherein the ceramic membranes is formed of a bearing membrane and a porcelain slurry with the solvent, the binder and the dispersant. The multi-layer stack resistance structure monomer is stacked on the ceramic substrate, and includes multiple bearing membranes and multiple resistive layers, wherein each resistive layer is formed on the surface of the corresponding bearing membrane, the resistive layers are parallel to each other, and the contiguous resistive layers are stacked with the interval of the predetermined distance along the vertical direction. The multi-layer stack resistance structure monomer and the ceramic substrate are sintered and shaped with the predetermined sintering temperature and the predetermined sintering time in a kiln stove. | 05-23-2013 |