Patent application number | Description | Published |
20120108190 | WIRELESS TRANSMISSION APPARATUS - A wireless transmission apparatus includes an electrically insulative housing, metal conducting terminals vertically arranged at the rear side of the electrically insulative housing and having one respective front contact portion respectively horizontally extended to the bottom wall of an accommodation chamber in the electrically insulative housing, and a transmission module, which includes a circuit assembly accommodated in the accommodation chamber of the electrically insulative housing and metal adapter terminals each having a bonding end vertically disposed at the rear side and respectively bonded to the circuit assembly and a springy contact end horizontally disposed at the front side and kept in positive contact with the front contact portion of one respective metal conducting terminal. | 05-03-2012 |
20140009246 | NETWORK SIGNAL ENHANCEMENT CIRCUIT ASSEMBLY - A network signal enhancement circuit assembly includes a processing circuit installed in a circuit board and having opposing first and second connection ends thereof respectively coupled to a network connector and a voltage-mode network-on-chip. The processing circuit includes coupling modules for coupling network signals, EMI protection modules for removing noises from coupled network signals, and a signal enhancement module including a voltage source and a plurality of pull-up resistors and adapted to compensate for an attenuation of the network signal due to long distance signal transmission, assuring a high level of signal transmission stability. | 01-09-2014 |
20140160608 | SURGE PROTECTIVE NETWORK SIGNAL PROCESSING CIRCUIT ASSEMBLY - A surge protective network signal processing circuit assembly includes a network chip, a network connector, and a processing circuit connected between the network chip and the network connector and including one or multiple two-wire channels electrically connected in parallel between the network chip and the network connector, a signal coupling capacitor electrically connected to each two-wire channel and a self-coupling AC regulator electrically connected in parallel to each two-wire channel between the network connector and the associating signal coupling capacitor and electrically connected to a ground terminal for discharging voltage surge | 06-12-2014 |
20150236874 | IMPEDANCE MATCHING DEVICE-INTEGRATED NETWORK SIGNAL PROCESSING CIRCUIT - An impedance matching device-integrated network signal processing circuit includes a first connection terminal electrically connected to the network chip, a second connection terminal electrically connected to the network connector, a plurality of circuit paths electrically connected between the first connection terminal and the second connection terminal, a coupling circuit including a plurality of capacitors respectively connected in series to the circuit paths and a plurality of inductors respectively connected in parallel between each two adjacent circuit paths, and a plurality of impedance matching devices respectively electrically connected in series to each two adjacent circuit paths, each impedance matching device including two microstrip coils respectively electrically connected in series to each two adjacent circuit paths between the first connection terminal and respective the inductors to keep the impedance at the motherboard of the computer in balance with the impedance at the network cable, avoiding signal interference and achieving signal transmission stability. | 08-20-2015 |
20150276822 | LIGHTNING DETECTION CIRCUIT ASSEMBLY - A lightning detection circuit assembly includes electrical connector including signal input terminal and signal processing system, and lightning detection circuit including resistor electrically connected with one end thereof to the electrical connector, grounding terminal electrically connected to the opposite end of the resistor and output terminal electrically connected to the end of the resistor that is electrically connected to the electrical connector. When the signal input terminal receives high current or high voltage of abnormal surge (lightning), the high voltage is transmitted to the lightning detection circuit and then discharged by the resistor through the grounding terminal, and at the same time, the resistor converts the surge into a data signal for output through the output terminal to external electronic device for recording, and thus the external electronic device can record the frequency, time or intensity of occurred surges (lightning) for reference in a further maintenance or inspection work. | 10-01-2015 |
Patent application number | Description | Published |
20100110686 | LED LIGHT MODULE - An LED light module of uniformly mixed light is provided. The LED light module has a plurality of shifted-disposed LED packages, arranged as a polygon, disposed on a substrate. Each of the shifted-disposed LED packages includes a base, and an LED die disposed aside from a center of the base. The light emitted from the shifted-disposed LED package is asymmetrically dispersed and is tilted to a predetermined direction. Therefore, the lights from the shifted-disposed LED packages are centralized and uniformly mixed as white light. | 05-06-2010 |
20100127672 | Power Supply Device with Fast Output Voltage Switching Capability - A power supply device is disclosed in the present invention, which includes a DC-DC boost converter and a charge recycling circuit. The DC-DC boost converter is utilized for boosting an input voltage to generate an output voltage, and adjusting a voltage level of the output voltage according to a level switching signal. The charge recycling circuit is electrically connected to the DC-DC boost converter, and is utilized for generating a current path according to the level switching signal to recycle redundant charges from the DC-DC boost converter when the output voltage is switched from high to low and to return stored charges back to the DC-DC boost converter when the output voltage is switched from low to high, so as to accelerate voltage switching of the output voltage and to reduce power consumption of the DC-DC boost converter. | 05-27-2010 |
20100164855 | Backlight Control Method for Liquid Crystal Panel and Related Liquid Crystal Display - A backlight control method for an LCD panel is disclosed, and includes steps of dividing the LCD panel into a plurality of backlight areas; configuring an expanding area and a weighted area for each backlight area of the plurality of backlight areas; and determining backlight intensity of each backlight area according to a weighted average grayscale value calculated with all pixels inside the expanding area and the weighted area, wherein the expanding area is formed by expanding outwardly from each backlight area, and the weighted area is focused on the center of each backlight area and has a range not greater than that of the expanding area. | 07-01-2010 |
Patent application number | Description | Published |
20100329084 | Clock Having Diverse Ornamental Variations - A clock includes a tumbler and a decorative scale unit including a plurality of decorative scales surrounding the tumbler. Thus, the clock has an outstanding outer appearance by the decorative scales of the decorative scale unit. In addition, a smaller one of the decorative scales of the decorative scale unit is received in a larger one of the decorative scales so that the decorative scales encircle each other before assembly to reduce the whole volume of the decorative scale unit, thereby facilitating packaging, storage and transportation of the clock. Further, the decorative scales are arranged arbitrarily to form different geometric shapes according to the requirements of different users, thereby greatly enhancing the aesthetic quality of the clock. | 12-30-2010 |
20110025542 | Integration Interface of a Remote Control Toy and an Electronic Game - An integration interface of a remote control toy and an electronic game includes an electronic equipment, at least one camera unit, an electronic monitor, an operation unit, a remote control signal output device, a horn, and a controlled object. Thus, when the operation unit inputs an operation signal into the electronic equipment, by decoding and calculation of the electronic equipment, the electronic equipment drives the remote control signal output device to transmit a wireless signal to drive and control movement of the remote control toy, so that the user or controller can operate the true toy on the electronic monitor so as to achieve a virtual reality amusement. | 02-03-2011 |
Patent application number | Description | Published |
20130181320 | Manufacturing Techniques for Workpieces with Varying Topographies - Some embodiments relate to a method for processing a workpiece. In the method, an anti-reflective coating layer is provided over the workpiece. A first patterned photoresist layer, which has a first photoresist tone, is provided over the anti-reflective coating layer. A second patterned photoresist layer, which has a second photoresist tone opposite the first photoresist tone, is provided over the first patterned photoresist layer. An opening extends through the first and second patterned photoresist layers to allow a treatment to be applied to the workpiece through the opening. Other embodiments are also disclosed. | 07-18-2013 |
20140151699 | Test Structure Placement on a Semiconductor Wafer - A method of fabricating integrated circuit devices is provided. The method includes forming a plurality of spaced integrated circuit dies on a semiconductor wafer and forming a dedicated test die on the semiconductor wafer adjacent the plurality of spaced integrated circuit dies, the dedicated test die including a test structure having a first width when viewed in a top view and being operable to generate wafer evaluation data. Further, the method includes forming a scribe line region interposed between the plurality of spaced integrated circuit dies, the scribe line region having a second width defined by a distance between adjacent integrated circuit dies when viewed in a top view, the second width being smaller than the first width, and the scribe line region being free of test structures. | 06-05-2014 |
20150249109 | METHOD OF FABRICATING A METAL GRID FOR SEMICONDUCTOR DEVICE - A method for manufacturing the image sensor device is provided. The method includes depositing a first dielectric layer over a back surface of a substrate, forming a ridge over the first dielectric layer, depositing a second dielectric layer over the first dielectric layer, including filling in a space between two adjacent ridges. The method also includes removing the ridge to form a trench in the second dielectric layer and forming a metal grid in the trench. | 09-03-2015 |
Patent application number | Description | Published |
20130137266 | MANUFACTURING TECHNIQUES TO LIMIT DAMAGE ON WORKPIECE WITH VARYING TOPOGRAPHIES - Some embodiments relate to a method for processing a workpiece. In the method, a first photoresist layer is provided over the workpiece, wherein the first photoresist layer has a first photoresist tone. The first photoresist layer is patterned to provide a first opening exposing a first portion of the workpiece. A second photoresist layer is then provided over the patterned first photoresist layer, wherein the second photoresist layer has a second photoresist tone opposite the first photoresist tone. The second photoresist layer is then patterned to provide a second opening that at least partially overlaps the first opening to define a coincidentally exposed workpiece region. A treatment is then performed on the coincidentally exposed workpiece region. Other embodiments are also disclosed. | 05-30-2013 |
20130207163 | Semiconductor Devices and Manufacturing Methods Thereof - Semiconductor devices and manufacturing methods thereof are disclosed. In one embodiment, a semiconductor device includes a workpiece with a first region having a plurality of first features and a second region having a plurality of second features proximate the first region. The first region and the second region share a patterning overlap region disposed between the first region and the second region. The patterning overlap region includes a residue feature with an aspect ratio of about 4 or less. | 08-15-2013 |
20130270667 | Metal Grid in Backside Illumination Image Sensor Chips and Methods for Forming the Same - A method includes forming a plurality of image sensors on a front side of a semiconductor substrate, and forming a dielectric layer on a backside of the semiconductor substrate. The dielectric layer is over the semiconductor substrate. The dielectric layer is patterned into a plurality of grid-filling regions, wherein each of the plurality of grid-filling regions overlaps one of the plurality of image sensors. A metal layer is formed on top surfaces and sidewalls of the plurality of grid-filling regions. The metal layer is etched to remove horizontal portions of the metal layer, wherein vertical portions of the metal layer remain after the step of etching to form a metal grid. A transparent material is filled into grid openings of the metal grid. | 10-17-2013 |
20130273740 | FILM PORTION AT WAFER EDGE - A film layer on a substrate of the wafer is patterned to form a first plurality of areas of the film layer and a second plurality of areas of the film layer. The first plurality of areas of the film layer is removed. The second plurality of areas of the film layer is kept on the substrate. A first portion of the film layer is kept on the substrate. A first edge of the first portion of the film layer is substantially near an edge of the wafer. The first portion of the film layer defines a boundary for the wafer. | 10-17-2013 |
20130302985 | METHOD OF REMOVING RESIDUE DURING SEMICONDUCTOR DEVICE FABRICATION - A method is described including forming a first photoresist feature and a second photoresist feature on a semiconductor substrate. A chemical material coating is formed on the semiconductor substrate. The chemical material coating interposes the first and second photoresist features. The semiconductor substrate is then rinsed; the rinsing removes the chemical material coating from the semiconductor substrate. The chemical material may mix with a residue disposed on the substrate between the first and second photoresist features. Removing the chemical material coating from the substrate may also remove the residue. | 11-14-2013 |
20140061738 | Method to Form a CMOS Image Sensor - The present disclosure relates to a method and composition to limit crystalline defects introduced in a semiconductor device during ion implantation. A high-temperature low dosage implant is performed utilizing a tri-layer photoresist which maintains the crystalline structure of the semiconductor device while limiting defect formation within the semiconductor device. The tri-layer photoresist comprises a layer of spin-on carbon deposited onto a substrate, a layer of silicon containing hard-mask formed above the layer of spin-on carbon, and a layer of photoresist formed above the layer of silicon containing hard-mask. A pattern formed in the layer of photoresist is sequentially transferred to the silicon containing hard-mask, then to the spin-on carbon, and defines an area of the substrate to be selectively implanted with ions. | 03-06-2014 |
20140065843 | Method of Forming a Photoresist Layer - A method for forming a photoresist layer on a semiconductor device is disclosed. An exemplary includes providing a wafer. The method further includes spinning the wafer during a first cycle at a first speed, while a pre-wet material is dispensed over the wafer and spinning the wafer during the first cycle at a second speed, while the pre-wet material continues to be dispensed over the wafer. The method further includes spinning the wafer during a second cycle at the first speed, while the pre-wet material continues to be dispensed over the wafer and spinning the wafer during the second cycle at the second speed, while the pre-wet material continues to be dispensed over the wafer. The method further includes spinning the wafer at a third speed, while a photoresist material is dispensed over the wafer including the pre-wet material. | 03-06-2014 |
20140080067 | METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT FABRICATION - A method of fabricating a semiconductor integrated circuit (IC) is disclosed. The method includes providing a substrate having two different topography areas adjacent to each other. A step-forming material (SFM) is deposited over the substrate. A patterned SFM is formed in the low topography area of the two areas. The formation of the patterned SFM provides a fairly planar surface across over the substrate. | 03-20-2014 |
20140272704 | THICKENING PHASE FOR SPIN COATING PROCESS - Among other things, one or more techniques and systems for performing a spin coating process associated with a wafer and for controlling thickness of a photoresist during the spin coating process are provided. In particular, a thickening phase is performed during the spin coating process in order to increase a thickness of the photoresist. For example, air temperature of down flow air, flow speed of the down flow air, and heat temperature of heat supplied towards the wafer are increased during the thickening phase. The increase in down flow air and heat increase a vaporization factor of the photoresist, which results in an increase in viscosity and thickness of the photoresist. In this way, the wafer can be rotated at relatively lower speeds, while still attaining a desired thickness. Lowering rotational speed of wafers allows for relatively larger wafers to be stably rotated. | 09-18-2014 |
20140272715 | Lithography Process on High Topology Features - A method includes forming a first photo resist layer over a base structure and a target feature over the base structure, performing an un-patterned exposure on the first photo resist layer, and developing the first photo resist layer. After the step of developing, a corner portion of the first photo resist layer remains at a corner between a top surface of the base structure and an edge of the target feature. A second photo resist layer is formed over the target feature, the base structure, and the corner portion of the first photo resist layer. The second photo resist layer is exposed using a patterned lithography mask. The second photo resist layer is patterned to form a patterned photo resist. | 09-18-2014 |
20150212420 | FILM PORTION AT WAFER EDGE - A method for preparing a wafer includes forming a film layer on a substrate of the wafer; coating the film layer with a photoresist layer; exposing a first portion of the photoresist layer to a beam of light; and patterning a second portion of the photoresist layer after performing exposing the first portion of the photoresist layer. A cross-link reaction is caused on the first portion of the photoresist layer and the first portion of the photoresist layer is converted to a reacted first portion of the photoresist layer. The reacted first portion of the photoresist layer is near an edge of the wafer. The second portion of the photoresist layer is different from the reacted first portion of the photoresist layer. The second portion of the photoresist layer is converted to a patterned second portion of the photoresist layer. | 07-30-2015 |
20150243500 | METHOD OF FORMING A PHOTORESIST LAYER - A method for forming a photoresist layer on a semiconductor device is disclosed. An exemplary includes providing a wafer. The method further includes spinning the wafer during a first cycle at a first speed, while a pre-wet material is dispensed over the wafer and spinning the wafer during the first cycle at a second speed, while the pre-wet material continues to be dispensed over the wafer. The method further includes spinning the wafer during a second cycle at the first speed, while the pre-wet material continues to be dispensed over the wafer and spinning the wafer during the second cycle at the second speed, while the pre-wet material continues to be dispensed over the wafer. The method further includes spinning the wafer at a third speed, while a photoresist material is dispensed over the wafer including the pre-wet material. | 08-27-2015 |
Patent application number | Description | Published |
20090260156 | PLAYPEN HUB ASSEMBLY - A playpen hub assembly includes a base, a first support part and a second support part. The first support part and the second support part are pivoted to two sides of a base body of the base respectively. A slider in the base is moved between a lock position and a release position along a first rail in the base body. An end of the slider has a first block structure for constraining rotation of the first support part relative to the base body. Another end of the slider has a second block structure for constraining rotation of the second support part relative to the base body. A driving part in the base is used for moving the slider to the release position. When the slider is located at the lock position, the first rail is substantially parallel to the first support part and the second support part. | 10-22-2009 |
20090315008 | FOLDABLE HANDRAIL STRUCTURE - A foldable handrail structure includes a casing, a first handrail member and a first locking member. The first handrail member is rotatably connected to the casing. The first locking member is rotatably disposed in the casing. The first locking member is capable of rotating between a first locked position and a first unlocked position, so as to selectively restrain the first handrail member from rotating. | 12-24-2009 |
20100060059 | HIGHCHAIR - A highchair includes a seat frame, a first fixing socket disposed on the seat frame, and a seat pivotally connected to the first fixing socket. The first fixing socket has a sliding groove and a first engaging groove. The sliding groove communicates with the first engaging groove. The highchair includes a pivoting member, a restraining member, a connecting member, an adjusting member and a fixing member. The adjusting member is movably disposed on the seat. The fixing member is rotatably disposed on the seat and capable of selectively locking or releasing the adjusting member. The pivoting member is pivotally connected to one side of the seat. One end of the connecting member is connected to the pivoting member and the other end is connected to the adjusting member. The restraining member is disposed at one end of the pivoting member and movably engaged with the first engaging groove. | 03-11-2010 |
20100109292 | STROLLER - A stroller includes two side frames and a first seat disposed between the side frames. Each side frame includes an armrest, a first leg, a second leg, a handle, and a first link. The first leg and the second leg are pivoted to the armrest, respectively. The handle is pivoted to the armrest, and a bottom end of the handle is detachably engaged with the first leg. A front end of the first link is pivoted to the second leg, and another opposite end is pivoted to the handle. The first seat is movably disposed on the first link. Thus, when the handle rotates between an extended position and a folded position, the first link can bring the first seat and the second leg to rotate relative to the armrest. | 05-06-2010 |
20100260536 | PLAYPEN HUB ASSEMBLY AND PLAYPEN USING THE SAME - A linking device is configured at the bottom of a playpen. Two of the bottom pipes at opposite side pivot to a base seat and further pivot to the linking device, which is engaged by a locking device so that the bottom pipes and the linking device are secured at an unfolding position. To fold the hub assembly, using a strap or by pushing the locking device directly pivots the locking device to disengage from the linking device and the bottom pipes may rotate to a folding position. To restore the hub assembly to the unfolding position, the linking device can be pressed to push an inclined surface of the locking device to impart a force to the locking device to pivot the locking device until the linking device snaps to engage the locking device, so the hub assembly is secured at the unfolding position again. | 10-14-2010 |
Patent application number | Description | Published |
20100123851 | Backlight Module and Display Device Using the Same - The present disclosure is a backlight module including a light guide plate, a supporter, and a light source module. The light guide plate has a light incident side. The supporter has a bottom plate, a sidewall, and a top plate corresponding to the bottom plate. The bottom plate extends from a first end of the sidewall toward the light guide plate, and the top plate extends along a second end of the sidewall toward the light guide plate. The length of the sidewall is longer than the length of the top plate, such that the top plate corresponding to the sidewall forms at least one breach to expose the second end of the sidewall. The bottom plate, the top plate, and the sidewall together form an accommodating space, and the light incident side of the light guide plate is disposed between the top plate and the bottom plate. The light source module is disposed in the accommodating space and partially exposed through the at least one breach. The light source module has at least one light emitting unit and a printed circuit board. The light emitting unit is disposed on the printed circuit board, such that an emitting surface of the light emitting unit can face the light incident side of the light guide plate. | 05-20-2010 |
20100245716 | Display Device and Backlight Module with Thermal Isolating Layer - A display device and a backlight module thereof are provided. The display device further includes a display panel having a display area. The backlight module is disposed under the display panel and includes a light source holder, a light source, and a light guide plate. The light source holder has a sidewall, a top plate, and a bottom plate, wherein the bottom plate partially overlaps the display area of the display device. The light guide plate is disposed corresponding to the display area of the display device and has one end located in an opening between the top plate and the bottom plate. A thermal isolating layer is interposed between the light guide plate and a portion of the bottom plate which corresponds to the display area. The perpendicular distance between the light guide plate and the portion of the bottom plate overlapping the thermal isolating layer is greater than a perpendicular distance between the light guide plate and the other portion of the bottom plate. | 09-30-2010 |
20110156063 | ORGANIC LIGHT EMITTING DIODE (OLED) DISPLAY DEVICE - An exemplary OLED display device includes a substrate, a colored photo-resist layer and a white OLED arranged in that order. The white OLED includes a reflecting electrode, a transmitting electrode, and an organic white light emitting layer arranged between the reflecting electrode and the transmitting electrode for emitting a white light. The colored photo-resist layer at least includes first through third photo-resist regions, the first through third photo-resist regions contain red pigment particles, green pigment particles and blue pigment particles respectively for extracting red, green and blue light components from the white light. Moreover, the colored photo-resist layer has an expected haze value e.g., greater than 30 by at least utilizing the scattering of the red, green and blue pigment particles and/or mixing of scattering particles that are different from the red, green and blue pigment particles into the first through third photo-resist regions. | 06-30-2011 |
20130026517 | ORGANIC LUMINANCE DEVICE, METHOD FOR MANUFACTURING SAME AND LIGHTING APPARATUS INCLUDING SAME - An organic luminance device includes a base substrate, a organic luminance multi-layered structure and a cover substrate. Furthermore, a protective film is used to wrap the light emitting surface and at least one lateral surface of the base substrate to prevent the substrate from crack. The protective film may be doped with one or more dopants having a refractive index different from original material of the protective film. | 01-31-2013 |
Patent application number | Description | Published |
20100239747 | SHADOW MASK AND EVAPORATION SYSTEM INCORPORATING THE SAME - A shadow mask and an evaporation system incorporating the same. The shadow mask comprises at least one opening. The length and the width of the opening range from about 100 μm to about 2000 μm and from about 25 μm to about 75 μm, respectively. | 09-23-2010 |
20110089819 | ORGANIC ELECTROLUMINESCENCE DEVICE AND ELECTRONIC DEVICE HAVING THE SAME - An organic electroluminescence device including a substrate, an organic emitting device layer, a circuit board, a sealant and an electrical bonding layer is provided. The organic emitting device layer is on the substrate and has a first electrode layer, an emitting layer and a second electrode layer. The first electrode layer is disposed on the substrate, the emitting layer is disposed on the first electrode layer and the second electrode layer is disposed on the emitting layer. The circuit board is disposed over the substrate and covers the organic emitting device layer. The sealant is disposed between the substrate and the circuit board to seal the circuit board on the substrate. The electrical bonding layer is disposed between the substrate and the circuit board to electrically connect the circuit board and the first electrode layer of the organic emitting device layer. | 04-21-2011 |
20120061701 | ORGANIC LIGHT EMITTING DEVICE - An organic light emitting device includes an organic light emitting panel and at least one light extraction enhanced film. The organic light emitting panel has at least one light emitting surface. The light extraction enhanced film is disposed on the light emitting surface of the organic light emitting panel, and the light extraction enhanced film has a recess array. The recess array includes a plurality of recess holes. The recess holes are recessed toward the organic light emitting panel. | 03-15-2012 |
20120086025 | ORGANIC LIGHT-EMITTING DIODE MODULE - An organic light-emitting diode (OLED) module includes a substrate, a bus line, an organic light-emitting device layer, a plurality of conductive elements, and at least one conductive wire. The bus line is configured on the substrate. The organic light-emitting device layer is configured on the substrate and electrically connected to the bus line. The conductive elements are configured on the substrate and electrically connected to the bus line. The conductive wire is configured next to the conductive elements and electrically connected to the conductive elements. | 04-12-2012 |
Patent application number | Description | Published |
20090032825 | Structure Of LED-Based Display Module And Method For Manufacturing The Same - The display module contains a circuit board, a heat-resistant and transparent protective layer, and a transparent and waterproofing enclosing member. The circuit board has a number of LED devices configured on the front surface and at least a terminal on the back surface. The LED devices are electrically and signally wired to the terminal so that electricity and video signals are fed to the LED devices via the terminal. The protective layer is coated on the outer surfaces of the LED devices and the circuit board so as to protect the wiring, the soldering contacts, and the electrical components of the circuit board from being damaged by the high temperature during the process of forming the enclosing member. The enclosing member wraps the circuit board and the LED devices entirely within and exposes only the terminal. | 02-05-2009 |
20100172131 | LED street lamp - A light-emitting diode (LED) street lamp is applicable for street lighting. The LED street lamp includes a casing, an LED module, and a heat dissipation module. The LED module and the heat dissipation module are arranged inside the casing. The LED module includes a frame, a circuit board carrying a plurality of LEDs, and a light regulation mechanism. The frame and the circuit board are set opposing each other with the light regulation mechanism arranged therebetween to interfere with emission light from the LEDs. The emission light, after being interfered with, is projected outside the casing to realize lighting. The heat dissipation module is in physical engagement with the LED module to remove heat generated by the LEDs. As such, the LED street lamp is provided with a broader range of illumination angle and more uniform brightness, so that the same LED street lamp is applicable to various sites and the heat generated by the LEDs can be efficiently dissipated. | 07-08-2010 |