Patent application number | Description | Published |
20090206028 | COMBINED NUTRIENT RECOVERY AND BIOGAS SCRUBBING SYSTEM INTEGRATED IN SERIES WITH ANIMAL MANURE ANAEROBIC DIGESTER - An economical, integrated system works in series with anaerobic digestion of animal waste to recover nitrogen and phosphorous, while also scrubbing the produced biogas. | 08-20-2009 |
20090209014 | HETEROTROPHIC ALGAL HIGH CELL DENSITY PRODUCTION METHOD AND SYSTEM - A multiphase culturing process for high density heterotrophic microalgal growth uses crude glycerol as the primary carbon source and produces ω-3 fatty acids. The process uses multiphase growth conditions that decouple the phases of increasing cell density and increasing cell size and fatty acid production. The entire process is integrated with biodiesel production. | 08-20-2009 |
20100159557 | Pelletization Process to Control Filamentous Fungi Morphology for Enhanced Reactor Rheology Bioproduct Formation - Filamentous fungi are grown in pellet form by culturing the filamentous fungi in liquid culture under one or more of the following conditions: 1) with addition of particulate substrates: 2) using spores which have been stored for a period of time prior to inoculation; and 3) using high spore inoculum concentrations. | 06-24-2010 |
20110091954 | INTEGRATION OF ANAEROBIC DIGESTION IN AN ALGAE-BASED BIOFUEL SYSTEM - Systems and methods for the treatment of lipid-extracted algae biomass and recycling nutrients are provided. The lipid-extracted algae biomass is hydrolyzed prior to anaerobic digestion, and the products generated by anaerobic digestion are further processed to yield by-products that are of use either for external use or as process inputs to carry out specific steps within an integrated algal growth and anaerobic digestion process designed to minimize economic costs, required costly inputs while improving upon system capabilities. | 04-21-2011 |
20120118035 | NUTRIENT RECOVERY SYSTEMS AND METHODS - Methods, systems, and apparatuses for anaerobic digestion of waste fibrous material and the recovery of nutrients are provided. Methods, systems, and apparatuses disclosed herein provide mechanisms to release dissolved gases from anaerobic digester effluent. Methods, systems and apparatuses disclosed herein can recover one or more nutrients from anaerobic digested effluent using a range of temperatures, aeration rates, aeration times, pH ranges, and settling times. | 05-17-2012 |
20120322130 | PROCESSING BIOMASS USING THERMOCHEMICAL PROCESSING AND ANAEROBIC DIGESTION IN COMBINATION - Systems and methods for integrating thermochemical processing of biomass and anaerobic digestion are provided. Light oxygenated organic compounds are produced as byproducts of thermochemical biomass processing e.g. by torrefaction and/or pyrolysis, and are converted to methane by anaerobic digestion. Thermochemical processing units may or may not be co-located with the anaerobic digestion units, with co-location providing benefits for e.g. rural agricultural enterprises. | 12-20-2012 |
20130309740 | Two-Stage Anaerobic Digestion Systems Wherein One of the Stages Comprises a Two-Phase System - Low cost, efficient two-stage anaerobic digestion systems for the production of biogas (e.g. methane) are provided. During the first stage, biogas is produced in a first reactor by anaerobic microbes cultured in two phases: a high solids phase and a low solids phase. During the second stage, biogas is produced in a second reactor by a methanogen-rich anaerobic culture cultured in low solids medium. Removal of effluent comprising pH lowering reaction products assists in maintaining a suitable pH in the high solids phase. The transfer of effluent from the second reactor to the first reactor assists in maintaining a suitable pH in the high solids phase, in mixing of the high solids phase, and in reseeding the high solids phase with methanogens. Methane is produced in and recovered from both reactors. | 11-21-2013 |
20130309759 | METHODS AND APPARATUSES FOR REMOVAL OF HYDROGEN SULFIDE AND CARBON DIOXIDE FROM BIOGAS - Methods, systems and apparatuses herein provide a unique and novel process to remove H | 11-21-2013 |
20140314657 | NUTRIENT RECOVERY SYSTEMS AND METHODS - Methods, systems, and apparatuses for anaerobic digestion of waste fibrous material and the recovery of nutrients are provided. Methods, systems, and apparatuses disclosed herein provide mechanisms to release dissolved gases from anaerobic digester effluent. Methods, systems and apparatuses disclosed herein can recover one or more nutrients from anaerobic digested effluent using a range of temperatures, aeration rates, aeration times, pH ranges, and settling times. | 10-23-2014 |
20150056676 | Two-Stage Anaerobic Digestion Systems Wherein One of the Stages Comprises a Two-Phase System - Low cost, efficient two-stage anaerobic digestion systems for the production of biogas (e.g. methane) are provided. During the first stage, biogas is produced in a first reactor by anaerobic microbes cultured in two phases: a high solids phase and a low solids phase. During the second stage, biogas is produced in a second reactor by a methanogen-rich anaerobic culture cultured in low solids medium. Removal of effluent comprising pH lowering reaction products assists in maintaining a suitable pH in the high solids phase. The transfer of effluent from the second reactor to the first reactor assists in maintaining a suitable pH in the high solids phase, in mixing of the high solids phase, and in reseeding the high solids phase with methanogens. Methane is produced in and recovered from both reactors. | 02-26-2015 |
Patent application number | Description | Published |
20090032933 | REDISTRIBUTED CHIP PACKAGING WITH THERMAL CONTACT TO DEVICE BACKSIDE - Redistributed Chip Packaging with Thermal Contact to Device Backside An integrated circuit assembly includes a panel including an semiconductor device at least partially surrounded by an encapsulant. A panel upper surface and a device active surface are substantially coplanar. The assembly further includes one or more interconnect layers overlying the panel upper surface. Each of the interconnect layers includes an insulating film having contacts formed therein an interconnect metallization formed thereon. A lower surface of the panel is substantially coplanar with either a backside of the device or a lower surface of a thermally and electrically conductive slab that has an upper surface in thermal contact with the device backside. The assembly may also include a set of panel vias. The panel vias are thermally and electrically conductive conduits extending through the panel between the interconnect layer and suitable for bonding with a land grid array (LGA) or other contact structure of an underlying circuit board. | 02-05-2009 |
20090057849 | INTERCONNECT IN A MULTI-ELEMENT PACKAGE - A packaged semiconductor device includes an interconnect layer over a first side of a polymer layer, a semiconductor device surrounded on at least three sides by the polymer layer and coupled to the interconnect layer, a first conductive element over a second side of the polymer layer, wherein the second side is opposite the first side, and a connector block within the polymer layer. The connector block has at least one electrical path extending from a first surface of the connector block to a second surface of the connector block. The at least one electrical path electrically couples the interconnect layer to the first conductive element. A method of forming the packaged semiconductor device is also described. | 03-05-2009 |
20090072357 | Integrated shielding process for precision high density module packaging - An electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed on a plurality of encapsulated modules by attaching a plurality of modules ( | 03-19-2009 |
20100006988 | Integrated Conformal Shielding Method and Process Using Redistributed Chip Packaging - An integrated conformal electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed on a plurality of encapsulated modules by attaching a plurality of modules ( | 01-14-2010 |
20100078760 | INTEGRATED CIRCUIT MODULE WITH INTEGRATED PASSIVE DEVICE - A disclosed integrated circuit (IC) module includes an IC panel and multi level circuit structure, referred to as an IPD structure, overlying an upper surface of the IC panel. The IC panel includes an electrically conductive embedded ground plane (EGP), an integrated circuit (IC) die, and an encapsulating material. The EGP is a substantially planar structure that includes or defines a plurality of cavities. The EGP may include or define an IC cavity and an IPD cavity. The IC die may be positioned within the IC cavity such that a perimeter of the IC cavity surrounds the IC die. The IPD structure may define or include a passive device such as an inductor. The passive device may be positioned or located overlying the void in the EGP. | 04-01-2010 |
20120252169 | REDISTRIBUTED CHIP PACKAGING WITH THERMAL CONTACT TO DEVICE BACKSIDE - An integrated circuit assembly includes a panel including an semiconductor device at least partially surrounded by an encapsulant. A panel upper surface and a device active surface are substantially coplanar. The assembly further includes one or more interconnect layers overlying the panel upper surface. Each of the interconnect layers includes an insulating film having contacts formed therein an interconnect metallization formed thereon. A lower surface of the panel is substantially coplanar with either a backside of the device or a lower surface of a thermally and electrically conductive slab that has an upper surface in thermal contact with the device backside. The assembly may also include a set of panel vias. The panel vias are thermally and electrically conductive conduits extending through the panel between the interconnect layer and suitable for bonding with a land grid array (LGA) or other contact structure of an underlying circuit board. | 10-04-2012 |
20140146509 | ELECTRONIC DEVICES WITH CAVITY-TYPE, PERMEABLE MATERIAL FILLED PACKAGES, AND METHODS OF THEIR MANUFACTURE - Embodiments include devices and methods of their manufacture. A device embodiment includes a package housing, at least one electronic circuit (e.g., a sensor circuit), a first material, and a second material. The package housing includes a cavity that is partially defined by a cavity bottom surface, and the cavity bottom surface includes a mounting area and a non-mounting area. The at least one electronic circuit is attached to the cavity bottom surface over the mounting area. The first material has a relatively high, first modulus of elasticity, and covers the non-mounting area. The second material has a relatively low, second modulus of elasticity, and is disposed over the first material within the cavity. | 05-29-2014 |