Patent application number | Description | Published |
20100258824 | ELECTRODE STRUCTURE AND LIGHT-EMITTING DEVICE USING THE SAME - An electrode structure includes at least two first electrodes and at least two second electrodes configured to be electrically connected in parallel to a power supply. Each of the first electrodes includes at least one first pad and at least one first extending wire with one end connected to the first pad, and the at least two first electrodes are spaced apart from each other. Each of the second electrodes includes at least one second pad and at least one second extending wire with one end connected to the second pad, and the at least two second electrodes are spaced apart from each other. | 10-14-2010 |
20100258836 | LIGHT-EMITTING DEVICE - A light-emitting device includes a substrate; a stacked structure including a first type semiconductor layer positioned on the substrate, a light-emitting structure positioned on the first type semiconductor layer, and a second type semiconductor layer positioned on the light-emitting structure, wherein the stacked structure includes a depression exposing the first type semiconductor layer; a first electrode positioned on the first type semiconductor layer in the depression, the first electrode including at least one first pad and at least one first extending wire with one end connected to the first pad; a second electrode positioned on the second type semiconductor layer, the second electrode including at least one second pad and at least one second extending wire with one end connected to the second pad; wherein the distance between the first pad and the second pad is greater than 70% of the width of the light-emitting device. | 10-14-2010 |
20130214318 | LIGHT-EMITTING DEVICE - A light-emitting device includes a substrate; a stacked structure including a first type semiconductor layer positioned on the substrate, a light-emitting structure positioned on the first type semiconductor layer, and a second type semiconductor layer positioned on the light-emitting structure, wherein the stacked structure includes a depression exposing the first type semiconductor layer; a first electrode positioned on the first type semiconductor layer in the depression, the first electrode including at least one first pad and at least one first extending wire with one end connected to the first pad; a second electrode positioned on the second type semiconductor layer, the second electrode including at least one second pad and at least one second extending wire with one end connected to the second pad; wherein the distance between the first pad and the second pad is greater than 70% of the width of the light-emitting device. | 08-22-2013 |
Patent application number | Description | Published |
20090309845 | TOUCH WINDOW - A touch window including a first transparent substrate, a second transparent substrate, a first conductive film and a pad is provided. The second transparent substrate is disposed on one side of the first transparent substrate, and the area of the first transparent substrate is larger than that of the second transparent substrate. The first conductive film is disposed on the second transparent substrate and is located between the first transparent substrate and the second transparent substrate. The pad is disposed on the same side of the first transparent substrate as the second transparent substrate being disposed. | 12-17-2009 |
20100001964 | Conductive structure and touch panel using the same - A conductive structure including several first lateral structures, pattern structures and second lateral structures is provided. Both the first lateral structures and the pattern structures are disposed separately and around the edges of a substrate. The pattern structures are located at the inner sides of the first lateral structures. Each pattern structure has a | 01-07-2010 |
20130278068 | VOLTAGE MODE DRIVER WITH CURRENT BOOSTER (VMDCB) - A voltage mode driver circuit able to achieve a larger voltage output swing than its supply voltage. The voltage mode driver circuit is supplemented by a current source or “current booster.” The circuit includes a first inverter, a second inverter, and a current source. The first inverter receives a first input and outputs a signal at a node. The second inverter receives a second input signal and outputs an inverted second input signal at the same node. The current source provides current to the node via a first switch, the first switch receiving an input at a first input where the voltage output swing at the node is larger than a power supply voltage applied to the current source. | 10-24-2013 |
20130307525 | CIRCUIT AND METHOD OF SIGNAL DETECTION - A circuit includes an input stage, a comparison stage, and a calibration stage. The input stage is configured to receive a first input signal, to generate a first reference signal, and to generate a second reference signal. The comparison stage is configured to generate a first comparison output signal in response to the first reference signal and a third reference signal and to generate a second comparison output signal in response to the second reference signal and a fourth reference signal. The calibration stage is configured to generate a detection signal responsive to the presence of the first comparison output signal and the second comparison output signal having a signal frequency within a predetermined frequency band. | 11-21-2013 |
20130328591 | VOLTAGE MODE DRIVER WITH CURRENT BOOSTER (VMDCB) - A voltage mode driver circuit able to achieve a larger voltage output swing than its supply voltage. The voltage mode driver circuit is supplemented by a current source or “current booster.” The circuit includes a first inverter, a second inverter, and a current source. The first inverter receives a first input and outputs a signal at a node. The second inverter receives a second input signal and outputs an inverted second input signal at the same node. The current source provides current to the node via a first switch, the first switch receiving an input at a first input where the voltage output swing at the node is larger than a power supply voltage applied to the current source. The voltage mode driver circuit uses a stable power supply voltage using a power amplifier with feedback. | 12-12-2013 |
20130335135 | CALIBRATION CIRCUIT, INTEGRATED CIRCUIT HAVING CALIBRATION CIRCUIT, AND CALIBRATION METHOD - A calibration circuit for calibrating a device to be calibrated includes a variable current generator, a device under test and a control unit. The variable current generator is coupled to a first node of a reference voltage and configured to generate a variable current responsive to variations of the reference voltage. The device under test is a copy of at least one portion of the device to be calibrated, and coupled to the variable current generator to derive, at a second node, a voltage dependent on the variable current. The control unit is coupled to the second node to receive the derived voltage and configured to compare the derived voltage with the reference voltage and to generate, based on a comparison result, at least one calibration signal for adjusting an adjustable electrical parameter of the device under test and the device to be calibrated. | 12-19-2013 |
20140003551 | SYSTEM AND METHOD FOR CHIP SYSTEM TIMING COMPENSATION | 01-02-2014 |
20140266315 | VOLTAGE THRESHOLD CALIBRATION TECHNIQUES FOR LEVEL DETECTORS - Some embodiments relate to a level detector, comprising a current mirror including first and second current legs to carry first and second signals, respectively. The first current leg includes a first variable resistor and the second current leg includes a second variable resistor. During a calibration mode, a switching element provides a predetermined reference voltage across first and second control terminals of the first and second variable resistors, respectively. During a non-calibration mode, the switching element decouples the predetermined reference voltage from the first and second control terminals, and provides a signal across the first and second control terminals. Other embodiments are also disclosed. | 09-18-2014 |
20150121322 | CIRCUIT DESIGN PORTING BETWEEN PROCESS DESIGN TYPES - Among other things, one or more systems and techniques for porting a circuit design from a first process design type to a second process design type are provided. A circuit design comprises one or more components, such as transistors, that are arranged and sized according to a first process design type, such as a 90 nm processing environment. The circuit design is partitioned into one or more topology categories such as a current mirror topology category or a differential pair topology category. Ordered sets of parameters are determined for respective topology categories. The components within the circuit design are resized based upon the one or more topology categories to generate a ported circuit design specified for the second process design type, such as a 50 nm processing environment. | 04-30-2015 |
20150236690 | HIGH-SWING VOLTAGE MODE DRIVER - A high-swing voltage mode driver is provided that is operably coupled to a Serializer/Deserializer (SerDes) chip. The high-swing voltage mode driver can operate at a speed of 16 gigabits per second. The high-swing voltage mode driver comprises a thirteenth transistor that is configured to stabilize a voltage at a fifth node, where an output signal that is a negative differential signal exists. The high-swing voltage mode driver comprises a sixteenth transistor that is configured to stabilize a voltage at a sixth node, where an output signal that is a positive differential signal exists. | 08-20-2015 |
20160036417 | CALIBRATION CIRCUIT, INTEGRATED CIRCUIT HAVING CALIBRATION CIRCUIT, AND CALIBRATION METHOD - A calibration circuit for calibrating a device to be calibrated includes a variable current generator, a circuit component, and a control unit. The variable current generator generates a variable current responsive to variations of a supply voltage relative to a predetermined voltage level. The circuit component is a copy of at least one portion of the device to be calibrated and is coupled between the variable current generator and the supply voltage. The control unit is coupled to the variable current generator and the circuit component, and generates, based on a voltage dependent on the variable current and the circuit component, at least one calibration signal for adjusting an adjustable electrical parameter of the circuit component and the device to be calibrated. | 02-04-2016 |
Patent application number | Description | Published |
20090020740 | RESISTIVE MEMORY STRUCTURE WITH BUFFER LAYER - A memory device comprises first and second electrodes with a memory element and a buffer layer located between and electrically coupled to them. The memory element comprises one or more metal oxygen compounds. The buffer layer comprises at least one of an oxide and a nitride. Another memory device comprises first and second electrodes with a memory element and a buffer layer, having a thickness of less than 50 Å, located between and electrically coupled to them. The memory comprises one or more metal oxygen compounds. An example of a method of fabricating a memory device includes forming first and second electrodes. A memory, located between and electrically coupled to the first and the second electrodes, is formed; the memory comprises one or more metal oxygen compounds and the buffer layer comprises at least one of an oxide and a nitride. | 01-22-2009 |
20090154222 | OPERATION METHOD FOR MULTI-LEVEL SWITCHING OF METAL-OXIDE BASED RRAM - Memory devices and methods for operating such devices are described herein. A method as described herein for operating a memory device includes applying a sequence of bias arrangements across a selected metal-oxide memory element to change the resistance state from a first resistance state in a plurality of resistance states to a second resistance state in the plurality of resistance states. The sequence of bias arrangements comprise a first set of one or more pulses to change the resistance state of the selected metal-oxide memory element from the first resistance state to a third resistance state, and a second set of one or more pulses to change the resistance state of the selected metal-oxide memory element from the third resistance state to the second resistance state. | 06-18-2009 |
20100148142 | ALUMINUM COPPER OXIDE BASED MEMORY DEVICES AND METHODS FOR MANUFACTURE - Memory devices are described along with methods for manufacturing. A memory device as described herein includes a first electrode and a second electrode. The memory device further includes a diode and an anti-fuse metal-oxide memory element comprising aluminum oxide and copper oxide. The diode and the metal-oxide memory element are arranged in electrical series between the first electrode and the second electrode. | 06-17-2010 |
20100276658 | Resistive Memory Structure with Buffer Layer - A memory device comprises first and second electrodes with a memory element and a buffer layer located between and electrically coupled to them. The memory element comprises one or more metal oxygen compounds. The buffer layer comprises at least one of an oxide and a nitride. Another memory device comprises first and second electrodes with a memory element and a buffer layer, having a thickness of less than 50 Å, located between and electrically coupled to them. The memory comprises one or more metal oxygen compounds. An example of a method of fabricating a memory device includes forming first and second electrodes. A memory, located between and electrically coupled to the first and the second electrodes, is formed; the memory comprises one or more metal oxygen compounds and the buffer layer comprises at least one of an oxide and a nitride. | 11-04-2010 |
20110175050 | Metal Oxide Resistance Based Semiconductor Memory Device With High Work Function Electrode - Various aspect are directed to a memory device or memory cell with a metal-oxide memory element arranged in electrical series along a current path between at least a first electrode, a metal-oxide memory element adjacent to the first electrode, and a second electrode. The first electrode comprises an electrode material having a first work function. The metal-oxide memory element comprises a metal-oxide material having a second work function. The first work function is greater than the second work function. Thermionic emission characterizes the current through this memory. | 07-21-2011 |
20110189819 | Resistive Memory Structure with Buffer Layer - A memory device comprises first and second electrodes with a memory element and a buffer layer located between and electrically coupled to them. The memory element comprises one or more metal oxygen compounds. The buffer layer comprises at least one of an oxide and a nitride. Another memory device comprises first and second electrodes with a memory element and a buffer layer, having a thickness of less than 50 Å, located between and electrically coupled to them. The memory comprises one or more metal oxygen compounds. An example of a method of fabricating a memory device includes forming first and second electrodes. A memory, located between and electrically coupled to the first and the second electrodes, is formed; the memory comprises one or more metal oxygen compounds and the buffer layer comprises at least one of an oxide and a nitride. | 08-04-2011 |
20110317471 | Nonvolatile stacked nand memory - A memory cell is arranged to enhance the electrical field of the memory element. The memory cell has a metal-oxide memory element, a nonconductive element, and a conductive element. The metal-oxide memory element is in a current path between a first electrode at a first voltage and a second electrode at a second voltage. The nonconductive element is adjacent to the metal-oxide memory element. | 12-29-2011 |
20120188813 | VERIFICATION ALGORITHM FOR METAL-OXIDE RESISTIVE MEMORY - Memory devices and methods for operating such devices are described which can effectively program the metal-oxide memory elements in an array, while also avoiding applying unnecessarily high voltage pulses. Programming operations described herein include applying a lower voltage pulse across a metal-oxide memory element to establish a desired resistance state, and only applying a higher voltage pulse when the lower voltage pulse is insufficient to program the memory element. In doing so, issues associated with applying unnecessarily high voltages across the memory element can be avoided. | 07-26-2012 |
20130153846 | THREE DIMENSIONAL MEMORY ARRAY ADJACENT TO TRENCH SIDEWALLS - A self-aligning stacked memory cell array structure and method for fabricating such structure. The memory cell array includes a stack of memory cells disposed adjacent to opposing sides of a conductive line that is formed within a trench. The memory cells are stacked such that the memory element surface of each memory cell forms a portion of the sidewall of the conductive line. The conductive line is formed within the trench such that electrical contact is made across the entire memory element surface of each memory cell. Such structure and method for making such structure is a self-aligning process that does not require the use of any additional masks. | 06-20-2013 |
20150214479 | MULTIPLE PHASE CHANGE MATERIALS IN AN INTEGRATED CIRCUIT FOR SYSTEM ON A CHIP APPLICATION - A device includes first and second pluralities of memory cells with memory elements and first and second capping materials on the first and second pluralities of memory cells. First and second capping materials can comprise lower and higher density silicon nitrides. The memory elements can include a programmable resistance memory material, and the capping materials can contact the memory elements. The first and second pluralities of memory cells can have a common cell structure. The first memory cells in the can comprise a top and bottom electrodes with a memory material therebetween and the first capping material contacting the memory material. Control circuits can apply different write algorithms to the first and second pluralities of memory cells. The first and second sets of memory cells can have different operational memory characteristics by forming the first and second capping layers using different capping materials but with the same cell structure. | 07-30-2015 |
Patent application number | Description | Published |
20090176048 | AgSb recording thin film for the inorganic write-once optical disc and the manufacturing method - A recording material of Ag1-xSbx (x=10.8˜25.5 at. %) films for WORM optical disk recording media is invented. The thermal analysis shows that the phase change temperature of AgSb film is between 250 and 270□. The optical property analysis shows that all the as deposited films have good optical absorption and high reflectivity. The X-ray Diffraction analysis shows that the as deposited film and the annealed film are kept at ∈′-AgSb crystalline phase. The TEM analysis shows that the grain size of the Ag80.9Sb19.1 film will grow after annealing. The dynamic test shows that the carrier-to-noise ratio (CNR) of the Ag80.9Sb19.1 optical disc is about 45 dB with λ=657 nm, NA=0.65 and a linear velocity of 3.5 m/s. These Ag | 07-09-2009 |
20110140722 | OBJECT-SENSING DEVICE - Proposed is an object-sensing device including: a carrier base; at least one first conductive element disposed on a carrying surface of the carrier base; a cover capable of resting seamlessly on the carrying surface and provided therein with a receiving space; a resilient element received in the receiving space; at least one second conductive element disposed on a surface of the resilient element, wherein the surface of the resilient element faces the carrying surface, the at least one second conductive element corresponding in position to the at least one first conductive element; and a sensor electrically connected to the first conductive element and an end of the at least one second conductive element and configured to detect electrical contact between each of the first conductive elements and another end of the at least one second conductive element. The sensor generates a first signal upon affirmative determination and generates a second signal upon negative determination to thereby precisely determine whether an object is present on the carrying surface. | 06-16-2011 |
20140187233 | WATCH TYPE MOBILE TERMINAL - A watch type mobile terminal capable of being worn on a user's wrist is provided. The watch type mobile terminal includes a case, a circuit board, a first connector, a band, a receiver and a first flexible printed circuit (FPC) board. The circuit board is disposed in the case. The first connector is disposed on the circuit board. The band is connected to the case, whereby the watch type mobile terminal is capable of being worn on the user's wrist, and the band has a first end and a second end opposite to the first end. The receiver is disposed at the first end. The first FPC board is disposed in the band and connected between the first connector and the receiver. | 07-03-2014 |
Patent application number | Description | Published |
20120307432 | PORTABLE ELECTRONIC DEVICE - A portable electronic device including a main body and a connector module is provided. The main body has a central region and a fringe region. A thickness of the central region is greater than a thickness of the fringe region, and the central region has a containing cavity. The connector module is slidably disposed in the containing cavity of the main body, and moves between an operation position and an accommodation position in relative to the main body. | 12-06-2012 |
20130122727 | ELECTRONIC DEVICE - An electronic device includes a body, a door, and a connection module. The body has an opening located at a side of the body. The door is pivoted to the body and capable of rotating between an opening position and a closing position in relative to the body for exposing or covering the opening. The connection module is slidably connected to the body. When the door is rotated to the opening position in relative to the body and exposes the opening, the door drives the connection module to slide to a working position in relative to the body, and when the door is rotated to the closing position in relative to the body and covers the opening, the door drives the connection module to slide to a retracted position in relative to the body. | 05-16-2013 |
20130201649 | ELECTRONIC DEVICE - An electronic device includes a base, a rotating element and a sliding element. The rotating element is pivoted to the base. The sliding element is slidably disposed on the base. When the rotating element is rotated relative to the base and an included angle between the two is greater than a specific angle, the sliding element slides from a first position to a second position relative to the base. | 08-08-2013 |
20130301201 | PORTABLE ELECTRONIC DEVICE AND CRADLE - A portable electronic device adapted to be detachably connected to a cradle having a containing cavity is provided, wherein an inner wall of the containing cavity has a recess. The portable electronic device includes a body and a locking-and-releasing mechanism disposed in the body and including a driving unit and a latch. The driving unit is disposed in the body. The latch is connected to the driving unit and suitable for being driven by the driving unit to protrude out of the body or hide in the body. When the portable electronic device is disposed in the containing cavity, the driving unit drives the latch to protrude out of the body and be engaged with the recess. When the portable electronic device is going to be detached from the containing cavity, the driving unit drives the latch to be disengaged from the recess and move back in the body. | 11-14-2013 |
20140049147 | ELECTRONIC APPARATUS AND CONTROLLING METHOD THEREOF - An electronic apparatus and a controlling method thereof are provided. A fastened mechanism of the electronic apparatus is configured to secure a first housing and a second housing of the electronic apparatus. An operating object within a sensing range is sensed via a first sensor unit. A first sensing signal is sent to a control unit when the sensor unit sensed the operating object within the sensing range. A control signal is sent to the fastened mechanism for unlocking the fastened mechanism when the control unit receives the first sensing signal. | 02-20-2014 |
20140104782 | ELECTRONIC DEVICE - An electronic device includes a first body and a second body. The first body includes a first main body and a first magnetic element fixed in the first main body. The second body includes a second main body, a supporting unit, a second magnetic element, and a third magnetic element. The second main body is adapted to hold the first body. The supporting unit is pivoted to the second main body. The second magnetic element is fixed in the second main body. The third magnetic element is slidably configured in the second main body to restrict a rotation of the supporting unit relative to the second main body. When the first body leans against the second main body, the third magnetic element is subject to a magnetic attraction force from the first magnetic element and escapes from the supporting unit, so that the supporting unit supports the first body. | 04-17-2014 |
20140153748 | ELECTRONIC DEVICE - An electronic device suitable for connecting with an expansion assembly is provided. The electronic device includes a main body and an expansion module. The expansion module is pivoted to the main body and suitable for rotating relative to the main body between an operating position and an accommodating position. When the expansion module is located at the operating position, the expansion assembly is suitable of being electrically connected to the expansion module and providing a supporting force to the main body. | 06-05-2014 |
20150131218 | ELECTRONIC DEVICE AND LOCKING STRUCTURE THEREOF - An electronic device includes a first body, a second body, a first pivot structure, a second pivot structure, and a locking structure not in contact with the second pivot structure. The second pivot structure is pivoted to the first body along a first axis through the first pivot structure. The second body is pivoted to the first pivot structure along a second axis through the second pivot structure. When the second body is unfolded to an open position along the first axis, the first pivot structure drives the locking structure to go to an unlocked state, and the second body is adapted to rotate along the second axis. When the second body is folded or unfolded to other positions along the first axis, the first pivot structure drives the locking structure to go to a locked state, and the locking structure stops the second body rotating along the second axis. | 05-14-2015 |
Patent application number | Description | Published |
20100231808 | VIDEO AND AUDIO SYSTEM CAPABLE OF SAVING ELECTRIC POWER - A power supply of a video and audio system is coupled to a first switch and a second switch. A power management unit is coupled between the first switch and at least one electronic device. An integrated circuit includes a first circuit and a second circuit. The first circuit is coupled to the power management unit and the at least one electronic device for controlling the operation of the at least one electronic device. The second circuit is coupled to a battery, the first switch, the second switch, and the first circuit for controlling the first switch and the second switch. | 09-16-2010 |
20130222190 | ANTENNA MODULE AND ELECTRONIC APPARATUS - An antenna module and an electronic apparatus are provided. The electronic apparatus includes a housing and the antenna module. The housing has an inner surface. The antenna module includes a circuit board, a proximity sensor and a sensing antenna patch. The circuit board is disposed in the housing, and has a top surface and a bottom surface opposite to the top surface. The circuit board has a communication antenna pattern on the top surface. The proximity sensor is mounted on the bottom surface. The sensing antenna patch is assembled on the inner surface of the housing and electrically connected to the proximity sensor. An orthogonal projection of the communication antenna pattern on the inner surface overlaps the sensing antenna patch on the inner surface. | 08-29-2013 |
20150294559 | REMOTELY CONTROLLABLE ELECTRONIC DEVICE - A remotely controllable electronic device comprises an infrared receiver, a control unit and a toggle detector. The infrared receiver is for wirelessly receiving a plurality of control signals. The control unit is coupled to the infrared receiver and generates a plurality of function signals. Each function signal is corresponding to one of the control signals received by the infrared receiver. The toggle detector is coupled to the control unit and receives electricity from a power source through a switching element. The toggle detector determines the power status of the electricity coming from the switching element in a predetermined period and generates a learning mode signal to the control unit when the switching element is switched a plurality of times during the predetermined period. The remotely controllable electronic device could be control by the control signals of any infrared remote control. | 10-15-2015 |
20150294560 | REMOTELY CONTROLLABLE ELECTRONIC DEVICE - A remotely controllable electronic device comprises an infrared receiver, a control unit and a keypad unit. The infrared receiver is for wirelessly receiving a plurality of control signals. The control unit is coupled to the infrared receiver and generates a plurality of function signals. Each function signal is corresponding to one of the control signals received by the infrared receiver. The keypad unit is coupled to the control unit. The keypad unit has a learning mode key. The learning mode key is for making the remotely controllable electronic device operate in a learning mode. The remotely controllable electronic device could be control by the control signals of any infrared remote control. | 10-15-2015 |
20150295661 | REMOTELY CONTROLLABLE ELECTRONIC DEVICE - A remotely controllable electronic device comprises an infrared receiver and a control unit. The infrared receiver is for wirelessly receiving a first signal and a plurality of control signals. The control unit coupled to the infrared receiver having a look-up table which stores a plurality of specific codes corresponding to a plurality of learning mode signals. The control unit compares the first signal received by the infrared receiver with the specific codes stored in the look-up table. When the first signal is one of the learning mode signals the control unit operates in a learning mode, and the control unit stores the control signals received after receiving the first signal which is one of the learning mode signals. The control unit generates a plurality of function signals. Each function signal is corresponding to one of the control signals received by the infrared receiver in the learning mode. | 10-15-2015 |
Patent application number | Description | Published |
20100182193 | DATA PROCESSING SYSTEM AND METHOD INTEGRATED WITH POSITIONING TECHNOLOGY - A data processing system and method integrated with positioning technology are provided. A plurality of mobile devices perform data processing on positioning signals received from a positioning device. The mobile devices together form at least a communication group. One of the mobile devices receives coordinate information from the other one or more of the plurality of mobile devices of the at least a communication group via a wireless signal transceiver module. A data computation module performs computation on the coordinate information to obtain group information, and transmits the group information via the wireless signal transceiver module such that all of the plurality of mobile devices of the at least a communication group are allowed to obtain the group information. Known problems, that is, conventional mobile devices fail to receive coordinate information from one another and thereby fail to interact with one another, are solved by the system and method. | 07-22-2010 |
20110085288 | All-In-One Desktop Computer - An all-in-one desktop computer includes a casing, a display module, a motherboard, a storage device, and a heat dissipating device. The display module is contained in the casing. The display module has a display panel exposed to the casing. The storage device is located at a center-of-gravity position of the all-in-one desktop computer. The motherboard, the storage device, and the heat dissipating device are contained in the casing and are disposed at the back of the display module without overlap. Therefore, the all-in-one desktop computer has smaller volume and a better heat dissipation effect via special disposition of the motherboard, the storage device, and the heat dissipating device. | 04-14-2011 |
20120292268 | FASTENING MODULE - A fastening module for fastening a data storage device is provided. A fastening trough is formed at a lower surface of the data storage device. The fastening module includes a frame bracket, a fastening member, and a buckling member. The frame bracket is used for carrying the data storage device. The frame bracket includes a lower frame and two side frames. The side frames are connected to two sides of the lower frame. The lower frame includes a clamping hole. The fastening member is disposed at the clamping hole and inserted into a fastening trough, so as to prevent the data storage device from moving. The buckling member is movably disposed at the side frames to buckle an upper surface of the data storage device. | 11-22-2012 |
20120292468 | FASTENING MODULE - A fastening module for fastening a data storage device is provided. The data storage device includes first and second positioning apertures. A frame of the fastening module includes a retaining hole, and first and second positioning holes. The data storage device is slidably received in the frame. A securing member of the fastening module includes a main body, a pivot member, and a pin. The main body includes a pivot hole pivotally connected by the pivot member. A securing piece of the pivot member passes through the retaining hole and rotates relative to the main body to fasten the securing member to the frame. When the securing piece passes through the retaining hole, the pin passes through either the first or second positioning hole and inserts into either the first or second positioning aperture to fasten the data storage device at different positions. | 11-22-2012 |
Patent application number | Description | Published |
20120098125 | INTEGRATED CIRCUIT PACKAGE AND PHYSICAL LAYER INTERFACE ARRANGEMENT - An integrated circuit (IC) package includes an IC chip and a package carrier. The IC chip includes a substrate and an IC layered structure configured on an active surface of the substrate. The IC layered structure includes a first physical layer interface and a second physical layer interface. The first physical layer interface includes a plurality of first bump pads and a plurality of first inner pads electrically connected to the first bump pads, respectively. The second physical layer interface includes a plurality of second bump pads and a plurality of second inner pads electrically connected to the second bump pads, respectively. The second bump pads are mirror images of the first bump pads with respect to a first geometric plane perpendicular to the active surface. The second inner pads are mirror images of the first inner pads with respect to the first geometric plane. | 04-26-2012 |
20120126398 | INTEGRATED CIRCUIT PACKAGE AND PHYSICAL LAYER INTERFACE ARRANGEMENT - An integrated circuit (IC) package includes an IC chip, a package carrier, and a plurality of conductive bumps connecting the IC chip to the package carrier. The IC chip includes a substrate and an IC layered structure configured on an active surface of the substrate. The active surface has a core area and a signal area surrounding the core area. The IC layered structure includes a first physical layer interface. The first physical layer interface includes a plurality of first bump pads and a plurality of first inner pads electrically connected to the first bump pads, respectively. The first inner pads are arranged in multiple rows in the signal area. | 05-24-2012 |
20120267965 | Power Control Device and Electronic Device Using the Same - A power control device for an electronic device includes a power switching unit for switching to output a dc power source to a load of the electronic device according to a power switching signal, a switching detection unit for responding a power switching status to generate a switching detection signal, a status latch module for generating the power switching signal according to the switching detection signal, a first status signal and a second status signal, and a logic unit for generating the first status signal and the second status signal for the status latch module according to the power switching signal, such that the status latch module latches the first status signal and the second status signal. | 10-25-2012 |
20130175681 | CHIP PACKAGE STRUCTURE - A chip package structure includes a carrier and a chip group. The chip group includes a pair of first chips that are identical IC chips. The pair of first chips are disposed on the carrier in opposite directions and parallel to each other, and electrically connected with the carrier. | 07-11-2013 |
Patent application number | Description | Published |
20110134733 | TILT ADJUSTMENT CONTROL METHOD OF NEAR-FIELD OPTICAL SYSTEM - A tilt adjustment control method for a near-field optical system is provided. The method includes the following steps. A gap between a lens and a disc is detected. A gain corresponding to the gap is provided. A tilt signal is detected. A tilt compensation value according to the tilt signal and the gain is obtained. A tilt adjustment control is performed on the lens according to the tilt compensation value. | 06-09-2011 |
20110141864 | TILT CONTROL METHOD OF NEAR-FIELD OPTICAL SYSTEM - A tilt control method for a near-field optical disc drive is provided. A gap between a lens and a disc is estimated. A tilt compensation for the lens is estimated according to a tilt signal when the lens is within a far-field region. A coarse tilt control is performed on the lens according to the tilt compensation when the lens is within the far-field region. | 06-16-2011 |
20130162598 | VIRTUAL PROJECTING INPUT SYSTEM AND INPUT DETECTING METHOD THEREOF - An input detecting method used for a virtual projecting input system includes: emitting an image light beam through a reflecting mirror, and the image light beam forming a projecting point on a projecting plane; enabling the reflecting mirror to swing, so as to enable the image light beam to swing, and the projecting point scanning back and forth on the projecting plane, and generating an input image; detecting a swing frequency of the reflecting mirror, and generating a frequency signal; judging whether an input action occurs, and if yes, generating a detecting signal; and analyzing a phase difference between the frequency signal and the detecting signal, and calculating an input position of the input action according to the phase difference. | 06-27-2013 |
20140002804 | Laser Scanning Projection System with Reduced Speckle Contrast and Speckle Contrast Reducing Method | 01-02-2014 |
20140016104 | PORTABLE ELECTRONIC DEVICE WITH MULTIPLE PROJECTING FUNCTIONS - A portable electronic device with multiple projecting functions is provided. The portable electronic device includes a main body, a projecting module, and a switching mechanism. The projecting module is disposed within the main body for generating an image beam. The switching mechanism is movably disposed on the main body. When the switching mechanism is located at a first position, the image beam is projected along a first projecting path, and the portable electronic device is in a first operating mode. When the switching mechanism is located at a second position, the image beam is projected along a second projecting path, and the portable electronic device is in a second operating mode. | 01-16-2014 |
20140036235 | LASER PROJECTION SYSTEM WITH SECURITY PROTECTION MECHANISM - A laser projection system comprising a laser light and a human body detection module is disclosed. The laser light source emits a laser light. The human body detection module detects a reflective light of the laser light irradiated on an object. The human body detection module determines whether the object is a human according to a relationship between several reflectivity indexes of the reflective light. If the relationship corresponds to predefined situation, the human body detection module reduces a laser output intensity of the laser light. | 02-06-2014 |
20140152963 | ALIGNING METHOD AND OPTICAL APPARATUS - An aligning method is provided. The aligning method includes: fixing a plurality of lenses and a beam combining unit in a fixing base; respectively disposing a plurality of light emitting units in a plurality of holders; leaning the holders on the fixing base, and respectively corresponding locations of the light emitting units to locations of the lenses; turning on the light emitting units, and enabling the light beams respectively emitted by the light emitting units to be combined by the beam combining unit after respectively passing through the lenses; and respectively adjusting positions of at least part of the light emitting units by using at least one jig to respectively hold the at least part of the light emitting units until an overlapping degree of the light beams combined by the beam combining unit matches a preset requirement. In addition, an optical apparatus is provided as well. | 06-05-2014 |
20140160448 | OPTICAL MODULE USED IN PROJECTION DEVICE - An optical module used in a projection device is provided. The optical module includes a base and a filter mirror. The base has an inclined leaning surface and a sidewall surface. The sidewall surface is located at a periphery of the base and forms a through hole along a direction. The inclined leaning surface is extended from the sidewall surface and an inclined angle is formed between the inclined leaning surface and the direction. The filter mirror is disposed on the inclined leaning surface. | 06-12-2014 |
20140218698 | PROJECTION APPARATUS - A projection apparatus including a light source module and a Micro-electro-mechanical-system (MEMS) mirror is provided. The light source module outputs a plurality of illumination beams having different transmission paths. The MEMS minor is disposed on the transmission paths of the illumination beams. Each illumination beam propagates to the MEMS mirror respectively, and the illumination beams are respectively reflected by the MEMS mirror to project on a plurality of positions within an imaging region, wherein the transmission paths of the illumination beams transmitted from the light source to the MEMS mirror are not intersected with the imaging region. | 08-07-2014 |
20150185593 | PICO PROJECTION FIXING MODULE - A pico projection fixing module includes a bracket main body, plural color light sources, and plural collimator lenses. The bracket main body includes plural assembling seats. The plural assembling seats are arranged side by side. Each of the plural assembling seats includes a first assembling part and a second assembling part beside the corresponding first assembling part. The plural color light sources are installed on the first assembling parts of the plural assembling seats, respectively. The plural collimator lenses are installed on the second assembling parts of the plural assembling seats and aligned with the plural color light sources, respectively. Moreover, plural color light beams from the plural color light sources are projected out through the corresponding collimator lenses. Moreover, plural concave spaces are arranged around bottoms of the plural second assembling parts, respectively, wherein the plural concave spaces are separated from each other. | 07-02-2015 |
Patent application number | Description | Published |
20080211377 | LIGHT SOURCE APPASRATUS AND BACKLIGHT MODULE - A light source apparatus applicable to a backlight module includes a cathode structure, an anode structure, a fluorescent layer, a secondary electron generation layer, and a low-pressure gas layer. The fluorescent layer is located between the cathode structure and the anode structure. The low-pressure gas layer is filled between the cathode structure and the anode structure. The secondary electron generation layer is disposed on the cathode structure and can generate additional secondary electrons to hit the fluorescent layer for improving the luminous efficiency. | 09-04-2008 |
20080211381 | APPARATUS OF LIGHT SOURCE - An apparatus of light source includes a cathode structure, an anode structure, a fluorescent layer, a secondary electron generating layer, and a low-pressure gas layer. The fluorescent layer is located between the cathode structure and the anode structure. The low-pressure gas layer is filled between the cathode structure and the anode structure. The secondary electron generating layer is located on the cathode structure. The secondary electron generating layer can generate additional secondary electrons to hit the fluorescent layer for improving the performance of the light source. | 09-04-2008 |
20100156265 | APPARATUS OF LIGHT SOURCE - An apparatus of light source includes a cathode structure, an anode structure, a fluorescent layer, and a low-pressure gas layer. The fluorescent layer is located between the cathode structure and the anode structure. The low-pressure gas layer is filled between the cathode structure and the anode structure, and has the function of electric conduction. The low-pressure gas layer has an electron mean free path, allowing most of electrons to directly impact the fluorescent layer under an operation voltage. | 06-24-2010 |
Patent application number | Description | Published |
20110086444 | PROCESS FOR PRODUCING SUBSTRATES FREE OF PATTERNS USING AN ALPHA STEPPER TO ENSURE RESULTS - The present disclosure provides a method for making an integrated circuit. The method comprises processing a first surface of a substrate to create the integrated circuit and grinding a second surface of the substrate to remove material until the substrate is substantially close to a desire thickness. The method also includes performing a wet etch process over the second surface of the substrate and performing a chemical mechanical polishing (CMP) process over the second surface of the substrate to remove a pattern on the substrate. The second surface of the substrate is examined with a metrological instrument to determine if the second surface is substantially smooth; if the second surface is not substantially smooth, the steps of performing the CMP process and examining the second surface with the metrological instrument are repeated until the second surface is substantially smooth. | 04-14-2011 |
20130119500 | IMAGE SENSOR WITH IMPROVED DARK CURRENT PERFORMANCE - Provided is a semiconductor image sensor device. The image sensor device includes a semiconductor substrate that includes an array region and a black level correction region. The array region contains a plurality of radiation-sensitive pixels. The black level correction region contains one or more reference pixels. The substrate has a front side and a back side. The image sensor device includes a first compressively-stressed layer formed on the back side of the substrate. The first compressively-stressed layer contains silicon nitride. The image sensor device includes a metal shield formed on the compressively-stressed layer. The metal shield is formed over at least a portion of the black level correction region. The image sensor device includes a second compressively-stressed layer formed on the metal shield and the first compressively-stressed layer. The second compressively-stressed layer contains silicon oxide. A sidewall of the metal shield is protected by the second compressively-stressed layer. | 05-16-2013 |
20140197513 | Image Sensor with Improved Dark Current Performance - Provided is a semiconductor image sensor device. The image sensor device includes a semiconductor substrate that includes an array region and a black level correction region. The array region contains a plurality of radiation-sensitive pixels. The black level correction region contains one or more reference pixels. The substrate has a front side and a back side. The image sensor device includes a first compressively-stressed layer formed on the back side of the substrate. The first compressively-stressed layer contains silicon nitride. The image sensor device includes a metal shield formed on the compressively-stressed layer. The metal shield is formed over at least a portion of the black level correction region. The image sensor device includes a second compressively-stressed layer formed on the metal shield and the first compressively-stressed layer. The second compressively-stressed layer contains silicon oxide. A sidewall of the metal shield is protected by the second compressively-stressed layer. | 07-17-2014 |
20150076638 | MECHANISMS FOR FORMING BACKSIDE ILLUMINATED IMAGE SENSOR DEVICE STRUCTURE - Embodiments of mechanisms of a backside illuminated image sensor device structure are provided. The backside illuminated image sensor device structure includes a substrate having a frontside and a backside and a pixel array formed in the frontside of the substrate. The backside illuminated image sensor device structure further includes an antireflective layer formed over the backside of the substrate, and the antireflective layer is made of silicon carbide nitride. | 03-19-2015 |