Syunichi
Syunichi Miyagishi, Wako-Shi JP
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20090024350 | Tilt-angle detecting method and apparatus for a motorcycle - A vehicular tilt-angle detecting apparatus includes a steering-angle sensor, a vehicle speed sensor, a lateral-G sensor, a turning-radius calculation unit, a base tilt-angle calculation unit, a transient tilt-angle calculation unit, and a transient tilt angle calculation unit. The turning-radius calculation unit determines a turning radius corresponding to a steering angle based on a predetermined relationship between a steering angle and a turning radius. The base tilt-angle calculation unit calculates a current instantaneous tilt angle of a vehicle body during short-term steady-state turning based on the turning radius and the vehicle speed. The transient tilt-angle calculation unit corrects the initial calculated tilt angle of the vehicle body based on a transient turning radius when a variation of the steering angle is equal to or greater than a predetermined value. When the variation is less than the predetermined value, the transient tilt-angle calculation unit calculates the lateral-G corrected transient tilt angle. | 01-22-2009 |
Syunichi Mori, Tokyo JP
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20080263889 | Hand Drying Apparatus - In a hand drying apparatus, an infrared light absorber absorbs infrared light, when a hand is not present, emitted from an infrared light emitter provided on an inner surface of a drying space. | 10-30-2008 |
Syunichi Ogasawara, Gunma-Gun JP
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20100101726 | PROCESS CONTROL METHOD IN SPIN ETCHING AND SPIN ETCHING APPARATUS - The present invention provides a process control method in spin etching capable of realizing uniformity in etching amount in etching treatment for even wafers each having various conditions, and achieving uniformity of thickness values among etched wafers. In the present invention, weight of a wafer before etching is measured in units of 1/1000 g, followed by predetermined etching treatment in a spin etching section. Thereafter, weight of the wafer is again measured in units of 1/1000 g after rinsing and drying treatment of the wafer, and then an actual etching amount is calculated from a difference between weight before and after etching of the wafer, confirming an etching rate each time etching to thereby control an etching time. | 04-29-2010 |
Syunichi Ogasawara, Gunma JP
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20080242101 | Process Control Method in Spin Etching and Spin Etching Apparatus - The present invention provides a process control method in spin etching capable of realizing uniformity in etching amount in etching treatment for even wafers each having various conditions, and achieving uniformity of thickness values among etched wafers. In the present invention, weight of a wafer before etching is measured in units of 1/1000 g, followed by predetermined etching treatment in a spin etching section. Thereafter, weight of the wafer is again measured in units of 1/1000 g after rinsing and drying treatment of the wafer, and then an actual etching amount is calculated from a difference between weight before and after etching of the wafer, confirming an etching rate each time etching to thereby control an etching time. | 10-02-2008 |
20090032188 | SINGLE-WAFER PROCESSOR - The present invention provides a single wafer processor structured such that similar immersion treatment to the conventional immersion treatment can be performed in the spin treatment, that a consumption of the chemical solutions can be reduced in the chemical solution treatment per wafer, that energy saving can be realized by using reaction heat of the chemical solutions to eliminate a necessity of a heating heater, that a problem of deterioration of the chemical solutions can be eliminated since the blending of the chemical solutions is implemented on the rotary disk part and the chemical solutions are used immediately thereafter, and that the maximum effective point of the chemical solutions can be utilized. The processor of the present invention includes: a rotary disk ( | 02-05-2009 |
20090032498 | Spin Processing Method And Apparatus - There are provided a spin processing method and a spin processing apparatus with which the improvement of a processing speed in spin processing can be compatible with the saving of a processing solution. The spin processing method comprises holding and fixing the wafer on the upper surface of the spin table, and supplying the processing solution to the surface of the wafer by the predetermined amount while rotating the spin table, to process the surface of the wafer, wherein the processing solution is supplied while the wafer is heated and maintained at the predetermined temperature, to process the wafer. The predetermined temperature for heating the wafer is equal to or higher than 25° C. | 02-05-2009 |
Syunichi Ono, Shizuoka JP
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20100103240 | MULTIBEAM LASER CONTROL DEVICE FOR IMAGE FORMING APPARATUS - An image data is pre-processed in parallel by a pre-processing unit (A) and a pre-processing unit (B) arranged in parallel. The image data is transferred in synchronization with an image processing signal obtained by ORing a BD signal and an interpolation signal. Laser scanning for plural beams of a multi-laser beam is performed in synchronization with the BD signal. Color matching processing or zeronization processing for the multi-laser beam is performed in synchronization with the image processing signal. | 04-29-2010 |
Syunichi Ono, Hiratsuka-Shi JP
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20090314374 | MARINE HOSE - An object of the present invention is to provide a marine hose of which a limit mechanism does not work unnecessarily at the time of being wound up to a reel. | 12-24-2009 |