Patent application number | Description | Published |
20130037990 | Molding Wafer Chamber - A bottom chase and a top chase of a molding system form a cavity to house a molding carrier and one or more devices. The molding carrier is placed in a desired location defined by a guiding component. The guiding component may be entirely within the cavity, or extend above a surface of the bottom chase and extend over a contacting edge of the top chase and the bottom chase, so that there is a gap between the edge of the top chase and the edge of the molding carrier which are filled by molding materials to cover the edge of the molding carrier. Releasing components may be associated with the top chase and/or the bottom chase, which may be a plurality of tape roller with a releasing film, or a plurality of vacuum holes within the bottom chase, or a plurality of bottom pins with the bottom chase. | 02-14-2013 |
20130062760 | Packaging Methods and Structures Using a Die Attach Film - Packaging methods and structures for semiconductor devices that utilize a novel die attach film are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a carrier wafer and forming a die attach film (DAF) that includes a polymer over the carrier wafer. A plurality of dies is attached to the DAF, and the plurality of dies is packaged. At least the carrier wafer is removed from the packaged dies, and the packaged dies are singulated. | 03-14-2013 |
20130122689 | Methods for De-Bonding Carriers - A method includes performing a dicing on a composite wafer including a plurality of dies, wherein the composite wafer is bonded on a carrier when the step of dicing is performed. After the step of dicing, the composite wafer is mounted onto a tape. The carrier is then de-bonded from the composite wafer and the first tape. | 05-16-2013 |
20140061888 | THREE DIMENSIONAL (3D) FAN-OUT PACKAGING MECHANISMS - The mechanisms of forming a semiconductor device package described above provide a low-cost manufacturing process due to the relative simple process flow. By forming an interconnecting structure with a redistribution layer(s) to enable bonding of one or more dies underneath a package structure, the warpage of the overall package is greatly reduced. In addition, interconnecting structure is formed without using a molding compound, which reduces particle contamination. The reduction of warpage and particle contamination improves yield. Further, the semiconductor device package formed has low form factor with one or more dies fit underneath a space between a package structure and an interconnecting structure. | 03-06-2014 |
20140151890 | PACKAGE WITH A FAN-OUT STRUCTURE AND METHOD OF FORMING THE SAME - An embodiment is a device comprising a semiconductor die, an adhesive layer on a first side of the semiconductor die, and a molding compound surrounding the semiconductor die and the adhesive layer, wherein the molding compound is at a same level as the adhesive layer. The device further comprises a first post-passivation interconnect (PPI) electrically coupled to a second side of the semiconductor die, and a first connector electrically coupled to the first PPI, wherein the first connector is over and aligned to the molding compound. | 06-05-2014 |
20140210080 | PoP Device - A method of forming a PoP device comprises placing an adhesive layer on a carrier substrate, coupling a plurality of chip packages to the adhesive layer on the carrier substrate, placing a bonding layer on the chip packages, and coupling a plurality of chips to the bonding layer on the chip packages. The method further comprises injecting a molding compound to encapsulate the chip packages and the chips on the carrier substrate, grinding the molding compound to expose a plurality of connecting elements of the chips and a plurality of second connecting elements of the chip packages, forming a redistribution layer (RDL) on the molding compound and the exposed connecting elements and second connecting elements, forming a ball grid array (BGA) on the RDL, and de-bonding the carrier substrate. | 07-31-2014 |
20140252579 | 3D-Packages and Methods for Forming the Same - A package includes an interposer, which includes a first substrate free from through-vias therein, redistribution lines over the first substrate, and a first plurality of connectors over and electrically coupled to the redistribution lines. A first die is over and bonded to the first plurality of connectors. The first die includes a second substrate, and through-vias in the second substrate. A second die is over and bonded to the plurality of connectors. The first die and the second die are electrically coupled to each other through the redistribution lines. A second plurality of connectors is over the first die and the second die. The second plurality of connectors is electrically coupled to the first plurality of connectors through the through-vias in the second substrate. | 09-11-2014 |
20140312492 | Package with a Fan-out Structure and Method of Forming the Same - An embodiment is a device comprising a semiconductor die, an adhesive layer on a first side of the semiconductor die, and a molding compound surrounding the semiconductor die and the adhesive layer, wherein the molding compound is at a same level as the adhesive layer. The device further comprises a first post-passivation interconnect (PPI) electrically coupled to a second side of the semiconductor die, and a first connector electrically coupled to the first PPI, wherein the first connector is over and aligned to the molding compound. | 10-23-2014 |
20150017764 | METHOD OF FORMING A SEMICONDUCTOR PACKAGE - A method of forming a semiconductor package includes forming an interconnecting structure on an adhesive layer, wherein the adhesive layer is on a carrier. The method further includes placing a semiconductor die on a surface of the interconnecting structure. The method further includes placing a package structure on the surface of the interconnecting structure, wherein the semiconductor die fits in a space between the interconnecting structure and the package structure. The method further includes performing a reflow to bond the package structure to the interconnecting structure. | 01-15-2015 |
20150108659 | 3D-Packages and Methods for Forming the Same - A package includes an interposer, which includes a first substrate free from through-vias therein, redistribution lines over the first substrate, and a first plurality of connectors over and electrically coupled to the redistribution lines. A first die is over and bonded to the first plurality of connectors. The first die includes a second substrate, and through-vias in the second substrate. A second die is over and bonded to the plurality of connectors. The first die and the second die are electrically coupled to each other through the redistribution lines. A second plurality of connectors is over the first die and the second die. The second plurality of connectors is electrically coupled to the first plurality of connectors through the through-vias in the second substrate. | 04-23-2015 |
20150162289 | Protective Layer for Contact Pads in Fan-out Interconnect Structure and Method of Forming Same - In accordance with a method embodiment includes providing a die having a contact pad on a top surface and forming a conductive protective layer over the die and covering the contact pad. A molding compound is formed over the die and the conductive protective layer. The conductive protective layer is exposed using a laser drilling process. A redistribution layer (RDL) is formed over the die. The RDL is electrically connected to the contact pad through the conductive protective layer. | 06-11-2015 |
Patent application number | Description | Published |
20130171492 | BATTERY PACK - A packaging structure, packaging material and a packaging method for a battery pack including multiple battery cell units, multiple conductive units and one or more packaging materials are provided. The conductive units are electrically connected to the battery cell units. The packaging material is filled to gaps between the battery cell units and tightly bonded to surfaces of the battery cell units. The battery pack has an integrated structure. Therefore, the battery cell units do not move relative to each other, and breaking of connections between the battery cell units and a conductive metal line or sheet can be avoided. | 07-04-2013 |
20150243939 | CAP ASSEMBLY FOR BATTERY - A cap assembly for a battery includes a roll combination member, a terminal combination member, an electrode terminal, a strength reinforcing block, a cap, and a pad assembly. The roll combination member includes at least one opening, so that terminal disposed portions of 2k rolls are capable of passing through the opening and k is an integer greater than 1, wherein one terminal disposed portion is formed by bending portions of central members of two adjacent rolls. The terminal combination member, the electrode terminal, the strength reinforcing block, the cap, and the pad assembly are sequentially combined on the roll combination member, wherein the electrode terminal includes an electrically conductive portion and a thermally conductive portion which surrounds the electrically conductive portion. The cap assembly is electrically connected to the bending portions at the same side of the 2k rolls. | 08-27-2015 |
Patent application number | Description | Published |
20080209741 | Blade structure of an electric hair trimmer - A blade structure of an electric hair trimmer is a blade set, comprising a fixed blade, a movable blade and a vibration seat which is driven by a motor. A front end of both fixed and movable blades is provided with a plurality of teeth to cut the hair by an alternate movement. The lower sections of edge parts at two sides of a tooth of the movable blade are extended outward from top to bottom to form with externally expanded surfaces with sharp transection angles. Accordingly, when hair is cut, a contact area of the edge parts between the hair is decreased, to largely reduce resistance to cutting, such that the hair can be cut off well with improved speed and efficiency and can be prevented from being damaged. Besides, lifetime of usage of blade structure in the electric hair trimmer can be extended. | 09-04-2008 |
20110302789 | Hair Trimmer - A hair trimmer includes a fixture having an upper and a lower tie plates, with an elastic element between the upper and lower tie plates; at least two cutting units at an end of the upper and lower tie plates, with each cutting unit having a corresponding cutting part, and an end of each cutting part having notches of different depths; and at least two combing units assembled with the upper and lower tie plates and corresponding to an exterior side of each cutting unit, with each combing unit including a teeth part which corresponds to each other and is parallel to the cutting part, and an end of each teeth part having comb slots of different depths. Therefore, a multiedged thinning can be carried out while trimming and it allows the hair to have more different levels of edge and a sense of beauty. | 12-15-2011 |
Patent application number | Description | Published |
20140184863 | METHOD FOR CORRECTING PIXEL INFORMATION OF COLOR PIXELS ON A COLOR FILTER ARRAY OF AN IMAGE SENSOR - A method for correcting pixel information of color pixels on a color filter array of an image sensor includes: establishing an M×M distance factor table, selecting M×M pixels of the color filter array, calculating a red/green/blue-color contribution from the red/green/blue pixels to a target pixel in the selected M×M pixels, calculating a red/blue/green-color pixel performance of the target pixel, calculating a red/blue/green-color correcting factor, obtaining a corrected pixel information of each of the red/green/blue pixels, by applying the red/green/blue-color correcting factor to the measured pixel information of each of the red/green/blue pixels. | 07-03-2014 |
20140362250 | METHOD FOR CORRECTING PIXEL INFORMATION OF COLOR PIXELS ON A COLOR FILTER ARRAY OF AN IMAGE SENSOR - A method for correcting pixel information of color pixels on a color filter array of an image sensor includes: establishing an M×M distance factor table, selecting M×M pixels of the color filter array, calculating a red/green/blue-color contribution from the red/green/blue pixels to a target pixel in the selected M×M pixels, calculating a red/blue/green-color pixel performance of the target pixel, calculating a red/blue/green-color correcting factor, obtaining a corrected pixel information of each of the red/green/blue pixels, by applying the red/green/blue-color correcting factor to the measured pixel information of each of the red/green/blue pixels. | 12-11-2014 |
20160093658 | IMAGE-SENSOR STRUCTURES - An image-sensor structure is provided. The image-sensor structure includes a substrate, a plurality of photoelectric conversion units formed in the substrate, a plurality of separated color filters formed above the substrate and the photoelectric conversion units, a first light shielding layer surrounding the separated color filters, and a first conductive polymer element blended with a low-refractive-index component filled between the individual separated color filters and between the all separated color filters and the first light shielding layer, wherein the first conductive polymer element is electrically connected to a grounding pad. | 03-31-2016 |
Patent application number | Description | Published |
20080232888 | Ink ribbon cartridge for a label printer - An ink ribbon cartridge is used in a label printer, including: a frame having two opposite side boards, a top board, and a bottom board, of which the top and bottom boards are mounted to top and bottom ends of the side boards; two first pivots respectively mounted to opposing surfaces of the opposite side boards and horizontally opposite to each other; two second pivots respectively mounted to the opposing surfaces of the opposite side boards and horizontally opposite to each other, the second pivots being arranged lower than the first pivots; and two channel structures including two first guides and two second guides, which are formed on the opposing surfaces of the opposite side boards and opposite to each other so as to delimit the two channel structures for guiding a printing module of the label printer along the channel structures for coupling to the ink ribbon cartridge. | 09-25-2008 |
20080232890 | Movable print head for a label printer - A movable print head is provided for a label printer, including: a control panel module having two pivots arranged on opposite sides of the control panel module and coupled to opposite sides of a body of the label printer to serve as rotational center for rotation of the control panel module; and a printing module fixed to an internal vertical surface of the control panel module and including two guide-in devices on opposite sides of the printing module to guide in an ink ribbon cartridge and a print head arranged between the two guide-in devices. The two guide-in devices of the printing module are movable in unison with the rotation of the control panel module to effect movable adjustment for guiding in the ink ribbon cartridge. | 09-25-2008 |
20090238628 | Printing mechanism of barcode printer - A printing mechanism is provided for a barcode printer and includes a frame, a printing head, a carbon ribbon axle, and a carbon ribbon collection axle. The frame is mounted to an upper end portion of an upper casing member. The printing head is mounted in the frame to effect printing of labels. The carbon ribbon axle is arranged in a lower portion of the frame and is located below the printing head for connecting and retaining a carbon ribbon that supplies a toner required for carrying out the printing of the labels by the printing head. The carbon ribbon collection axle is arranged in an upper portion of the frame and is located above the printing head in an arrangement that is reversed to the carbon ribbon axle to allow the carbon ribbon from the carbon ribbon axle to be rolled up in the carbon ribbon collection axle after the printing operation carried out by the printing head. The carbon ribbon from the carbon ribbon axle can be wound around and collected by the carbon ribbon collection axle in a shortest path. Thus, a printing mechanism featuring a reduced length of carbon ribbon collection path and a reduced size is provided. | 09-24-2009 |
20090238629 | Barcode label retention device of barcode printer - A barcode label retention device is provided for a barcode printer. The barcode label retention device includes s at least one pair of label roll retainers, at least one pair of resilient elements, and at least one pair of fixing plates. The label roll retainers are mounted inside a housing of a barcode printer and spaced from each other to receive and retain a label roll therebetween. The resilient elements are arranged inside each label roll retainer, and the fixing plates are arranged inside each label roll retainer. The fixing plate is connected to the resilient element to provide the fixing plate with resiliency for inward depressibility or outward biasing so that a front portion of the fixing plate projects inwards beyond the label roll retainer to abut against opposite ends of the label roll, whereby the label roll can be securely held by the two fixing plates engaging the opposite ends thereof and the path of a winding/unwinding operation can be stabilized. | 09-24-2009 |
20090238630 | Label roll positioning device of barcode printer - A label roll positioning device is provided for a barcode printer and includes at least one slide rail, at least one positioning rail, and at least one pair of roll retainers. The slide rail and the positioning rail are arranged in a parallel manner inside a housing of the barcode printer. The positioning rail forms teeth on a surface thereof. At least one of the roll retainers has a bottom forming a mounting portion that is slidably fit and mounted to the slide rail for being slidable along the slide rail. The roll retainers are spaced to receive a roll of label therebetween in a securely held manner. The roll retainer is provided therein at least one positioning plug having an end forming a locking section. The positioning plug can be downward driven to have the locking section downward projecting out of the roll retainer, and the positioning plug can be upward driven to have the locking section back into concealment inside the roll retainer. Thus, with the roll of label received between the roll retainers, the positioning plug is downward driven and the locking section engages the teeth of the positioning rail to effect positioning and fixing for securely holding the roll of label between the roll retainers. A positioning device with movable and adjustable locking engagement can be realized. | 09-24-2009 |
20090279932 | Carbon ribbon retaining mechanism - A carbon ribbon retaining mechanism includes a barcode-printer base, an upper cover, a printing head device, and at least one pair of resilient fastener elements. The barcode-printer base has an upper portion forming a receiving space. The upper cover is coupled to the receiving space of the barcode-printer base for being downward closed to and covering the receiving space. At least one pawl is respectively formed on opposite edge portions of the upper cover. The printing head device is accommodated in the receiving space. A carbon ribbon retention shaft is arranged above the printing head device. The resilient fastener elements are mounted above the printing head device. By means of the engagement effected between the pawls of the upper cover and the resilient fastener elements, the upper cover is fixed to and above the printing head device to cover the receiving space. Further, by flapping the upper cover upward, the pawls of the upper cover are disengaged from the resilient fastener elements to allow opening of the upper cover and thus expose the carbon ribbon retention shaft for replacement and/or maintenance. | 11-12-2009 |
Patent application number | Description | Published |
20120010861 | Method for optimal selecting LED light sources and implementing full spectrum light - A method for optimal selecting light-emitting diode (LED) light sources for full spectrum lighting is disclosed. The optimal selecting method includes the following steps: gathering a plurality of spectral power distributions corresponding to LED light sources; arranging the spectral power distributions to obtain a matrix A corresponding to the LED light sources; calculating a reconstructed coefficient, which is a least-square approximation of the matrix with respect to a spectral power distribution of a CIE standard illuminant; and selecting a best combination of the LED light sources according to the reconstructed coefficient. An LED light source assembly is also disclosed. | 01-12-2012 |
20140049178 | LIGHTING LAMP - The present invention discloses a lighting lamp ( | 02-20-2014 |
20140146318 | ILLUMINATION APPARATUS AND METHOD FOR OPTIMAL VISION - An illumination apparatus for optimal vision provided in the present invention includes an illumination module, a sensing module, and a computing module. The illumination module is utilized to generate an illuminating light with a plurality of different color temperatures for sequentially illuminating the illuminated object. The sensing module is utilized to sense a reflected light form the illuminated object. The computing module is utilized to calculate a saturation, chorma, and brightness of the illuminated object under the illuminating light by each color temperature, so as to obtain a plurality of preferred values corresponding to the color temperatures of the illuminating light, and for controlling the illumination module to illuminate by the illuminating light with the color temperature corresponding to a maximum among the preferred values. An illumination apparatus for optimal vision is further disclosed. | 05-29-2014 |
20140265926 | ILLUMINATION APPARATUS WITH GRADUALLY CHANGEABLE COLOR TEMPERATURES - The present invention provides an illumination apparatus with gradually changeable color temperatures; the apparatus includes an illumination module and a control module. The illumination module is utilized to generate an illuminating light which has a plurality of different color temperatures. The control module is utilized to control a color temperature variation of the illuminating light so that a color difference in Duv corresponding to the variation of the illuminating light is less than 0.006 under the color temperature variation. Moreover, all color rendering indices of the illuminating light corresponding to the different color temperatures are larger than 90, thereby completely simulating the variation of sun. | 09-18-2014 |