Patent application number | Description | Published |
20130271984 | LED LIGHTING APPARATUS HAVING SNOW MELTING FUNCTION - An LED (light emitting diode) lighting apparatus includes an LED, a light adjusting device and a shell. The LED includes a main lighting surface and a heat dissipating surface. The shell receives the LED and the light adjusting device therein, the shell having a light emitting window for light emitted from the LED to transmit therethrough after the light is directed by the light adjusting device. The heat dissipating surface of the LED connects the light emitting window, and heat generated by the LED is transferred from the heat dissipating surface to the light emitting window to prevent snow from accumulating on the light emitting window. | 10-17-2013 |
20130279150 | LED LIGHT EMITTING APPARATUS HAVING A LIGHT GUIDING DEVICE TO ACHIEVE A UNIFORM COLOR DISTRIBUTION - An LED light emitting apparatus includes an LED light source, a light guiding device and an emitting window. The emitting window is covered with a phosphor layer. Light emitted directly from the LED light source is first transmitted to the light guiding device and then guided by the light guiding device towards the emitting window to evenly excite the phosphor layer. | 10-24-2013 |
20130285094 | LIGHT EMITTING DIODE LIGHT SOURCE DEVICE - An LED light source device includes an LED light source, a first translucent structure covering the LED light source and a second translucent structure covering the first translucent structure. An interior of the first translucent structure has light scattering powder distributed therein. The LED light source is embedded in the first translucent structure. The LED light source is covered by the light scattering powder. The second translucent structure has a radius of R and an index of refraction of N | 10-31-2013 |
20140001505 | LIGHT EMITTING DIODE PACKAGE WITH LENS AND METHOD FOR MANUFACTURING THE SAME | 01-02-2014 |
20140177216 | LIGHT EMITTING DEVICE AND METHOD FOR MIXING LIGHT THEREOF - An exemplary light emitting device includes a blue-green light source and a orange-red light source. The blue-green light source emits blue-green light and the orange-red light source emits orange-red light when they are activated. The blue-green light and the orange-red light are mixed together to obtain white light. | 06-26-2014 |
20150060935 | LED MODULE - An light emitting diode (LED) module includes a circuit board, a set of LED chips formed on and electrically connected to the circuit board, and an encapsulant arranged on the circuit board and covering the LED chips, a set of first recesses defined in a top surface of the encapsulant. | 03-05-2015 |
Patent application number | Description | Published |
20090026598 | Wafer Level Packaging Integrated Hydrogen Getter - A wafer-level package that employs one or more integrated hydrogen getters within the wafer-level package on a substrate wafer or a cover wafer. The hydrogen getters are provided between and among the integrated circuits on the substrate wafer or the cover wafer, and are deposited during the integrated circuit fabrication process. In one non-limiting embodiment, the substrate wafer is a group III-V semiconductor material, and the hydrogen getter includes a titanium layer, a nickel layer, and a palladium layer. | 01-29-2009 |
20090026627 | Support Structures for On-Wafer Testing of Wafer-Level Packages and Multiple Wafer Stacked Structures - A semiconductor structure, such as a wafer-level package or a vertically stacked structure. The wafer-level package includes a substrate wafer on which an integrated circuit is formed. A cover wafer is bonded to the substrate wafer to provide a cavity between the substrate wafer and the cover wafer in which the integrated circuit is hermetically sealed. Vias are formed through the substrate wafer and make electrical contact with signal and ground traces formed on the substrate wafer within the cavity, where the traces are electrically coupled to the integrated circuit. Probe pads are formed on the substrate wafer outside of the cavity and are in electrical contact with the vias. A support post is provided directly beneath the probe pad so that when pressure is applied to the probe pad from the probe for testing purposes, the support post prevents the substrate wafer from flexing and being damaged. | 01-29-2009 |
20090029526 | Method of Exposing Circuit Lateral Interconnect Contacts by Wafer Saw - A method for fabricating wafer-level packages including lateral interconnects. The method includes precutting a cover wafer at the locations where the cover wafer will be completely cut through to separate the wafer-level packages. The cover wafer is bonded to the substrate wafer using bonding rings so as to seal the integrated circuit within a cavity between the cover wafer and the substrate wafer, where the precuts face the substrate wafer. The cover wafer is then cut at the precut locations to remove the unwanted portions of the cover wafer between the packages and expose contacts or probe pads for the lateral interconnects. The substrate wafer is then cut between the wafer-level packages to separate the packages. | 01-29-2009 |
20090029554 | Method of Batch Integration of Low Dielectric Substrates with MMICs - A method for mounting a dielectric substrate to a semiconductor substrate, such as mounting a dielectric antenna substrate to an MMIC semiconductor substrate. The method includes providing a thin dielectric antenna substrate having metallized layers on opposing sides. In one embodiment, carrier wafers are used to handle and maintain the dielectric substrate in a flat configuration as the metallized layers are patterned. The dielectric substrate is sealed to the semiconductor substrate using a low temperature bonding process. In an alternate embodiment, the metallized layers on the dielectric substrate are patterned simultaneously so as to prevent the substrate from curling. | 01-29-2009 |
20110050371 | Monolithically integrated active electronic circuit and waveguide structure for terahertz frequencies - An electronic system. The electronic system includes a waveguide structure having a first waveguide-coupling point and a second waveguide-coupling point and an active electronic circuit having a first circuit-coupling point and a second circuit-coupling point. The second waveguide-coupling point is coupled to the first circuit-coupling point; the system is capable of receiving an input signal at the first waveguide-coupling point and transmitting an output signal at the second circuit-coupling point and/or receiving the input signal at the second circuit-coupling point and transmitting the output signal at the first waveguide-coupling point; the input signal and the output signal have frequencies in a terahertz frequency range; and the system is fabricated as a monolithic integrated structure having the waveguide structure fabricated by micromachining and the circuit fabricated monolithically. | 03-03-2011 |