Patent application number | Description | Published |
20100227014 | MOLD CLAMPING DEVICE - In a mold clamping device including a fixed platen, a movable platen, a plurality of tie bars, and mold clamping half nuts, a pair of additional half members which is restricted in the axial direction of the tie bar and moves in an opening/closing direction of the half nuts relative to the mold clamping half nuts is further provided, and when the mold clamping half nuts are closed and mated with the screw or the ring groove of the tie bar, the additional half members are closed to hold the tie bar so that play at mated parts is removed or cancelled by fixation. | 09-09-2010 |
20120087999 | INJECTION MOLDING MACHINE FOR TWO-MATERIAL MOLDING - It is an object to prevent dies from interfering with each other when the dies are closed and effectively prevent overshoot of cavity temperature while efficiently performing heating of the dies. In an injection molding machine for two-material molding including two sets of a first injecting unit and a second injecting unit that respectively plasticize different resin materials and inject and fill the resin materials, prior to performing injection molding on the first injecting unit side on a secondary side, after injection molding on the second injecting unit side on a primary side, heating of the dies is started before 180-degree rotation of a rotary die plate is completed. After the start of heating, until the 180-degree rotation of the rotary die plate is completed, i.e., die closing is performed, die temperatures are maintained within a temperature range set higher than die temperatures during the heating start and lower than die temperatures during injection. | 04-12-2012 |
20130129858 | DIE CLAMPING DEVICE FOR INJECTION MOLDING MACHINE - Breakage of the actuator moving the movable platen in the clamping device of an injection moulder is prevented. The clamping device includes a movable platen shifting device increasing and decreasing a horizontal distance between the movable platen ( | 05-23-2013 |
20150044325 | MOLD CLAMPING DEVICE AND INJECTION MOLDING MACHINE - A mold clamping device includes a fixed platen on which a fixed mold is disposed, a movable platen on which a movable mold that defines a cavity along with the fixed mold is disposed, a tie bar configured to resist a mold clamping force that is generated between the fixed platen and the movable platen, and a half nut opening and closing device configured to grip the tie bar, thereby locking the movable platen and the tie bar, in which the half nut opening and closing device includes half nuts configured to grip the tie bars, an actuator which is disposed on the movable platen and configured to move the half nuts back and forth with respect to the tie bars, and a clevis configured to connect the actuator to the half nuts so as to allow the actuator to swing with respect to the gripping member. | 02-12-2015 |
Patent application number | Description | Published |
20090114501 | Frictional engagement device - A wave washer is interposed on an inner peripheral groove via a snap ring. The wave washer urges a radiation direction outer end of a bottom plate member against a wall surface side of the inner peripheral groove in a direction of an axis. | 05-07-2009 |
20100126819 | WAVE SPRING HOLDING STRUCTURE AND FRICTIONAL ENGAGEMENT APPARATUS - A wave spring holding structure includes a wave spring that includes crest portions and recessed portions that are alternately formed in a circumferential direction thereof, and a first gap; a circular member provided to be rotatable around an axis; and an arc-shaped snap ring that includes a second gap, and that restricts movement of the circular member in a direction of the axis. The wave spring and the snap ring share the axis with the circular member. The wave spring and the snap ring are rotatable with respect to each other. The wave spring is disposed and held between the circular member and the snap ring so that the crest portions protrude toward the circular member, and the recessed portions protrude toward the snap ring. The first gap is formed in one of the crest portions. | 05-27-2010 |
20100140038 | Piston apparatus of automatic transmission - In an embodiment of the present invention, a piston apparatus of an automatic transmission includes a piston member capable of moving in the axial direction of the rotation shaft, and a hydraulic chamber, and has been configured so that the piston member moves in the axial direction due to pressure in the hydraulic chamber. The piston member includes a cylinder part that extends in the axial direction and to which pressure in the hydraulic chamber is transmitted, a pressing part that extends in the radial direction and presses against a friction engaging element of the automatic transmission, and a connecting part that connects the cylinder part and the pressing part and, with respect to the axial direction, is offset from the pressing part in a direction of separation from the friction engaging element. Also, the axial direction offset amount of the connecting part from the pressing part of the piston member has been set larger than the stroke amount of the piston member. | 06-10-2010 |
Patent application number | Description | Published |
20090044059 | SEMICONDUCTOR INTEGRATED CIRCUIT AND DEBUGGING SYSTEM - This invention is to provide a technology for taking out trace information externally without lacking under the condition of limited output bandwidth. A semiconductor integrated circuit provided includes: a processing unit which can perform arithmetic processing according to a predetermined program and can output trace information with respect to the arithmetic processing; and a trace compression unit which can compress the trace information outputted from the processing unit. The trace compression unit includes a storage device, a comparator unit which can compare trace information stored in the storage device and the trace information newly outputted from the processing unit, and a trace information compression controller which can compress trace information to be externally outputted, based on the comparison result of the comparator unit. When a content of the trace information is in agreement with that of the trace information already outputted, information indicating the already-outputted trace information is outputted, accordingly the trace information is compressed. | 02-12-2009 |
20090113186 | MICROCONTROLLER AND CONTROLLING SYSTEM - A microcontroller and a controlling system having the same are provided, in which the increase in the program code for performing floating-point arithmetic, in particular, the increase in the amount of code due to a variable are suppressed, and the processing overhead for converting fixed-point data into floating-point data is reduced. The microcontroller includes a floating-point converter which inputs integer data and corresponding decimal point position data as fixed-point data and which converts the input data into floating-point data by acquiring a fraction part, an exponent part, and a sign of the floating type from the input data, and a floating-point arithmetic logic unit which receives the output of the floating-point converter and calculates the floating-point data. The floating-point converter acquires the exponent part by performing addition and subtraction of the decimal point position data and the shift amount of the fraction part to the integer data. | 04-30-2009 |
20090216974 | MICROCOMPUTER - A microcomputer includes a first CPU, a first bus, a first memory, a second CPU, a second bus, and a second memory. The first memory and the second memory are arranged in address spaces individually managed by the first CPU and the second CPU corresponding to the memories. An address translation circuit is provided. When a task so programmed to have a data area in the first memory is transferred to the second memory and executed by the second CPU, the address translation circuit carries out the following processing: the address translation circuit translates an address outputted from the second CPU so that access to the first memory by the task becomes access to the second memory. As a result, the number of access cycles is reduced and degradation in computing capability is avoided when a task is transferred between CPUs for load sharing. | 08-27-2009 |
20090271576 | DATA PROCESSOR - There is a need for providing a data processor capable of easily prefetching data from a wide range. A central processing unit is capable of performing a specified instruction that adds an offset to a value of a register to generate an effective address for data. This register can be assigned an intended value in accordance with execution of an instruction. A buffer maintains part of instruction streams and data streams stored in memory. The buffer includes cache memories for storing the instruction stream and the data stream. From the memory, the buffer prefetches a data stream containing data corresponding to an effective address designated by the specified instruction stored in the cache memory. A data prefetch operation is easy because a data stream is prefetched by finding the specified instruction from the fetched instruction stream. Data can be prefetched from a wider range than the use of a PC-relative load instruction. | 10-29-2009 |
20100026562 | Detecting device and railroad vehicle - Location information of a vehicle such as a railroad vehicle and an elevator cage is detected by using a reflection strength change of an electromagnetic wave. A system is configured by a radiowave transmitter which emits a first radiowave, positional markers which generate unique reflection strengths and patterns of temporal changes in the reflection strength from the emitted first radiowave at respective absolute positions, a radiowave receiver which receives a second radiowave reflected by the positional marker and converts the second radiowave into a signal format for extracting location information to output the same, and a marker recognition device which obtains a location of the vehicle from the output of the radiowave receiver. Accordingly, a highly-precise location specification with a resolution smaller than or equal to 1 cm and a highly-reliable location specification which is not affected by slip and slide of wheels can be realized. | 02-04-2010 |
20100064106 | DATA PROCESSOR AND DATA PROCESSING SYSTEM - The present invention provides a data processor capable of automatically discriminating a loop program and performing a reduction in power by size-variable lock control on an instruction buffer. The instruction buffer of the data processor includes a buffer controller for controlling a memory unit that stores each fetched instruction therein. When an execution history of a fetched condition branch instruction suggests condition establishment, and in the case that the branch direction of the fetched condition branch instruction is a direction opposite to the order of an instruction execution and the difference of instruction addresses from the branch source to the branch target based on the condition branch instruction is a range held in the storage capacity of the instruction buffer, the buffer controller retains an instruction sequence from a branch source to a branch target based on the condition branch instruction in the instruction buffer. While the instruction execution of the instruction sequence retained therein is repeated, the buffer controller supplies the corresponding instruction of the instruction sequence from the instruction buffer to the instruction decoder and releases retention of the instruction sequence when the instruction execution is exited from the instruction sequence. | 03-11-2010 |
Patent application number | Description | Published |
20090020386 | AUTOMATIC TRANSMISSION INCLUDING CLUTCH DEVICES - An automatic transmission including a first clutch selectively connecting a first rotary member and a second rotary member disposed coaxially with the first rotary member, a second clutch selectively connecting the first rotary member and a third rotary member disposed coaxially with the first rotary member, a first drum in which a first piston of the first clutch is axially slidably received, a second drum disposed coaxially with the first drum, to accommodate the first drum, and in which a second piston of the second clutch is axially slidably received, an abutting portion abutting contact of the first and second drums with each other in an axial direction of the first and second drums, and a fitting portion at which the first drum is fitted in the second drum and that inhibits relative rotation of the first and second drums about a common axis of the first and second drums. | 01-22-2009 |
20090042655 | POWER TRANSMISSION DEVICE AND METHOD OF PRODUCING THE SAME - A power transmission device that can have deformation in processing suppressed. A spiral gear as a rotation member includes a disk section extending radially outwards from a boss section. The disk section includes a through hole in slit form through laser processing. | 02-12-2009 |
20090082155 | VEHICULAR AUTOMATIC TRANSMISSION - A vehicular automatic transmission including first and second shafts coaxially splined to each other at their adjacent axial end portions, and a lubrication system including: first and second lubrication passages formed through the respective first and second shafts in their axial direction, in communication with each other through the adjacent axial end portions, oil outlet holes in communication with the lubrication passages and spaced apart from each other in the axial direction, and first and second oil inlet holes formed through the respective first and second rotary shafts such that the oil outlet holes are located between the oil inlet holes and the adjacent axial end portions of the shafts, so that lubricating oil introduced into the lubrication passages through the respective oil inlet holes flows through the lubrication passages toward the adjacent axial end portions of the shafts. | 03-26-2009 |
20090114500 | AUTOMATIC TRANSMISSION INCLUDING CLUTCH DEVICES - An automatic transmission including a first clutch, a second clutch, a first drum in which a first piston of the first clutch is axially slidably received and that cooperates with the first piston to define a first oil chamber, a second drum disposed coaxially with the first drum, so as to accommodate the first drum, and in which a second piston of the second clutch is axially slidably received, the second drum cooperating with the second piston to define a second oil chamber, a first fluid supply portion for feeding a working fluid into the first oil chamber through the first drum and the second drum, to operate the first piston, and a second fluid supply portion for feeding the working fluid into the second oil chamber through the second drum, to operate the second piston, and wherein the second fluid supply portion is located radially outwardly of the first fluid supply portion. | 05-07-2009 |
20140008781 | SEMICONDUCTOR UNIT - A semiconductor unit includes a first conductive layer, a second conductive layer electrically insulated from the first conductive layer, a first semiconductor device mounted on the first conductive layer, a second semiconductor device mounted on the second conductive layer, a first bus bar for electrical connection of the second semiconductor device to the first conductive layer, and a second bus bar for electrical connection of the first semiconductor device to one of the positive and negative terminals of a battery. The first bus bar is disposed in overlapping relation to the second bus bar in such a manner that mold resin fills between the first bus bar and the second bus bar. | 01-09-2014 |
20140008782 | SEMICONDUCTOR UNIT - A semiconductor unit includes a base having a surface where a first insulation layer is disposed, a second insulation layer spaced apart from the first insulation layer to form a region therebetween and disposed parallel to the surface of the base where the first insulation layer is disposed, a single conductive layer disposed across the first insulation layer and the second insulation layer, and a semiconductor device bonded to the conductive layer. | 01-09-2014 |
20140035120 | SEMICONDUCTOR UNIT - A semiconductor unit includes an insulation layer, a conductive layer bonded to one side of the insulation layer, a semiconductor device mounted on the conductive layer, a cooler thermally coupled to the other side of the insulation layer, a first bus bar having a bonding surface bonded to the semiconductor device or the conductive layer and a non-bonding surface that is the part of the first bus bar other than the bonding surface, and a second bus bar having a bonding surface bonded to the semiconductor device or the conductive layer and a non-bonding surface that is the part of the second bus bar other than the bonding surface. The second bus bar has a greater ratio of the area of the bonding surface to the area of the non-bonding surface than the first bus bar. The second bus bar has a lower electric resistance than the first bus bar. | 02-06-2014 |
20140090809 | COOLING DEVICE - A cooling device to which a heating element is joinable includes a base, a plurality of first groups of pin fins and a plurality of second groups of pin fins. The second groups and the first groups are arranged alternately in a flow direction in which a cooling medium flows through a passage of the base. A second outermost pin fin of each second group is more distant from a side surface of the base than a first outermost pin fin of each first group. Width between a side surface of the second outermost pin fin of each second group and the side surface of the base is the same as or larger than width between a side surface of the pin fin of each first group that is adjacent to the first outermost pin fin of the first group and the side surface of the second outermost pin fin. | 04-03-2014 |
20140091444 | SEMICONDUCTOR UNIT AND METHOD FOR MANUFACTURING THE SAME - A semiconductor unit includes a base, an insulating substrate bonded to the base, a conductive plate made of a metal of poor solderability, a semiconductor device mounted to the insulating substrate through the conductive plate, and a metal plate interposed between the conductive plate and the semiconductor device and made of a metal of good solderability as compared to the metal used for the conductive plate. The base, the insulating substrate, the conductive plate and the metal plate are brazed together, and the semiconductor device is soldered to the metal plate. | 04-03-2014 |
20140117508 | SEMICONDUCTOR UNIT - A semiconductor unit includes an insulating substrate having a first surface and a second surface opposite to the first surface, a first conductive layer bonded to the first surface of the insulating substrate, a second conductive layer bonded to the first surface of the insulating substrate at a position different from that for the first conductive layer, a stress relief layer bonded to the second surface of the insulating substrate, a radiator bonded to the stress relief layer on the side thereof opposite to the insulating substrate, and semiconductor devices electrically bonded to the respective first and second conductive layers. The insulating substrate has a low-rigidity portion provided between the first and second conductive layers and having a lower rigidity than the rest of the insulating substrate, and at least the low-rigidity portion is sealed and covered by a mold resin. | 05-01-2014 |
Patent application number | Description | Published |
20130075272 | HIGHLY PURE COPPER ANODE FOR ELECTROLYTIC COPPER PLATING, METHOD FOR MANUFACTURING SAME, AND ELECTROLYTIC COPPER PLATING METHOD - Provided are a highly pure copper anode for electrolytic copper plating, a method for manufacturing the same, and an electrolytic copper plating method using the highly pure copper anode. The highly pure copper anode obtains a crystal grain boundary structure having a special grain boundary ratio Lσ | 03-28-2013 |
20130156631 | METHOD OF REMOVING OXIDE FILM ON SURFACE OF COPPER OR COPPER-BASE ALLOY AND COPPER OR COPPER-BASE ALLOY RECOVERED USING THE METHOD - A pickling solution, including: 50 g/L to 400 g/L of sulfuric acid; 1 g/L to 100 g/L of at least one oxidant selected from a group consisting of nitric acid, hydrogen peroxide, peroxodisulfate ions, and iron (III) ions; 0.01 g/L to 10 g/L of at least one additive selected from a group consisting of aromatic sulfonic acid, aromatic sulfonate, alkylamine, aromatic carboxylic acid, and aromatic carboxylate; 0.005 g/L to 10 g/L of at least one surfactant selected from a group consisting of alkylbenzene sulfonic acid and alkylbenzene sulfonate; and 10 g/L to 300 g/L of copper sulfate, is used to remove oxide film, and then reused by being electrolyzed and adding the oxidant, the additive and the surfactant in amounts equivalent to consumed amounts. | 06-20-2013 |
20130196171 | TIN-PLATED COPPER-ALLOY MATERIAL FOR TERMINAL AND METHOD FOR PRODUCING THE SAME - Tin-plated copper-alloy material for terminal having: a substrate made of Cu or Cu alloy; an Sn-based surface layer formed on a surface of the substrate; and a Cu—Ni—Sn alloy layer including Ni formed between the Sn-based surface layer and the substrate, in which the Cu—Ni—Sn alloy layer is made of: fine Cu—Ni—Sn alloy particles; and coarse Cu—Ni—Sn alloy particles, an average thickness of the Sn-based surface layer is not less than 0.2 μm and not more than 0.6 μm, an area ratio of the Cu—Ni—Sn alloy layer exposed at a surface of the Sn-based surface layer is not less than 10% and not more than 40%, and a coefficient of kinetic friction of the tin-plated copper-alloy material for terminal is not more than 0.3. | 08-01-2013 |
20130334057 | HIGH-PURITY ELECTROLYTIC COPPER AND ELECTROLYTIC REFINING METHOD THEREOF - This electrolytic refining method of high-purity electrolytic copper includes: performing electrolysis by using an electrolyte which includes a copper nitrate solution, a cathode made of stainless steel, and an anode made of copper so as to deposit high-purity electrolytic copper on the cathode.
| 12-19-2013 |
20140004373 | TIN-PLATED COPPER-ALLOY MATERIAL FOR TERMINAL AND METHOD FOR PRODUCING THE SAME | 01-02-2014 |
20140170436 | TIN-PLATED COPPER-ALLOY MATERIAL FOR TERMINAL HAVING EXCELLENT INSERTION/EXTRACTION PERFORMANCE - Tin-plated copper-alloy material for terminal in which: a Sn-based surface layer is formed on a surface of a substrate made of Cu alloy, and a Cu—Sn alloy layer is formed between the Sn-based surface layer and the substrate; the Cu—Sn alloy layer is an alloy layer containing Cu | 06-19-2014 |
20140287262 | TIN-PLATED COPPER-ALLOY MATERIAL FOR TERMINAL HAVING EXCELLENT INSERTION/EXTRACTION PERFORMANCE - Tin-plated copper-alloy terminal material in which Sn-based surface layer is formed on a surface of a substrate made of Cu alloy, and a Cu—Sn alloy layer is formed between the Sn-based surface layer and the substrate; the Cu—Sn alloy layer contains Cu | 09-25-2014 |
20150056466 | TIN-PLATED COPPER-ALLOY MATERIAL FOR TERMINAL HAVING EXCELLENT INSERTION/EXTRACTION PERFORMANCE - A tin-plated copper-alloy terminal material wherein: a Sn-based surface layer formed on a surface of a substrate made of Cu alloy, and a Cu—Sn alloy layer/a Ni—Sn alloy layer/a Ni or Ni alloy layer are formed in sequence from the Sn-based surface layer between the Sn-based surface layer and the substrate; the Cu—Sn alloy layer is a compound-alloy layer containing Cu | 02-26-2015 |
20150118515 | TIN-PLATED COPPER-ALLOY TERMINAL MATERIAL - Tin-plated copper-alloy terminal material including a base material made of Cu alloy; a Sn-based surface layer formed on a surface of the base material and having an average thickness of 0.2 μm or larger and 0.6 μm or smaller; a Cu—Sn alloy layer generated between the Sn-based surface layer and the base material; and a Ni-based coating layer, formed of Ni or Ni—Sn alloy having a coating thickness of 0.005 μm or larger and 0.05 μm or smaller, in which an oil-sump depth Rvk of the Cu—Sn alloy layer measured when the Cu—Sn alloy layer is appeared on a surface by fusing and removing the Sn-based surface layer is 0.2 μm or larger; a part of the Cu—Sn alloy layer is exposed from the Sn-based surface layer; the Ni-based coating layer is formed on the exposed Cu—Sn alloy layer; and dynamic friction coefficient of the surface is 0.3 or less. | 04-30-2015 |