Hsun-Fa
Hsun-Fa Li, Nan-Tou Hsien TW
Patent application number | Description | Published |
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20090057374 | HOT-BAR SOLDERING TOOL HEAD - A hot-bar head is adapted for soldering at least two flexible flat cables to a substrate. The hot-bar head includes a head body having a connecting portion that extends in a longitudinal direction, and at least two soldering portions, each of which extends from the connecting portion and has a blade edge adapted for contacting one of the flexible flat cables. Adjacent ones of the soldering portions are spaced apart from each other in the longitudinal direction. | 03-05-2009 |
Hsun-Fa Li, Tsao-Tun Chen TW
Patent application number | Description | Published |
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20090022928 | Method and mask assembly for forming solder bodies on a substrate - A method for forming solder bodies on a substrate includes: positioning a first mask plate, which is formed with at least one first through-hole, on the substrate; filling the first through-hole with a first solder paste so as to form a first solder body on the substrate; positioning a second mask plate, which is formed with at least one second through-hole and at least one recess spaced apart from the second through-hole, on the substrate in such a manner that the first solder body is received in the recess; and filling the second through-hole with a second solder paste so as to form a second solder body on the substrate. | 01-22-2009 |
Hsun-Fa Li, Nantou County TW
Patent application number | Description | Published |
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20130062111 | STACKED SUBSTRATE MODULE - A stacked substrate module includes a first and a second substrate. The first substrate has several pads which extend respectively from a stacked area of the first substrate to the outside of the stacked area. The second substrate has several welding areas arranged on the outer lateral side thereof; each welding area extends respectively from the outer lateral side of the second substrate to an upper and a lower surface of the second substrate. The second substrate is stacked in the stacked area of the first substrate, wherein the lateral side of the second substrate is aligned to the edge of the stacked area of the first substrate. The aforementioned pads correspond to the welding areas respectively. It is suitable to position a solder paste between the pads and the welding areas which can be reflowed to connect the pads and the welding areas. | 03-14-2013 |