Hsia, TW
Alex Hsia, Taoyuan Hsien TW
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20090120613 | HEAT SINK - A heat sink includes a heat conductive portion, a plurality of fins and at least one connecting portion. The fins and connecting portion are disposed around the heat conductive portion. The connecting portion is disposed between the fins and has a fixed part. The fixed part is disposed at one side of the connecting portion and is used for connecting with a fastener. | 05-14-2009 |
Chang-Fu Hsia, Taichung City TW
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20130147433 | METHOD OF CONTROLLING THE POWER STATUS OF A BATTERY PACK AND RELATED SMART BATTERY DEVICE - In a smart battery device, a battery pack having a plurality of battery cells is provided. During charging, if the voltage of each battery cell does not exceed the maximum operational voltage associated with individual battery cell, the battery pack is charged by a first voltage. If the voltage of any battery cell is not smaller than the maximum operational voltage associated with individual battery cell, the battery pack is charged by a second voltage smaller than the first voltage. | 06-13-2013 |
20140368040 | VOLTAGE-STACKED SYSTEM FOR MANAGING STACKED VOLTAGE SOURCES BY USING MULTIPLE MONITORING CIRCUITS - A voltage-stacked system includes a first voltage source, at least one second voltage source, a master monitoring circuit and at least one slave monitoring circuit. The first voltage source and the at least one second voltage source are coupled in series. The master monitoring circuit is coupled to the first voltage source, and arranged for monitoring and controlling the first voltage source and transmitting a monitoring signal. The at least one slave monitoring circuit is respectively coupled to the at least one second voltage source and the master monitoring circuit for monitoring and controlling the at least one second voltage source, and accordingly sending a response signal to the master monitoring circuit. | 12-18-2014 |
Cheng-Yu Hsia, Chu-Nan TW
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20110266662 | Leadframe enhancing molding compound bondability and package structure thereof - A leadframe enhancing molding compound bondability includes a chip base and a pin holder. The chip bases includes a chip pad and a support, wherein the chip pad includes a side protrusion extending out of the support, and the side protrusion has a lower surface, and the support has a sidewall, and wherein the lower surface and the sidewall interconnect at an intersection line, and the lower surface is formed upwardly with a recess. Further, a pin holder includes a pin stand and a seat, wherein the pin stand has an edge portion extending out of the seat, the edge portion has a lower surface, the seat has a sidewall, and the lower surface and the sidewall interconnect at a crossing line. The lower surface of the pin stand is formed upward with a recess. As such, the bondability between the leadframe and the molding compound can be greatly enhanced. | 11-03-2011 |
Chen-Yuan Hsia, Hsin-Chu TW
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20110005010 | SYSTEM AND METHOD FOR REMOVING PARTICLES IN SEMICONDUCTOR MANUFACTURING - A system for semiconductor wafer manufacturing, comprises a chamber process path for processing the wafer, and a device operable to remove particles from the wafer by electrostatic and electromagnetic methodologies wherein the device is installed in the chamber process path. | 01-13-2011 |
Chi-Chun Hsia, Kaohsiung City TW
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20100069795 | METHOD AND SYSTEM FOR CONTOUR FITTING AND POSTURE IDENTIFICATION, AND METHOD FOR CONTOUR MODEL ADAPTATION - A method for contour fitting and posture identification initially receives a sensor data formed of a plurality of sensor signals. Thereafter at least one candidate posture or contour is determined from a set of at least one posture model based on the sensor data. Finally, user posture is determined from the at least one candidate posture through a decision making process. The sensor data can also be used to modify the at least one posture model for increasing identification accuracy. The sampling frequency of each sensor signal is dynamically adjusted to receive the sensor data in a nearly real-time manner. | 03-18-2010 |
20110082394 | METHOD AND SYSTEM FOR MONIORING SPORT RELATED FITNESS BY ESTIMATING MUSCLE POWER AND JOINT FORCE OF LIMBS - The present invention relates to a method and system for monitoring sport related fitness by estimating muscle power and joint force of limbs, in which the system comprises a sensing module and a force/track detection module, wherein sensor values from the sensing module are fed to the force/track detection module to be used as base for estimating feature parameters and classifying a motion series relating to muscle power and joint force of limbs so as to obtain skill-related fitness parameters corresponding to the sensing of the sensor module. | 04-07-2011 |
20120289868 | METHOD AND SYSTEM FOR MONIORING SPORT RELATED FITNESS BY ESTIMATING MUSCLE POWER AND JOINT FORCE OF LIMBS - The present invention relates to a method and system for monitoring sport related fitness by estimating muscle power and joint force of limbs, in which the system comprises a sensing module and a force/track detection module, wherein sensor values from the sensing module are fed to the force/track detection module to be used as base for estimating feature parameters and classifying a motion series relating to muscle power and joint force of limbs so as to obtain skill-related fitness parameters corresponding to the sensing of the sensor module. | 11-15-2012 |
20140181109 | SYSTEM AND METHOD FOR ANALYSING TEXT STREAM MESSAGE THEREOF - A system and method for analyzing text stream message for a micro-blog are provided. The system includes a sliding window module, storing a plurality of text stream messages from the micro-blog and updating the plurality of text stream messages once every preset duration; a dynamic text weight module, receiving the plurality of text stream messages and calculating the plurality of text stream messages for generating a burst weight according to a dynamic text stream weight algorithm; a clustering module, clustering the plurality of text stream messages for generating a plurality of clusters by a clustering algorithm according to the plurality of text stream messages and the burst weight; and a memory device, storing the clusters. | 06-26-2014 |
Chih-Hao Hsia, Taoyuan Hsien TW
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20090168351 | HEAT DISSIPATION MODULE AND FAN THEREOF - The present invention provides a heat dissipation module and a fan thereof. The heat dissipation module includes a heatsink and a frameless fan. The fan is disposed in the heatsink. The fan includes a motor base, an impeller, a motor and at least one engaging member. The impeller and the motor are disposed on the motor base. The motor drives the impeller to rotate, and the engaging member is extended radially from the motor base. The fan is directly assembled to the heatsink via the engaging member. | 07-02-2009 |
Chih-Hui Hsia, Taiwan TW
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20110159740 | CAGE FOR ELECTRICAL CONNECTOR AND CONNECTOR ASSEMBLY USING THE CAGE - A cage for shielding and handling electrical connectors, the cage has a pair of sidewalls each having a first and second longitudinal portions. A transverse link pierce joins the first longitudinal portions to form a single piece. Support members extend from the sidewalls and disposed in the space between the second longitudinal portions. A portion of the electrical connector is seated onto the support members, with the mounting portions of the contact terminals of the connector exposed. The electrical connector can be carried and positioned onto a PCB during the assembling process, by handling the cage only. The electrical connector is movable relative to the cage along vertical direction when contact terminals are brought into contact with the PCB to ensure the coplanary of contact terminals and PCB circuits. The present invention ensures the positioning accuracy of the connector onto the PCB and eases handling and assembling process. | 06-30-2011 |
Chih-Peng Hsia, Hsinchu County TW
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20110279443 | Driving Module and Driving Method - The present invention discloses a driving module for a liquid crystal display device. The driving module includes a data line signal processing unit, for generating a plurality of data driving signals, a scan line signal processing unit, for generating a plurality of gate driving signals, and a control unit, for controlling the data line signal processing unit and the gate line signal processing unit, such that a plurality of sub-pixels corresponding to a data line are with different charging orders in different frames, or are charged with different charging periods in a same frame. | 11-17-2011 |
20120249446 | TOUCH-SENSING APPARATUS - A touch-sensing apparatus including a touch panel and a touch-sensing controller is provided. The touch panel includes a plurality of touch blocks. Each of the touch blocks includes a first portion and a second portion. The touch-sensing controller includes a driving line and a plurality of sensing lines. The driving line is coupled to the first portions of the touch blocks, and the sensing lines are respectively coupled to the second portions of the touch blocks. The touch-sensing controller outputs a driving signal to the first portions through the driving line and receives a plurality of sensing signals generated by the second portions according to the driving signal through the sensing lines, so as to determine a touch coordinates corresponding to one of the touch blocks. | 10-04-2012 |
20130257790 | CAPACITIVE TOUCH DEVICE AND SENSING METHOD THEREOF - A capacitive touch device includes a capacitive touch panel, a driving control unit, k ADCs, a multiplex network and a processing unit. The capacitive touch panel has an m×n sensing point matrix formed by m driving line and n sensing lines. The driving control unit is coupled to the m driving lines. The multiplex network connects the n sensing lines and the k ADCs by time-domain multiplexing. The processing unit is coupled to the k ADCs. At least a part of the driving lines and at least a part of the sensing lines are assigned to be electrically connected. The processing unit senses according to multiple frequencies to obtain multiple signal strength values, and selects the frequency corresponding to a smallest signal value to be a sensing frequency of the capacitive touch device. | 10-03-2013 |
20130264095 | ELECTRODE STRUCTURE OF CAPACITIVE TOUCH PANEL - An electrode structure of a capacitive touch panel is provided, which includes a plurality of receiving electrodes and a plurality of driving electrodes. Each of the receiving electrodes has a hexagonal electrode structure. Each of the driving electrodes includes a main region. Each of the main regions has a quadrilateral electrode structure. The area of each driving electrode is larger than that of each receiving electrode. By using the foregoing electrode structure, the capacitive touch panel can not only provide sensing signals with less noise but also increase the intensity of input signals to enhance the signal to noise ratio. | 10-10-2013 |
20130277091 | ELECTRODE STRUCTURE OF CAPACITIVE TOUCH PANEL - An electrode structure of a capacitive touch panel including a plurality of receiving electrodes and driving electrodes is provided. Each of the receiving electrodes has at least one opening. Each of the driving electrodes includes a main region and a plurality of elongation regions. The area of each driving electrode is larger than that of each receiving electrode. Parts of the receiving electrodes surround a corresponding one of the driving electrodes, and the elongation regions of the surrounded driving electrode correspondingly stretch into the openings of the receiving electrodes which surround the driving electrode. By using the foregoing electrode structure, the capacitive touch panel is not only capable of providing sensing signals with less noise but is also capable of increasing input signals to enhance the signal to noise ratio. | 10-24-2013 |
20140267146 | TOUCHING APPARATUS AND TOUCHING DETECTING METHOD THEREOF - A touching apparatus and a touching detecting method thereof are provided. The touching detecting method is adapted for a touch panel. The touch panel has a plurality of touching rows and a plurality of touching columns. The touching detecting method includes: performing a mutual-capacitor touching detection and a self-capacitor touching detection alternatively to the touch panel for obtaining a mutual-capacitor detection result and a self-capacitor detection result, respectively; and obtaining position information of at least one touch point on the touch panel by an operation based on the mutual-capacitor detection result and the self-capacitor detection result. | 09-18-2014 |
Chih-Peng Hsia, Zhubei City TW
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20120287109 | DATA DRIVER AND DISPLAY MODULE USING THE SAME - A data driver and a display module using the same are provided. The data driver includes a data line driving circuit and a power control circuit. The data line driving circuit drives data lines of the display module. The power control circuit controls an external power generating circuit connected to the data driver to generate a scan voltage for a scan driver of the display module. | 11-15-2012 |
Chi-Kang Hsia, New Taipei City TW
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20130021212 | EXTERNAL CASING STRUCTURE FOR PROVIDING AN ANTENNA FUNCTION - An external casing structure for providing an antenna function includes a metal casing unit, an antenna unit, and an appearance decoration unit. The metal casing unit includes at least one metal casing. The antenna unit includes at least one antenna layer disposed on the metal casing, and the antenna layer is extended from the inner surface of the metal casing to the outer surface of the metal casing. The appearance decoration unit includes at least one appearance decoration layer disposed on the outer surface of the metal casing, and one part of the antenna layer is covered with the appearance decoration layer. | 01-24-2013 |
Chin Hsia, Taichung City TW
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20140133270 | Ultrasound Transmission Circuit and Time Delay Calibration Method Thereof - An ultrasound transmission circuit comprises a pulse generating circuit, a feedback circuit and a processing circuit. The feedback circuit outputs a trigger signal according to a first pulse signal arriving at an ultrasound transducer. The processing circuit records a first time point at which the first pulse signal is generated, and records a second time point at which the first pulse signal arrives the ultrasound transducer according to the trigger signal. The processing circuit adjusts a first delay value according to a variance between the first time point and the second time point to generate a second delay value, and drives the pulse generating circuit according to the second delay value to generate a second pulse signal. | 05-15-2014 |
20150036247 | APPARATUS FOR A VOLTAGE PROTECTION TRANCEIVER AND DEVICE THEREWITH - A voltage protection transceiver is introduced herein. The voltage protection transceiver includes a transmission element and a voltage-driven switch circuit. The voltage-driven switch circuit at least includes a sensing circuit and a protection switch. The voltage-driven switch circuit and the transmission element for transmitting input signals are separated from each other for maintaining integrity of transmission of signals. When a voltage level of the input signal is higher than a predetermined value and being detected by the sensing circuit, the voltage-driven switch circuit is turned on to protect electrical components at an output stage from being damaged or influenced by the high-level input signals. When the voltage level of input signals is lower than the predetermined value, the voltage-driven switch circuit is turned off to reach an output without power loss. | 02-05-2015 |
Chin-Chiu Hsia, Taipei City TW
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20080209381 | SHALLOW TRENCH ISOLATION DUMMY PATTERN AND LAYOUT METHOD USING THE SAME - A dummy cell pattern for shallow trench isolation (STI). Active and shallow trench isolation areas are bounded by a circumference. An active area pattern completely overlaps the active area and a first polysilicon pattern in the shallow trench isolation area is outside the active area pattern. Layout methods using the same are also disclosed. | 08-28-2008 |
20100252907 | Shallow Trench Isolation Dummy Pattern and Layout Method Using the Same - A dummy cell pattern for shallow trench isolation (STI). Active and shallow trench isolation areas are bounded by a circumference. An active area pattern completely overlaps the active area and a first polysilicon pattern in the shallow trench isolation area is outside the active area pattern. Layout methods using the same are also disclosed. | 10-07-2010 |
Ching-Ju Hsia, Taipei City TW
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20140136054 | VEHICULAR IMAGE SYSTEM AND DISPLAY CONTROL METHOD FOR VEHICULAR IMAGE - A vehicular image system includes a display unit, an image capture unit, a sensing receiving unit, a gesture recognition unit and a processing unit. The image capture unit is arranged to receive a plurality of sub-images. The sensing receiving unit is arranged to detect a sensing event to generate detection information. The gesture recognition unit is coupled to the sensing receiving unit, and is arranged to generate a gesture recognition result according to the detection information. The processing unit is coupled to the image capture unit and the gesture recognition unit, and is arranged to generate a vehicular image according to the sub-images and control a display of the vehicular image on the display unit according to the gesture recognition result. | 05-15-2014 |
Ching-Wen Hsia, Taoyuan TW
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20120163004 | ANGLE ADJUSTABLE LAMP - An angle adjustable lamp includes a base, at least one lamp holder, a support rod installed between the base and the lamp holder, and an angle adjusting mechanism disposed between the support rod and the lamp holder. The angle adjusting mechanism includes a plurality of cavities circularly arranged at one end of the support rod, at least one protrusion formed on the lamp holder and a bolt. The shape and location of the protrusion is corresponding to the cavities. The bolt pivots the support rod and the lamp holder, so the protrusion can be engaged with various cavities. When the lamp holder is turned, the location of the protrusion is changed so as to be engaged with another cavity, such that the illumination angle of the lamp is adjusted. The adjusted angle is fixed through tightening the bolt. | 06-28-2012 |
Ching-Wu Hsia, Taipei City TW
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20120231016 | Pharmaceutical Composition for Inhibiting Histone H4 and Manufacturing Method Thereof - The present invention discloses a pharmaceutical composition for inhibiting histone H4 and a manufacturing method thereof. The pharmaceutical composition comprises an anti-histone H4 antibody and a pharmaceutically acceptable excipient. The hair loss resulted from medications, including cancer drugs, can be reduced by using the pharmaceutical composition of the present invention, thereby resolving mental depression and promoting prognosis effects for patients. | 09-13-2012 |
Chi-Ni Hsia, Wufeng Taichung TW
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20090152232 | COMPLEX CAP AND CULTURE CONTAINER ASSEMBLY USING SAME - A complex cap includes a coupling element, a shielding element and at least one filtering element. The coupling element has a first coupling part to be coupled with a neck portion of a bottle body, a recess formed in the first coupling part, and a first opening is formed in a bottom of the recess. The first opening is communicated with the mouth portion of the bottle body when the first coupling part is coupled with the neck portion of the bottle body. The shielding element is used for at least partially sheltering the first opening of the coupling element and comprises a second coupling part to be tight-fitted into the recess of the coupling element. The filtering element is mounted in the recess of the coupling element and arranged between the coupling element and the shielding element for filtering off external contaminants and controlling gas-permeable amount. | 06-18-2009 |
Chun-Ching Hsia, Hualien County TW
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20120063254 | Voltage Regulator for Memory - A voltage regulator includes a first transistor, a second transistor, a third transistor, a feedback unit, a comparison unit, a first control unit and a second control unit. The first transistor is controlled by the feedback unit and the comparison unit, for stabilizing the voltage of the output node. When the first control unit turns on the second transistor, the voltage of the output node rises. When the first control unit turns off the second transistor, it triggers the second control unit turning on the third transistor, so the first transistor is turned on completely. Therefore, when the third transistor is turned off, the first transistor can be controlled by the feedback unit and the comparison unit for stabilizing the voltage of the output node. | 03-15-2012 |
20120170387 | DEVICE FOR GENERATING A TEST PATTERN OF A MEMORY CHIP AND METHOD THEREOF - A method of generating a test pattern of a memory chip includes generating and outputting a pattern enabling signal according to a first pattern signal and a second pattern signal, generating and outputting a first pre-input-output signal and a second pre-input-output signal according to a memory bank signal, a section signal, and the pattern enabling signal, executing an exclusive-OR logic operation on a third input-output signal and the second pattern signal to generate and output a first enabling signal, generating and outputting a first input-output signal and a second input-output signal according to the first enabling signal, the first pre-input-output signal and the second pre-input-output signal, and writing a predetermined logic voltage to each memory cell of the memory chip according to the first input-output signal and the second input-output signal. | 07-05-2012 |
Chun-Hua Hsia, Taipei TW
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20100225283 | FAST CHARGING ELECTRONIC SYSTEM - A fast charging electronic system includes an adapter having an interface module adapted to receive an input voltage from an external source, and an adapter port electrically connected to the interface module to output the input voltage. The fast charging electronic system further includes a wireless electronic device having a charging port removably and electrically connected to the adapter port of the adapter to receive the input voltage output therefrom, a charging module electrically connected to the charging port to receive the input voltage and convert the input voltage into a charge electrical energy, and a supercapacitor electrically connected to the charging module to receive the charge electrical energy therefrom for storage of an operating electrical energy, and outputting the operating electrical energy to enable operation of the wireless electronic device. | 09-09-2010 |
Chun-Hua Hsia, Taipei County TW
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20090206985 | CONTROL METHOD AND SYSTEM FOR CONTROLLING ACCESS THROUGH AN AUTOMATED DOOR - A control method for controlling access through an automated door is performed by a control system that includes a first communications unit, a processor and a storage space. The control method includes the steps of: a) through the first communications unit, receiving a communications signal transmitted from a second communications unit that has a second identification code and that transmits the communications signal upon dialing of the first identification code, and obtaining the second identification code of the second communications unit from the communications signal; and b) through the processor, comparing the second identification code obtained in step a) with at least one authorized identification code stored in the storage space, and controlling the automated door to permit access therethrough when a match is found. | 08-20-2009 |
20090272567 | ELECTRONIC DEVICE AND METHOD FOR MAKING THE SAME - An electronic device includes: first and second electronic parts, each of which has a conductive contact; and a plurality of first and second conductive filaments formed on the conductive contacts of the first and second electronic parts, respectively. The first and second electronic parts are connected detachably and coupled electrically to each other through interlocking between the first and second conductive filaments. | 11-05-2009 |
20100280658 | AUTOMATED VENDING SYSTEM AND METHOD - An automated vending system includes an automated vending machine and an account managing device for managing purchase transactions made with the automated vending machine. The automated vending machine includes an article dispenser operable to dispense an article, a memory unit storing a user phone number, a communication module, and a processing unit. The communication module is assigned with a first phone number and is adapted to receive a request made by a user through operating a mobile phone assigned with a second phone number to dial the first phone number. The processing unit is operable to determine if the second phone number contained in the request has a match with the user phone number stored in the memory unit, and controls the article dispenser to enable dispensing of the article when the second phone number has a match with the user phone number. | 11-04-2010 |
Chun-Hua Hsia, Tien-Shui Chen TW
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20080289770 | Adhesive tape cutting device - An adhesive tape cutting device includes: a sleeve body adapted to be sleeved on an adhesive tape roll and defining a channel that has opposite first and second open ends which open in opposite circumferential directions, the sleeve body further defining a tape-discharging slot that is disposed between the first and second open ends, that is in spatial communication with the channel, and that opens in a radial direction for extension of an unrolled end portion of an adhesive tape of the adhesive tape roll therethrough; and a cutting member mounted on the sleeve body. | 11-27-2008 |
Chun-Hua Hsia, Tamshui TW
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20110157939 | POWER ADAPTER APPARATUS AND POWER MANAGEMENT METHOD - A power adapter apparatus and a power management method thereof are disclosed in the invention. The power adapter includes an output interface and a power modulation unit. The power adapter can be electrically connected with an electronic device through the output interface. There is a detective structure disposed on the output interface. The power management method includes steps of: 1) detecting whether the power adapter apparatus is electrically connected with the electronic device by the detective structure; and 2) when the output interface is detected to be disconnected from the electronic device, switching the power modulation unit to a standby state, so as to reduce a total power consumption of the power modulation unit. | 06-30-2011 |
20110195606 | ELECTRICAL CONNECTOR - An electrical connector includes an insulation pedestal, an outer cover, an enhanced shell and a plurality of terminals partially embedded in the insulation pedestal. The insulation pedestal includes a main body and a tongue section. The enhanced shell includes a fixed side and a support side. The fixed side is embedded in the main body; and the tongue section is partially covered by the support side such that the support side can support the tongue section. The insulation pedestal is integratedly formed together with the terminals and the enhanced shell to strengthen the structure of the tongue section. | 08-11-2011 |
20110285492 | FERRITE CORE COIL - A ferrite core coil is provided, which includes a ferrite core element, at least a flexible substrate, and a plurality of first conductors disposed at an interval on the flexible substrate. The ferrite core element has at least a winding area, and the flexible substrate wraps a surface of the winding area of the ferrite core element. Furthermore, two ends of each first conductor respectively have a first contact and a second contact. In this manner, when the first contact of the first conductor and the second contact of the adjacent first conductor are connected electrically, a coil circumscribing the ferrite core element is formed. The winding process is thus greatly simplified, automatic fabrication of the ferrite core coil is facilitated, and the lithography process can be used to fabricate the first conductors on the flexible substrate, resulting in a small sized ferrite core coil. | 11-24-2011 |
20110286250 | POWER ADAPTATION DEVICE AND POWER SUPPLY MANAGEMENT METHOD - A power adaptation device and a power supply management method thereof are provided. The power adaptation device includes a terminal seat, a detection structure, a detection unit, an electric power modulation unit, an electric power modulation unit, and a control unit. The power supply management method includes the following steps. A detection result of the detection structure is read by the detection unit to judge whether the power terminal is electrically connected to the electronic device. The detection unit notifies the control unit that the power terminal is not connected to the electronic device when judging that the power terminal is not connected to the electronic device. The control unit controls the electric power modulation unit to stop supplying power to the electric power modulation unit to reduce a total power consumption of the electric power modulation unit. | 11-24-2011 |
20120025941 | IRON-CORE COIL ASSEMBLY - An iron-core coil assembly is provided, which includes a substrate, a plurality of U-shaped wires, a first pin, a second pin, and an iron-core device. The substrate has a groove divided into a winding area and a non-winding area. The plurality of U-shaped wires is disposed in the winding area at a space from each other, and each U-shaped wire has an opening and a recess. The first pin and the second pin are respectively arranged at two ends of the opening, and the recess is located in the groove. The iron-core device is disposed in the groove, and passes through the recess of each U-shaped wire. | 02-02-2012 |
20120252281 | ELECTRICAL CONNECTOR - An electrical connector includes an insulation pedestal, an outer cover, an enhanced shell and a plurality of terminals partially embedded in the insulation pedestal. The insulation pedestal includes a main body and a tongue section. The enhanced shell includes a fixed side and a support side. The fixed side is embedded in the main body; and the tongue section is partially covered by the support side such that the support side can support the tongue section. The insulation pedestal is integratedly formed together with the terminals and the enhanced shell to strengthen the structure of the tongue section. | 10-04-2012 |
Chu-Wei Hsia, Zhubei City TW
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20140176211 | SIGNAL COUPLING CIRCUIT AND ASSOCIATED METHOD - A signal coupling circuit for generating an output signal according to an input signal is provided. The signal coupling circuit includes: a coupling capacitor, configured to generate a coupling signal according to the input signal; a clock generating circuit, configured to generate a clock and determine a duty cycle of the clock by the coupling capacitor; a discharge circuit, configured to intermittently discharge the coupling capacitor according to the duty cycle of the clock; and an output circuit, coupled to the coupling capacitor, for generating the output signal according to the coupling signal. | 06-26-2014 |
Der-Lin Hsia, New Taipei City TW
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20130026491 | LED STRUCTURE AND METHOD FOR MANUFACTURING THEREOF - The present invention discloses a LED structure and a method for manufacturing the LED structure. The LED structure includes a substrate, a reflection layer, a first conducting layer, a light emitting layer, and a second conducting layer. The substrate has a plurality of grooves, and the reflection layer is disposed inside the plurality of grooves. The reflection layer is formed as a reflection block inside each of the grooves. The first conducting layer is disposed on the substrate, that is, the reflection layer is disposed between the first conducting layer and the substrate. The light emitting layer and the second conducting layer are sequentially disposed on the first conducting layer. The light emitting layer generates light when a current pass through the light emitting layer. Accordingly, the light generated by the light emitting layer can be emitted to the same side of the LED structure. | 01-31-2013 |
20130112998 | SOLID STATE LIGHT EMITTING SEMICONDUCTOR DEVICE - A solid state light emitting semiconductor device including a substrate, a mesa epitaxy stacking structure, an insulating layer, a first type electrode and a second type electrode is provided. The mesa epitaxy stacking structure includes a first type semiconductor layer, an active layer and a second type semiconductor layer arranged in order. A concave area is formed in the middle of the mesa epitaxy stacking structure to expose a portion of the first type semiconductor layer. The insulating layer covers the exposed surface of the first type semiconductor layer around the mesa epitaxy structure, sidewalls of the mesa epitaxy stacking structure and a portion of surface of the second type semiconductor layer. The first type electrode is located on the exposed first type semiconductor layer in the concave area, and is surrounded by the second type electrode located on the insulating layer around the mesa epitaxy stacking structure. | 05-09-2013 |
Der-Lin Hsia, Hsinchu TW
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20130207071 | LIGHT EMITTING DIODE ARRAY - A light emitting diode (LED) array includes a substrate with an array having a plurality of LED chips thereon, a dielectric layer, a plug, and a conductive connection layer. Each of the LED chips is isolated from another LED chip adjacent thereto by a trench. The dielectric layer covers a surface of the substrate exposed by the trench and sidewalls and partial surfaces of the LED chips adjacent to the trench. The plug fills the trench. The conductive connection layer is disposed over the plug and the dielectric layer to connect the LED chips with the LED chips adjacent thereto. Radiation emitted from one of the LED chips can be reflected by the dielectric layer and the plug, and finally reflected and output from a side of the LED chip not adjacent to the trench, thereby not affecting the adjacent LED chip and being absorbed by it. | 08-15-2013 |
Der-Ling Hsia, New Taipei City TW
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20140231858 | LED Sub-Mount and Method for Manufacturing Light Emitting Device Using the Sub-Mount - A LED sub-mount includes a substrate body and a plurality of first electrical-conductive layers. The substrate body has a first surface. The first electrical-conductive layers are positioned on the first surface of the substrate body, wherein the first surface between every adjacent two of the first electrical-conductive layers has an adhesive-filling groove. | 08-21-2014 |
20150034959 | PATTERNED SUBSTRATE AND LIGHT EMITTING DIODE STRUCTURE HAVING THE SAME - A light emitting diode structure includes a patterned substrate, an N-type semiconductor layer, a light emitting layer, and a P-type semiconductor layer. Plural protruding portions are formed on a surface of the substrate. A horizontal projection of each of the protruding portions on the surface of the substrate has a projection width W | 02-05-2015 |
Der-Ling Hsia, Taoyuan County TW
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20100258818 | LIGHT EMITTING DIODE CHIP AND MANUFACTURING METHOD THEREOF - The present invention provides a manufacturing method of an LED chip. First, a device layer is formed on a growth substrate, wherein the device layer has a first surface connected to the growth substrate and a second surface. Next, a plurality of first trenches are formed on the second surface of the device layer. Then, a protection layer is formed on the side walls of the first trenches. After that, the second surface is bonded with a supporting substrate and the device layer is then separated from the growth substrate. Further, a plurality of second trenches corresponding to the first trenches are formed in the device layer to form a plurality of LEDs, wherein the second trenches extend from the first surface to the bottom portions of the first trenches. Furthermore, a plurality of electrodes are formed on the first surface of the device layer. | 10-14-2010 |
20100258827 | LIGHT-EMITTING DIODE PACKAGE AND WAFER-LEVEL PACKAGING PROCESS OF LIGHT-EMITTING DIODE - A wafer-level packaging process of a light-emitting diode is provided. First, a semiconductor stacked layer is formed on a growth substrate. A plurality of barrier patterns and a plurality of reflective layers are then formed on the semiconductor stacked layer, wherein each reflective layer is surrounded by one of the barrier patterns. A first bonding layer is then formed on the semiconductor stacked layer to cover the barrier patterns and the reflective layers. Thereafter, a carrying substrate having a plurality of second bonding layers and a plurality of conductive plugs electrically insulated from each other is provided, and the first bonding layer is bonded with the second bonding layer. The semiconductor stacked layer is then separated from the growth substrate. Next, the semiconductor stacked layer is patterned to form a plurality of semiconductor stacked patterns. Next, each semiconductor stacked pattern is electrically connected to the conductive plug. | 10-14-2010 |
20120164768 | Light-Emitting Diode Package and Wafer-Level Packaging Process of Light-Emitting Diode - A wafer-level packaging process of a light-emitting diode is provided. First, a semiconductor stacked layer is formed on a growth substrate. A plurality of barrier patterns and a plurality of reflective layers are then formed on the semiconductor stacked layer, wherein each reflective layer is surrounded by one of the barrier patterns. A first bonding layer is then formed on the semiconductor stacked layer to cover the barrier patterns and the reflective layers. Thereafter, a carrying substrate having a plurality of second bonding layers and a plurality of conductive plugs electrically insulated from each other is provided, and the first bonding layer is bonded with the second bonding layer. The semiconductor stacked layer is then separated from the growth substrate. Next, the semiconductor stacked layer is patterned to form a plurality of semiconductor stacked patterns. Next, each semiconductor stacked pattern is electrically connected to the conductive plug. | 06-28-2012 |
En-Chieh Hsia, Kaohsiung City TW
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20110009060 | Systems and Methods for Reducing Interference Between a Plurality of Wireless Communications Modules - A wireless communications system is provided with a first wireless communications and a second wireless communications. The first wireless communications module transmits or receives a first wireless signal in a first frequency band selected from a first frequency range. The second wireless communications module transmits or receives a second wireless signal in a second frequency band selected from a second frequency range, and adjusts a transmission power of the second wireless signal in response to that a frequency offset between the first frequency band and the second frequency band falls within a predetermined range. | 01-13-2011 |
20110053523 | Systems and Methods for Coexistence of a Plurality of Wireless Communications Modules - A wireless communications system is provided with a first wireless communications module, a second wireless communications module, and an RF module. The first wireless communications module transmits or receives a first wireless signal, and the second wireless communications module transmits or receives a second wireless signal. The RF module allocates a first transceiving path and a second transceiving path to the first wireless communications module and the second wireless communications module, respectively, to enable the transmission or reception of the first wireless signal and the second wireless signal at the same time. | 03-03-2011 |
20130244720 | METHODS PERFORMED BY WIRELESS COMMUNICATIONS DEVICES TO ALLEVIATE SELF-INTERFERENCE - An embodiment of the invention provides a method to be performed by a wireless communications device. The wireless communications device includes at least a first wireless module and a second wireless module. According to the method, the wireless communications device obtains a quality indicator of the first wireless module. Then, the wireless communications device examines the quality indicator to determine whether to restrain a transmission power of the second wireless module for the first wireless module. | 09-19-2013 |
20140254634 | SYSTEMS AND METHODS FOR REDUCING INTERFERENCE BETWEEN A PLURALITY OF WIRELESS COMMUNICATIONS MODULES - A wireless communications includes a first wireless communications and a second wireless communications. The first wireless communications module transmits or receives a first wireless signal in a first frequency band selected from a first frequency range. The second wireless communications module transmits or receives a second wireless signal in a second frequency band selected from a second frequency range, and adjusts a transmission power of the second wireless signal in response to that a frequency offset between the first frequency band and the second frequency band falls within a predetermined range. The first wireless communications module is further configured to determine an in-band range in the overlapping part of the first and second frequency ranges, and a transmission power of the second wireless signal is adjusted in response to a frequency offset between the first frequency band and the second frequency band. | 09-11-2014 |
Hsiang-Lung Hsia, Changhua City TW
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20130306451 | TOUCH PANEL AND MANUFACTURING METHOD THEREOF - A touch panel includes a strengthen cover lens and a touch electrode layer. The strengthen cover lens includes a first non-planar sulfate, and is planned with a display region and a peripheral region surrounding the display region. The touch electrode layer is formed, on the first non-planar surface and overlaid on the display region and at least part of the peripheral region for manufacturing a non-planar touch panel. | 11-21-2013 |
Hsiang-Lung Hsia, Changhua TW
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20130092520 | TOUCH DEVICE AND FABRICATION METHOD THEREOF - The present disclosure relates to a touch technology, and more particularly to a touch device and a fabrication method thereof. The touch device comprises a sensing area and a peripheral area. The touch device further comprises a sensing electrode layer, a shading layer, a signal transmission line layer, and a conductive layer. The sensing electrode layer extends from the sensing area to the peripheral area. The shading layer is disposed on the peripheral area to overlay the sensing electrode layer and has a through hole to expose a portion of the sensing electrode layer. The signal transmission line layer is disposed on the shading layer and does not cover the through hole. The conductive layer fills the through hole and electrically connects the sensing electrode layer. In addition, a fabrication method of a touch device is also provided. | 04-18-2013 |
20140176453 | TOUCH PANEL AND A MANUFACTURING METHOD THEREOF - The present disclosure provides a method for manufacturing a touch panel, wherein the method comprises: forming a touch sensing layer on a visible region and a non-visible region of a cover substrate, wherein the non-visible region is located at periphery of the visible region forming a first opaque insulating layer on the touch sensing layer in the non-visible region; forming a wiring layer on the first opaque insulating layer: and forming a conductive layer to electrically connect the wiring layer and the touch sensing layer. Moreover, the present disclosure also provides a touch panel. Accordingly, the touch sensing accuracy is maintained, and the production rate is improved. | 06-26-2014 |
Hsien-Chung Hsia, Jhongli City TW
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20090176972 | Novel reactive dyestuff with N,N-dialkylamino bridge group - The present invention relates to a novel reactive dyestuff with an N,N-dialkylamino bridge group, represented by the following formula (I): | 07-09-2009 |
Hsing-Kuo Hsia, Hsin Chu County TW
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20140077152 | III-V Group Compound Devices with Improved Efficiency and Droop Rate - The present disclosure involves an illumination apparatus. The illumination apparatus includes an n-doped semiconductor compound layer, a p-doped semiconductor compound layer spaced apart from the n-doped semiconductor compound layer, and a multiple-quantum-well (MQW) disposed between the first semiconductor compound layer and the second semiconductor compound layer. The MQW includes a plurality of alternating first and second layers. The first layers of the MQW have substantially uniform thicknesses. The second layers have graded thicknesses with respect to distances from the p-doped semiconductor compound layer. A subset of the second layers located most adjacent to the p-doped semiconductor compound layer is doped with a p-type dopant. The doped second layers have graded doping concentration levels that vary with respect to distances from the p-doped semiconductor layer. | 03-20-2014 |
20140077224 | Pre-Cutting a Back Side of a Silicon Substrate for Growing Better III-V Group Compound Layer on a Front Side of the Substrate - The present disclosure involves an apparatus. The apparatus includes a substrate having a front side a back side opposite the front side. The substrate includes a plurality of openings formed from the back side of the substrate. The openings collectively define a pattern on the back side of the substrate from a planar view. In some embodiments, the substrate is a silicon substrate or a silicon carbide substrate. Portions of the silicon substrate vertically aligned with the openings have vertical dimensions that vary from about 100 microns to about 300 microns. A III-V group compound layer is formed over the front side of the silicon substrate. The III-V group compound layer is a component of one of: a light-emitting diode (LED), a laser diode (LD), and a high-electron mobility transistor (HEMT). | 03-20-2014 |
Hsing-Kuo Hsia, Jhubei City TW
Patent application number | Description | Published |
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20110193174 | Multiple Silicide Integration Structure and Method - A structure and method for providing a multiple silicide integration is provided. An embodiment comprises forming a first transistor and a second transistor on a substrate. The first transistor is masked and a first silicide region is formed on the second transistor. The second transistor is then masked and a second silicide region is formed on the first transistor, thereby allowing for device specific silicide regions to be formed on the separate devices. | 08-11-2011 |
20110266674 | Laser Etch Via Formation - The present disclosure provides methods for forming semiconductor devices with laser-etched vias and apparatus including the same. In one embodiment, a method of fabricating a semiconductor device includes providing a substrate having a frontside and a backside, and providing a layer above the frontside of the substrate, the layer having a different composition from the substrate. The method further includes controlling a laser power and a laser pulse number to laser etch an opening through the layer and at least a portion of the frontside of the substrate, filling the opening with a conductive material to form a via, removing a portion of the backside of the substrate to expose the via, and electrically coupling a first element to a second element with the via. A semiconductor device fabricated by such a method is also disclosed. | 11-03-2011 |
20120012871 | LIGHT EMITTING DEVICE - The present disclosure relates to methods for performing wafer-level measurement and wafer-level binning of LED devices. The present disclosure also relates to methods for reducing thermal resistance of LED devices. The methods include growing epitaxial layers consisting of an n-doped layer, an active layer, and a p-doped layer on a wafer of a growth substrate. The method further includes forming p-contact and n-contact to the p-doped layer and the n-doped layer, respectively. The method further includes performing a wafer-level measurement of the LED by supplying power to the LED through the n-contact and the p-contact. The method further includes dicing the wafer to generate diced LED dies, bonding the diced LED dies to a chip substrate, and removing the growth substrate from the diced LED dies. | 01-19-2012 |
20120032212 | METHOD OF LIGHT EMITTING DIODE SIDEWALL PASSIVATION - A Light-Emitting Diode (LED) includes a light-emitting structure having a passivation layer disposed on vertical sidewalls across a first doped layer, an active layer, and a second doped layer that completely covers at least the sidewalls of the active layer. The passivation layer is formed by plasma bombardment or ion implantation of the light-emitting structure. It protects the sidewalls during subsequent processing steps and prevents current leakage around the active layer. | 02-09-2012 |
20120064642 | METHOD TO REMOVE SAPPHIRE SUBSTRATE - A Light-Emitting Diode (LED) is formed on a sapphire substrate that is removed from the LED by grinding and then etching the sapphire substrate. The sapphire substrate is ground first to a first specified thickness using a single abrasive or multiple abrasives. The remaining sapphire substrate is removed by dry etching or wet etching. | 03-15-2012 |
20120080698 | HIGH EFFICIENCY LIGHT EMITTING DIODES - The present disclosure relates to high efficiency light emitting diode devices and methods for fabricating the same. In accordance with one or more embodiments, a light emitting diode device includes a substrate having one or more recessed features formed on a surface thereof and one or more omni-directional reflectors formed to overlie the one or more recessed features. A light emitting diode layer is formed on the surface of the substrate to overlie the omni-directional reflector. The one or more omni-directional reflectors are adapted to efficiently reflect light. | 04-05-2012 |
20120088322 | DICING-FREE LED FABRICATION - Provided is a method of fabricating a light-emitting diode (LED) device. The method includes providing a substrate having opposite first and second sides. A semiconductor layer is formed on the first side of the substrate. The method includes forming a photoresist layer over the semiconductor layer. The method includes patterning the photoresist layer into a plurality of photoresist components. The photoresist components are separated by openings. The method includes filling the openings with a plurality of thermally conductive components. The method includes separating the semiconductor layer into a plurality of dies using a radiation process that is performed to the substrate from the second side. Each of the first regions of the substrate is aligned with one of the conductive components. | 04-12-2012 |
20120104409 | FORMING LIGHT-EMITTING DIODES USING SEED PARTICLES - A seed layer for growing a group III-V semiconductor structure is embedded in a dielectric material on a carrier substrate. After the group III-V semiconductor structure is grown, the dielectric material is removed by wet etch to detach the carrier substrate. The group III-V semiconductor structure includes a thick gallium nitride layer of at least 100 microns or a light-emitting structure. | 05-03-2012 |
20120119228 | LED DEVICE WITH IMPROVED THERMAL PERFORMANCE - An apparatus includes a wafer with a number of openings therein. For each opening, an LED device is coupled to a conductive carrier and the wafer in a manner so that each of the coupled LED device and a portion of the conductive carrier at least partially fill the opening. A method of fabricating an LED device includes forming a number of openings in a wafer. The method also includes coupling light-emitting diode (LED) devices to conductive carriers. The LED devices with conductive carriers at least partially fill each of the openings. | 05-17-2012 |
20120119246 | LIGHT EMITTING DIODE COMPONENTS INTEGRATED WITH THERMOELECTRIC DEVICES - The present disclosure relates to structures of LED components that integrate thermoelectric devices with LEDs on LED emitter substrates for cooling the LEDs. The present disclosure also related to methods for integrating LED dies with thermoelectric elements. The LED component includes an LED emitter substrate with a cavity in a downward facing surface of the LED emitter substrate and thermal vias that extend from a bottom of the cavity to an area close to an upward facing surface of the LED emitter substrate. The device also includes thermoelectric elements disposed in the cavity where the thermoelectric elements connect with their corresponding thermal vias. The device further includes a thermoelectric substrate in the cavity to electrically connect to the thermoelectric elements. The device further includes an LED die on the upward facing surface of the LED emitter substrate such that the LED die is opposite the cavity. | 05-17-2012 |
20120126262 | ETCHING GROWTH LAYERS OF LIGHT EMITTING DEVICES TO REDUCE LEAKAGE CURRENT - The present disclosure relates to methods for fabricating LEDs by patterning and etching an n-doped epitaxial layer to form regions of roughened surface of the n-doped layer and mesa structures adjacent to the roughened surface regions before depositing an active layer and the rest of the epitaxial layers on the mesa structures. The method includes growing epitaxial layers of an LED including an un-doped layer and an n-doped layer on a wafer of growth substrate. The method also includes patterning the n-doped layer to form a first region of the n-doped layer and a mesa region of the n-doped layer adjacent to the first region. The method further includes etching the first region of the n-doped layer to create a roughened surface. The method further includes growing additional epitaxial layers of the LED including an active layer and a p-doped layer on the mesa region of the n-doped layer. | 05-24-2012 |
20120129282 | WAFER LEVEL CONFORMAL COATING FOR LED DEVICES - Provided is a method of fabricating a light-emitting diode (LED) device. The method includes providing a wafer. The wafer has light-emitting diode (LED) devices formed thereon. The method includes immersing the wafer into a polymer solution that has a surface tension lower than that of acetic acid. The polymer solution contains a liquid polymer and phosphor particles. The method includes lifting the wafer out of the polymer solution at a substantially constant speed. The method includes drying the wafer. The above processes form a conformal coating layer at least partially around the LED devices. The coating layer includes the phosphor particles. The coating layer also has a substantially uniform thickness. | 05-24-2012 |
20120181568 | MICRO-INTERCONNECTS FOR LIGHT-EMITTING DIODES - The present disclosure provides a method of fabricating a light emitting diode (LED) package. The method includes bonding a plurality of separated light emitting diode (LED) dies to a substrate, wherein each of the plurality of separated LED dies includes an n-doped layer, a quantum well active layer, and a p-doped layer; depositing an isolation layer over the plurality of separated LED dies and the substrate; etching the isolation layer to form a plurality of via openings to expose portions of each LED die and portions of the substrate; forming electrical interconnects over the isolation layer and inside the plurality of via openings to electrically connect between one of the doped layers of each LED die and the substrate; and dicing the plurality of separated LED dies and the substrate into a plurality of LED packages. | 07-19-2012 |
20120205694 | METHOD OF FORMING A LIGHT EMITTING DIODE EMITTER SUBSTRATE WITH HIGHLY REFLECTIVE METAL BONDING - The present disclosure provides one embodiment of a method for fabricating a light emitting diode (LED) package. The method includes forming a plurality of through silicon vias (TSVs) on a silicon substrate; depositing a dielectric layer over a first side and a second side of the silicon substrate and over sidewall surfaces of the TSVs; forming a metal layer patterned over the dielectric layer on the first side and the second side of the silicon substrate and further filling the TSVs; and forming a plurality of highly reflective bonding pads over the metal layer on the second side of the silicon substrate for LED bonding and wire bonding. | 08-16-2012 |
20120228650 | Light Emitting Diode Emitter Substrate with Highly Reflective Metal Bonding - The present disclosure provides one embodiment of a method for fabricating a light emitting diode (LED) package. The method includes forming a plurality of through silicon vias (TSVs) on a silicon substrate; depositing a dielectric layer over a first side and a second side of the silicon substrate and over sidewall surfaces of the TSVs; forming a metal layer patterned over the dielectric layer on the first side and the second side of the silicon substrate and further filling the TSVs; and forming a plurality of highly reflective bonding pads over the metal layer on the second side of the silicon substrate for LED bonding and wire bonding. | 09-13-2012 |
20120264296 | METHODS OF FORMING THROUGH SILICON VIA OPENINGS - A method of forming a through-silicon-via (TSV) opening includes forming a TSV opening through a substrate. A recast of a material of the substrate on sidewalls of the TSV opening is removed with a first chemical. The sidewalls of the TSV opening are cleaned with a second chemical by substantially removing a residue of the first chemical. | 10-18-2012 |
20120273749 | METHOD AND STRUCTURE FOR LED WITH NANO-PATTERNED SUBSTRATE - The present disclosure provides one embodiment of a method for fabricating light-emitting diode (LED) devices. The method includes forming a nano-mask layer on a first substrate, wherein the nano-mask layer has a randomly arranged grain pattern; growing a first epitaxy semiconductor layer in the first substrate, forming a nano-composite layer; growing a number of epitaxy semiconductor layers over the nano-composite layer; bonding a second substrate to the epitaxy semiconductor layers from a first side of the epitaxy semiconductor layers; applying a radiation energy to the nano-composite layer; and separating the first substrate from the epitaxy semiconductor layers from a second side of the epitaxy semiconductor layers. | 11-01-2012 |
20120286240 | Methods of Fabricating Light Emitting Diode Packages - An LED array comprises a growth substrate and at least two separated LED dies grown over the growth substrate. Each of LED dies sequentially comprise a first conductive type doped layer, a multiple quantum well layer and a second conductive type doped layer. The LED array is bonded to a carrier substrate. Each of separated LED dies on the LED array is simultaneously bonded to the carrier substrate. The second conductive type doped layer of each of separated LED dies is proximate to the carrier substrate. The first conductive type doped layer of each of LED dies is exposed. A patterned isolation layer is formed over each of LED dies and the carrier substrate. Conductive interconnects are formed over the patterned isolation layer to electrically connect the at least separated LED dies and each of LED dies to the carrier substrate. | 11-15-2012 |
20130214281 | METHOD OF GROWING A HIGH QUALITY III-V COMPOUND LAYER ON A SILICON SUBSTRATE - The present disclosure involves a method of fabricating a semiconductor device. A surface of a silicon wafer is cleaned. A first buffer layer is then epitaxially grown on the silicon wafer. The first buffer layer contains an aluminum nitride (AlN) material. A second buffer layer is then epitaxially grown on the first buffer layer. The second buffer layer includes a plurality of aluminum gallium nitride (Al | 08-22-2013 |
20130221320 | LED WITH EMBEDDED DOPED CURRENT BLOCKING LAYER - The present disclosure involves an apparatus. The apparatus includes a photonic die structure that includes a plurality of layers. A current blocking layer is embedded in one of the plurality of layers. The current blocking layer is a doped layer. The present disclosure also involves a method of fabricating a light-emitting diode (LED). As a part of the method, an LED is provided. The LED includes a plurality of layers. A patterned mask is then formed over the LED. The patterned mask contains an opening. A dopant is introduced through the opening to a layer of the LED through either an ion implantation process or a thermal diffusion process. As a result of the dopant being introduced, a doped current blocking component is formed to be embedded within the layer of the LED. | 08-29-2013 |
20130230935 | LED DEVICE WITH IMPROVED THERMAL PERFORMANCE - An apparatus includes a wafer with a number of openings therein. For each opening, an LED device is coupled to a conductive carrier and the wafer in a manner so that each of the coupled LED device and a portion of the conductive carrier at least partially fill the opening. A method of fabricating an LED device includes forming a number of openings in a wafer. The method also includes coupling light-emitting diode (LED) devices to conductive carriers. The LED devices with conductive carriers at least partially fill each of the openings. | 09-05-2013 |
20130240831 | GROWING AN IMPROVED P-GAN LAYER OF AN LED THROUGH PRESSURE RAMPING - The present disclosure involves an apparatus. The apparatus includes a photonic die structure that includes a light-emitting diode (LED) die. The LED die is a vertical LED die in some embodiments. The LED die includes a substrate. A p-doped III-V compound layer and an n-doped III-V compound layer are each disposed over the substrate. A multiple quantum well (MQW) layer is disposed between the p-doped III-V compound layer and the n-doped III-V compound layer. The p-doped III-V compound layer includes a first region having a non-exponential doping concentration characteristic and a second region having an exponential doping concentration characteristic. In some embodiments, the second region is formed using a lower pressure than the first region. | 09-19-2013 |
20140021483 | Forming Light-Emitting Diodes Using Seed Particles - A seed layer for growing a group | 01-23-2014 |
20140159096 | Micro-Interconnects for Light-Emitting Diodes - The present disclosure provides a method of fabricating a light emitting diode (LED) package. The method includes bonding a plurality of separated light emitting diode (LED) dies to a substrate, wherein each of the plurality of separated LED dies includes an n-doped layer, a quantum well active layer, and a p-doped layer; depositing an isolation layer over the plurality of separated LED dies and the substrate; etching the isolation layer to form a plurality of via openings to expose portions of each LED die and portions of the substrate; forming electrical interconnects over the isolation layer and inside the plurality of via openings to electrically connect between one of the doped layers of each LED die and the substrate; and dicing the plurality of separated LED dies and the substrate into a plurality of LED packages. | 06-12-2014 |
20140235053 | Methods of Forming Through Silicon Via Openings - A method of forming a through-silicon-via (TSV) opening includes forming a TSV opening through a substrate. A recast of a material of the substrate on sidewalls of the TSV opening is removed with a first chemical. The sidewalls of the TSV opening are cleaned with a second chemical by substantially removing a residue of the first chemical. | 08-21-2014 |
20140264410 | LED with IC Integrated Lighting Module - The present disclosure involves a method of packaging light-emitting diodes (LEDs). A carrier having a first side and a second opposite the first side is provided. The carrier includes a plurality of conductive interconnect elements. An integrated circuit (IC) die is bonded to the first side of the carrier. A packaging material having light-reflective properties is molded over the first and second sides of the carrier such that the IC die is sealed by the packaging material. A portion of the packaging material is molded into a reflective cap structure. A light-emitting diode (LED) is bonded to the second side of the carrier. Sidewalls of the reflective cap structure circumferentially surround the LED. The LED and the IC die are electrically coupled together through the conductive interconnect elements in the carrier. A lens is then formed over the LED. | 09-18-2014 |
Hsin Sheng Hsia, Taipei City TW
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20080244897 | APPARATUS FOR TRANSPLANTING MULTI-BOARD - An apparatus for transplanting a multi-board is provided. This apparatus includes an orientation device, a calibration device, and an image-adjusting device. The orientation device has a first movable platform, and the multi-board is fixed on the first movable platform. The calibration device has a second movable platform and is used for moving a substitution circuit board to a recombination position of the multi-board. The image-adjusting device captures image data of the multi-board and the substitution circuit board and compares the image data to obtain an error signal. The calibration device receives the error signal and moves the second movable platform according to the error signal in order to calibrate the relative position between the substitution circuit board and the multi-board. | 10-09-2008 |
Hung-Jung Hsia, Taipei City TW
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20100129208 | ASSEMBLED FAN FRAME - An assembled fan frame suitable for a case body includes a framework, a plurality of first assemblies, a back slab, and a plurality of second assemblies. The framework includes a fixing slab, a first side wall and a second side wall facing each other, and an accommodation space is defined to accommodate at least one fan module. The fixing slab has at least one first vent and a plurality of first assembling holes which are disposed around the first vent. The first assembly is disposed through the first assembling hole and fastens the fan module on the fixing slab. The back slab is vertically mounted on a surface of the case body and faces the fixing slab. The back slab includes at least one second vent and a plurality of second assembling holes. The second assembly is disposed through the second assembling hole and detachably fixes the framework on the back slab. | 05-27-2010 |
20140139996 | VIBRATION-ABSORBING MODULE AND CASE STRUCTURE THEREOF - A vibration-absorbing module comprises a case structure and an electronic device. The case structure comprises a bottom plate, two lateral walls and a plurality of vibration absorbing elements. The two lateral walls are disposed on and perpendicular to the bottom plate. The vibration absorbing elements are pivotally disposed on the two lateral walls respectively. The distance between opposing pairs of vibration absorbing elements disposed on the two opposite lateral walls is smaller than the distance between the two lateral walls. The electronic device is detachably disposed between the two lateral walls, and the vibration absorbing elements are in contact with two opposite sides of the electronic device. | 05-22-2014 |
20140353458 | SHOCK ISOLATION CAGE - A shock isolation cage including a bottom plate, two side plates, a top plate, and two shock isolation members is provided. Each of the side plates is fixed to the bottom plate. The top plate is fixed to the side plates. The bottom plate, the side plates, and the top plate surround to form an accommodating space for accommodating an electronic apparatus. Each of the shock isolation members includes a main body, a first shock isolation portion, and a second shock isolation portion. The main body is fixed to the corresponding side plate. The first and second shock isolation portions are connected to the main body, and respectively contact the bottom surface and the top surface of the electronic apparatus. | 12-04-2014 |
Joseph Hsia, Taoyuan TW
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20100240258 | Connector - The present invention relates to a connector. The connector includes: a housing; a plurality of the terminals arranged thereon for electrically contacting with a board; a pair of arms extending from two ends of the housing, respectively; a first projection and a second projection formed on each of the arms; and a metal member arranged along the length direction of each of the arms, having a hold-down portion and a first recess for engaging with the first projection with a first buffer space existing therebetween. The metal member is spaced from the second projection by a second buffer space. When the hold-down portion is soldered to a board, the first projection or the second projection may remedy overwarp of the board or the housing. | 09-23-2010 |
Ko-Yu Hsia, Hsinchu County TW
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20110280571 | SIGNAL PROCESSING DEVICE AND METHOD, AND INFRARED MULTI-CHANNEL RECEIVER - A signal processing device includes an amplifier, a filter module, a demodulation module and a band control module. When the band control module controls the filter module to output a specific single-channel signal, the resonator of the demodulator is switched to resonate the selected single-channel signal. Then the selected single-channel signal is demodulated. A signal processing method and an infrared multi-channel receiver are also described herein. | 11-17-2011 |
Kuo-Chao Hsia, Taipei City TW
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20080201504 | USB flash drive capable of providing data security - The invention discloses a USB flash drive comprising a USB interface, a memory, a flash drive controller, an identification controller and an input interface. The identification controller stores a first ID code. The input interface is used for inputting a second ID code by a user. When the identification controller identifies the second ID code as the first ID code, the identification controller will enable the flash drive controller, such that a computer system can control the flash drive controller to access the memory via the USB interface. When the identification controller cannot identify the second ID code, the identification controller will disable the flash drive controller, such that the computer system cannot control the flash drive controller to access the memory via the USB interface. | 08-21-2008 |
Mao-Chih Hsia, Kaohsiung City TW
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20120008377 | STATIC RANDOM ACCESS MEMORY WITH DATA CONTROLLED POWER SUPPLY - A static random access memory with data controlled power supply, which comprises a memory cell circuit and at least one Write-assist circuit, for providing power to the memory cell circuit according to data to be written to the memory cell circuit. | 01-12-2012 |
20120008449 | LOW POWER STATIC RANDOM ACCESS MEMORY - A SRAM that keeps the memory cell array under a low voltage in the Standby mode and Write mode, and raises the memory cell array supply voltage to a high voltage in the Read mode. A SRAM comprising: at least one memory cell circuit, comprising a latch circuit with at least two inverters, and comprising two power receiving terminals for receiving power; and a power supplying circuit, for providing the power to the memory cell circuit, such that the voltages at the power receiving terminals of the latch circuit is below a predetermined voltage level when data is written to the latch circuit. In one embodiment, the memory cell circuit includes a plurality of data accessing terminals and the data accessing terminals are respectively controlled by at least two pass-transistor switch devices. | 01-12-2012 |
Meng-Lin Hsia, Min-Hsiung TW
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20080244273 | CRYPTOGRAPHIC METHOD USING REDUNDANT BITS AND ADAPTIVE CLOCK FREQUENCY - The present invention discloses a cryptographic method using redundant bits and an adaptive clock frequency, which adds redundant bits and modifies clock frequency to change the contents and transmission rate of the bit sequence to encrypt data. The present invention can combine with the existing security mechanism or cryptographic algorithm, such as AES (Advanced Encryption Standard) or DES (Data Encryption Standard), to achieve a multi-fold security function. Thereby, the present invention can apply to various communication devices to increase the immunity against attacks, promote information security and protect personal privacy. | 10-02-2008 |
20110058603 | LOW-COMPLEXITY INVERSE TRANSFORM AND SUB-SAMPLING - Disclosed is a method of inverse transform and sub-sampling having low computational complexity, wherein, a complicated inverse transform process is simplified, meanwhile, a sub-sampling is performed, in particular said simplified process is provided with a compensation scheme, and that is utilized to solve a distortion problem as incurred by said simplified process. This method can be utilized in a video or image codec, for an inverse transform and a sub-sampling from a frequency domain to a spatial domain, thus reducing computational complexity of a frame-size reduction transform, and increasing decoding speed. Said method is applicable in equal and unequal reduction ratios of a frame length and width. | 03-10-2011 |
20120166502 | LOW-COMPLEXITY INVERSE TRANSFORM COMPUTATION METHOD - A low-complexity inverse transform computation method, comprising following steps: firstly, analyzing an end-of-block (EOB) point in a matrix of a block; next, determining whether a bottom-left corner coefficient or a top-right coefficient before said EOB point is zero, and if it is zero, reducing further size of said matrix; then, determining an adequate operation mode to reduce computational complexity; and finally, realizing 2-D inverse transform through simplified 1-D inverse transforms. An inverse transform process of said method mentioned above is capable of lowering computation amount, reducing burden and computational complexity of a decompression system, and shortening effectively computation time of said 2-D inverse transform, such that it is applicable to inverse transforms of various video and still image codecs. | 06-28-2012 |
Ming-Hung Hsia, Taipei Hsien TW
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20120008042 | SUPPORT STRUCTURE AND DOCUMENT PROJECTOR USING THE SAME - A support structure is disclosed, which includes plural cylindrical joints. Each cylindrical joint includes a cylindrical joint body having a wire channel for being passed through by a wire, a cylindrical joint head disposed on one end of the cylindrical joint body and having the wire channel, a cylindrical joint socket disposed on another end of the cylindrical joint body and having the wire channel The cylindrical joints are connected one by one by coupling the cylindrical joint to the corresponding cylindrical joint socket and are rotated along the radial direction of the cylindrical joint head. | 01-12-2012 |
Ming-Hung Hsia, New Taipei City TW
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20130329003 | VIDEO CAMERA POSITIONING SYSTEM AND CONTROL METHOD THEREOF - A method for controlling a video camera positioning system includes the steps of controlling a motor for driving a video camera to capture a panoramic frame, dividing the panoramic frame into a plurality of frames, controlling the motor for driving the camera lens to turn to the frame corresponding to an encoded command signal when the microcontroller receiving the encoded command signal, and zooming in the frame by the video camera. Furthermore, a video camera positioning system is also disclosed herein. | 12-12-2013 |
Ming-Hung Hsia, Chung Ho City TW
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20080258019 | Document Camera Device - A document camera device includes a pedestal, a bendable support arm, an image-capturing unit and a fastening mechanism. The pedestal has a concave accommodation space. The bendable support arm has one end pivotally connected with the pedestal. The image-capturing unit is secured to an opposite end of the bendable support arm such that the image-capturing unit is able to be adjusted to a desired position. The fastening mechanism is to secure the image-capturing unit within the concave accommodation space. | 10-23-2008 |
20100196085 | Ball Joint Structure - A ball joint structure is disclosed, which includes a socket with a containing opening, a ball disposed in the socket, a cover disposed at the containing opening, a protrusion disposed at an outer surface of the ball, a concavity disposed at an inner surface of the socket, and plural adjustable elastic screws screwed on the socket. The protrusion is moved in the concavity when the ball is rotated in the socket. The ball is gripped in the socket with a force provided by the adjustable elastic screws. | 08-05-2010 |
Ming-Tsung Hsia, Kaohsiung TW
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20090183045 | TESTING SYSTEM FOR A DEVICE UNDER TEST - A testing system for a device under test (DUT) includes a test parameter-generating device and a platform module. The test parameter-generating device stores test information, and is operable so as to execute a test algorithm, so as to generate a transmission signal upon execution of the test algorithm, and so as to generate a test environment with reference to the transmission signal. The platform module is operable so as to conduct testing of the DUT using the test information stored in the test parameter-generating device under the test environment generated by the test parameter-generating device. | 07-16-2009 |
Min-Hsiang Hsia, Hsin-Chu City TW
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20120040617 | Security Connection Establishing Method and Related Wireless Device and Wireless Host - A security connection establishing method for a wireless device and a wireless host is disclosed. The security connection establishing method includes the steps of allowing the wireless device to generate a trigger signal, allowing the wireless host to receive the trigger signal, allowing the wireless host to generate an accepting signal according to the trigger signal, allowing the wireless device and the wireless host to directly establish a security connection according to the accepting signal, and providing a connection result. | 02-16-2012 |
Ping-Hsin Hsia, Hsinchu City TW
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20100085754 | LIGHT EMITTING DEVICES HAVING HEAT-DISSIPATING SURFACE - A light-emitting device may include a heat-dissipating base, a light-emitting unit, a housing, and a first conductive contact and a second conductive contact. The heat-dissipating base has a top portion and a bottom portion. The bottom portion of the heat-dissipating base may include an exposed heat-dissipation surface. The light-emitting unit is over the top portion of the heat-dissipating base and is arranged to provide heat conductivity at least from the light-emitting unit to the heat-dissipating base. The light-emitting unit may include at least one light-emitting diode for emitting light and a first electrode and a second electrode. Heat may be generated as the light-emitting diode emits light, and the at least one light-emitting diode may have power input terminals for receiving power input to the at least one light-emitting diode. The power input may include one of an alternating-current input and a direct-current input. The first electrode and the second electrode are electrically coupled with the input terminals of the at least one light-emitting diode. The housing encloses at least a portion of the light emitting unit and covers the top portion of the heat-dissipating base. The first conductive contact and the second conductive contact are near or below a portion of the heat-dissipating base and are configured to receive external power supply. The first conductive contact may be electrically coupled with the first electrode, and the second conductive contact may be electrically coupled with the second electrode. | 04-08-2010 |
Sheng-Huang Hsia, Taipei TW
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20080272965 | COMBINATION OF PORTABLE COMPUTER AND ANTENNA - A combination of a portable computer and an antenna includes a portable computer and an antenna. The antenna is mounted on the casing of the portable computer. The outer surface of the casing of the portable computer has a recessed region. The recessed region is provided with a plurality of protruding stripes therein. The antenna is composed of an outer plate, an antenna device and a sliding plate. The mounting surface of the sliding plate is provided with a plurality of sliding troughs each of which is combined with the corresponding protruding strip, so that the sliding plate can slide with respect to the portable computer. Via this sliding action, the user can adjust the position of the antenna, so that the portable computer can receive the wireless signals. | 11-06-2008 |
Shih-Chang Hsia, Yunlin TW
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20140219555 | METHOD FOR DETECTING AND REMOVING SCROLLING TEXTS DURING VIDEO COMMUNICATION - A method for detecting and removing scrolling texts comprising a step of using an adaptive transient difference processing of video communication to conduct frame calculation, wherein the adaptive transient difference processing takes first N frames f | 08-07-2014 |
Shih-Min Hsia, New Taipei City TW
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20130053449 | METHOD FOR INHIBITING HISTONE GENE TRANSCRIPTION AND EXPRESSION - A method for inhibiting at least one of histone gene transcription and histone expression in a subject is provided. The method comprises administrating to the subject an effective amount of a compound of formula (I) or a pharmaceutically acceptable salt thereof: | 02-28-2013 |
20130137776 | METHOD FOR INHIBITING HISTONE GENE TRANSCRIPTION AND EXPRESSION - A method for inhibiting at least one of histone gene transcription and histone expression in a subject is provided. The method comprises administrating to the subject an effective amount of a compound of formula (I) or a pharmaceutically acceptable salt thereof: | 05-30-2013 |
Shouli Steve Hsia, Taipei TW
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20120326198 | LED STRUCTURE - A light emitting diode (LED) structure comprises a first dopant region, a dielectric layer on top of the first dopant region, a bond pad layer on top of a first portion the dielectric layer, and an LED layer having a first LED region and a second LED region. The bond pad layer is electrically connected to the first dopant region. The first LED region is electrically connected to the bond pad layer. | 12-27-2012 |
20140061688 | LED Structure - A light emitting diode (LED) structure comprises a first dopant region, a dielectric layer on top of the first dopant region, a bond pad layer on top of a first portion the dielectric layer, and an LED layer having a first LED region and a second LED region. The bond pad layer is electrically connected to the first dopant region. The first LED region is electrically connected to the bond pad layer. | 03-06-2014 |
Tsun-Hsiao Hsia, Taipei Hsien TW
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20090153217 | Active Clamp Switching Circuit - An active clamp switching circuit includes a transformer having a primary winding and a secondary winding, a first switch, a capacitor, an impedance device, a second switch and a rectifier. The capacitor, the impedance device and the second switch form a reset loop for the primary winding so that the impedance device lowers the electric current going through the second switch, preventing burnout of the second switch. | 06-18-2009 |
Tsun-Hsiao Hsia, Taipei TW
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20090091961 | Single-Stage Power Factor Correction Circuit - A single-stage power factor correction circuit includes a first rectifier, a second rectifier, a full bridge rectifier, a capacitor, a fly back transformer, and a switch. Unlike conventional single-stage power factor correction circuits, the present invention just needs to pass through two rectifiers at positive and negative half cycles, so as to reduce the conduction loss, lower the temperature of the power supply, and control the voltage of the control energy storage capacitor, and stabilize voltage output. | 04-09-2009 |
Tsun-Hsiao Hsia, Taipei City TW
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20080316775 | Soft-switching circuit for power supply - A soft-switching circuit for a power supply comprises a bridgeless rectifier circuit and an auxiliary circuit. The auxiliary circuit is connected to the bridgeless rectifier circuit, which comprises at least one filtering inductor, two main switches, two diodes and a capacitor. The filtering inductor is connected to the first diode. The first diode is connected to the second diode. The second diode is connected to the first main switch. The first main switch is connected to the second main switch. The diodes and the main switches are connected in parallel with the capacitor to reduce conducting loss. The auxiliary circuit comprises at least one resonant inductor, an auxiliary switch, at least two diodes and a voltage source circuit. The diodes are connected to the resonant inductor and further connected to the voltage source circuit. The voltage source circuit is connected to the auxiliary switch, whereby the soft-switching circuit can accomplish zero voltage switching and zero current switching to provide low conducting loss and low switching loss. | 12-25-2008 |
Tzu-Ting Hsia, New Taipei City TW
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20130335678 | BACKLIGHT MODULE AND DISPLAY APPARATUS THEREOF - A backlight module is for providing light to a liquid crystal panel having a visible region. The backlight module includes a light guide plate, light emitting units, a mesh dot layer, and a diffusing tape. The light emitting units are disposed at a position corresponding to a light entrance surface of the light guide plate for emitting light to the light entrance surface. The mesh dot layer is disposed on a bottom surface of the light guide plate. A side of the mesh dot layer corresponding to the light entrance surface is shifted inward by a first distance relative to a side of the visible region corresponding to the light entrance surface. The diffusing tape is attached onto the bottom surface corresponding to the light entrance surface for diffusing light in the light guide plate to a light exit surface of the light guide plate. | 12-19-2013 |
Wei-Lun Hsia, Caotun Township TW
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20120000796 | Measurement Device and Method Utilizing the Same - A measurement device measuring a solution and including a reference voltage generating unit, a plurality of sensing units, a reading unit and a processing unit is disclosed. The reference voltage generating unit is disposed in the solution to generate a reference voltage. The sensing units are disposed in the solution to generate a plurality of output signals relating to the reference voltage. The reading unit outputs a reading signal according to one of the output signals. The processing unit generates a measuring signal according to the reading signals. | 01-05-2012 |
Wei-Lun Hsia, Nantou County TW
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20090266712 | CALCIUM ION SENSORS AND FABRICATION METHOD THEREOF, AND SENSING SYSTEMS COMPRISING THE SAME - A calcium ion sensor is provided. The calcium ion sensor includes a metal oxide semiconductor field effect transistor, a sensing unit including a substrate, a ruthenium dioxide membrane formed thereon and a calcium ion sensing membrane formed on the ruthenium dioxide membrane, and a conductive wire connecting the metal oxide semiconductor field effect transistor and the sensing unit. The invention also provides a method for fabricating a calcium ion sensor, and a sensing system including the sensor. | 10-29-2009 |
Wen-Nan Hsia, Hsichih TW
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20100213040 | SWITCH STRUCTURE ON SIDEWALL OF CIRCUIT BOARD FOR ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE CIRCUIT BOARD - A switch structure on the sidewall of a circuit board for an electronic device and manufacturing methods of the circuit board are provided. The switch structure includes a circuit board, a plurality of conductive portions, and a movable unit. The conductive portions are formed on a sidewall of the circuit board and electrically insulated from each other. The movable unit is disposed corresponding to the conductive portions to electrically connect or disconnect the plurality of conductive portions to achieve the switch function. The switch structure utilizes the structural design of the circuit board to reduce the space on the circuit board preserved for a circuit board switch. | 08-26-2010 |
Wen-Nan Hsia, Hsinchih TW
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20120228100 | SWITCH STRUCTURE ON SIDEWALL OF CIRCUIT BOARD FOR ELECTRONIC DEVICE AND MANUFACTURING METHODS OF THE CIRCUIT BOARD - A switch structure on the sidewall of a circuit board for an electronic device and manufacturing methods of the circuit board are provided. The switch structure includes a circuit board, a plurality of conductive portions, and a movable unit. The conductive portions are formed on a sidewall of the circuit board and electrically insulated from each other. The movable unit is disposed corresponding to the conductive portions to electrically connect or disconnect the plurality of conductive portions to achieve the switch function. The switch structure utilizes the structural design of the circuit board to reduce the space on the circuit board preserved for a circuit board switch. | 09-13-2012 |
Wen-Nan Hsia, New Taipei City TW
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20140009107 | Dynamic Charging Device and Method Thereof - A dynamic charging device includes a detection module for generating a detection signal according to an input signal, a control module coupled to the detection module for generating a control signal according to the detection signal, and an output module coupled to the control module for dynamically adjusting amounts of the input signal according to the control signal and the input signal, so as to process a charging operation for a load module, wherein the input signal is an input current or a voltage source. | 01-09-2014 |
20140085225 | TOUCH PANEL MODULE AND ELECTRONIC DEVICE THEREWITH - A touch panel module includes a frame, a base plate, a touch material layer, a transmission cable and a first attaching layer. The frame with an opening and a breach connected to the opening formed therein is disposed on a casing. The base plate is disposed on the casing and located inside the opening. The touch material layer is disposed on the base plate, and a peripheral portion of the touch material layer is attached to the frame for sealing the base plate inside the opening. The transmission cable is connected to the touch material layer in a position near the peripheral portion and passes through the casing via the breach. The first attaching layer attaches the frame and the casing for sealing a gap between the frame and the casing, so as to prevent liquids from entering the opening and the breach from the gap. | 03-27-2014 |
Wen-Nan Hsia, Taipei Hsien TW
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20100033612 | Composite Image Device and Related Portable Electronic device - A composite image device having image capturing, laser pointing, lighting and related functions in one includes a first perspective window, a second perspective window, a third perspective window, an image capturing module, laser source module, a light source module and a switchable light modulating module. The image capturing module captures ambient light through the first perspective window to generate digital image data. The laser source module emits a laser through the second perspective window. The light source module emits illuminating light through the third perspective window. The switchable light modulating module includes at least a light modulating gate and a switching device for moving the at least a light modulating gate to a position relatively parallel to the second or third perspective window to modulate the emitted laser or the emitted illuminating light. | 02-11-2010 |
Yi-Chih Hsia, Longtan Township TW
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20090253209 | Method of obtaining BZM purity, quantity of [123I]IBZM labeled ligand and quantity of BZM free ligand - A purity of BZM is analyzed by a high performance liquid Chromatography (HPLC) to know whether the purity is qualified. And a quantity of a labeled ligand ([ | 10-08-2009 |
Yi-Chih Hsia, Taoyuan County TW
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20100112706 | METHOD FOR ANALYZING STRUCTURE AND PURITY OF SEROTONIN TRANSPORTER IMAGING AGENT [123I] ADAM AND PRECURSOR SnADAM - An analytical technique for determining the structures of serotonin transporter (SERT) imaging agent [ | 05-06-2010 |
20120101741 | DIRECT SOLID SAMPLE ANALYTICAL TECHNOLOGY FOR DETERMINING A CONTENT AND A UNIFORMITY THEREOF IN A LYOPHILIZED KIT OF A SULFUR-CONTAINING CHELATOR WITH A STABLE COMPLEX CAPACITY FOR RADIOTECHNETIUM (TC-99M) AND RADIORHENIUM (RE-186, RE-188) - The present invention is related to a direct solid sample analytical technology for determining a content and a uniformity thereof in a lyophilized kit of a sulfur-containing chelator with a stable complex capacity for radiotechnetium (Tc-99m) and radiorhenium (Re-186, Re-188). An economical, stable and easily accessible coal standard is used herein as a contrast substance to construct a sulfur calibration curve, followed by obtaining the sulfur content and the uniformity thereof in the solid lyophilized sample by interpolating the foregoing result into the sulfur calibration curve. Then, the weight content percent is converted to get the content and the uniformity of the chelator in the lyophilized kit. The quality control of active pharmaceutical ingredients (API) in the lyophilized kit during key production processes and clinical applications is thus assured. | 04-26-2012 |
Yu-Fang Hsia, Hsinchu TW
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20140216802 | SUBSTRATE STRUCTURE AND THE PROCESS MANUFACTURING THE SAME - The present invention discloses a package substrate layout design to achieve multiple substrate functions for engineering development and verification. The substrate layout contains a connection structure to connect to a plurality of power/ground domains on the package substrate. With different combination of the cutting lines on the package substrate, the invention can achieve multiple substrate functions without impacting the customer's PCB or system board design and provide cost effective and fast cycle time for engineering development phase. | 08-07-2014 |
Yu-Lung Hsia, Tainan TW
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20110271783 | CONSTANT SPEED DEVICE FOR A MOTORCYCLE - A constant speed device for a motorcycle having a twist grip throttle and has a clamping segment and a pressing segment. The clamping segment a clamping space, an abutting face and a gap. The clamping space is defined through the clamping segment to mount around the twist grip throttle of the motorcycle. The abutting face is formed around the clamping space of the clamping segment to abut with the twist grip throttle. The gap is formed through a side of the clamping segment and communicates with the clamping space to allow the twist grip throttle mounting in the clamping space of the clamping segment. The pressing segment is connected to the clamping segment opposite to the gap. | 11-10-2011 |
Yung-Ming Hsia, Taipei City TW
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20110116224 | DOCKING STATION - A docking station including a holder, a slider and a sliding plate is provided. The holder has a supporting surface, and both the slider and the sliding plate are movably disposed on the holder, wherein the slider has a plurality of protrusions and the sliding plate has a plurality of rails, and each protrusion on the slider is located correspondingly on one of the rails. When the sliding plate moves in relation to the holder, the protrusions of the slider are guided by the rails of the sliding plate, and a first supporting area and a second supporting area is formed on the supporting surface according to a first position and a second position whereat the slider is located on the supporting surface. The first supporting area is greater than the second supporting area. | 05-19-2011 |
Yvonne C. Hsia, New Taipei TW
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20130330979 | CONNECTOR FOR A COVERING MEMBER OF A CABLE - A connector for a covering member of a cable contains a connector; the covering member, including an outer tube having a first hole, the first hole having an external portion extending outward from a peripheral side of another end thereof, the outer tube being retained in the connector, a bottom end of the external periphery being larger than the first hole; an inner tube having a second hole; a needle portion having a head projection and an engaging section; wherein after the needle projection retains in the second hole of the inner tube, the needle portion and the inner tube are received in the first hole of the outer tube so as to retain in the connector with the outer tube. | 12-12-2013 |
Yvonne C. Hsia, Taichung TW
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20120032433 | JOINT FOR A CABLE - A joint for a cable contains a connecting sleeve including threads around an inner wall of an upper end thereof and a shoulder on a bottom end of an inner wall thereof; an internal tube including an arresting ring extending around an upper end thereof and a circular groove around an outer wall thereof; an inner fitting member including a hole disposed on a top surface thereof, at least one curved recess formed on an outer wall thereof, and the inner fitting member including an insertion extending from a bottom end thereof; an outer fitting member including a protrusion and a first fixing section disposed on a bottom end thereof; a sheath member including a bore mounted on an upper end thereof, the bore including an annular cutout formed on an outer wall thereof and a raised loop fixed on a bottom end thereof; a banding member fitted to the annular cutout. | 02-09-2012 |