Patent application number | Description | Published |
20090021329 | CHIP-LEVEL THROUGH HOLE STRUCTURE OF ELECTRONIC PACKAGE - A through-hole structure for a wafer level packaging includes a wafer, a RF passage penetrating through the wafer, and a through-hole structure disposed around the RF passage. The through-hole structure has three types of structure. The through hole structure includes a plurality of holes filled with metal material thereinside. On the other hand, the through hole structure can be a plurality of holes coated with a metal layer on the internal surface thereof. Alternatively, the through hole structure has both of the two above hole structure. Depending on the structure, the through hole structure performs an electric reference for preventing the RF signal from decay or interference. | 01-22-2009 |
20090039479 | MODULE FOR INTEGRATING PERIPHERAL CIRCUIT AND A MANUFACTURING METHOD THEREOF - A module for integrating peripheral circuit includes a silicon chip substrate, at least one peripheral circuit unit, and at least one main circuit unit. The peripheral circuit unit is integrated in the silicon chip substrate via a semiconductor manufacturing process. The main circuit unit is mounted on the surface of the silicon chip substrate and is electrically connected with the peripheral circuit unit for transmitting the signal. Thereby, the dimension of the module is reduced. | 02-12-2009 |
20090051044 | Wafer-level packaged structure and method for making the same - A wafer-level packaging method is shown below: providing an un-cut wafer having a front side and a back side. A plurality of cutting lines is formed on the front side of the wafer so as to define the positions of each chip module such as a wireless module. The next step is providing an extendible film attached onto the back side of the wafer. Next is dicing the wafer along the cutting line to separate each chip module and expending the extendible film so that a gap is formed between each chip module. At last, filling a packaging compound onto the front side and the lateral side of the chip module produces a packaged structure. As mentioned above, the structure is employed for protecting the external surface of the chip. | 02-26-2009 |
20090051461 | OUTPUT POWER DETECTING SYSTEM WITH A DIRECTIONAL COUPLER - A output power detecting system with a directional coupler has a directional coupler at the output terminal of the output power detecting system. The directional coupler includes a main line, a first sub line, and a second sub line. The output of the power amplifying unit is fully coupled to a power detecting unit via the coupling between the main line and the first sub line, and the external noise is coupled to the ground via the coupling between the first sub line and the second sub line. Therefore, the power detecting unit accurately detects the output power of the output power detecting system. | 02-26-2009 |
20090065905 | Conductive metal structure applied to a module IC and method of manufacturing the same - A conductive metal structure applied to a module IC includes a wafer, a first insulating unit, and a first conductive unit. The wafer has a main body and a through hole passing through the main body. The first insulating unit has a first inner insulating layer formed on an inner surface of the through hole and a first outer insulating layer that is extended from the first inner insulating layer and is formed on a first bottom surface of the main body. The first conductive unit has a first inner conductive layer formed on the first inner insulating layer and at least one first conductive pad formed on the first outer insulating layer. The present invention integrates semiconductor technologies of etching and deposition and combines them with the development of the module IC in order to provide a conductive metal structure that has lower cost and is manufactured easily. | 03-12-2009 |
20090079447 | TESTING SYSTEM FOR A RADIO FREQUENCY MODULE - A testing system for a RF module includes a metal casing formed a testing space therein, a RF testing socket disposed inside the testing module, and a pressing manipulator penetrating through the metal casing. A shielding material layer is disposed on the internal surface of the metal casing so that the RF signal is isolated inside the metal casing. An end of the pressing manipulator extends into the testing space. The pressing manipulator is controlled automatically and provides for a pressure on a RF module disposed on the testing module so as to execute a testing process. As mentioned above, the testing set for a RF module can prevent from RF testing interference and the testing manufacture efficiency is improved. | 03-26-2009 |
20090096517 | Filtering apparatus and method for dual-band sensing circuit - A filtering apparatus and method for dual-band sensing circuit are disclosed. The invention features a dual-band sensing unit disposed in a filtering device that receives the signals from a sub-system with variable frequency spectrum. The signals are split up into several bands. After that, one or more frequency detecting units are used to detect the power of high-band and low-band signals, and convert the power into a voltage signal. Users can externally adjust the gain of a tunable gain amplifier for the voltage signal. Further, a comparison operation is processed by a comparator, and a signal resulted from the comparison operation is used to control the switch timing for an RF switching unit. Consequently, this like adaptive notch filter is achieved to determine the intensity of noise and thereby to turn on the high-band or low-band notch filters, so as to reduce the in-band loss. | 04-16-2009 |
20090111405 | Signal matching module for single or multiple systems - A signal matching module for single or multiple systems is disclosed, thereby enhancing the flexibility in using a communication module, and the performance of each subsystem. Further, a fine-tuning function is introduced into a selective matching circuit for the case that the inner matching components in the communication module cannot reach a required matching. Still further, a multi-stage matching circuit is used to reach a required Q-value (quality factor) for the matching circuit, thereby tuning the bandwidth. One of the preferred embodiments is to provide a unit cell which is used to connect with one or multiple subsystems, and a feeding point disposed outside the matching circuit to generate a better impedance matching and bandwidth. | 04-30-2009 |
20090137217 | Communication transmission system and power detection method thereof - A communication transmission system is applied to an application device and includes a power detection circuit, and a radio frequency module. The power detection circuit is used for detecting the power on the output port of the communication transmission system, and for producing a feedback signal. The radio frequency module is connected to the power detection circuit for receiving the feedback signal so as to adjust its output power. In addition, the power detection circuit is built to be independent of the RF module for directly detecting the power on the output port of the communication transmission system which represents the actual power of the application device, thereby achieving the purpose of outputting a more stable and accurate output power through the RF module. | 05-28-2009 |
20090174463 | Multi-system module having functional substrate - A multi-system module having a functional substrate includes a substrate comprising therein at least one control circuit units, and a plurality of main circuit units provided on one side surface of the substrate. The main circuit units are electrically connected to the control circuit unit, whereby the control circuit unit is used to manage the operation of the main circuit units. Via the above module structure, the substrate can improve the function of controlling multiple systems. | 07-09-2009 |
20090190706 | Substrate module having an embedded phase-locked loop, integerated system using the same, and fabricating method thereof - A substrate module having an embedded phase-locked loop is cooperated with at least one function unit mounted thereon for forming an integrated system. The substrate module includes a base, a multi-layer structure, a built-in circuit unit, and an external circuit unit. The built-in circuit unit is integrated inside the multi-layer structure and the multi-layer structure is formed in the base. The external circuit unit is mounted on the upper surface of the base and is electrically coupled to the built-in circuit unit for jointly forming a phase-locked loop, so as to cooperate with the function unit. | 07-30-2009 |
20090192750 | Parallel testing system with shared golden calibration table and method thereof - A parallel testing system with shared golden calibration table includes: a storage unit, multiple testing platforms, and a server. The storage unit is used for storing the golden calibration table, and the testing platforms are used to test a device under test (DUT) respectively by utilizing the golden calibration table. The server is connected to the storage unit and the testing platforms to send the golden calibration table to the testing platforms, and then, to cumulatively record calibration data produced after the testing platforms respectively test the DUTs, so that the server can further perform a weighted arithmetic operation to the calibration data so as to update the golden calibration table. Thereby, the purpose of accelerating the convergence speed of the golden calibration table can be achieved. | 07-30-2009 |
20090275296 | Communication module with dual systems and method for defining operating mode thereof - A communication module with dual systems for processing a first RF signal and a second RF signal that belong to different communication systems is provided. The communication module includes a first connection port and a signal distribution circuit. The first connection port is coupled to an external circuit, and the signal distribution circuit is coupled to the first connection port and between a first system path and a second system path inside the communication module. Regardless whether the external circuit is composed by an dual-band antenna or two uni-band antenna, the signal distribution circuit controls the first RF signal transmitting along the path between the first connection port and the first system path and controls the second RF signal transmitting along the path between the path between the first connection port and the second system path. | 11-05-2009 |
20090296361 | Integrated circuit module with temperature compensation crystal oscillator - An integrated circuit module with temperature compensation crystal oscillator (TCXO) applying to an electronic device comprises: one substrate having one top surface; one temperature compensation crystal oscillator (TCXO) disposed on the top surface; at least one chip disposed on the top surface; one encapsulating piece formed on the top surface for covering the TCXO and the chip. As above-described structure, TCXO is prevented from exchanging heat due to the temperature difference so that the stability of the TCXO is improved. | 12-03-2009 |
20100009501 | Packaging structure, method for manufacturing the same, and method for using the same - A packaging structure applied for a surface mounting process, comprising: a chip module having a packaging surface; and a pre-cured layer formed on the packaging surface of the chip module. As above-mentioned, the structure is employed for protecting the external surface of the wafer. The pre-cured layer is formed on pre-curing a gluing material and the gluing material is uniformly filled with the space between the connecting protrusions on the packaging surface. The pre-cured later is post-curing in a connecting process for mounting the connecting protrusions to the substrate so that the connecting strength is improved. Moreover, the rate of the packaging process is increasing. | 01-14-2010 |
20100052143 | Electronic packaging structure and a manufacturing method thereof - A packaging structure includes a main substrate having a plurality of circuit lines thereon, and an electronic module having at least one conductive pad at the bottom thereof and having a plurality of conductive lines on the sides thereof. The pad and the conductive circuits are connected electrically to the circuits on the main substrate when the electronic module is disposed on the main substrate. As above-mentioned, one electronic module can be stacked on top of another so that the integrity of the packaging structure is improved. | 03-04-2010 |
20100055840 | Electronic packaging structure and a manufacturing method thereof - A packaging structure includes a main substrate having a plurality of circuit lines thereon, and an electronic module having at least one conductive pad at the bottom thereof and having a plurality of conductive lines on the sides thereof. The pad and the conductive circuits are connected electrically to the circuits on the main substrate when the electronic module is disposed on the main substrate. As above-mentioned, one electronic module can be stacked on top of another so that the integrity of the packaging structure is improved. | 03-04-2010 |
20100123238 | Packaging structure of sip and a manufacturing method thereof - A manufacturing method for a packaging structure of SIP (system in package) includes the following steps. First step is providing a substrate having electronic devices thereon. Second step is covering the electronic devices by a mixture of a molding compound and a conductive polymer precursor so as to form a molding structure, wherein the substrate, the electronic devices and the molding structure forms a collective electronic module. Third step is separating the collective electronic module into a plurality of individual electronic modules. Fourth step is performing a doping step by using a doping element for transforming the conductive polymer precursor in the mixture into a conductive layer near the surface of the molding structure. Therefore, the manufacturing method is optimized for forming a shielding structure of the SIP module. | 05-20-2010 |
20100220450 | PACKAGING STRUCTURE OF SIP AND A MANUFACTURING METHOD THEREOF - A manufacturing method for a packaging structure of SIP (system in package) includes the following steps. First step is providing a substrate having electronic devices thereon. Second step is covering the electronic devices by a mixture of a molding compound and a conductive polymer precursor so as to form a molding structure, wherein the substrate, the electronic devices and the molding structure forms a collective electronic module. Third step is separating the collective electronic module into a plurality of individual electronic modules. Fourth step is performing a doping step by using a doping element for transforming the conductive polymer precursor in the mixture into a conductive layer near the surface of the molding structure. Therefore, the manufacturing method is optimized for forming a shielding structure of the SIP module. | 09-02-2010 |
20120162930 | MODULE IC PACKAGE STRUCTURE WITH ELECTRICAL SHIELD FUNCTION AND METHOD FOR MAKING THE SAME - A module IC package structure with electrical shield function includes a substrate unit, an electronic unit, a conductive unit, a package unit and a shielding unit. The substrate unit includes a circuit substrate having at least one grounding pad. The electronic unit includes a plurality of electronic elements electrically connected to the circuit substrate. The conductive unit includes at least one conductive element disposed on the circuit substrate, and the conductive element has a first end portion electrically connected to the grounding pad. The package unit includes a package resin body disposed on the circuit substrate to cover the electronic elements and one part of the conductive element, and the conductive element has a second end portion is exposed from the package resin body. The shielding unit includes a metal shielding layer formed on the outer surface of the package resin body to electrically contact the second end portion. | 06-28-2012 |