Patent application number | Description | Published |
20090021732 | LIGHT DISTRIBUTION MEASUREMENT SYSTEM - Optical test apparatuses and methods, and related subject matter, are disclosed herein. | 01-22-2009 |
20090085049 | Phosphor down converting element for an LED package and fabrication method - There is provided a phosphor down converting element based on fluoropolymer resin and a method for fabricating the same. There is further provided a method for using said phosphor down converting element to generate white light from a radiation source. The method for fabricating phosphor down converting element includes preparing an appropriate phosphor powder mixture that is capable of absorbing a first band of wavelengths and emitting a second band of wavelengths being greater in length than the first bands, incorporating the phosphor powder mixture into or on a phosphor carrier element comprising a fluoropolymer material, and molding the phosphor down converting elements into useful shapes. Fluoropolymers are the most chemically inert of all plastics, can withstand both extremely high and low temperatures, and show a resistance to weavering and UV degradation, making fluoropolymers optimal for use as a phosphor carrier. | 04-02-2009 |
20090141474 | LED-BASED CHANGEABLE COLOR LIGHT LAMP - Systems and methods are described that facilitate providing a user with interchangeable phosphor-coated shells, or envelopes, for generate different shades and intensities of white light from a single UV light source. The interchangeability of the low-cost phosphor-coated envelopes permits the use of a single light engine, which is the more expensive component of a solid state lamp. In this manner, consumers are provided with a greater number of lighting choices at low cost than can be achieved using conventional single-envelope lamps. | 06-04-2009 |
20090147513 | BACKLIGHTING LED POWER DEVICES - A generally planar illumination, display, or backlighting device is disclosed, including a generally planar arrangement of side emitting light emitting diode (LED) devices generating side emitted illumination, and a generally planar arrangement of wavelength conversion elements arranged coplanar with the generally planar arrangement of side emitting light emitting diode (LED) devices. The wavelength conversion elements are interspersed amongst the side emitting LED devices and configured to wavelength convert the side emitted illumination generated by the side emitting LED devices. A display device using such a generally planar illumination device is also disclosed, in which a liquid crystal display (LCD) panel is backlit by the generally planar illumination device. | 06-11-2009 |
20090155958 | ROBUST DIE BONDING PROCESS FOR LED DIES - Systems and methods are provided to mitigate excess die attachment material accrual, and parasitic conductive paths formed thereby. A die attachment material (e.g., solder) is melted using a combination of localized heat sources and ultrasonic energy. The heat sources bring the die attachment material close to its melting point, which reduces an amount of bonding force associated with purely ultrasonic bonding techniques. An ultrasonic transducer brings the die attachment material the rest of the way up to its melting point, which reduces the overall temperature that the die and/or sensitive components thereon endure during the bonding process. | 06-18-2009 |
20090167151 | Lighting device having illumination, backlighting and display applications - Provided are a lighting device, a backlighting device, and a display device that comprise a radiation source such as LED and wavelength converting members comprising phosphors. In one embodiment, self-absorption within the devices is suppressed or reduced by placing a selective reflector between two wavelength converting members, and the wavelength converting member emitting light with longer peak wavelength is substantially isolated from the irradiation of another wavelength converting member emitting light with shorter peak wavelength. In other embodiments, the wavelength converting members are arranged in strip configuration; or in adjacent hexagons configuration. | 07-02-2009 |
20090212317 | CIRCUIT BOARD FOR DIRECT FLIP CHIP ATTACHMENT - A packaging method comprises: forming a circuit board by forming a substantially continuous conductive layer on an insulating board and removing selected portions of the continuous conductive layer to define an electrically conductive trace; laser cutting the electrically conductive trace to define sub-traces electrically isolated from each other by a laser-cut gap formed by the laser cutting; and bonding a light emitting diode (LED) chip to the circuit board across or adjacent to the laser-cut gap, the bonding including operatively electrically connecting an electrode of the LED chip to one of the sub-traces without using an interposed submount. A semiconductor package comprises an LED chip flip-chip bonded to sub-traces of an electrically conductive trace of a circuit board, the sub-traces being electrically isolated from each other by a narrow gap of less than or about 100 microns. | 08-27-2009 |
20110080740 | LED LAMP WITH UNIFORM OMNIDIRECTIONAL LIGHT INTENSITY OUTPUT - A light emitting apparatus comprises: an LED-based light source; a spherical, spheroidal, or toroidal diffuser generating a Lambertian light intensity distribution output at any point on the diffuser surface responsive to illumination inside the diffuser; and a base including a base connector. The LED based light source, the diffuser, and the base are secured together as a unitary LED lamp installable in a lighting socket by connecting the base connector with the lighting socket. The diffuser is shaped and arranged respective to the LED based light source in the unitary LED lamp to conform with an isolux surface of the LED based light source. The base is operatively connected with the LED based light source in the unitary LED lamp to electrically power the LED based light source using electrical power received at the base connector. | 04-07-2011 |
20120025216 | PHOSPHOR SUSPENDED IN SILICONE, MOLDED/FORMED AND USED IN A REMOTE PHOSPHOR CONFIGURATION - A light emitting package comprising a support hosting at least one light emitting diode. A light transmissive dome comprised of a silicone including a phosphor material positioned to receive light emitted by the diode. A glass cap overlies said dome | 02-02-2012 |
20120176770 | LED-BASED LIGHT BULB - A light source ( | 07-12-2012 |
20120176804 | LED-BASED LIGHT BULB - A light source ( | 07-12-2012 |
20120182711 | OMNIDIRECTIONAL LED BASED SOLID STATE LAMP - A lighting apparatus includes a bilaterally symmetrical light engine comprising first and second light emitting diode (LED) devices or planar LED device arrays facing opposite directions, and an envelope including phosphor spaced apart from and surrounding the bilaterally symmetrical light engine. The phosphor is effective to convert light emitted by the light engine to emission light. The bilaterally symmetrical light engine may be configured to emit light having a bilaterally symmetrical intensity distribution that is uniform except at emission angles within 10° of the symmetry plane of the bilaterally symmetrical light engine. Each of the first and second LED devices or planar LED device arrays may comprise at least one hemispherically emitting LED device including an LED chip and an encapsulant encapsulating the LED chip and shaped to refract light emitted by the LED chip into a uniform distribution over a hemispherical solid angle. | 07-19-2012 |
20120230012 | LED-BASED LIGHT BULB - A light source ( | 09-13-2012 |
20140184062 | SYSTEMS AND METHODS FOR A LIGHT EMITTING DIODE CHIP - Provided is a light emitting diode (LED) chip. The LED chip includes a substrate and a mesa structure formed from a heterostructure grown on the substrate. The mesa structure includes an LED mesa portion and a photo diode (PD) mesa portion. A channel separates the LED mesa portion from the PD mesa portion. | 07-03-2014 |
20140268638 | LED LAMP WITH UNIFORM OMNIDIRECTIONAL LIGHT INTENSITY OUTPUT - A light emitting apparatus comprises: an LED-based light source; a spherical, spheroidal, or toroidal diffuser generating a Lambertian light intensity distribution output at any point on the diffuser surface responsive to illumination inside the diffuser; and a base including a base connector. The LED based light source, the diffuser, and the base are secured together as a unitary LED lamp installable in a lighting socket by connecting the base connector with the lighting socket. The diffuser is shaped and arranged respective to the LED based light source in the unitary LED lamp to conform with an isolux surface of the LED based light source. The base is operatively connected with the LED based light source in the unitary LED lamp to electrically power the LED based light source using electrical power received at the base connector. | 09-18-2014 |