Patent application number | Description | Published |
20080274587 | Method of Assembling Electronic Components of an Electronic System, and System Thus Obtained - An electronic system comprising: an electronic system support substrate for the attachment of components of the electronic system, the electronic system support substrate including electric signal propagation paths for the propagation of electric signals between the system components; at least a first and a second electronic components, wherein at least the first electronic component is part of a module in mechanical and electrical connection with the electronic system support substrate, the module comprising a module substrate to which the first electronic component is at least mechanically connected, and an electric coupling between the first and the second electronic components, for the electric coupling allowing the first and the second electronic components exchange of electric signals. The electric coupling comprises a direct electric connection, particularly formed by a flexible electrical interconnection member, between the first and the second electronic components, the electric connection being independent of the electronic system support substrate. | 11-06-2008 |
20100164030 | CHIP CARRIER BEARING LARGE SILICON FOR HIGH PERFORMANCE COMPUTING AND RELATED METHOD - Embodiments of the present invention provide a system and method for manufacturing integrated circuit (IC) chip packages. In one embodiment, the integrated circuit (IC) chip package can include an IC chip and a substrate coupled to the IC chip. The substrate can include a glass fiber re-enforced epoxy core, a plurality copper circuitry containing particle re-enforced epoxy layers symmetrically-oriented to each surface of the glass fiber re-enforced epoxy core, and an outermost amorphous glass layer on each surface of the plurality of layers. The IC chip can be coupled to copper circuitry bonded to one of the outermost amorphous glass layers. | 07-01-2010 |
20110134614 | DEMOUNTABLE DRY CONNECTION FOR FLEXIBLE CIRCUITS TO CIRCUIT BOARDS - Substrates are connected by demountable coupling by connecting an electronic module to a substrate. An electronic module and a substrate carrying electrical and/or optical circuits are provided. A connector electrical circuit is connected between the substrate and the electronic module. The connector electrical circuit is electrically demountable dry connected to the electronic module. | 06-09-2011 |
20130205588 | Method and System for Improving Alignment Precision of Parts in MEMS - Methods for improving alignment precision of two parts of an electronic device are disclosed. Two parts are stacked with an intervening rolling element having a first diameter. One part can pivot relative to the other part about the rolling element to bring the two parts into alignment. The pivoting can be achieved by imposing a z-direction force on the parts, such as a magnetic force. The aligned parts can be locked by solidification of solder. Prior to the pivoting step, the one rolling element can be held on one of said two parts using a thermally dissipative material that comprises glycerol. | 08-15-2013 |
20150237729 | SUBSTRATE DEVICE AND ELECTRIC CIRCUIT ARRANGEMENT - A substrate device for electronic circuits or devices includes a first substrate section including a first plurality of layers attached to each other having a first orientation (x | 08-20-2015 |
Patent application number | Description | Published |
20080209378 | METHOD AND SYSTEM FOR PROTOTYPING ELECTRONIC DEVICES WITH MULTI-CONFIGURATION CHIP CARRIERS - A solution for prototyping electronic devices is proposed. The solution uses a carrier which allows mounting the desired components with different configurations. In order to achieve this result, for some of these components, such as discrete capacitors, the carrier includes more contacts than the corresponding terminals. In this way, each capacitor may be mounted in multiple positions (such as a working one based on the manufacturing standards, an advanced one with gaps between the components below the corresponding safety margins, and as control one with larger gaps). As a result, it is possible to assemble different prototypes by using a single type of carrier, thereby substantially reducing the cost of the process. | 08-28-2008 |
20110138600 | Electro-optical Assembly Fabrication - A flip-chip bonder fabricates an optical assembly by horizontally positioning a flexible portion of a substrate including a waveguide with the waveguide exposed at one end edge of the substrate; bending a portion of the flexible substrate to place the waveguide exposed end in approximately a vertical position; vertically positioning a bond head containing an optical component upon the waveguide exposed substrate edge to optically mate the optical component with the exposed waveguide; and fixably mounting the optical component to the substrate edge. | 06-16-2011 |
20130067715 | Electro-optical Assembly Fabrication - A flip-chip bonder fabricates an optical assembly by horizontally positioning a flexible portion of a substrate including a waveguide with the waveguide exposed at one end edge of the substrate; bending a portion of the flexible substrate to place the waveguide exposed end in approximately a vertical position; vertically positioning a bond head containing an optical component upon the waveguide exposed substrate edge to optically mate the optical component with the exposed waveguide; and fixably mounting the optical component to the substrate edge. | 03-21-2013 |
20130067733 | Electro-optical Assembly Fabrication - A flip-chip bonder fabricates an optical assembly by horizontally positioning a flexible portion of a substrate including a waveguide with the waveguide exposed at one end edge of the substrate; bending a portion of the flexible substrate to place the waveguide exposed end in approximately a vertical position; vertically positioning a bond head containing an optical component upon the waveguide exposed substrate edge to optically mate the optical component with the exposed waveguide; and fixably mounting the optical component to the substrate edge. | 03-21-2013 |
20130067739 | Electro-optical Assembly Fabrication - A flip-chip bonder fabricates an optical assembly by horizontally positioning a flexible portion of a substrate including a waveguide with the waveguide exposed at one end edge of the substrate; bending a portion of the flexible substrate to place the waveguide exposed end in approximately a vertical position; vertically positioning a bond head containing an optical component upon the waveguide exposed substrate edge to optically mate the optical component with the exposed waveguide; and fixably mounting the optical component to the substrate edge. | 03-21-2013 |
20140208571 | Electro-optical Assembly Fabrication - A flip-chip bonder fabricates an optical assembly by horizontally positioning a flexible portion of a substrate including a waveguide with the waveguide exposed at one end edge of the substrate; bending a portion of the flexible substrate to place the waveguide exposed end in approximately a vertical position; vertically positioning a bond head containing an optical component upon the waveguide exposed substrate edge to optically mate the optical component with the exposed waveguide; and fixably mounting the optical component to the substrate edge. | 07-31-2014 |
20150206838 | Integrated helical multi-layer inductor structures - A chip package comprising: a chip stack comprising at least one chip; and a thermal power plane comprising at least two substantially parallel dielectric layers having conductive connectors patterned therein, the at least two dielectric layers electrically connected by vias, wherein said vias are substantially perpendicular to the at least two dielectric layers, wherein each of the vias electrically connects to a connector patterned within a dielectric layer of the at least two dielectric layers at a via connection, wherein an inductor used in supplying power to the at least one chip is formed from the vias and from connectors electrically connecting via connections on each of the at least two dielectric layers. | 07-23-2015 |