Tseng, Hsinchu
Bo-Hsiang Tseng, Hsinchu TW
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20120305965 | LIGHT EMITTING DIODE SUBSTRATE AND LIGHT EMITTING DIODE - A light emitting diode (LED) substrate includes a sapphire substrate which is characterized by having a surface consisting of irregular hexagonal pyramid structures, wherein a pitch of the irregular hexagonal pyramid structure is less than 10 μm. A symmetrical cross-sectional plane of each of the irregular hexagonal pyramid structures has a first base angle and a second base angle, wherein the second base angle is larger than the first base angle, and the second base angle is 50° to 70°. This LED substrate has high light-emitting efficiency. | 12-06-2012 |
Bo-Yu Tseng, Hsinchu TW
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20090308527 | Method For Fabricating Circuit Trace On Core Board Having Buried Hole - A method for fabricating a circuit trace on a core board having a buried hole is provided. The method includes: providing a carrier plate having a detachable metal layer, an etching barrier layer, and a metal layer sequentially stacked thereon; roughening the metal layer which can be completely roughened; laminating the bonded metal layer, the etching barrier layer, the detachable metal layer and the carrier plate onto a dielectric, wherein the metal layer faces and contacts with the dielectric; and then removing the carrier plate therefrom. As such, even if the dielectric is difficult to be completely roughened, the roughened metal layer can enhance the bondability between the metal layer and the dielectric. The metal layer is processed to become the circuit trace later. | 12-17-2009 |
20130072012 | Method For Forming Package Substrate With Ultra-Thin Seed Layer - A method for forming a package substrate with a seed layer is provided, which includes a step of etching away the metal foil laminated on the substrate, so that the substrate has a rough surface, and a step of forming an ultra-thin seed layer on the rough surface of the substrate, wherein the ultra-thin seed layer is formed along the rough surface of the substrate, and thereby the ultra-thin seed layer has a rough surface. Consequently, the adhesion between the metal bumps or circuits formed on the ultra-thin rough seed layer and the substrate can be increased. Furthermore, because the seed layer is ultra thin, the metal bumps or the circuit lines formed on the package substrate can be made finer in line widths and line pitches, and the good yield of the package substrate with fine circuit lines can be increased. | 03-21-2013 |
20130118794 | Package Substrate Structure - A package substrate structure includes a substrate, a circuit layer formed on the substrate, and an ultra-thin seed layer made of an electrically conductive material and formed between the substrate and the circuit layer. The ultra-thin seed layer is advantageous to increase the adhesion between the metal bumps or the circuit lines of the circuit layer, and the substrate. Furthermore, because the seed layer is ultra thin, the metal bumps or the circuit lines on the package substrate can be made finer in line widths and line pitches, and the good yield of the substrate with fine circuit lines can be increased. | 05-16-2013 |
Chao-Ming Tseng, Hsinchu TW
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20110096088 | ELECTROPHORESIS DISPLAY - An electrophoresis display includes a temperature sensor, a memory, a central processing unit and a display unit. The temperature sensor senses and outputs a present temperature. The memory stores a temperature characteristic table. The central processing unit is electrically coupled to the temperature sensor and the memory. The central processing unit receives the present temperature and reads the temperature characteristic table for matching the present temperature with the temperature characteristic table to obtain and output a drive level or timing. The display unit is electrically coupled to the central processing unit for receiving the drive level or timing and displaying according to the drive level. | 04-28-2011 |
Chien-Chang Tseng, Hsinchu TW
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20110170656 | BIDRECTIONAL SHIFTER REGISTER AND METHOD OF DRIVING SAME - A bidirectional shift register includes first, second, third and four control signal bus lines for providing first, second, third and fourth control signals, Bi | 07-14-2011 |
20120087461 | BIDIRECTIONAL SHIFTER REGISTER AND METHOD OF DRIVING SAME - A bidirectional shift register includes first, second, third and fourth control signal bus lines for providing first, second, third and fourth control signals, Bi | 04-12-2012 |
20130222357 | GATE DRIVER FOR LIQUID CRYSTAL DISPLAY - A gate driver for driving a TFT-LCD panel includes a number of gate-driver circuits arranged in groups and stages. Each gate-driver circuit has a main driver and an output section. The main driver is used to provide a charging signal to the output section which has two or more output circuits. Each of the output circuits is configured to provide a gate-line signal in response to the charging signal and a clock signal. The gate-driver circuit uses fewer switching elements, such as thin-film transistors, than the conventional circuit. When the gate driver is integrated in a TFT-LCD display panel and disposed within the periphery area around the display area, it is desirable to reduce or minimize the number of switching elements in the gate driver so that the periphery area can be reduced. | 08-29-2013 |
Chien-Chung Tseng, Hsinchu TW
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20130044006 | Blind Spot Detection System - A blind spot detection system for a vehicle includes a vehicle information detecting module for obtaining at least one vehicle information of the vehicle corresponding to an external environment, an alarm for generating an alarm signal, a plurality of sensors each for emitting a radio signal and receiving a reflecting signal of the transmitted radio signal to detect whether an object exists within a specific range and generate a detection result accordingly, and a control module for controlling the alarm to generate the alarm signal according to the at least one vehicle information and a plurality of detection results generated by the plurality of sensors. | 02-21-2013 |
20140159885 | Blind Spot Detection System - A blind spot detection system comprises an alarm, capable of generating an alarm signal; a plurality of sensors, each for emitting a radio signal and receiving a reflecting signal of the emitted radio signal, to detect whether an object exists within a specific range and generate a detection result accordingly; and a control module, for receiving at least one vehicle information from the OBD system and controlling the alarm to generate the alarm signal according to the at least one vehicle information and a plurality of detection results generated by the plurality of sensors. | 06-12-2014 |
20140313069 | Compound Circuit Board and Radar Device - A compound circuit board for a radar device includes a first substrate including a plurality of trace layers having a first trace layer formed with a digital signal processing unit and an electronic control unit in a first area, a second substrate including a plurality of trace layers having a second trace layer formed with an antenna module in a second area, and a prepreg layer between the first and second substrates for connecting the first and second substrates, wherein the first area and the second area in a first projecting result generated by projecting the first trace layer on the second trace layer are substantially overlapped. | 10-23-2014 |
Chien-Hsien Tseng, Hsinchu TW
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20080198454 | Color Filter For Image Sensor - An image sensor device includes a semiconductor substrate having a front surface and a back surface, pixels formed on the front surface of the semiconductor substrate, and grid arrays aligned with one of the pixels. One of the grid arrays is configured to allow a wavelength of light to pass through to the corresponding one of the pixels. The grid arrays are disposed overlying the front or back surface of the semiconductor substrate. | 08-21-2008 |
20080217719 | Method For Reducing Crosstalk In Image Sensors Using Implant Technology - The present disclosure provides an image sensor semiconductor device. A semiconductor substrate having a first-type conductivity is provided. A plurality of sensor elements is formed in the semiconductor substrate. An isolation feature is formed between the plurality of sensor elements. An ion implantation process is performed to form a doped region having the first-type conductivity substantially underlying the isolation feature using at least two different implant energy. | 09-11-2008 |
20110001206 | IMAGE SENSOR DEVICE AND METHOD FOR MAKING SAME - The present invention discloses an image sensor device and a method for making an image sensor device. The image sensor device comprises an optical pixel and an electronic circuit, wherein the optical pixel includes: a substrate; an image sensor area formed in the substrate; a masking layer formed above the image sensor area, wherein the masking layer is formed during a process for forming the electronic circuit; and a light passage above the masking layer for increasing light sensing ability of the image sensor area. | 01-06-2011 |
20110260223 | STRESS ENGINEERING TO REDUCE DARK CURRENT OF CMOS IMAGE SENSORS - The active pixel cell structures and methods of preparing such structures described above enable reduction of dark current and white cell counts for active pixel cells. The process of preparing active pixel cell structures introduces stress on the substrate, which could lead to increased dark current and white cell counts of active pixel cells. By depositing a stress layer as part of a pre-metal dielectric layer with a stress that counters the stress induced, both the dark current and the white cell counts can be reduced. If the transistors of the active pixel cells are NMOS, the carrier mobility can also be increased by a tensile stress layer. Raman Spectroscopy can be used to measure the stress exerted on the substrate prior to the deposition of the stress layer. | 10-27-2011 |
20120248515 | STRESS ENGINEERING TO REDUCE DARK CURRENT OF CMOS IMAGE SENSORS - This disclosure relates to an active pixel cell including a shallow trench isolation (STI) structure. The active pixel cell further includes a photodiode neighboring the STI structure, where a first stress resulted from substrate processing prior to deposition of a pre-metal dielectric layer increases dark current and white cell counts of a photodiode of the active pixel cell. The active pixel cell further includes a transistor, where the transistor controls the operation of the active pixel cell. The active pixel cell further includes a stress layer over the photodiode, the STI structure, and the transistor, and the stress layer has a second stress that counters the first stress exerted on the substrate, and the second stress reduces the dark current and the white cell counts caused by the first stress. | 10-04-2012 |
20130249041 | Method for Reducing Crosstalk in Image Sensors Using Implant Technology - The present disclosure provides an image sensor semiconductor device. A semiconductor substrate having a first-type conductivity is provided. A plurality of sensor elements is formed in the semiconductor substrate. An isolation feature is formed between the plurality of sensor elements. An ion implantation process is performed to form a doped region having the first-type conductivity substantially underlying the isolation feature using at least two different implant energy. | 09-26-2013 |
20140001523 | STRESS ENGINEERING TO REDUCE DARK CURRENT OF CMOS IMAGE SENSORS | 01-02-2014 |
20140113401 | Image Sensor Device and Method for Making Same - The present invention discloses an image sensor device and a method for making an image sensor device. The image sensor device comprises an optical pixel and an electronic circuit, wherein the optical pixel includes: a substrate; an image sensor area formed in the substrate; a masking layer formed above the image sensor area, wherein the masking layer is formed during a process for forming the electronic circuit; and a light passage above the masking layer for increasing light sensing ability of the image sensor area. | 04-24-2014 |
Chien-Hsiung Tseng, Hsinchu TW
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20090015936 | ZOOM LENS - A zoom lens including a first lens group with a negative refractive power and a second lens group with a positive refractive power is provided. The first lens group includes a first lens, a second lens, and a third lens arranged from an object side to an image side in sequence. The refractive powers of the first, second, and third lenses are negative, negative, and positive sequentially. The second lens group includes a fourth lens, a fifth lens, a sixth lens, and a seventh lens arranged from the object side to the image side in sequence. The refractive powers of the fourth, fifth, sixth, and seventh lenses are positive, positive, negative, and positive sequentially. The first lens group and the second lens group are capable of moving between the object side and the image side. | 01-15-2009 |
20100259839 | FIXED-FOCUS LENS - A fixed-focus lens includes a first, a second, and a third lens groups arranged in sequence from the enlarged side to the reduced side and having positive refractive powers. The first lens group includes a first, a second, and a third lenses from the enlarged side to the reduced side. The second lens group includes a fourth, a fifth, and a sixth lenses from the enlarged side to the reduced side. The third lens group includes a seventh lens. The lens of the first lens group closest to the enlarged side in the fixed-focus lens has a concave surface. The distance between the lens surface of the second lens group closest to the reduced side and the lens surface of the third lens group closest to the enlarged side is L | 10-14-2010 |
20100265596 | FIXED-FOCUS LENS - A fixed-focus lens including a first lens group and a second lens group is provided. The first lens group is disposed between a magnified side and a reduced side and includes a first lens and a second lens arranged in sequence from the magnified side to the reduced side. The refractive powers of both the first lens and the second lens are negative, and the first lens is an aspheric lens. The second lens group is disposed between the first lens group and the reduced side and includes a third lens, a fourth lens, a fifth lens, a sixth lens, a seventh lens, an eighth lens, and a ninth lens arranged in sequence from the magnified side to the reduced side. The refractive powers of the seven lenses from the third lens to the ninth lens are respectively positive, negative, positive, negative, positive, negative, and positive in sequence. | 10-21-2010 |
20110157710 | ZOOM LENS - A zoom lens including a first lens group and a second lens group arranged in sequence from a magnified side toward a reduced side is provided. The first lens group has a negative refractive power and includes a first lens, a second lens, a third lens, and a fourth lens arranged in sequence from the magnified side toward the reduced side, of which the refractive powers are respectively positive, negative, negative, and positive. The second lens group has a positive refractive power and includes a fifth lens, a sixth lens, a seventh lens, an eighth lens, a ninth lens, a tenth lens, and an eleventh lens arranged in sequence from the magnified side toward the reduced side, of which the refractive powers are respectively positive, negative, positive, negative, positive, negative, and positive. The eighth lens, the ninth lens, and the tenth lens together form a triple cemented lens. | 06-30-2011 |
20120081799 | FIXED-FOCUS LENS - A fixed-focus lens disposed between an enlarged side and a reduced side is provided. An f-number of the fixed-focus lens is smaller than or equal to 2. The fixed-focus lens includes a first lens group and a second lens group. The first lens group includes a first lens, wherein the first lens is an aspheric lens. The second lens group, disposed between the first lens group and the reduced side, has a positive dioptre. The second lens group includes a second lens, wherein the second lens is an aspheric lens. The fixed-focus lens focuses by moving the first and the second lens group and satisfies 0.1<|f/f1|<1, 0.2<|f/f2|<1.5, and 1.504-05-2012 | |
20150029596 | ZOOM LENS - A zoom lens including a first lens group, a second lens group, a third lens group, and a fourth lens group with positive, negative, positive, and positive refractive powers respectively arranged in sequence from an object side to an image side is provided. The first lens group includes a first lens and a second lens. The second lens group includes a third lens, a fourth lens, and a fifth lens. The third lens group includes a sixth lens. The fourth lens group includes a seventh lens, an eighth lens, and a ninth lens. The first lens, the second lens, the third lens, the fourth lens, the fifth lens, the sixth lens, the seventh lens, the eighth lens, and the ninth lens respectively having negative, positive, negative, negative, positive, positive, positive, negative, and positive refractive powers are arranged in sequence from the object side to the image side. | 01-29-2015 |
Chih-Hao Tseng, Hsinchu TW
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20100084978 | System And Method For Driving LED Vehicle Lights - A system and method for driving LED vehicle lights is provided, for diving an LED taillight and brake light, an LED reversing light and an LED direction indicator. The system and method uses direction indicator controller to receive the direction indicator enabling signal generated by vehicle light power controller and generate an direction indicator control signal to an enabling switch controller to avoid the flasher frequency of the direction indicator from being affected by the lighted taillight and brake light and reversing light so as to provide the driving capability that can stabilize the flasher frequency of the direction indicator. | 04-08-2010 |
20110282101 | METHOD OF ENANTIOSELECTIVE ADDITION TO ENONES - The present invention relates to a method of enantioselective addition to enones, including: reacting R | 11-17-2011 |
Chih-Yu Tseng, Hsinchu TW
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20110068415 | Radio Frequency Device and Method for Fabricating the Same - A radio frequency (RF) device that can achieve high frequency response while maintaining high output impedance and high breakdown voltage includes a substrate, a gate, at least a dummy gate, at least a doped region, a source region and a drain region. The substrate includes a well of first type and a well of second type. The well of second type is adjacent to the well of first type. | 03-24-2011 |
Ching Hung Tseng, Hsinchu TW
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20080260185 | Method And Apparatus For Automatically Detecting Audio Signal And Sending Control Signal - An apparatus and method for automatically detecting an audio signal and sending a control signal are provided. The present invention is for automatically detecting an audio signal from a conventional IC, and controlling the power amplifier of the driving speaker or the switch of other external circuit. The apparatus at least includes an audio detection circuit and a reset/delay circuit. The audio detection circuit is connected to an audio signal from a conventional IC to detect the presence of the audio signal. The reset/delay circuit, after receiving an output signal from the audio detection circuit, can either reset the reset/delay circuit, or send a control signal after delaying for a period of time. The apparatus of the present invention can also be integrated into the external circuit, such as a power amplifier, to simplify the control to the external circuit by the conventional IC so as to switch off the external circuit to save power when there is no presence of the audio signal. | 10-23-2008 |
20120212513 | Method Of Improving Operation Of Handheld Pointer Device In A Display Screen - A method of improving operation of handheld pointer device in a display screen is provided, applicable to a handheld pointer device and a display. The display can display a cursor indicating the location of a handheld pointer device in a display screen. The method includes the steps of: the handheld pointer device issuing a control signal to the display to enter a predefined mode; the display receiving the control signal and activating the predefined mode, the predefined mode including selecting a rectangular area inside the operation screen and the rectangular area being a partial area of the operation screen; the display in the predefined mode receiving and executing each of the control signals issued by the handheld pointer device; and determining whether to exit the predefined mode based on the execution result of previous step. | 08-23-2012 |
20130314318 | METHOD OF IMPROVING CURSOR OPERATION OF HANDHELD POINTER DEVICE IN A DISPLAY AND HANDHELD POINTER DEVICE WITH IMPROVED CURSOR OPERATION - A method and apparatus of improving cursor operation of handheld pointer device in a display is provided, applicable to a handheld pointer device and a display. The display can display a cursor indicating the location of a handheld pointer device in a display. The method includes the steps of: the handheld pointer device transmitting a control signal to the display to enter a slow cursor movement mode; the display in the slow movement mode receiving a control signals transmitted by the handheld pointer device; the display showing a slow moving cursor accordingly when the control signal being a move cursor command; the display exiting the slow cursor mode and entering selected object when the control signal being a select object command; and the display exiting the slow cursor movement mode when the control signal being an exit mode command. | 11-28-2013 |
20140112493 | APPARATUS FOR DIFFERENTIAL INTERPOLATION PULSE WIDTH MODULATION DIGITAL-TO-ANALOG CONVERSION AND OUTPUT SIGNAL CODING METHOD THEREOF - A differential interpolation pulse width modulation (iPWM) digital to analog converter is provided, including an iPWM for generating differential pulse from an input digital audio data stream, a power driver for providing energy to a terminal load and a filter for removing unwanted harmonic signal to reconstruct analog signal, wherein the iPWM further includes a PWM pulse generator to convert the digital input numerical code to a series of time domain pulse width; an interpolation unit to increase the time domain resolution of the pulse width; a self-calibration unit to maintain the pulse-width accuracy of the interpolation unit; a differential pulse width generator to convert series of PWM pulse into voltage and time domain differential form. | 04-24-2014 |
Ching-Ping Tseng, Hsinchu TW
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20080227181 | SYSTEM AND PROCESS FOR TREATING WASTE GAS EMPLOYING BIO-TREATMENT TECHNOLOGY - A waste gas treatment process using biological treatment technology including filtering waste gas to be treated, and introducing the filtered waste gas into a biological treatment system periodically and switchably from two ends of the system. | 09-18-2008 |
Chi-Xiang Tseng, Hsinchu TW
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20090261439 | MICROLENS ARRAY AND IMAGE SENSING DEVICE USING THE SAME - A microlens array is provided, including a base layer with a plurality of first microlenses formed over a first region thereof, wherein the first microlenses are formed with a first height. A plurality of second microlenses are formed over a second region of the base layer, wherein the second region surrounds the first region and the second microlenses are formed with a second height lower than the first height. A plurality of third microlenses are formed over a third region of the base layer, wherein the third region surrounds the second and three regions, and the microlenses are formed with a third height lower than the first and second heights. | 10-22-2009 |
20090305453 | METHOD OF FABRICATING IMAGE SENSOR DEVICE - A method for fabricating an image sensor device is disclosed. A substrate having a sensing area comprising a pixel array therein is provided. A photoresist layer is coated over the substrate. Exposure is performed on at least two regions of the photoresist layer by at least two binary half-tone masks, respectively, in which a first and second binary half-tone masks of the two binary half-tone masks have different optical transparency distributions. Development is performed on the exposed photoresist layer to form a convex microlens array corresponding to the pixel array of the sensing area and comprising at least two microlenses with different convex profiles. | 12-10-2009 |
20100108866 | COLOR FILTER ARRAYS AND IMAGE SENSORS USING THE SAME - Color filter arrays (CFA) and image sensors using same are provided. A color filter array includes a plurality of first color filter patterns respectively interlaced with a plurality of second color filter patterns, wherein the first and second color filter patterns comprise a plurality of color filters of at least three different colors of red (R), green (G) and blue (B) filters, and the first and second color filter patterns are not mirror symmetrical, and a blue (B) filter in one of the first color filter patterns is adjoined by a red (R) filter in one of the second color filter patterns adjacent thereto and/or a red (R) filter in one of the first color filter patterns is adjoined by a blue filter in one of the color filter patterns adjacent thereto. | 05-06-2010 |
20110001038 | IMAGE SENSOR DEVICE WITH SILICON MICROSTRUCTURES AND FABRICATION METHOD THEREOF - An image sensor device is disclosed. The image sensor device includes a semiconductor substrate having a first pixel region and a second pixel region. A first photo-conversion device is disposed within the first pixel region of the semiconductor substrate to receive a first light source. A second photo-conversion device is disposed within the second pixel region of the semiconductor substrate to receive a second light source different from the first light source. The surface of the semiconductor substrate corresponding to the first photo-conversion device and the second photo-conversion device has a first microstructure and a second microstructure, respectively, permitting a reflectivity of the first pixel region with respect to the first light source to be lower than a reflectivity of the second pixel region with respect to the first light source. The invention also discloses a fabrication method of the image sensor device. | 01-06-2011 |
Chun-Jen Tseng, Hsinchu TW
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20090278908 | LIGHTSCRIBE OPTICAL DISC DRIVE - An optical disc drive for marking a label side of a lightscribe disc is provided. The optical disc drive includes a spoke detecting device, a traverse assembly frame, a spindle motor PCB and an insulating base. The spoke detecting device is used for detecting spoke patterns on the lightscribe disc. The spindle motor PCB is communicated with the spoke detecting device through a flexible cable. The insulating base is coupled with the frame for supporting the spoke detecting device such that the spoke detecting device is separated from the lightscribe disc by a specified gap. | 11-12-2009 |
20110254910 | LIGHTSCRIBE OPTICAL DISC DRIVE - An optical disc drive for marking a label side of a lightscribe disc is provided. The optical disc drive includes a metallic plate, a spoke detecting device and a spindle motor PCB. The spoke detecting device is used for detecting spoke patterns on the lightscribe disc. The spindle motor PCB is supported on the metallic plate and having a notch such that a receptacle is defined by sidewalls of the notch and a surface of the metallic plate. The spoke detecting device is received in the receptacle such that the spoke detecting device is separated from the lightscribe disc by a specified gap. | 10-20-2011 |
20110258651 | LIGHTSCRIBE OPTICAL DISC DRIVE - An optical disc drive for marking a label side of a lightscribe disc is provided. The optical disc drive includes a spoke detecting device, a spindle motor PCB and an insulating pad. The spoke detecting device is used for detecting spoke patterns on the lightscribe disc. The spindle motor PCB is communicated with the spoke detecting device through a flexible cable. The insulating pad is coupled with the spindle motor PCB for supporting the spoke detecting device such that the spoke detecting device is separated from the lightscribe disc by a specified gap. | 10-20-2011 |
Fan-Gang Tseng, Hsinchu TW
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20080207468 | Micro-fabricated stamp array for depositing biologic diagnostic testing samples on bio-bindable surface - The present invention discloses micro-stamp array supported on a substrate comprising a plurality of micro-stamp sticks. Each of the micro-stamp sticks includes a micro-stamp-stick head having a channel opened through a central portion in each of the micro-stamp sticks. Each of the micro-stamp-stick heads is attached to a tapered guide tube surrounded by tapered guide-tube walls wherein the tapered guide tube is in hydraulic communication with the micro-stamp-head channel. The micro-stamp array further includes a filler chip that includes a filler reservoirs disposing on top of the tapered guide tubes, each of the filler reservoirs having a refill channel opened to the tapered guide tube for refilling the tapered guide tube and the channels. | 08-28-2008 |
20090064495 | Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates - Various embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer. In other embodiments, electrochemically fabricated structures are formed on dielectric substrates. | 03-12-2009 |
20090165295 | Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates - Various embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer. In other embodiments, electrochemically fabricated structures are formed on dielectric substrates. | 07-02-2009 |
20120186978 | Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates - Various embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer. In other embodiments, electrochemically fabricated structures are formed on dielectric substrates. | 07-26-2012 |
20140045254 | CELL SELF-ASSEMBLY ARRAY CHIP AND MANUFACTURING METHOD THEREOF - A cell self-assembly array chip comprises a first substrate, a second substrate and a plurality of spacer elements. The first substrate, the spacer elements and the second substrate are stacked to be one in turn, wherein the spacer elements are annularly arranged at interval and disposed on the second substrate, so as to define a cell self-assembly region and at least one drawing channel. Furthermore, because the liquid portion of cell suspension horizontally and radially passed the drawing channel outward and the radially outward pulling force generated by the evaporation effect of the liquid portion, so as to cause the cells are arranged by the cell self-assembly array to the cell self-assembly region. The present invention further provides a manufacturing method of a cell self-assembly array chip to solve the conventional problems which is difficult to culture living cells and not easy to apply optical observation. | 02-13-2014 |
20140099570 | Fuel Directing Reaction Device for Passive Fuel Cell - A fuel directing reaction device for a passive fuel cell comprises: a substrate, which has a first side and a second side opposite to the first side; a fuel reservoir, which is disposed on the first side of the substrate; a fuel introducing microfluidic channel portion, which is disposed on the first side of the substrate and connected with the fuel reservoir; a first rib array portion, which is disposed on the first side of the substrate, and connected with the fuel introducing microfluidic channel portion; a second rib array portion, which is disposed on the first side of the substrate, and connected with the first rib array; and a plurality of reaction holes, each of which is disposed on the open side of the V-shaped portion of the second ribs and extends through the substrate to connect the first side and the second side of the substrate. | 04-10-2014 |
20150018247 | METHOD OF MANUFACTURING BIOMEDICAL MOLECULAR DETECTION PLATFORM AND THE DETECTION PLATFORM MANUFACTURED THEREFROM - The present invention provides a method of manufacturing biomedical molecular detection platform, comprising providing a plurality of reagent droplets on a first surface of a substrate; forming a plurality of hydrophilic regions and a water-repellant region on a second surface of a test paper, and the plurality of hydrophilic regions separated individually by the water-repellant region; and contacting the first surface of the substrate with the second surface of the test paper for transferring each reagent droplet on the substrate to each hydrophilic region of the test paper. The present invention also provides a biomedical molecular detection platform manufactured therefrom. The method of present invention can rapidly manufacture large quantity of biomedical molecular detection platforms, and the biomedical molecular detection platform can be used to any test that use pigmentation to determine results. | 01-15-2015 |
Hsiang-Jen Tseng, Hsinchu TW
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20110291197 | INTEGRATED CIRCUITS AND MANUFACTURING METHODS THEREOF - An integrated circuit includes a first diffusion area for a first type transistor. The first type transistor includes a first drain region and a first source region. A second diffusion area for a second type transistor is spaced from the first diffusion area. The second type transistor includes a second drain region and a second source region. A gate electrode continuously extends across the first diffusion area and the second diffusion area in a routing direction. The first metallic layer is electrically coupled with the first source region. The first metallic layer and the first diffusion area overlap with a first distance. A second metallic layer is electrically coupled with the first drain region and the second drain region. The second metallic layer and the first diffusion area overlap with a second distance. The first distance is larger than the second distance. | 12-01-2011 |
Hsien-Chieh Tseng, Hsinchu TW
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20090173943 | ACTIVE MATRIX ARRAY STRUCTURE AND MANUFACTURING MEHTOD THEREOF - An active matrix array structure, disposed on a substrate, includes a first patterned conductive layer, a patterned gate insulating layer, a patterned semiconductor layer, a second patterned conductive layer, a patterned overcoat layer and a transparent conductive layer. The patterned gate insulating layer has first openings that expose a part of the first patterned conductive layer. The patterned semiconductor layer is disposed on the patterned gate insulating layer. The second patterned conductive layer is disposed on the patterned semiconductor layer. The patterned overcoat layer has second openings that expose a part of the first patterned conductive layer and a part of the second patterned conductive layer. The transparent conductive layer is completely disposed on the substrate. The transparent conductive layer disposed in the first openings and the second openings is broken off at a position that is in between the substrate and the patterned overcoat layer. | 07-09-2009 |
20100213464 | ACTIVE MATRIX ARRAY STRUCTURE - An active matrix array structure, disposed on a substrate, includes a first patterned conductive layer, a patterned gate insulating layer, a patterned semiconductor layer, a second patterned conductive layer, a patterned overcoat layer and a transparent conductive layer. The patterned gate insulating layer has first openings that expose a part of the first patterned conductive layer. The patterned semiconductor layer is disposed on the patterned gate insulating layer. The second patterned conductive layer is disposed on the patterned semiconductor layer. The patterned overcoat layer has second openings that expose a part of the first patterned conductive layer and a part of the second patterned conductive layer. The transparent conductive layer is completely disposed on the substrate. The transparent conductive layer disposed in the first openings and the second openings is broken off at a position that is in between the substrate and the patterned overcoat layer. | 08-26-2010 |
Hsin-Rong Tseng, Hsinchu TW
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20100021622 | Apparatus and method for forming multilayer polymer thin film - Apparatus and method for forming multilayer polymer thin film. The method uses a solution container with a gap to prevent the huge amount of solution from directly falling on the first layer. Then the wet film is formed by moving the container with the thin film thickness is decided by the distance between the gap and the substrate. The wet film is dried in a very short time by the heater therefore there is no time for the second solvent to dissolve the first layer. The method can effectively achieve the large-area and multilayer structure in organic devices through solution processing. | 01-28-2010 |
20100140594 | ORGANIC OPTOELECTRONIC COMPONENT - An organic optoelectronic component is provided, which includes a first electrode, an active layer formed on the first electrode, a second intermediate layer formed on the active layer, and a second electrode formed on the second intermediate layer, wherein the second intermediate layer is formed with a second mixture containing a second polymer and at least a second organic molecule. The second organic molecule is one for forming hole transferring material, electron transferring material, electron blocking material or hole blocking material. The organic optoelectronic component of the present invention is prepared by a solution process, thereby simplifying the process, improving film-formation property, and enhancing component efficiency. | 06-10-2010 |
20100283039 | ORGANIC PHOTOSENSITIVE OPTOELECTRONIC DEVICE - An organic photosensitive optoelectronic device includes an anode, an organic photosensitive layer formed on the anode and having a donor portion and an acceptor portion, a hole blocking layer formed on the organic photosensitive layer so as for the organic photosensitive layer to be sandwiched between the anode and the hole blocking layer, and a cathode formed on the hole blocking layer so as for the hole blocking layer to be sandwiched between the cathode and the organic photosensitive layer. The highest occupied molecular orbitals (HOMO) of the hole blocking layer is at least 0.3 eV higher than that of the donor portion. Therefore, the optoelectronic device efficiently suppresses dark current so as to enhance sensitivity when applied to a detector. | 11-11-2010 |
20110159171 | Method for preparing organic light emitting diode and device thereof - A method for fabricating an organic light emitting diode and a device thereof are provided. The method includes: providing a substrate; dispensing to the substrate a second organic molecule solution resulting from dissolving a second organic molecule in a solvent; applying the second organic molecule solution to a surface of the substrate so as to form a wet film layer; and heating the wet film layer by a heating unit to remove the solvent therefrom and thereby form a second organic molecule film. The method is effective in fabricating a uniform multilayer structure for use in fabrication of large-area photoelectric components. | 06-30-2011 |
20110163300 | ORGANIC LIGHT-EMITTING MATERIAL, ORGANIC LIGHT-EMITTING ELEMENT USING THE SAME AND METHOD OF FORMING THE SAME - The present invention provides compound of formula (I) | 07-07-2011 |
20130137206 | ORGANIC LIGHT-EMITTING MATERIAL, ORGANIC LIGHT-EMITTING ELEMENT USING THE SAME AND METHOD OF FORMING THE SAME - The present invention provides compound of formula (I) | 05-30-2013 |
Hua-Chou Tseng, Hsinchu TW
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20100140741 | STRUCTURE OF CAPACITOR SET - A structure of a capacitor set is described, including at least two capacitors that are disposed at the same position on a substrate and include a first capacitor and a second capacitor. The first capacitor includes multiple first capacitor units electrically connected with each other in parallel. The second capacitor includes multiple second capacitor units electrically connected with each other in parallel. The first and the second capacitor units are arranged spatially intermixing with each other to form an array. | 06-10-2010 |
Hung-Wei Tseng, Hsinchu TW
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20090028570 | OPTICAL-TO-ELECTRICAL CONVERTER AND ANALOG-TO-DIGITAL CONVERTER THEREOF - An analog-to-digital converter (ADC) for converting an optical signal into an electrical signal is disclosed. The ADC includes a detection module, a first P-type metal oxide semiconductor (PMOS) transistor, a first N-type metal oxide semiconductor (NMOS) transistor, a first switch unit, and an output module. The first PMOS transistor and the first NMOS transistor form an inverter. The first switch unit is disposed between the input terminal and the output terminal of the inverter and is turned on/off according to a first control signal. The output module is coupled to the output terminal of the inverter for counting the time that an input voltage is greater than a reference voltage and generating a digital signal. | 01-29-2009 |
20090284517 | Display Apparatus - A display apparatus is provided. The display apparatus includes a display module, a plurality of driving modules, and a plurality of sensing modules. The display module has a first side and a second side opposite the first side. The driving modules are respectively adjacent to the first and second sides and are electrically connected to the display module. The sensing modules are respectively adjacent to the first and second sides, in which the sensing modules are configured to sense an environment status surrounding the display apparatus to modulate the display module from the first status to the second status. One of the driving modules adjacent to the first side is substantially opposite to one of the sensing modules adjacent to the second side, with respect to the display module. | 11-19-2009 |
Jen-Chou Tseng, Hsinchu TW
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20080258223 | ESD PROTECTION DEVICE - An ESD protection device is provided. The ESD protection device of the present invention includes a semiconductor substrate/well, a first doped region, a second doped region and a third doped region. The first doped region doped with a first dopant is disposed in the semiconductor substrate/well. The second doped region doped with a second dopant is disposed in the semiconductor substrate/well, wherein a predetermined distance is maintained between the second doped region and the first doped region. The third doped region doped with the second dopant is disposed in the first doped region. The ESD protection device of the present invention is adapted for solving the reverse recovery problem of the conventional diode during the bipolar type ESD stressing. | 10-23-2008 |
20090174470 | LATCH-UP PROTECTION DEVICE - A latch-up protection device is provided. The latch-up protection device includes a first transistor, a detection module, and a processing module. The first transistor includes a first source/drain coupled to a pad, a body and a second source/drain coupled to a first voltage, and a gate. The detection module is adapted for detecting a terminal voltage between the first source/drain and the second source/drain of the first transistor, and generating a first signal when the terminal voltage is greater than a trigger voltage. The processing module is coupled between the detection module and the gate of the first transistor, for conducting a logic processing to the first signal, and generating an enable signal to the gate of the first transistor to conduct the first transistor. | 07-09-2009 |
Ko-Yuan Tseng, Hsinchu TW
Patent application number | Description | Published |
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20090280304 | Method for defining regions of differing porosity of a nitrocellulose film on a substrate - A method of forming a pattern on a nitrocellulose film on a substrate by providing a nitrocellulose based film of uniform porosity on a substrate; defining a desired pattern on said substrate wherein at least one region of lower porosity is defined and wherein at least one region of normal porosity is defined; exposing to a flow of a suitable solvent vapor over said region of lower porosity wherein said nitrocellulose based film of said region of lower porosity is dissolved by said suitable solvent vapor; removing said suitable solvent vapor and said nitrocellulose based film from said region of lower porosity wherein said lower porosity is capable of separating multiple experiments that are performed simultaneously over said region of normal porosity. | 11-12-2009 |
20100261193 | Valve Structure for Consistent Valve Operation of a Miniaturized Fluid Delivery and Analysis System - A valve structure of a fluid delivery and analysis system having an upper substrate, a lower substrate and an intermediate layer with at least one opening and at least one open cavity having a first touch point between the upper substrate and the intermediate layer and a second touch point between the lower substrate and the intermediate layer where the first touch point and the second touch point are offset to create a torque so that when intermediate layer is compressed between the upper substrate and the lower substrate that the torque deforms the intermediate rubber layer in the direction of the opening for better sealing. | 10-14-2010 |
Kuan-Hsueh Tseng, Hsinchu TW
Patent application number | Description | Published |
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20120019415 | Wideband Antenna - A wideband antenna for a radio transceiver device includes a first radiating element for transmitting and receiving wireless signals of a first frequency band, a second radiating element for transmitting and receiving wireless signals of a second frequency band, a grounding unit, a shorting unit having one end electrically connected to the first radiating element and the second radiating element, and another end electrically connected to the grounding unit, and a feeding board including a first feeding metal plane for transmitting wireless signals of the first frequency band and the second frequency band, a second feeding metal plane electrically connected to the second radiating element, and a metal strip electrically connected between the first radiating element and the second radiating element. | 01-26-2012 |
20120250228 | PORTABLE ELECTRONIC APPARATUS - A portable electronic apparatus includes a host, a pivotal connection device, a display, and an antenna. The host includes a base casing and an electronic device. The base casing has a side portion. The display is pivotally connected to the side portion through the pivotal connection device. The base casing thereon defines an antenna radiation reference surface. The side portion has a first accommodating space and a second accommodating space adjacent to each other. The projections of the first and second accommodating spaces on the antenna radiation reference are non-overlapped. The electronic device is disposed in the first accommodating space, the antenna in the second accommodating space. Thereby, the antenna is not influenced by the material of the casing of the display and still can perform wireless communication, which solves the plight of having to cut a metal upper casing in the prior art where an antenna is disposed. | 10-04-2012 |
20130070952 | SPEAKER MODULE AND ELECTRONIC APPARATUS THEREOF - A speaker module for installing on an electronic device is disclosed. The speaker module includes a containing casing, a speaker device, an antenna, at least one audio signal transmitting member, and at least one antenna signal transmitting member. The containing casing has at least one hole formed thereon. The speaker device is disposed in the containing casing and outputs sound via the hole. The antenna is formed integrally with the containing casing along the contour of the containing casing. The audio signal transmitting member is electrically connected to the speaker device for electrically connecting to the electronic device, so as to establish audio signal transmission between the speaker device and the electronic device. The antenna signal transmitting member is electrically connected to the antenna for electrically connecting to the electronic device, so as to establish antenna signal transmission between the antenna and the electronic device. | 03-21-2013 |
20130120214 | ANTENNA STRUCTURE - An antenna structure includes a radiation element, a grounding element, a short element, and a feeding element. The radiation element includes a first radiator and a second radiator, wherein the second radiator is extended from the first radiator and coupled to the first radiator. The short element includes a first end as well as a second end, wherein the first end of the short element is coupled to a joint in between the first radiator and the second radiator, and the second end of the short element is coupled to the grounding element. The feeding element includes a first end and a second end, and the first end of the feeding element is electrically connected with the radiation element. The short element is located on a first plane, and the feeding element is located on a second plane being different from the first plane. | 05-16-2013 |
20130135810 | PORTABLE COMPUTER APPARATUS - A portable computer apparatus includes a display module, a host module, at least one shaft mechanism, and an antenna. The display module has a first pivot side and includes first and second upper-cover members and a display device contained in the first and second upper-cover members. The host module has a second pivot side and includes first and second lower-cover members and a host device contained in the first and second lower-cover members. The host device is electrically connected to the display device and the antenna. The shaft mechanism is pivotally connected to at least one of the first and second upper-cover members corresponding to the first pivot side and at least one of the first and second lower-cover members corresponding to the second pivot side. The antenna is integrally formed with the shaft mechanism or on one of the first and second pivot sides. | 05-30-2013 |
20130249743 | Foldable Electronic Device - A foldable electronic device includes a flat panel display, a base and at least one antenna set. The flat panel display has a metal housing. The base has a pivot side, and the metal housing is pivoted to the pivot side. The antenna set is disposed in the base, and each antenna set has a main antenna and at least one auxiliary antenna, in which the main antenna and the auxiliary antenna are staggered. | 09-26-2013 |
20140112523 | SPEAKER MODULE AND ELECTRONIC APPARATUS THEREOF - An electronic apparatus includes an antenna, an antenna signal transmitting member, and an electronic device having an attachment part, and a speaker module installed in the attachment part and including a containing casing, a speaker device, and an audio signal transmitting member. The containing casing has a first hole formed thereon. A second hole is formed on the attachment part. The audio signal transmitting member is electrically connected to the speaker device for electrically connecting to the electronic device, so as to establish audio signal transmission between the speaker device and the electronic device. The antenna is formed integrally with the attachment part along a contour of the attachment part. The antenna signal transmitting member is formed on the attachment part and coupled to the electronic device. The antenna is coupled to the antenna signal transmitting member for establishing antenna signal transmission between the antenna and the electronic device. | 04-24-2014 |
20140315606 | Radio-Frequency Device and Wireless Communication Device - A radio-frequency (RF) device for a wireless communication device includes a grounding element, an antenna, a first DC blocking element for cutting off a direct-current (dc) signal route between a grounding terminal of the antenna and the grounding element, a capacitive sensing unit capable of using a radiating element of the antenna to sense an environment capacitance within a specific range, a second DC blocking element electrically connected between the radiating element and the feed-in element for blocking a dc signal path from the radiating element to the feed-in element, and a high-frequency blocking element electrically connected between the radiating element and the capacitive sensing unit for blocking a high-frequency signal path from the radiating element to the capacitive sensing unit. | 10-23-2014 |
20150061952 | Broadband Antenna - A broadband antenna for a wireless transceiver includes a grounding unit for grounding; a radiating part; a signal feed-in element for transmitting a radio signal to the radiating part in order to emit the radio signal via the radiating part, where a grounding terminal of the signal feed-in element is electrically connected to the grounding unit; a feed-in point, located on the radiating part; a capacitor, electrically connected between the feed-in point and the signal feed-in element; and an inductor, having a first terminal electrically connected to the capacitor. | 03-05-2015 |
Kuo-Hua Tseng, Hsinchu TW
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20110137380 | FLEXIBLE ANTENNA MODULE FOR WIRELESS ENERGY TRANSMISSION - This invention provides a flexible antenna module for wireless energy transmission, which uses an antenna size controlling device to adjust the antenna's size to conform a living body's outer portion wearing the flexible annular antenna. An antenna energy transmission control module is provided to adjust the power for driving the flexible annular antenna according to the deformation of the flexible annular antenna. This invention can adjust both the antenna size to fit the individual and the power for driving the antenna. The individual can use the present antenna module under a comfortable, safe and reliable circumstance. | 06-09-2011 |
Kuo-Ming Tseng, Hsinchu TW
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20120227523 | SHIFTING APPARATUS - A shifting apparatus including a base, first and second shifting elements, a pushing element, a fixed portion, and two screws is provided. The fixed portion fixed on the base has two trenches extending along first and second directions perpendicular to each other. The first shifting element is slidably disposed on the base along the first direction. The second shifting element is slidably disposed on the first shifting element along the second direction. The pushing element is slidably disposed in the two trenches. One screw screwed on the fixed portion along the second direction is capable of pushing the pushing element to move along the two trenches, such that the first shifting element is pushed by the pushing element to shift along the first direction. Another screw screwed on the first shifting element along the second direction is capable of pushing the second shifting element to shift along the second direction. | 09-13-2012 |
20120227641 | ROTATING APPARATUS - A rotating apparatus including a base and a rotating element is provided. The base has first and second concave spherical surfaces. The rotating element includes first and second universally-jointing portions. The first universally-jointing portion has a first convex spherical surface. The first convex spherical surface is universally jointed to the first concave spherical surface. The second universally-jointing portion is fixed on the bottom of the first universally-jointing portion and has a second convex spherical surface. A curvature radius of the second convex spherical surface is smaller than a curvature radius of the first convex spherical surface. The first and second convex spherical surfaces have the same curvature center. The second convex spherical surface is universally jointed to the second concave spherical surface and the rotating element is supported on the second concave spherical surface of the base by the second universally-jointing portion. | 09-13-2012 |
Kuo-Yu Tseng, Hsinchu TW
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20090115560 | INDUCTOR/TRANSFORMER AND MANUFACTURING METHOD THEREOF - A manufacturing method for the inductor/transformer is disclosed. A simulator is used to simulate the inductance, the quality factor, and the self-resonance frequency of said inductor/transformer to generate at least one group of the area size, the number of the conductive layer, the line width, the number of turns, and/or the line space of the conductive layers and the first conductive layer; the inductor/transformer is manufactured according to the factors. Thereafter, the Monte-Carlo simulation is used to initiate the process variability analysis of the factors of the conductive layer and the first conductive layer, and the geometric size of the inductor/transformer can be modulated according to the results of the process variability analysis during the manufacturing process, such that the inductor/transformer can be manufactured by the process of the generic logic circuit. | 05-07-2009 |
Kuo-Yuan Tseng, Hsinchu TW
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20100201490 | DISPLAY DEVICE AND DISPLAY SYSTEM THEREOF - A display device includes a RFID tag unit, a display unit, a processing unit and a power supply unit. The RFID tag unit follows a wireless communication standard of a RFID system to receive a wireless signal and outputs identification information. The processing unit electrically connected with the RFID tag unit and the display unit receives the identification information and outputs to the display unit for displaying. The power supply unit supplies operation power required to the processing unit and the display unit. The required power while the above-mentioned display device refreshes the information is supplied by the power supply unit, so that the information can be refreshed with longer communication distance and power saving is achieved. A display system including the above-mentioned display device and a reader/writer device is also disclosed. | 08-12-2010 |
Li-Chuan Tseng, Hsinchu TW
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20130064188 | DYNAMIC RESOURCE MANAGEMENT FOR ORTHOGONAL FREQUENCY DIVISION MULTIPLE ACCESS WIRELESS NETWORKS - The disclosed subject matter relates to dynamic resource management for wireless network components with a wireless communications environment. Personal base stations can be deployed in a substantially uncoordinated manner resulting in conflicts among wireless radio resources. Dynamically assigning subchannel and dynamically allocating power for subchannels can reduce these conflicts. Dynamic resource management can employ combinatorial auction schema such that assignment of subchannels can be considerate of selecting a power level for performance and to minimize overlapping subchannel interference. In an aspect, several methods can be employed to reduce the computational complexity of the general integer programming problem presented. These several methods can include a Combinatorial Auction with Greedy Algorithm scheme, a Random Equal Subchannel Partition scheme, a Local Combinatorial Auction scheme, and a Neighbors' Poor Channels scheme. | 03-14-2013 |
20130101008 | SYSTEMS AND METHODS FOR DOWNLINK SCHEDULING IN MULTIPLE INPUT MULTIPLE OUTPUT WIRELESS COMMUNICATIONS SYSTEMS - Systems and methods for downlink scheduling in wireless communications systems are described. In some embodiments, a method includes: applying channel prediction at a transmitter for transmitting information to one or more mobile devices; predicting channel state information for a channel over which the information is transmitted, the channel state information being based, at least, on the channel prediction; determining a precoding matrix to apply to the information, the determining the precoding matrix being based, at least, on predicted channel state information; and scheduling transmission of the information to the one or more mobile devices based, at least, on an asymptotic ergodic rate for the one or more mobile devices. The asymptotic ergodic rate can be based on large-scale channel behavior and a maximum Doppler shift between the mobile devices. | 04-25-2013 |
Li-Hsin Tseng, Hsinchu TW
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20100006965 | ELECTRONIC DEVICE PACKAGE WITH ELECTROMAGNETIC COMPATIBILITY (EMC) COATING THEREON - Electronic device packages with electromagnetic compatibility (EMC) coating thereon are presented. An electronic device package includes a chip scale package having a CMOS image sensor (CIS) array chip and a set of lenses configured with an aperture. An encapsulation is molded overlying the chip scale package. A shield is atop the encapsulation. A frame fixes the set of lenses to the encapsulation. An electromagnetic compatibility (EMC) coating is formed on the encapsulation to prevent electromagnetic interference. | 01-14-2010 |
20100226633 | COMPACT CAMERA MODULE - The invention provides a compact camera module. The compact camera module includes an image sensing device, a set of optical elements, and a zooming device. The set of optical elements connects to the image sensing device, and comprises a lens set. The zooming device connects to the set of optical elements for adjusting a distance between the lens set and the image sensing device. The zooming device directly electrically joins with the image sensing device. | 09-09-2010 |
Ling Hua Tseng, Hsinchu TW
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20100037037 | METHOD FOR INSTRUCTION PIPELINING ON IRREGULAR REGISTER FILES - A method for pipelining instructions on a PAC processor includes determining a minimum initial interval, and grouping the instructions so that the operands of dependent instructions are assigned to the same local register file. The virtual registers of the instructions that have data dependency across the first functional unit and the second functional unit are assigned to a global register file. The instructions are then modulo scheduled based on a current value of initial interval. The virtual registers of the scheduled instructions are allocated to the corresponding register files. If the allocation fails, a set of virtual registers is transferred from the first or second register file to the global register file. | 02-11-2010 |
Ming-Te Tseng, Hsinchu TW
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20110227782 | METHOD FOR DETECTING A VEHICLE TYPE, A VEHICLE SPEED AND WIDTH OF A DETECTING AREA BY A VEHICLE RADAR SENSOR - A method for detecting a vehicle type, a vehicle speed and width of a detecting area by a vehicle radar sensor is disclosed. A radio wave is transmitted to a tracked vehicle. Subsequently, the reflective radio wave from the vehicle is received. The Doppler frequency versus time distribution is generated from the reflective radio wave. Because the reflective radio wave is influenced by the Doppler Effect, a parallelogram or a shape close to a parallelogram of a consecutive motion diagram is shown in the Doppler frequency versus time distribution of the vehicle. According to the consecutive motion diagram, certain information, such as the length and speed of the tracked vehicle and the width of the detecting area, can be acquired. | 09-22-2011 |
Nan-Hsiung Tseng, Hsinchu TW
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20120100944 | ELECTRICAL CONTROL BELT CONTINUOUSLY VARIABLE TRANSMISSION SYSTEM - An electrical control belt continuously variable transmission system controls a movable driving half-pulley or movable driven half-pulley initiatively, by changing a driving interval between the movable driving half-pulley and a fixed driving half-pulley or a driven interval between the movable driven half-pulley and a fixed driven half-pulley, respectively, depending on different statuses, in order to adjust a velocity ratio. By manipulating the movable driving half-pulley or the movable driven half-pulley, the system may further form a driving gap between the movable driving half-pulley and a transmission belt or a driven gap between the movable driven half-pulley and the transmission belt, such that the power is cut off. Clamping the movable driving half-pulley or the movable driven half-pulley to the transmission belt may restore the outputting of the power. | 04-26-2012 |
Ping Chin Tseng, Hsinchu TW
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20090163149 | TRANSCEIVER FOR RADIO-FREQUENCY COMMUNICATION - A transceiver for radio-frequency communication comprises a waveguide, a transmitting port, a receiving port and a receiver load termination. The waveguide receives and transmits radio-frequency signals. The transmitting port is connected to the waveguide and transmits the radio-frequency signals to the waveguide. The receiving port is connected to the waveguide and receives the radio-frequency signals from the waveguide. The receiver load termination is connected to the waveguide and removes the vertical polarization components of the receiving radio-frequency signals. The receiver load termination includes a filtering unit to reduce the energy of the transmitting radio-frequency signals entering the receiver load termination. | 06-25-2009 |
Shao-Yen Tseng, Hsinchu TW
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20120158367 | INDEPENDENT COMPONENT ANALYSIS PROCESSOR - An independent component analysis processor conducts real-time operations of multiple-channel parallel signals. The processor includes an input buffering unit for receiving and storing multiple-channel parallel signals, a mean/covariance unit, a centering unit for removing direct current components in the multiple channels parallel signals, a whitening unit for performing a whitening process, and an ICA training unit and an ICA calculating unit that perform an independent component analysis process, to calculate independent components in the multiple-channel parallel signals and separate artifacts from the signals. | 06-21-2012 |
Sheng-Hsiang Tseng, Hsinchu TW
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20110117747 | METHOD OF FABRICATING SINGLE CHIP FOR INTEGRATING FIELD-EFFECT TRANSISTOR INTO MEMS STRUCTURE - A method of fabricating a single chip for integrating a field-effect transistor into a microelectromechanical systems (MEMS) structure is provided. The method includes the steps of: providing a substrate having thereon at least one transistor structure, a MEMS structure and a blocking structure, wherein the blocking structure encircles the MEMS structure to separate the MEMS structure from the transistor structure; forming a masking layer for covering the transistor structure, the MEMS structure and the blocking structure; forming a patterned photoresist layer on the masking layer; performing a first etching process by using the patterned photoresist layer to remove the masking layer on the MEMS structure; and performing a second etching process by removing a portion of the MEMS structure to form a plurality of microstructures such that a relative motion among the microstructures takes place in a direction perpendicular to the substrate. | 05-19-2011 |
20110133256 | CMOS-MEMS Cantilever Structure - The present invention discloses a CMOS-MEMS cantilever structure. The CMOS-MEMS cantilever structure includes a substrate, a circuit structure, and a cantilever beam. The substrate has a circuit area and a sensor unit area defined thereon. The circuit structure is formed in the circuit area. The cantilever beam is disposed in the sensor unit area with one end floating above the substrate and the other end connecting to the circuit structure. With the above arrangement, the manufacturing process of CMOS-MEMS cantilever structure of this invention can be simplified. Furthermore, the structure of the cantilever beam is thinned down and therefore has a higher sensitivity. | 06-09-2011 |
20120279838 | CMOS-MEMS SWITCH STRUCTURE - A CMOS-MEMS switch structure is disclosed. The CMOS-MEMS switch structure includes a first substrate, a second substrate, a first cantilever beam, and a second cantilever beam. The first and second substrates are positioned opposite each other. The first cantilever beam is provided on the first substrate, extends from the first substrate toward the second substrate, and bends downward. Likewise, the second cantilever beam is provided on the second substrate, extends from the second substrate toward the first substrate, and bends downward. The first and second substrates are movable toward each other to connect a first top surface of the first cantilever beam and a second top surface of the second cantilever beam, and away from each other so that the first top surface of the first cantilever beam and the second top surface of the second cantilever beam are disconnected, thereby closing or opening the CMOS-MEMS switch structure. | 11-08-2012 |
Sheng-Yang Tseng, Hsinchu TW
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20090032692 | Apparatus of generating an optical tweezers with momentum and method thereof and photo-image for guiding particles - An apparatus of generating an optical tweezers with momentum and method thereof and an optical tweezers photo-image for guiding particles are provided. The apparatus generates at least one optical tweezers on an examined object that carries at least one particle. The apparatus includes a laser source, a diffractive optical element and a convergent lens. The laser beam from the laser source passes through the diffractive optical element to produce a diffractive pattern. The laser beam is then received by the convergent lens and then to be focused on a plane of the examined object. The optic axis of the convergent lens is substantially not perpendicular to the plane of the examined object, so that the laser beam is projected onto the plane of the examined object in a skewed manner for providing a lateral momentum to move the particle. | 02-05-2009 |
20090052038 | Apparatus and method for changing optical tweezers - An apparatus and a method for changing optical tweezers are provided. The apparatus includes a diffractive optical element (DOE), a mask unit and an objective lens. The DOE includes a plurality of phase delay patterns. The mask unit includes a plurality of mask patterns that correspond to the phase delay patterns, respectively, wherein at least a portion of the mask patterns are complementary. A laser beam passing through each phase diffractive pattern correspondingly passes through each mask pattern to generate a compound diffractive pattern. The objective lens receives the compound diffractive pattern and focuses it on an examining object to form an optical tweezers. | 02-26-2009 |
Shih-Che Tseng, Hsinchu TW
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20110248617 | REFLECTIVE LIGHT EMITTING DIODE LAMP - A reflective LED lamp includes a metallic shell, a reflecting member, and an LED unit. The metallic shell includes a surrounding wall formed with a mounting hole unit, and an accommodating space defined by the surrounding wall. The reflecting member is disposed within the accommodating space, and includes a reflection region unit configured as at least one concaved curve surface. The LED unit is disposed within the mounting hole unit in the shell for emitting light onto the reflection region unit of the reflecting member, so that the light is reflected by the reflection region unit out of the shell. | 10-13-2011 |
20120273180 | HEAT DISSIPATING DEVICE - A heat dissipating device includes a tubular body having a first open end, and a plurality of heat dissipating fins, each having a fin body and a first engaging portion formed on the fin body for engaging the first open end of the tubular body in a manner that the heat dissipating fins are disposed to radiate from and to surround the tubular body. The first engaging portion includes a first extension section bent from the fin body, and a first hook extending from the first extension section for hooking onto the tubular body at the first open end. | 11-01-2012 |
Shih-Feng Tseng, Hsinchu TW
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20110256231 | METHOD FOR PREPARING A MICRO-PARTICLE DRUG IN HEMISPHERE-SHAPED DOSAGE FORM AND APPLICATIONS THEREOF - A method for preparing drug in hemisphere-shaped dosage form. A high molecular weight solution containing the drug is prepared, and the solution is then dropped on a base material. The interface phenomena between the solution and different base materials makes the drop of high molecular weight solution containing the drug form a hemisphere-shape. After solidifying by cross-link or evaporation, the drug in hemisphere-shaped dosage form is obtained. The advantages of the preparation method are a simple and fast process, and simple operation. Applications of the method to prepare a drug in hemisphere-shaped dosage form are also provided. | 10-20-2011 |
20130256932 | METHOD FOR PREPARING A HEMISPHERE-SHAPED DOSAGE FORM CONTAINING DRUG AND APPLICATIONS THEREOF - A method for preparing a hemisphere-shaped dosage form containing drug. A high molecular weight solution containing the drug is prepared, and the solution is then dropped onto a base material. The interface phenomenon between the solution and different base materials causes the solution to form a hemisphere-shaped liquid drop dosage. After solidifying by cross-link or evaporation, a hemisphere-shaped dosage form containing drug is obtained. The advantages of the preparation method are a simple and fast process, and simple operation. Applications of the preparation method to prepare a hemisphere-shaped dosage form containing drug are also provide. | 10-03-2013 |
Shi-Liang Tseng, Hsinchu TW
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20090042864 | PYRAZOLE COMPOUNDS - This invention relates to pyrazole compounds of formula (I) shown below: | 02-12-2009 |
Tien-Cheng Tseng, Hsinchu TW
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20100242182 | Portable Cushion Device - A portable cushion device is provided, including a first cushion region, a second cushion region, a control interface module, and an alarm unit. The second cushion region includes an inflation inlet. The first cushion region is located on the outside of the second cushion region. The control interface module is connected to the second cushion region, and is able to inflate the second cushion region to a specific pressure through the inflation inlet. When an object is placed on the second cushion region, the control interface module measures the weight of the object and monitors the object continuously. The alarm unit is triggered to issue an alarm when the control interface module detects a sudden increase or decrease of the weight of the monitored object on the second cushion region. | 09-30-2010 |
Tomson Tseng, Hsinchu TW
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20080237440 | Mounting device for a line replaceable unit in an aircraft and a method for using the same - A mounting device for a line replaceable unit in an aircraft, and a method for using the same. The mounting device provides for easy installation and removal of a line replaceable unit from overhead mounting apparatus or mounting rails in an aircraft, in particular, an Airbus. The mounting device includes a fixing block having a least one opening, and at least one assembly including a shaft portion passing through the opening, a clamping element and a visual position element whose orientation indicates an orientation of the clamping element. The assembly is operable such that the clamping element secures the device to a component of the vehicle when positioned in a first position, and releases the device when positioned in a second position, and the visual position element provides an indication of whether the clamping element is in the first or second position. | 10-02-2008 |
Tsan-Fu Tseng, Hsinchu TW
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20090059186 | LAMP HOLDER OF A PROJECTION APPARATUS AND FABRICATION THEREOF - A method for forming a lamp holder. The lamp holder is applied in a projection apparatus. First, the lamp holder comprising metal is provided. An insulating layer is formed on one surface of the lamp holder to insulate the lamp holder from another element of the projection apparatus. | 03-05-2009 |
20090246588 | Planar fuel cell device - A planar fuel cell device including a fuel cell module, a first cathode channel plate, a second cathode channel plate, and a fixing structure is provided. The first cathode channel plate is adapted to be disposed on a first surface of the fuel cell module and includes a first curved surface and a first channel structure disposed on the first curved surface. The first curved surface protrudes toward the fuel cell module for pressing the first surface of the fuel cell module. The second cathode channel plate is adapted to be disposed on a second surface of the fuel cell module opposite to the first surface. The fixing structure is adapted to be disposed on the edge of the fuel cell module for fixing the first cathode channel plate and the second cathode channel plate on the first surface and the second surface respectively. | 10-01-2009 |
Tseung-Yuen Tseng, Hsinchu TW
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20090203282 | Gate controlled field emission triode and process for fabricating the same - This invention relates to a process for fabricating ZnO nanowires with high aspect ratio at low temperature, which is associated with semiconductor manufacturing process and a gate controlled field emission triode is obtained. The process comprises providing a semiconductor substrate, depositing a dielectric layer and a conducting layer, respectively, on the semiconductor substrate, defining the positions of emitter arrays on the dielectric layer and conducting layer, depositing an ultra thin ZnO film as a seeding layer on the substrate, growing the ZnO nanowires as the emitter arrays by using hydrothermal process, and etching the areas excluding the emitter arrays, then obtaining the gate controlled field emission triode. | 08-13-2009 |
20110059592 | NONVOLATILE MEMORY AND FABRICATION METHOD THEREOF - Non-volatile memories formed on a substrate and fabrication methods are disclosed. A bottom electrode comprising a metal layer is disposed on the substrate. A buffer layer comprising a LaNiO | 03-10-2011 |
20110171811 | METHOD FOR FABRICATING A RESISTOR FOR A RESISTANCE RANDOM ACCESS MEMORY - A method for fabricating a resistor for a resistance random access memory (RRAM) includes: (a) forming a first electrode over a substrate; (b) forming a variable resistance layer of zirconium oxide on the first electrode under a working temperature, which ranges from 175° C. to 225° C.; and (c) forming a second electrode of Ti on the variable resistance layer. | 07-14-2011 |
Tsung-Chi Tseng, Hsinchu TW
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20090160834 | DISPLAY SCREEN AND SENSOR MODULE THEREOF - A display screen with a display area includes a frame and a sensor module. The frame surrounds the display area. The sensor module is mounted on the frame and includes a mount disposed on the frame and a slidable assembly slidably disposed on the mount and including an ambient light sensor and a screen light sensor, wherein the ambient light sensor and the screen light sensor are disposed on two opposite sides of the slidable assembly respectively. When a side of the slidable assembly on which the screen light sensor is disposed faces the display area, the screen light sensor detects brightness of the display area. When the side of the slidable assembly does not face the display area, the ambient light sensor detects brightness of an ambiance. | 06-25-2009 |
Tsung-Pei Tseng, Hsinchu TW
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20100227047 | Method for manufacturing organic light emitting diode - A method for manufacturing an organic light emitting diode (OLED) is disclosed, which comprises: (a) providing a substrate on which an anode is formed; (b) coating a Br-fluorocarbon precursor on the anode, and curing the Br-fluorocarbon precursor with UV light to form a fluorocarbon polymer film; (c) forming an organic light emitting structure on the fluorocarbon polymer film; and (d) forming a cathode on the organic light emitting structure. After coating, the remaining Br-fluorocarbon precursor can be recycled. Furthermore, the process of removing solvent is unnecessary. Therefore, the problem of waste can be prevented. Hence, it is possible to manufacture an OLED with a simple process and low cost by the method of the present invention. | 09-09-2010 |
Wei-Hsin Tseng, Hsinchu TW
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20120229315 | N-BIT DIGITAL-TO-ANALOG CONVERTING DEVICE - An N-bit digital-to-analog converting device includes: a decoder for converting an N-bit binary digital signal into a multi-bit thermometer code during each cycle of a clock signal alternating between first and second states, N being an integer not less than two; a random number generator for generating a reset signal having at least one high logic level bit and at least one low logic level bit that are equal in number and that have a random, time-varying arrangement; and a converting module coupled electrically to the decoder and the random number generator, and configured to convert the thermometer code into an analog voltage corresponding to the digital signal when the clock signal is in the first state, and to reset the analog voltage to a reset value according to the reset signal when the clock signal is in the second state. | 09-13-2012 |
Wen-Chih Tseng, Hsinchu TW
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20100230214 | Safe Braking Apparatus - A safe braking apparatus using in a two-wheel vehicle includes a left brake unit that drives the real brake unit and the front brake unit simultaneously, a right brake unit that drives the real brake unit and the front brake unit simultaneously, a front brake unit that actuates a front-wheel brake of said two-wheel vehicles, and a real brake unit that actuates a real-wheel brake of said two-wheel vehicles. Wherein, the front brake unit always works less than the real brake unit in movement | 09-16-2010 |
Wen Liang Tseng, Hsinchu TW
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20110169034 | PACKAGE STRUCTURE OF PHOTOELECTRONIC DEVICE AND FABRICATING METHOD THEREOF - A package structure includes a silicon substrate, a first insulating layer, a reflective layer, a second insulating layer, a first conductive layer, a second conductive layer and a die. The silicon substrate has a first surface and an opposite second surface. The first surface has a reflective opening, and the second surface has two electrode via holes connected to the reflective opening and a recess disposed outside the electrode via holes. The first insulating layer overlays the first surface, the second surface and the recess. The reflective layer is disposed on the reflective opening. The second insulating layer is disposed on the reflective layer. The first conductive layer is disposed on the second insulating layer. The second conductive layer is disposed on the second surface and inside the electrode via holes. The die is fixed inside the reflective opening and electrically connected to the first conductive layer. | 07-14-2011 |
20110266574 | LED PACKAGE - An LED package includes a substrate, an LED die, and an encapsulating layer. The LED die is arranged on the substrate. The encapsulating layer covers the LED die and at least a part of the substrate. The encapsulating layer includes a light dispersing element. A light scattering intensity of the light dispersing element is proportional to the light intensity of light generated by the LED die and illuminated at the encapsulating layer. A luminance at a center of the LED package is substantially identical to that at a circumference of the LED package. | 11-03-2011 |
20110291138 | LIGHT-EMITTING ELEMENT PACKAGE AND FABRICATION METHOD THEREOF - A light-emitting element package includes a package member for encapsulating a light-emitting element. A plurality of photonic crystal patterns is formed on the package member. A distribution density of the photonic crystal patterns corresponds to light distribution of the light-emitting element. Each photonic crystal pattern consists of a plurality of photonic crystals. | 12-01-2011 |
20110297981 | FLUORESCENT STRUCTURE AND METHOD FOR FORMING THE FLUORESCENT STRUCTURE AND LED PACKAGE USING THE SAME - A fluorescent structure for a light-emitting package includes a first fluorescent layer and a second fluorescent layer covering the first fluorescent layer. The first fluorescent layer includes first fluorescent strips, and defines first transparent regions between the first fluorescent strips. The second fluorescent layer includes second fluorescent strips, and defines second transparent regions between the second fluorescent strips. A method for forming the fluorescent structure and a light-emitting diode package using the fluorescent structure are also provided. | 12-08-2011 |
20120020089 | LIGHT EMITTING DIODE LIGHT BAR - An LED light bar includes an elongated circuit board, a first lighting module formed in the middle of the circuit board and two second light modules formed at two opposite ends of the circuit board. Each of first lighting module and the two second lighting module includes a plurality of LEDs arranged linearly on a surface of the circuit board. A density of the LEDs in the first lighting module is smaller than that in the second lighting modules. | 01-26-2012 |
20120074827 | LED LAMP STRUCTURE - An LED lamp structure includes a heat sink and a base. The heat sink includes a first receiving cavity, a second receiving cavity opposite to the first receiving cavity and a partition. A light board having LED modules is mounted on the partition. The partition defines two first threaded through holes therein. The base has two positioning protrusions engaging in two positioning grooves of the heat sink. Thus, second screw holes of two screw pillars of the base are aligned at the first screw holes of the partition of the heat sink. Screws are used to threadedly engage in the first screw holes, the second screw holes and third screw holes in the light board to thereby assemble the heat sink, the base and the light board together. | 03-29-2012 |
20120075858 | LED BULB - An exemplary LED bulb includes a holder, a housing, a heat spreader, a power module and an LED module. The housing connects to the holder. The heat spreader detachably engages with the housing. The power module detachably engages with the housing and is received in the housing. The LED module is arranged on the heat spreader. The LED module electrically connects to the holder via the power module. The LED module is physically separated from the power module. | 03-29-2012 |
20130065332 | METHOD FOR MANUFACTURING LED WITH AN ENCAPSULANT HAVING A FLAT TOP FACE - A method for manufacturing LEDs is disclosed. A base is firstly provided. The base includes a plate, sidewalls formed on the plate and pairs of leads connected to the plate. The sidewalls enclose cavities above the plate. Light emitting chips are fixed in the cavities and electrically connected to the leads, respectively. Encapsulants are formed in the cavities to seal the light emitting chips. Each encapsulant has a convex top face protruding beyond top faces of the sidewalls. The convex top faces of the encapsulants are grinded to become flat. Finally, the base is cut to form individual LEDs. | 03-14-2013 |
20130122618 | LED PACKAGE AND MOLD OF MANUFACTURING THE SAME - A light emitting diode package includes a base having a first surface, an electrode portion attached to the base, a pair of inner electrodes disposed on the first surface, a pair of outer electrodes, a pair of conductive pillars, a light emitting diode die, and a cap layer. Each outer electrode includes an end surface section and a side surface section. The end surface sections are disposed, corresponding to the inner electrodes, on the second surface. Each side surface section extends onto the side surface of the electrode portion. The conductive pillar penetrates between the inner electrode and the outer electrode. The light emitting diode die is on the first surface, electrically connecting the inner electrode file cap layer covers the light emitting diode die. | 05-16-2013 |
20130242554 | TRAFFIC LIGHT ASSEMBLY - A traffic light assembly includes at least one light module, at least one lens located in front of the at least one light module, a housing enclosing the at lest one light module and the at least one lens therein, and a foldable cover located in front of the at least one lens and connected to the housing. A cleaning device is located on an outer surface of the foldable cover to clean snow and dust accumulated on the outer surface of the foldable cover. | 09-19-2013 |
20130244358 | METHOD OF MANUFACTURING LIGHT EMITTING DIODE - A method of manufacturing a light emitting diode (LED) comprising: providing a porous carrier, a base disposed on the carrier and a plurality of light emitting elements mounted on the base, wherein the carrier defines a plurality of micro through-holes extending through a first face to a second face of the carrier, and the base has electrical structures formed thereon electrically connecting to the light emitting elements, respectively; providing a mold to receive the carrier therein and distributing a phosphor glue on the base to cover the light emitting elements, and the mold defining an air outlet communicated with the through-holes of the carrier; vacuuming the mold via the air outlet to flatten an outer face of the phosphor glue; heating the phosphor glue and removing the mold; and removing the carrier. | 09-19-2013 |
20130248922 | FLIP-CHIP SEMICONDUCTOR OPTOELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME - A method for fabricating flip-chip semiconductor optoelectronic devices initially flip-chip bonds a semiconductor optoelectronic chip attached to an epitaxial substrate to a packaging substrate. The epitaxial substrate is then separated using lift-off technology. | 09-26-2013 |
20130285097 | SIDE-VIEW LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A side-view LED package includes a substrate, a pair of electrodes connected to the substrate, an LED die electrically connected to the electrodes, a reflective cup formed on the substrate, an opening defined at a lateral side of the reflective cup, an encapsulation formed on the substrate to cover the LED die, and a reflective layer coated on a top of the encapsulation and a top of the reflective cup, wherein part of light emitting from the LED die is reflected by the reflective cup and the reflective layer and then emits out of the side-view LED package from the opening. The present disclosure also provides a method for manufacturing the side-view LED package described above. | 10-31-2013 |
20130288406 | METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE HAVING LED DIE FIXED BY ANISOTROPIC CONDUCTIVE PASTE - A method for packaging an LED, includes steps: providing a substrate and forming a plurality of pairs of electrodes on the substrate; positioning anisotropic conductive pastes on the substrate and attaching each anisotropic conductive paste to each pair of the electrodes; positioning an LED die on each anisotropic conductive paste and electrically connecting each LED die to each corresponding pair of the electrodes with the anisotropic conductive paste by hot compressing; forming an encapsulation on the substrate to cover the LED dies; and cutting the substrate to obtain individual LED packages. | 10-31-2013 |
20130330854 | METIOD OF MAKING LED WITH BAT-WING EMITTING FIELD LENS - A method for manufacturing an LED (light emitting diode) with bat-wing emitting field lens is disclosed. Firstly, a substrate is provided. The substrate includes a plurality of depressions each corresponding to a pair of electrodes. A plurality of LED chips are fastened in the depressions and electrically connected to the pairs of electrodes. A plurality of unsolidified lenses are formed in the depressions to cover the LED chips. A pressing mold including a plurality of protrusions is provided. The pressing mold is moved towards the substrate to force the protrusions of the pressing mold to insert into the unsolidified lenses. The lenses are solidified and the pressing mold is removed and concavities are defined at the lenses. The substrate is cut to obtain a plurality of separated and finished LEDs. | 12-12-2013 |
20140061712 | SIDE VIEW LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A side view light emitting diode (LED) package includes an electrode structure, an LED die disposed on the electrode structure and an encapsulation layer covering the LED die. The encapsulation layer includes a light outputting surface. The electrode structure includes a first electrode and a second electrode spaced from each other to define a tortuous gap therebetween. Resin material for forming a substrate of the LED package fills in the gap to interconnect the first and second electrode together. The LED die is electrically connected to the first electrode and the second electrode. The present disclosure also provides a method for manufacturing the side view LED package. | 03-06-2014 |
20140084315 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - An exemplary light-emitting diode (LED) package includes an electrically insulating substrate, an electrode structure embedded in the insulating substrate, and a plurality of LED chips electrically connecting with the electrodes of the electrode structure respectively. The electrode structure includes a first electrode, a second electrode and a third electrode located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of a top surface of the insulating substrate to support the LED chips. Bottom surfaces of the first and second electrodes are exposed out of a bottom surface of the substrate to connect with welding pads of a printed circuit board. A bottom surface of the third electrode is received in the substrate. | 03-27-2014 |
20140084326 | LIGHT-EMITTING DIODE AND MANUFACTURING METHOD THEREOF - A light-emitting diode includes a ceramic substrate, an electrode group setting on the substrate and co-fired with the ceramic substrate, an LED chip setting on the substrate and electrically connecting the electrode group. The electrode includes a first electrode and a second electrode spacing from the first electrode. The first electrode and the second electrode extend from a top surface of the substrate to a bottom surface of the substrate via side surfaces of the substrate. The light-emitting diode can be connected to a power source by the electrode group on the bottom surface of the substrate or by the electrode group on the side surfaces of the substrate. | 03-27-2014 |
20140119008 | LIGHT EMITTING DIODE BULB - A light emitting diode (LED) bulb includes a connecting body, a mounting base located on the connecting body and a plurality of LED modules mounted on the mounting base. The mounting base has a top face spaced from the connecting body and at least three surrounding walls. The top face of the mounting base orients toward a direction different that of each of the at least three surrounding walls. A lamp cover is secured to the connecting body and encloses the LED modules. An extension of the top face of the mounting base interests with the lamp cover at a point. A tangent line of the lamp cover through the point and the extension of the top face form an included angle which is less than 60 degrees. Furthermore, a center of the lamp cover is located above the top face. | 05-01-2014 |
20140119009 | LIGHT EMITTING DIODE BULB - A light emitting diode (LED) bulb includes a connecting body, a lamp cap located at a first end of the connecting body, a mounting base located at a second end of the connecting body opposite to the first end, a plurality of LED modules mounted on the mounting base and a sheath assembled to the second end of the connecting body. The sheath includes a first portion and a second portion detachably engaged with the first portion to cooperatively define an enclosed space enclosing the mounting base and the LED modules therein. | 05-01-2014 |
20140145216 | LED WITH WIRE SUPPORT - An LED includes a base, a first chip and a second chip mounted on the base, a wire support formed on the base, and wires electrically connecting the first chip and the second chip with the base. The base includes a first lead, a second lead and an insulative band connecting the first lead and the second lead. A first wire connects an electrode of the first chip to the wire support, and a second wire connects an electrode of the second chip to the wire support. The first wire and the second wire are electrically connected to each other via a conductive layer formed on the wire support. The wire support in one embodiment is a Zener diode. | 05-29-2014 |
20140167078 | LEAD FRAME AND LIGHT EMITTING DIODE PACKAGE HAVING THE SAME - An exemplary lead frame includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes a first connecting surface and a second connecting surface spaced from the first connecting surface. Top surfaces of the bonding electrode, the first connecting electrode and the second connecting electrode are exposed out of the substrate to support and electrically connect with light emitting chips. Light emitting chips can be mounted on the lead frame and electrically connect with each other in parallel or in series; thus, the light emitting chips can be connected with each in a versatile way. | 06-19-2014 |
20140175482 | LIGHT EMITTING DIODE PACKAGE WITH LIGHT REFLECTING CUP INTERNALLY SLANTED - An exemplary LED package includes a base, electrodes formed on the base, an LED chip electrically connecting the electrodes, and a reflecting cup mounted on the base and surrounding the LED chip therein. The reflecting cup includes a bottom surface and an inner surface recessed up from the bottom surface and slantwise oriented towards a top end of the reflecting cup. The reflecting cup is annular. The inner surface includes a reflecting portion slantwise extending from the top surface, and a transition portion extending downwardly from the reflecting portion. The transition portion defines a through hole therein. The reflecting portion defines a reflecting hole therein. An angle α is defined between the reflecting portion and an imaginary surface parallel to the bottom surface. An angle β is defined between the reflecting portion and the bottom surface. The angle β is larger than the angle α. | 06-26-2014 |
Yang-Tai Tseng, Hsinchu TW
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20120056865 | LIGHT EMITTING DIODE DRIVING APPARATUS - A light emitting diode (LED) driving apparatus is provided, which includes a power conversion circuit for receiving and converting an input power so as to generate a DC voltage to simultaneously drive a plurality of LED strings arranged in parallel; and a plurality of current regulation chips each having a single regulation channel and respectively corresponding to the LED strings, wherein an i | 03-08-2012 |
20120206055 | LIGHT EMITTING DIODE DRIVING APPARATUS - A light-emitting-diode (LED) driving apparatus is provided, and which includes a power switch having a first terminal coupled to a first node and a second terminal coupled to a second node, wherein an LED string is coupled between a DC voltage and the first node; a first resistor coupled between the second node and a ground potential; and a control chip for generating a driving signal in response to a voltage on the second node and a bandgap voltage during an activation phase of the LED driving apparatus, so as to switch the power switch and thus making the LED string to be operated under a constant current for producing light, and further comparing a detection voltage obtained in response to a voltage on the first node with a predetermined voltage, so as to stop generating the driving signal when the detection voltage is greater than the predetermined voltage. | 08-16-2012 |
Yao-Hsuan Tseng, Hsinchu TW
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20130022931 | CHEMICAL LOOPING COMBUSTION METHOD USING DUAL METAL COMPOUND OXIDE - A chemical looping combustion method using a dual metal compound oxide includes the following steps: a fuel material combusting with the dual metal compound oxide in a first reactor to obtain a metal product; supplying the metal product obtained in the first reactor into a second reactor, and the metal product reacting with the air in the second reactor to obtain the dual metal compound oxide; and, supplying the dual metal compound oxide obtained in the second reactor into the first reactor. The dual metal compound oxide used in the chemical looping combustion process has high oxidation rate as well as high reduction rate so as to increase the efficiency of the chemical looping combustion process. | 01-24-2013 |
20130130032 | FE-NI COMPOUND OXIDE FOR CHEMICAL LOOPING COMBUSTION PROCESS AND METHOD OF MANUFACTURING THE SAME - A Fe—Ni compound oxide is used as an oxygen carrier for chemical looping combustion process, wherein the structure of the Fe—Ni compound oxide is a single-phase spinel structure. The method for manufacturing the Fe—Ni compound oxide of the invention includes the following steps: mixing Fe | 05-23-2013 |
Yi-Fong Tseng, Hsinchu TW
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20110001206 | IMAGE SENSOR DEVICE AND METHOD FOR MAKING SAME - The present invention discloses an image sensor device and a method for making an image sensor device. The image sensor device comprises an optical pixel and an electronic circuit, wherein the optical pixel includes: a substrate; an image sensor area formed in the substrate; a masking layer formed above the image sensor area, wherein the masking layer is formed during a process for forming the electronic circuit; and a light passage above the masking layer for increasing light sensing ability of the image sensor area. | 01-06-2011 |
20140113401 | Image Sensor Device and Method for Making Same - The present invention discloses an image sensor device and a method for making an image sensor device. The image sensor device comprises an optical pixel and an electronic circuit, wherein the optical pixel includes: a substrate; an image sensor area formed in the substrate; a masking layer formed above the image sensor area, wherein the masking layer is formed during a process for forming the electronic circuit; and a light passage above the masking layer for increasing light sensing ability of the image sensor area. | 04-24-2014 |
Yu-Chee Tseng, Hsinchu TW
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20090072945 | Automatic Lighting Control System And Method - Disclosed is directed to an automatic lighting control system and method. The system includes at least a lighting device, at least a sensor, and a decision module. Each lighting device is adjustable and has a remote control function. A wireless sensor network is configured by the one or more sensors. Each sensor may sense a corresponding luminance and returns the luminance to the decision module in a wireless manner. The decision module may dynamically adjust one or more lighting devices to a suitable luminance by referring to system information, the returned luminance and user's demands. | 03-19-2009 |
Yu-Cheng Tseng, Hsinchu TW
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20120176598 | APPARATUS AND METHOD FOR QUANTIFYING RESIDUAL STRESS OF A BIREFRINGENT MATERIAL - An apparatus for quantifying residual stress of a birefringent material comprises a light source generating light; a vertical polarizer converting a beam of light into a beam with vertical polarization; a standard material being mounted in front of the vertical polarizer; a horizontal polarizer converting a beam of light into a beam with horizontal polarization; an applied force unit applying different forces to the standard material; a spectrometer being mounted in front of the horizontal polarizer and recording intensity of light passing through the horizontal polarizer and transmittance of the standard material and a processing module being connected to the spectrometer, deriving a stress formula from the applied forces and transmittances of the standard material and obtaining a stress distribution of the birefringent material. A method for quantifying residual stress of a birefringent material is also disclosed. | 07-12-2012 |
Yu-Chu Tseng, Hsinchu TW
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20100163104 | SOLAR CELL - A solar cell includes a semiconductor substrate, an emitter layer, an anti-reflective coating, a first electrode, a second electrode, and a first light conversion layer. The emitter layer is formed on a light-receiving side of the semiconductor substrate. A p-n junction is formed between the emitter layer and the semiconductor substrate. The anti-reflective coating is formed on the emitter layer. The first electrode is connected to the emitter layer. The second electrode is formed on a back-lighted side of the semiconductor substrate. The first light conversion layer is formed on the anti-reflective coating. The first light conversion layer absorbs a first light with a first wavelength and emits a second light with a second wavelength, thereby performing a photoelectric converting operation. | 07-01-2010 |
Yu-Ming Tseng, Hsinchu TW
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20120106411 | PORTABLE ROUTER - A portable router comprises a memory unit, a network sharing port, an operating/processing unit connecting with the two components. The memory unit has an original parameter configuration area and an updated parameter configuration area. An originally-configured network address and a prime DHCP server address range are built in the original parameter configuration area. The network sharing port has an external network connection port and an internal network connection port. The external network connection port implements connection with an external network having an external network address. The internal network connection port implements an internal network. The operating/processing unit retrieves the originally-configured network address and compares it with the external network address. When two addresses are identical, the operating/processing unit generates a new network address different from the external network address and a new DHCP server address range. When two addresses are different, the operating/processing unit directly adopts the originally-configured network address. | 05-03-2012 |
Yu Ting Tseng, Hsinchu TW
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20090061696 | Data storage apparatus - The present invention discloses a data storage apparatus, including a memory module, a USB connector connected with the memory module, a housing for accommodating the memory module, a movable carriage for holding the memory module and the USB connector, and a rotary driving mechanism for transmitting a rotary motion into a linear motion for driving the USB connector. | 03-05-2009 |