Satoshi Matsui
Satoshi Matsui, Kanagawa JP
Patent application number | Description | Published |
---|---|---|
20080197491 | SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME - The semiconductor device includes a silicon interposer made of a semiconductor and a first semiconductor chip mounted on one surface of the silicon interposer. The semiconductor device is provided with a through electrode penetrating the silicon interposer and having a side surface insulated from the silicon interposer; and a wiring connecting one end of the through electrode and the silicon interposer. The through electrode is connected to a power supply wiring or a GND wiring provided on the first semiconductor chip. | 08-21-2008 |
20090075478 | SEMICONDUCTOR DEVICE,HAVING A THROUGH ELECTRODE, SEMICONDUCTOR MODULE EMPLOYING THEREOF AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING A THROUGH ELECTRODE - The layout density of the through electrodes in the horizontal plane of the substrate is enhanced. Through holes | 03-19-2009 |
20090302430 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - In this semiconductor device, the through-hole is formed in the substrate, and is located under the conductive pattern. The insulating layer is located at the bottom surface of the through-hole. The conductive pattern is located on one surface side of the substrate. The opening pattern is formed in the insulating layer which is located between the through-hole and the conductive pattern, where the distance r | 12-10-2009 |
20100144091 | Semiconductor device and method of manufacturing the same - A method of manufacturing a semiconductor device includes forming an interconnect member, mounting a first semiconductor chip having a semiconductor substrate in a face-down manner on the interconnect member, forming a resin layer on the interconnect member to cover a side surface of the first semiconductor chip, thinning the first semiconductor chip and the resin layer, forming an inorganic insulating layer on a back surface of the first semiconductor chip so as to be in contact with the back surface and to extend over the resin layer, and forming a through electrode so as to penetrate the inorganic insulating layer and the semiconductor substrate. | 06-10-2010 |
20100258918 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE EMPLOYING THEREOF - A semiconductor device is provided with a silicon substrate and a structure filled in a through hole that has a rectangular cross section and extends through the silicon substrate. The structure comprises a pipe-shaped through electrode, stripe-shaped through electrodes, silicons, a first insulating film, a second insulating film and a third insulating film. The pipe-shaped through electrode is utilized as a pipe-shaped electric conductor that extends through the silicon substrate. In addition, the stripe-shaped through electrodes are provided in the interior of the pipe-shaped through electrode so that the stripe-shaped through electrodes extend through the silicon substrate and is spaced away from the pipe-shaped through electrode. A plurality of through electrodes are provided in substantially parallel within the inner region of the pipe-shaped through electrode. | 10-14-2010 |
20110210426 | SEMICONDUCTOR DEVICE PROVIDING A FIRST ELECTRICAL CONDUCTOR AND A SECOND ELECTRICAL CONDUCTOR IN ONE THROUGH HOLE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device | 09-01-2011 |
20120025371 | SEMICONDUCTOR DEVICE - A semiconductor device includes a semiconductor chip, wiring formed thereon, a first insulating film formed on the wiring, provided with a first opening, a pad electrode formed so as to be in contact with the wiring, a second insulating film formed on the pad electrode film, provided with a second opening, and a flip chip bump formed so as to be in contact with the pad electrode film. In this case, the second insulating film exists between the flip chip bump and the pad electrode film, in a region directly underneath the outer edge of the flip chip bump, as seen in a plan view, and the outer edge of the flip chip bump is formed in a region inside the outer edge of the pad electrode film. | 02-02-2012 |
20120100715 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING THROUGH ELECTRODE - The present invention provides a semiconductor device including at least one of an insulating layer and a semiconductor layer each including a hole formed therein, and a through electrode provided in the hole. In the semiconductor device, the side wall of the hole is constituted of a first region from the opening of the hole to a predetermined position between the opening of the hole and the bottom surface of the hole, and a second region from the predetermined position to the bottom surface of the hole. The through electrode includes a seed layer and a plating layer. The seed layer covers the second region and the bottom surface of the hole without covering the first region. In addition, the plating layer covers the seed layer and at least a part of the first region. | 04-26-2012 |
20120248602 | SEMICONDUCTOR DEVICE - In this semiconductor device, the through-hole is formed in the substrate, and is located under the conductive pattern. The insulating layer is located at the bottom surface of the through-hole. The conductive pattern is located on one surface side of the substrate. The opening pattern is formed in the insulating layer which is located between the through-hole and the conductive pattern, where the distance r | 10-04-2012 |
Satoshi Matsui, Hitachinaka-Shi JP
Patent application number | Description | Published |
---|---|---|
20100109586 | Controller for Rotating Electrical Machines - A controller for rotating electrical machines comprises a processing unit, to which a plurality of parameters are input, for generating a switching instruction to control a switching operation of a switching semiconductor device and outputting a signal corresponding to the switching instruction to a power converter. The processing unit includes at least a function to input thereto signals having been output from each of sensors such as a current sensor to detect current passed between the power converter and a winding of an armature, a temperature sensor to detect temperature of the winding of the armature, and a magnetic pole position sensor to detect magnetic pole position of a magnetic field system, and, based upon information on current, temperature, and rotation speed of the rotating electrical machines, having been obtained from those sensor signals, detects a magnetic flux that interlinks with the winding of the armature from a permanent magnet. | 05-06-2010 |
Satoshi Matsui, Okazaki-Shi JP
Patent application number | Description | Published |
---|---|---|
20090159038 | ACCESSORY MOUNTING STRUCTURE - A horizontal groove extending horizontally when an alternator bracket is fixed to a cylinder block of a vehicle engine is formed in the alternator bracket. A shank of a bolt inserted through mounting pieces of an alternator is inserted into the horizontal groove from a horizontally lateral direction toward the cylinder block to support the bolt on a lower surface of the horizontal groove. After insertion, the bolt is restrained from moving toward an opening of the horizontal groove. Since the insertion of the bolt into the horizontal groove is facilitated, and the weight of the alternator is borne by the lower surface of the horizontal groove, a burden on a fixing portion is reduced, and it becomes easy to position the alternator and hold it when it is fixed. Thus, the accessory can be mounted on the cylinder block with satisfactory work efficiency and with support accuracy kept high. | 06-25-2009 |
Satoshi Matsui, Kawasaki JP
Patent application number | Description | Published |
---|---|---|
20080296779 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - Aimed at providing a semiconductor device improved in reliability of bonding and yield of products, even when semiconductor chips having through electrodes are used, the semiconductor device of the present invention has a substrate; a stack placed on the substrate, and composed of a plurality of semiconductor chips (first semiconductor chip and second semiconductor chip), each having through electrodes, stacked while placing bumps connected to the through electrodes in between; and a reinforcing chip (semiconductor chip) provided on the stack specifically on the surface thereof opposite to the substrate-side surface, or between the substrate and the stack, wherein thickness of the reinforcing chip is larger than the thickest semiconductor chip out of the plurality of semiconductor chips. | 12-04-2008 |
Satoshi Matsui, Kawasaki-Shi JP
Patent application number | Description | Published |
---|---|---|
20080222436 | POWER SUPPLY VOLTAGE REGULATOR CIRCUIT AND MICROCOMPUTER - A power supply voltage regulator circuit including a power supply circuit which switches to a first through a fourth state; the first state being the state wherein voltage is supplied to neither a normal circuit nor a backup system circuit based on the combination of logic for the normal circuit power control signal, the second state being the state wherein a primary power supply voltage is supplied to the normal circuit and a secondary power supply voltage is supplied to the backup system circuit, the third state being the state wherein voltage is not supplied to the normal circuit and the secondary power supply voltage is supplied to the backup system circuit, the fourth state being the state wherein the primary power supply voltage is supplied to both the normal circuit and the backup system circuit. | 09-11-2008 |
Satoshi Matsui, Tokyo JP
Patent application number | Description | Published |
---|---|---|
20130029964 | [5, 6] HETEROCYCLIC COMPOUND - An object of the present invention is to provide a novel low molecular weight compound exhibiting an osteogenesis-promoting action. This object is achieved by a compound having the general formula (I) or a pharmacologically acceptable salt thereof. In the general formula (I), R | 01-31-2013 |
20130152896 | RECOIL STARTER MECHANISM - One embodiment provides a recoil starter mechanism, including: a starter case having a rotation shaft; a rope reel rotatably mounted on the rotation shaft; a coil spring wound on the rotation shaft, one end thereof being formed into a tip projecting portion; a hold plate holding the coil spring to the rotation shaft; and a ratchet which is formed into a ring-like shape and interposed between the rope reel and the hold plate. The ratchet includes: a fulcrum around which the ratchet is swingable with respect to the rope reel; a guide groove in which the tip projecting portion is engaged; and an engagement pawl which is to be engaged with an engagement portion of a pulley to thereby start an engine. The guide groove and the engagement pawl are disposed at opposite sides so as to interpose the rotation shaft therebetween. | 06-20-2013 |