Koutani
Eiji Koutani, Tokyo JP
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20100218439 | VIBRATION DAMPER - A vibration damper comprises a first plate | 09-02-2010 |
Masato Koutani, Osaka-Shi JP
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20080238566 | High frequency oscillator circuit with feedback circuit of fet and short-stub transmission line - In a high frequency oscillator circuit including first and second field effect transistors, the first field effect transistor has a gate connected to a short-stub transmission line and a drain connected to an oscillation output terminal, and the second field effect transistor has a drain connected to a source of the first field effect transistor and a grounded source. The high frequency oscillator circuit oscillates by using a feedback circuit including the short-stub transmission line and the second field effect transistor. A feedback capacitor is further provided which is connected between a gate of the second field effect transistor and the drain of the first field effect transistor. | 10-02-2008 |
20100225375 | REFERENCE SIGNAL GENERATOR CIRCUIT PROVIDED WITH TWO 90-DEGREE PHASE SHIFTERS AND TWO MIXER CIRCUITS - A first mixer circuit mixes a first center frequency signal with a first local oscillation signal to generate a second mixed signal, and mixes the first center frequency signal with a second local oscillation signal to generate a first mixed signal, and a second mixer circuit mixes a second center frequency signal with the first local oscillation signal to generate a fourth mixed signal, and mixes the second center frequency signal with the second local oscillation signal to generate a third mixed signal. An adder and subtracter circuit subtracts the third mixed signal from the second mixed signal to output a signal of subtraction result as a first upper side band signal, and adds the first mixed signal to the fourth mixed signal to output a signal of addition result as a second upper side band signal different in phase from the first upper side band signal by 90 degrees. | 09-09-2010 |
Nobuyuki Koutani, Osaka JP
Patent application number | Description | Published |
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20090020318 | Circuit board, and semiconductor device - A circuit board including a flexible insulating substrate, a plurality of conductive wirings placed in line on the flexible insulating substrate, and bumps provided at end portions of the respective conductive wirings positioned in a region for mounting a semiconductor chip is provided. The circuit board further includes an auxiliary conductive wiring positioned at an outermost corner of the region for mounting the semiconductor chip, being adjacent to and an outside the outermost conductive wiring, and an auxiliary bump formed on the auxiliary conductive wiring in line with the bumps on the conductive wirings. One end portion of the auxiliary conductive wiring is terminated at a position in the outside vicinity of the auxiliary bump in an outward direction of the region for mounting the semiconductor chip, and the auxiliary conductive wiring is bent at the other end portion positioned inside the auxiliary bump in an inward direction of the region for mounting the semiconductor chip, and connected to an end of the adjacent outermost conductive wiring. A break in the outermost conductive wiring, which is caused by concentrated stress at the time of joining the bumps of the circuit board and electrode pads of the semiconductor chip, can be suppressed. | 01-22-2009 |
20100265665 | ELECTRONIC DEVICE HAVING A HEAT SINK - The electronic device includes: a heat sink including a front surface having a concave portion; a heat conductive component placed in the concave portion, in contact with the heat sink; a semiconductor element placed in the concave portion, in contact with the heat conductive component; a flexible base plate electrically connected to the semiconductor element and placed on the surface of the heat sink; and a chassis member having a front surface on which the heat sink is fixed so as to come in contact with the heat sink at the back surface opposite to the front surface. | 10-21-2010 |
Shoichi Koutani, Hiroshima JP
Patent application number | Description | Published |
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20160131222 | STEEL SHEET FOR STEEL BELT AND PROCESS FOR MANUFACTURING SAME, AND STEEL BELT - Manufacturing a steel sheet for a steel belt includes hot rolling a steel slab containing, in mass %, 0.60 to 0.80% of C, 1.0% or less of Si, 0.10 to 1.0% of Mn, 0.020% or less P, 0.010% or less S, 0.1 to 1.0% of Cr, 0 to 0.5% of V, 0 to 0.1% of Ti, 0 to 0.1% of Nb, and 0 to 0.01% of B, the balance Fe and unavoidable impurities, under a finish hot rolling temperature of 800 to 900° C. An average cooling rate from finish rolling to coiling is 20° C. per second or more. A coiling temperature is 450 to 650° C. The hot-rolled slab is cold rolled with a total rolling reduction ratio of 40% or more and a reduction ratio per one pass of less than 12%, without performing a heat treatment. The cold-rolled slab is aged at 200 to 500° C. for 0.5 to 30 hours. | 05-12-2016 |