Patent application number | Description | Published |
20120233564 | Information Processing Apparatus - A mode setting unit sets either a first mode or a second mode. When the first mode is set, the item information acquiring unit acquires item acquisition information stored in an external server via a communication unit. On the other hand, when the second mode is set, the item information acquiring unit acquires the item acquisition information from a storage. A display processing unit displays on a display unit an item acquisition status using the item acquisition information acquired by the item information acquiring unit. | 09-13-2012 |
20150209676 | Information Processing Apparatus - When a communication unit receives a connection request from a device, a selection screen generating unit provides a selection screen for selecting a registered user. A login user storage unit separately stores information identifying a primary user who logged in first and information identifying one or more secondary users who logged in second or thereafter. Specifically, the login user storage unit stores the information identifying the primary user in association with information indicating initial login. An application startup unit starts an application upon receipt of a start instruction from the device used by the primary user but does not start the application when given the start instruction from the device used by the secondary user. | 07-30-2015 |
20150254396 | INFORMATION PROCESSING APPARATUS - A communication section receives a connection request from a game controller to connect the game controller with an information processing apparatus. A registered user information holding section holds biometric information of a user registered in the information processing apparatus. A biometric authentication portion compares biometric information of a user included in a taken image with biometric information held in the registered user information holding section to determine whether the imaged user is a user registered in the information processing apparatus. After the imaged user is found to be a user registered in the information processing apparatus, a login controller executes login processing of the user, or to be more specific, stores information for identifying a device included in the taken image and information for identifying the user into a login user storage portion by relating these items of information with each other. | 09-10-2015 |
20150294098 | INFORMATION PROCESSING DEVICE - An information processing device includes: an input receiving section receiving an input; a display control section changing a display screen to a first screen when the input receiving section has not received any input for a predetermined time; a registered user information retaining section retaining biological information of a plurality of users registered in the information processing device; a biological information obtaining portion obtaining biological information; and a biometric authenticating portion determining whether a user whose biological information is obtained by the biological information obtaining portion is a registered user by comparing the obtained biological information with the biological information of the plurality of users retained in the registered user information retaining section. When the biometric authenticating portion determines that the user whose biological information is obtained is a registered user, the display control section changes the first screen to a second screen. | 10-15-2015 |
20150363188 | Information Processing Device and Information Processing System - An information processing device includes: a notification processing unit notifying a user that a terminal device is in a state of being able to update software; a confirmation receiving part receiving a confirmation that an update is to be performed from the user; and a transmitting section transmitting an execution instruction to update the software. | 12-17-2015 |
20160082355 | INFORMATION PROCESSING APPARATUS - An acquisition processing section acquires information data addressed to a user and a notification processing section gives notification of the acquired information addressed to the user. When a plurality of users have logged in concurrently, the notification processing section gives notification of user identification information identifying the addressee of the information, along with the information. On the other hand, when only one user has logged in, the notification processing section gives notification of the information but does not give notification of the user identification information. A login managing unit manages login users. The notification processing section determines whether or not to give notification of the user identification information depending on whether one user or a plurality of users are managed by the login managing unit. | 03-24-2016 |
Patent application number | Description | Published |
20100095258 | Wiring layout method of integrated circuit and computer-readable medium storing a program executed by a computer to execute the same - A wiring layout method includes designing a layout of a power wiring for an integrated circuit; designing a layout of plural signal wirings for the integrated circuit; comparing the signal frequency; classifying the signal wirings; calculating an evaluation value of a temperature rise; and modifying the layouts of the integrated circuit. | 04-15-2010 |
20100333052 | Method of manufacturing semiconductor device, semiconductor inspection apparatus, and program - A reliability reference storage unit stores reference data for dividing semiconductor devices into equal to or more than three reliability ranks on the basis of the magnitude of an overlay error between a first interconnect layer and a second interconnect layer disposed over the first interconnect layer. An error storage unit stores overlay errors measured at multiple points within the surface of a semiconductor wafer. An error calculation unit calculates the overlay errors for a plurality of semiconductor chips on the basis of the coordinates of the plurality of semiconductor chips within the surface of the semiconductor wafer and the overlay errors stored in the error storage unit. A reliability information providing unit provides reliability information indicating reliability ranks to the plurality of semiconductor chips on the basis of the overlay errors for the plurality of semiconductor chips and reference data. | 12-30-2010 |
20120181615 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - A distance between a contact and a gate electrode can be measured efficiently. Conversion data indicating a correlation between the distance between the first gate electrode and the first contact and a magnitude of a leakage current amount is prepared in advance. The leakage current amount between the first gate electrode and the first contact is measured, and the measured leakage current amount is converted into the distance between the first gate electrode and the first contact by using the conversion data. Then, a superposition error between an exposure process for forming the first gate electrode and an exposure process for forming the first contact can be measured from a difference between the measured value of the distance between the first gate electrode and the first contact and a design value of the distance. | 07-19-2012 |
20120181694 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - The semiconductor device includes an interlayer insulating film, a wiring provided in the interlayer insulating film, and a SiN film provided over the interlayer insulating film and over the wiring. The peak positions of Si—N bonds of the SiN film, which are measured by FTIR, are within the range of 845 cm | 07-19-2012 |
20130221520 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor chip SC includes an electrode pad PAD. A Cu pillar PIL is formed on the electrode pad PAD. In addition, an interconnect substrate INT includes a connection terminal TER. The connection terminal TER contains Cu. For example, the connection terminal TER is formed of Cu, and is formed, for example, in a land shape. However, the connection terminal TER may not be formed in a land shape. The Cu pillar PIL and the connection terminal TER are connected to each other through a solder layer SOL. The solder layer SOL contains Sn. A Ni layer NIL is formed on either the Cu pillar PIL or the connection terminal TER. The minimum value L of the thickness of the solder layer SOL is equal to or less than 20 μm. | 08-29-2013 |
20150228586 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME - A semiconductor device includes an interlayer insulating film INS | 08-13-2015 |
Patent application number | Description | Published |
20090295971 | SOLID-STATE IMAGING DEVICE, IMAGING DEVICE AND DRIVING METHOD OF SOLID-STATE IMAGING DEVICE - A solid-state imaging device includes a pixel array section having unit pixels arranged two-dimensionally in a matrix form. Each of the unit pixels includes a charge generation section configured to generate a signal charge, charge transfer sections configured to transfer the signal charge generated by the charge generation section, and a signal output section configured to generate and output a target signal commensurate with the charge of the signal generated by the charge generation section. The plurality of charge transfer sections are provided for each of the charge generation sections. The plurality of charge transfer sections are connected, on the side opposite to the charge generation section, to the signal output sections in different rows. | 12-03-2009 |
20100134667 | Solid-state image pickup device, method for driving solid-state image pickup device, and image pickup apparatus - A solid-state image pickup device includes a pixel array section including an effective pixel region, an optical black pixel region, and a pixel region between the effective pixel region and the optical black pixel region; a vertical drive section which performs driving so that signals of pixels of the pixel region disposed at a side of the effective pixel region in a vertical direction are skipped and signals of pixels of the effective pixel region and the optical black pixel region are read; and a horizontal drive section which performs driving so that, from among the pixels selected by the vertical drive section, the signals of the pixels of the pixel region disposed at a side of the effective pixel region in a horizontal direction are skipped and the signals of the pixels of the effective pixel region and the optical black pixel region are read. | 06-03-2010 |
20110161904 | METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT, AND COMPUTER READABLE MEDIUM - A design method of a semiconductor integrated circuit sets an area having apices of opposing corners of a position of a start point logic cell and a position of an end point logic cell to a repeater search area, adds free area information to the repeater search area, sets a drive boundary in the repeater search area based on a drive ability of the start point logic cell, searches a repeater candidate that can be arranged in an area of the drive boundary based on the free area information, calculates a delay time from the start point logic cell to the end point logic cell based on delay time information and a coordinate of the repeater candidate that is searched, and determines a repeater arranged between the start point logic cell and the end point logic cell from the repeater candidate based on the delay time that is calculated. | 06-30-2011 |
20130021511 | SOLID-STATE IMAGE PICKUP DEVICE, METHOD FOR DRIVING SOLID-STATE IMAGE PICKUP DEVICE, AND IMAGE PICKUP APPARATUS - A solid-state image pickup device includes a pixel array section including an effective pixel region, an optical black pixel region, and a pixel region between the effective pixel region and the optical black pixel region; a vertical drive section which performs driving so that signals of pixels of the pixel region disposed at a side of the effective pixel region in a vertical direction are skipped and signals of pixels of the effective pixel region and the optical black pixel region are read; and a horizontal drive section which performs driving so that, from among the pixels selected by the vertical drive section, the signals of the pixels of the pixel region disposed at a side of the effective pixel region in a horizontal direction are skipped and the signals of the pixels of the effective pixel region and the optical black pixel region are read. | 01-24-2013 |
Patent application number | Description | Published |
20100045763 | EXPOSURE DEVICE, LIGHT-EMITTING DEVICE, IMAGE FORMING APPARATUS AND FAILURE DIAGNOSING METHOD - The exposure device includes: a light output device outputting light for exposing a charged image carrier, and including light-emitting elements caused to emit light or not through a control using a light-emission signal, switch elements provided corresponding to the light-emitting elements, and sequentially turned on to set the light-emitting elements ready to emit light, a transfer-signal generating unit generating a transfer signal for sequentially turning on the switch elements, a light-emission signal supply unit supplying the light-emission signal to the light-emitting elements, and a detection unit causing the transfer-signal generating unit to generate a transfer signal having cycles whose number is larger than that of the light-emitting elements, and detecting a potential of an output region of the light-emission signal supply unit while making an output from the light-emission signal supply unit high impedance; and an optical member focusing light outputted by the light output device onto the image carrier. | 02-25-2010 |
20100060704 | LIGHT-EMITTING DEVICE, EXPOSURE DEVICE, IMAGE FORMING APPARATUS AND LIGHT-EMISSION CONTROL METHOD - The light-emitting device includes: a light-emitting element array that has plural light-emitting elements arrayed in a line at intervals corresponding to a first resolution; a supply unit that supplies a light-emission signal corresponding to a second resolution, the second resolution being 1/m of the first resolution, where m is an integer not less than 2; a setting unit that divides the plural light-emitting elements into plural sets each including m continuous light-emitting elements in the light-emitting element array, and that sets whether to cause the m continuous light-emitting elements, which are included in each of the plural sets, to emit light on a single set basis by using the light-emission signal supplied from the supply unit; and a correcting unit that corrects the division of the plural light-emitting elements in the light-emitting element array performed by the setting unit, on a single light-emitting element basis. | 03-11-2010 |
20120194629 | LIGHT EMITTING ELEMENT HEAD, LIGHT EMITTING ELEMENT ARRAY CHIP, AND IMAGE FORMING APPARATUS - A light emitting element head includes a first light emitting element array, a second light emitting element array, and an optical device. The first light emitting element array includes a plurality of light emitting elements arranged in a main scan direction. The second light emitting element array includes a plurality of light emitting elements arranged in the main scan direction. The optical device focuses a light output from the first light emitting element array and the second light emitting element array on a photoreceptor to form an electrostatic latent image on the photoreceptor. The first light emitting element array and the second light emitting element array are overlapped each other in a sub scan direction in an overlapping section. Interval between the light emitting elements of the first light emitting element array are different from interval between the light emitting elements of the second light emitting element array. | 08-02-2012 |
20150103128 | LIGHT SCANNING DEVICE AND IMAGE FORMING APPARATUS - A light scanning device includes a scanning unit and a power consumption unit. The scanning unit faces a scan surface and performs scanning by dividing one scan area into segments by having multiple light-emitting-element groups arranged in a predetermined scanning direction. Each light-emitting-element group writes an image onto the scan surface by causing multiple light-emitting elements arranged in the scanning direction to emit light in a time-division manner based on image information. The power consumption unit operates during a non-writing period occurring between scanning processes repeatedly executed in each light-emitting-element group, so as to cause consumption of electric power corresponding to electric power consumed for light emission in the light-emitting-element group. | 04-16-2015 |
Patent application number | Description | Published |
20120008025 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS - A solid-state imaging device includes an image sensor chip and a signal processing chip, which are electrically connected. A low thermal conductivity region is positioned between the image sensor chip and the signal processing chip. The low thermal conductivity region is configured to insulate the image sensor chip from heat, which may be generated by the signal processing chip. | 01-12-2012 |
20130010145 | SOLID-STATE IMAGE SENSING APPARATUS AND ELECTRONIC APPARATUS - A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers. | 01-10-2013 |
20140218573 | SOLID-STATE IMAGE SENSING APPARATUS AND ELECTRONIC APPARATUS - A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers. | 08-07-2014 |
20150123234 | SOLID-STATE IMAGE SENSING APPARATUS AND ELECTRONIC APPARATUS - A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers. | 05-07-2015 |
Patent application number | Description | Published |
20090252485 | OPTICAL DEVICE, ILLUMINATION APPARATUS, AND CAMERA - An optical device includes a housing having first to fourth sidewalls and top and bottom plates; and (M−1) partitions between the first and second sidewalls, and has M lens chambers, each filled with first and second liquids forming a liquid lens. A first lens chamber is defined by the first, third, and fourth sidewalls, first partition, and top and bottom plates. The top plate, first sidewall, and first partition respectively have first to third electrodes. An (m+1)-th lens chamber is defined by an m-th partition, third sidewall, (m+1)-th partition, fourth sidewall, and top and bottom plates, m being 1, 2, . . . , or M−2. The top plate, m-th partition, and (m+1)-th partition respectively have first to third electrodes. An M-th lens chamber is defined by an (M−1)-th partition, second to fourth sidewalls, and top and bottom plates. The top plate, (M−1)-th partition, and second sidewall respectively have first to third electrodes. | 10-08-2009 |
20100254021 | LIQUID LENS DEVICE AND MANUFACTURING METHOD THEREFOR - A manufacturing method for a liquid lens device includes the steps of: preparing a body having a liquid chamber, a conductive first liquid stored in the liquid chamber, an insulating second liquid stored in the liquid chamber, and a hollow electrode pipe for making the communication between the inside and the outside of the liquid chamber, the liquid chamber being defined by a first transparent substrate on which an electrode layer is formed, a second transparent substrate opposed to the first transparent substrate, and an annular sealing member interposed between the first transparent substrate and the second transparent substrate; applying pressure to the first and second transparent substrates to thereby compress the sealing member and discharge the first liquid from the second end of the hollow electrode pipe; and closing the second end of the hollow electrode pipe. | 10-07-2010 |
20100277923 | LIQUID LENS ELEMENT AND ILLUMINATION APPARATUS - Disclosed is a liquid lens element. The liquid lens element includes a main body, a lens surface, and a first reflection surface. The main body has a light incident surface and a light exiting surface and includes a liquid chamber formed therein. The lens surface changes orientation of light that exits the light exiting surface by being electrically deformed, and the lens surface is formed of an interface between two liquids that are contained in the liquid chamber and have different refractive indexes. The first reflection surface reflects part of light that enters the light incident surface toward an optical axis of the lens surface, and the first reflection surface is provided to the main body. | 11-04-2010 |
20110051425 | VARIABLE ILLUMINATION APPARATUS - A variable illumination apparatus includes: a first substrate; a second substrate opposed to the first substrate with a predetermined gap therebetween; a surrounding wall that is disposed between the first and second substrates, has a first opening and a second opening opposed to each other, and has an inner side surface that is tapered toward the second opening from the first opening; a partition wall to partition a liquid chamber formed by the first substrate, the second substrate, and the surrounding wall into regions, the partition wall being vertical to the first substrate and the second substrate; a liquid lens having a lens surface that is formed at an interface between two liquids and is electrically deformable, the two liquids being accommodated in each of the regions and each having a different refractive index; and a light source to irradiate light to the liquid lens from the first opening side. | 03-03-2011 |
20110096071 | STEREOSCOPIC IMAGE DISPLAY DEVICE AND DRIVING METHOD OF THE SAME - An image display device includes an image display section and a lenticular lens including a plurality of lenses arranged in a linear array. Each lens is defined by a plurality of adjacent variable lenses having a common optical axis. The image display device also includes a controller that controls optical characteristics in a plurality of the variable lenses such that the common optical axis for at least one of the lenses is moved in a given direction. | 04-28-2011 |
Patent application number | Description | Published |
20090025205 | Method and apparatus for manufacturing a head gimbal assembly - Embodiments of the present invention help to decrease the amount of inactive gas necessary for reflow to interconnect connection terminals of a head slider and a suspension. In an embodiment of the present invention, inactive gas is blown from a nozzle of a reflow apparatus toward interconnection joints of a head slider and a suspension. The head slider is bonded onto a gimbal tongue. The nozzle comprises a duct through which the inactive gas passes and a porous member fitted in an ejection outlet of the tube. Placing the porous member close to the head slider achieves effective reduction of oxygen concentration around solder balls. | 01-29-2009 |
20090039505 | Thermally insulating bonding pad structure for solder reflow connection - A thermally insulating bonding pad for solder reflow is described. The bonding pad includes a structure. The structure forms the bonding pad. The bonding pad further includes an insulator formed on the structure. The insulator is configured to be interposed between the structure and a substrate of a component onto which said bonding pad is to be disposed. The bonding pad provides thermal insulation for said substrate when said bonding pad is subject to a solder reflow process being performed thereon. | 02-12-2009 |
20100089981 | APPARATUS FOR INTERCONNECTING CONNECTION PADS OF A HEAD-GIMBAL ASSEMBLY AND MANUFACTURING METHOD FOR THE HEAD-GIMBAL ASSEMBLY - An apparatus for interconnecting two connection pads in a head-gimbal assembly. The apparatus includes a conveyer for conveying a metallic slug, and a nozzle for ejecting the metallic slug toward the two connection pads. The nozzle includes a receiving portion for receiving the metallic slug from the conveyer, and a straight guide disposed downstream of the receiving portion. The straight guide has a maximum inner diameter that is smaller than a minimum inner diameter of the receiving portion. The apparatus also includes a laser for applying a laser beam from an inlet side of the nozzle to the metallic slug as the metallic slug passes along a path that includes a first portion through said straight guide and a second portion between the straight guide and the two connection pads. The laser is configured to melt the metallic slug for attaching the metallic slug to the two connection pads. | 04-15-2010 |
20100154989 | METHOD AND APPARATUS FOR MANUFACTURING A HEAD-GIMBAL ASSEMBLY - A method for manufacturing a head-gimbal assembly. The head-gimbal assembly includes a head-slider bonded to a suspension. The method includes placing the head-slider and the suspension in a superposed manner with a photo-thermosetting adhesive applied between the head-slider and the suspension. The method also includes heating the suspension from a side of the suspension opposite to a side of the suspension in contact with the photo-thermosetting adhesive with a heated gas-stream. In addition, the method includes irradiating the photo-thermosetting adhesive with light at least partly in a time period during which the suspension is heated by the gas-stream. | 06-24-2010 |
20110075301 | HEAD-GIMBAL ASSEMBLY, MICROACTUATOR, AND MANUFACTURING METHOD OF THE MICROACTUATOR - A head-gimbal assembly. The head-gimbal assembly includes a suspension, a microactuator disposed on the suspension, and a head-slider bonded to the microactuator. The head-gimbal assembly further includes a connection pad disposed on the suspension, a connection pad disposed on the microactuator and formed over an edge between a side surface and a top surface of the microactuator to have a bend portion with an obtuse angle, and a metallic interconnection joint for interconnecting the connection pad of the suspension with the connection pad of the microactuator. | 03-31-2011 |
20110132879 | CONNECTING ELECTRICAL PARTS - A method for connecting electrical parts The method includes retaining a piece of metal within a nozzle, supplying inert gas to the nozzle, and irradiating the retained piece of metal with a light source while the supplied inert gas flows from apertures in the nozzle. The metal is melted by the light source. The method also includes ejecting the melted metal from the nozzle by the supplied inert gas onto electrical parts. | 06-09-2011 |
20110149440 | HEAD GIMBAL ASSEMBLY AND DISK DRIVE WITH A PIEZOELECTRIC ELEMENT - A head gimbal assembly having a stage fixed to a head-slider. A piezoelectric element which comprises; an upper surface, a first side surface, a second side surface, a lower surface, a first electrode, a second electrode, and a gap between the first and second electrodes on the lower surface, the piezoelectric element moving the stage by extension or contraction thereof according to a voltage applied to the first and second electrodes. A transmission wiring part which has a connection pad for the piezoelectric element. A cross-connector for physically and electrically cross-connecting the first electrode and the connection pad. An adhesive fixing part which is formed from an insulating adhesive and adhesively fixes the lower surface of the piezoelectric element to the transmission wiring part, between an end of the second electrode at the gap and the cross-connector. | 06-23-2011 |
20130063839 | HEAD-GIMBAL ASSEMBLY WITH A SUSPENSION-LEAD PAD HAVING A FORM THAT IS CONFIGURED TO INHIBIT FORMATION OF AN INTER-PAD SOLDER BRIDGE - A head-gimbal assembly (HGA) with a suspension-lead pad having a form that is configured to inhibit formation of an inter-pad solder bridge. The HGA includes a gimbal, a head-slider and a plurality of suspension-lead pads. The head-slider is coupled with the gimbal, and includes a plurality of head-slider pads. The plurality of suspension-lead pads is coupled with the plurality of head-slider pads by a plurality of solder bonds. A suspension-lead pad comprises a first lateral side, a second lateral side, a proximal side, disposed in proximity to a respective head-slider pad, and a distal side. A first width of the suspension-lead pad closer to the proximal side is substantially larger than a second width of the suspension-lead pad further from the proximal side than the first width. A disk drive including the HGA, and a head-slider with a head-slider pad having similar form to the suspension-lead pad are also provided. | 03-14-2013 |
20130256281 | SOLDER-JET NOZZLE, LASER-SOLDERING TOOL, AND METHOD, FOR LASERSOLDERING HEAD-CONNECTION PADS OF A HEAD-STACK ASSEMBLY FOR A HARD-DISK DRIVE - A solder-jet nozzle for laser-soldering head-connection pads of a head-stack assembly (HSA) for a hard-disk drive (HDD). The solder-jet nozzle includes a body, a central duct, and an outer surface of the body. The body includes a tip configured to deliver a solder ball in proximity to head-connection pads of a head-gimbal assembly (HGA) of the HSA. The central duct is configured to convey the solder ball to the tip. The outer surface of the body includes a first portion, and at least a first flat. The first portion substantially coincides with a conical surface of a cone with axis disposed about along the central axis of the body. The first flat, which is parallel to the central axis, is contiguous with the first portion, and intersects the conical surface of the cone. A laser-soldering tool and a method, for laser-soldering head-connection pads of the HSA are also provided. | 10-03-2013 |
Patent application number | Description | Published |
20080225070 | Image forming apparatus - In an image forming apparatus, a control unit determines that dirt is present on the linear scale when a detecting unit detects a change in a moving direction of a moving member while the moving member is moving at a constant speed. | 09-18-2008 |
20100194795 | IMAGE FORMING APPARATUS, IMAGE FORMING SYSTEM AND COMPUTER-READABLE STORAGE MEDIUM - An image forming apparatus includes a voltage applying unit to apply a voltage to and charge a surface of transport belt, a leak judging unit to judge a charge leak on the surface of the transport belt, and a recovery operation unit to perform a charge leak recovery operation in which the transport belt is driven in a state where the voltage applying unit applies no voltage to the transport belt, if the leak judging unit judges that the charge leak is generated on the surface of the transport belt. The leak judging unit again judges whether the charge leak is generated on the surface of the transport belt after the recovery operation unit performs the charge leak recovery operation. | 08-05-2010 |
20110063344 | IMAGE FORMING APPARATUS AND RECORDING MEDIUM - An image forming apparatus includes a head to eject liquid droplets, a sub-tank having a container to store an amount of liquid supplied to the head, a negative pressure generator unit generating a negative pressure and an air introducing mechanism to introduce air, a main-tank to supply the amount of liquid into the sub-tank, a pressure detector unit to detect a pressure inside the sub-tank, and a controller to control an image forming operation using a remaining amount of liquid in the sub-tank while the main-tank is at an end status, where the controller determines whether the pressure inside the sub-tank is within a normal range, causes, if the detected pressure is not within the normal range, the air introducing mechanism to introduce air to raise the pressure inside the sub-tank, and causes the head to eject non-image forming liquid to cause the pressure to fall within the normal range. | 03-17-2011 |
20110148955 | IMAGE FORMING DEVICE, PUMP CONTROL METHOD, AND RECORDING MEDIUM - An image forming device includes a pump which supplies a recording fluid contained in a first container to a second container via a tube, and a control unit configured to perform rotation of a roller disposed in the pump to press the tube and feed the recording fluid in the tube. When a negative pressure in the second container is not formed by performing a first backward rotation of the roller by a predetermined amount, the control unit performs a forward rotation of the roller and performs a second backward rotation of the roller after an end of the forward rotation. | 06-23-2011 |
20120303679 | IMAGE FORMING APPARATUS AND INFORMATION PROCESSING APPARATUS - In an image forming apparatus, an operation result output part outputs a result of operation of a component. An operation result information creation part creates operation result information by giving information identification character information, which is determined by the component or the result of operation of the component, to the result of operation of the component. An identifier table stores the information identification character information and a unique identifier related to each other and the result of operation of the component and a unique identifier related to each other. An operation result information conversion part reads the identifier related to the information identification character information from the identifier table and converts the operation result information into after conversion operation result information in which at least the information identification character information is replaced by the identifier. An operation result information storage part stores the after conversion operation result information. | 11-29-2012 |
Patent application number | Description | Published |
20090092189 | MOVEMENT PREDICTION METHOD AND MOVEMENT PREDICTION APPARATUS - Disclosed herein is a movement-prediction/compensation method for carrying out processing based on search layers to search for a movement vector by selecting one or more reference frame images for each of movement-compensated blocks obtained as a result of dividing a processed frame image existing among successive frame images. The method includes: a layer creation step; a first movement-prediction/compensation step; a reference frame image determination step; and a second movement-prediction/compensation step. | 04-09-2009 |
20100272181 | IMAGE PROCESSING METHOD AND IMAGE INFORMATION CODING APPARATUS USING THE SAME - Disclosed herein is an image information coding method for performing a motion vector search based on hierarchical search in an image compression information device adapted to output image compression information, the image information coding method including the steps of, compressing a plurality of frame images at a predetermined compression ratio to generate a plurality of reduced screens of lower hierarchical levels, searching for a first motion vector using the plurality of reduced screens, switching between search areas in a memory in which the frame images are stored, and searching for a second motion vector using the first motion vector in the switched search area. | 10-28-2010 |
20130058416 | IMAGE PROCESSING APPARATUS AND METHOD - An image processing apparatus and an image processing method capable of further improving coding efficiency while suppressing an increase in a load. For example, in a case a macro block with a size of 16×16 pixels or less used in AVC is a coding process target, a motion search and compensation unit performs a motion search using an image with the original size which is not reduced. In addition, for example, in a case where an extended macro block with a size larger than 16×16 pixels is a coding process target, the motion search and compensation unit performs a motion search using a reduced image. | 03-07-2013 |
20150381980 | IMAGE PROCESSING DEVICE, IMAGE PROCESSING METHOD, AND PROGRAM - An image processing system, method and device for processing an image signal. The image processing system, method and device receive an operating mode signal indicative of a determined operating mode associated with resource efficiency, and control a depth of block division for a block setting process based on the determined operating mode indicated by the operating mode signal. | 12-31-2015 |
Patent application number | Description | Published |
20110014168 | LACTIC ACID BACTERIA HAVING ACTION OF LOWERING BLOOD URIC ACID LEVEL - Various types of lactic acid bacteria were cultured in the presence of a purine, the amount of the purine consumed and the amount of purine degradation products produced were measured, and several lactic acid bacteria showing remarkable purine-decomposing ability were selected. Lactic acid bacteria that were assessed to have high purine-decomposing ability according to the above-mentioned selection were orally administered to rats reared on purine-containing feed, the general status and serum uric acid level of the rats were measured, and the effect of lactic acid bacteria administration on serum uric acid levels was examined. As a result, lactic acid bacteria that significantly suppress the increase of serum uric acid levels, | 01-20-2011 |
20120308539 | LACTIC ACID BACTERIA HAVING ACTION OF LOWERING BLOOD URIC ACID LEVEL - Various types of lactic acid bacteria were cultured in the presence of a purine, the amount of the purine consumed and the amount of purine degradation products produced were measured, and several lactic acid bacteria showing remarkable purine-decomposing ability were selected. Lactic acid bacteria that were assessed to have high purine-decomposing ability according to the above-mentioned selection were orally administered to rats reared on purine-containing feed, the general status and serum uric acid level of the rats were measured, and the effect of lactic acid bacteria administration on serum uric acid levels was examined. As a result, lactic acid bacteria that significantly suppress the increase of serum uric acid levels, | 12-06-2012 |
Patent application number | Description | Published |
20080230804 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD OF SAME - A semiconductor device having an electrode with reduced electrical contact resistance even where either electrons or holes are majority carriers is disclosed. This device has an n-type diffusion layer and a p-type diffusion layer in a top surface of a semiconductor substrate. The device also has first and second metal wires patterned to overlie the n-type and p-type diffusion layers, respectively, with a dielectric layer interposed therebetween, a first contact electrode for electrical connection between the n-type diffusion layer and the first metal wire, and a second contact electrode for connection between the p-type diffusion layer and the second metal wire. The first contact electrode's portion in contact with the n-type diffusion layer and the second contact electrode's portion contacted with the p-type diffusion layer are each formed of a first conductor that contains a metal and a second conductor containing a rare earth metal. | 09-25-2008 |
20090008726 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device reducing interface resistance of n-type and p-type MISFETs are provided. According to the method, a gate dielectric film and a gate electrode of the n-type MISFET are formed on a first semiconductor region, a gate dielectric film and a gate electrode of the p-type MISFET are formed on a second semiconductor region, an n-type diffusion layer is formed by ion implantation of As into the first semiconductor region, a first silicide layer is formed by first heat treatment after a first metal containing Ni is deposited on the n-type diffusion layer, the first silicide layer is made thicker by second heat treatment after a second metal containing Ni is deposited on the first silicide layer and second semiconductor region, and third heat treatment is provided after formation of a second silicide layer and ion implantation of B or Mg into the second silicide layer. | 01-08-2009 |
20090134388 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD OF SAME - A semiconductor device having a metal insulator semiconductor field effect transistor (MISFET) with interface resistance-reduced source/drain electrodes is disclosed. This device includes a p-type MISFET formed on a semiconductor substrate. The p-MISFET has a channel region in the substrate, a gate insulating film on the channel region, a gate electrode on the gate insulating film, and a pair of laterally spaced-apart source and drain electrodes on both sides of the channel region. These source/drain electrodes are each formed of a nickel (Ni)-containing silicide layer. The p-MISFET further includes an interface layer which is formed on the substrate side of an interface between the substrate and each source/drain electrode. This interface layer contains magnesium (Mg), calcium (Ca) or barium (Ba) therein. A fabrication method of the semiconductor device is also disclosed. | 05-28-2009 |
20090152652 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND THE SEMICONDUCTOR DEVICE - Described herein is a method of manufacturing a semiconductor device realizing higher performance by reducing contact resistance of an electrode. In the method, a gate insulating film, a gate electrode are formed on a semiconductor substrate. A first metal is deposited substrate, and a metal semiconductor compound layer is formed on the surface of the semiconductor substrate by making the first metal and the semiconductor substrate react each other by a first heat treatment. Ions having a mass equal to or larger than atomic weight of Si are implanted into the metal semiconductor compound layer. A second metal is deposited on the metal semiconductor compound layer. An interface layer is formed by making the second metal segregated at an interface between the metal semiconductor compound layer and the semiconductor substrate by diffusing the second metal through the metal semiconductor compound layer by a second heat treatment. | 06-18-2009 |
20130062622 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device according to the present embodiment includes a semiconductor substrate having a first n-type silicon carbide layer and a second n-type silicon carbide layer, a first p-type impurity region formed in the n-type silicon carbide layer, a first n-type impurity region of 4H—SiC structure formed in the n-type silicon carbide layer, a second n-type impurity region of 3C—SiC structure formed in the n-type silicon carbide layer having a depth shallower than the first n-type impurity region, a gate insulating film, a gate electrode formed on the gate insulating film, and a metallic silicide layer formed above the first n-type impurity region and having a bottom portion and a side surface portion such that the second n-type impurity region is sandwiched between the first n-type impurity region and at least the side surface portion. | 03-14-2013 |
20130062623 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - Disclosed is a semiconductor device including: a first electrode formed of a conductive material; a p-type first silicon carbide (SiC) semiconductor section and an n-type second SiC semiconductor section | 03-14-2013 |
20130062624 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device according to an embodiment includes a silicon carbide, a metal silicide formed on the silicon carbide and including a first layer and a second layer having a carbon ratio lower than that of the first layer, and a metallic electrode formed on the metal silicide, wherein the second layer is formed on the first layer, and the second layer is in contact with the metallic electrode, and an average grain diameter of a metal silicide in the second layer is larger than an average grain diameter of a metal silicide in the first layer. | 03-14-2013 |
20130234159 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device of an embodiment includes: a substrate formed of a single-crystal first semiconductor; a gate insulating film on the substrate; a gate electrode including a layered structure of a semiconductor layer formed of a polycrystalline second semiconductor and a metal semiconductor compound layer formed of a first metal semiconductor compound that is a reaction product of a metal and the second semiconductor; and electrodes formed of a second metal semiconductor compound that is a reaction product of the metal and the first semiconductor, and formed on the substrate with the gate electrode interposed therebetween, and an aggregation temperature of the first metal semiconductor compound on the polycrystalline second semiconductor is lower than an aggregation temperature of the second metal semiconductor compound on the single-crystal first semiconductor, and a cluster-state high carbon concentration region is included in an interface between the semiconductor layer and the metal semiconductor compound layer. | 09-12-2013 |
20140042462 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device according to the present embodiment includes a semiconductor substrate having a first n-type silicon carbide layer and a second n-type silicon carbide layer, a first p-type impurity region formed in the n-type silicon carbide layer, a first n-type impurity region of 4H—SiC structure formed in the n-type silicon carbide layer, a second n-type impurity region of 3C—SiC structure formed in the n-type silicon carbide layer having a depth shallower than the first n-type impurity region, a gate insulating film, a gate electrode formed on the gate insulating film, and a metallic silicide layer formed above the first n-type impurity region and having a bottom portion and a side surface portion such that the second n-type impurity region is sandwiched between the first n-type impurity region and at least the side surface portion. | 02-13-2014 |
20140134817 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device according to an embodiment includes a silicon carbide, a metal silicide formed on the silicon carbide and including a first layer and a second layer having a carbon ratio lower than that of the first layer, and a metallic electrode formed on the metal silicide, wherein the second layer is formed on the first layer, and the second layer is in contact with the metallic electrode, and an average grain diameter of a metal silicide in the second layer is larger than an average grain diameter of a metal silicide in the first layer. | 05-15-2014 |
Patent application number | Description | Published |
20080266126 | Battery Residual Quantity Display Method and Electronic Equipment - The present invention is directed to a battery residual quantity display method for performing display of battery residual quantity of a battery pack mounted at an electronic equipment and serving to supply power to the electronic equipment. When power is turned ON, a first microcomputer ( | 10-30-2008 |
20090280396 | BATTERY RESIDUAL QUANTITY DISPLAY METHOD AND ELECTRONIC EQUIPMENT - A battery pack detachably connectable to an equipment body to supply power to the equipment body, the battery pack including a battery cell, a microcomputer for communicating with the equipment body, a connection terminal connected to the microcomputer, a positive power supply input terminal connected to a cathode of the battery cell; and a negative power supply input terminal connected to an anode of the battery cell. After the power of the equipment body is turned on, the microcomputer alternately sends to the equipment body by serial communication via the connection terminal information to be used in authentication processing executed by the equipment body and information to be used in a battery residual quantity count executed by the equipment body. After the authentication processing is complete, the microcomputer sends to the equipment body information to be used in updating the battery residual quantity count executed by the equipment body. | 11-12-2009 |
20120150465 | ELECTRONIC DEVICE, BATTERY PACK, AND METHOD OF COMPUTING BATTERY PACK CAPACITY - An electronic device includes a battery capacity computing unit configured to compute the current full-charge capacity of a currently inserted battery apparatus having secondary cells. The battery capacity computing unit acquires at least information on the full-charge capacity of the battery apparatus in a brand-new state and information on the battery charge/discharge cycle count from the battery apparatus, retains a correction coefficient used when computing the current full-charge capacity of the battery apparatus, and calculates the current full-charge capacity of the battery apparatus using the information on the full-charge capacity of the battery apparatus in a brand-new state, the information on the battery charge/discharge cycle count, and the correction coefficient. | 06-14-2012 |