Patent application number | Description | Published |
20090015932 | METHOD FOR MANUFACTURING FILM COATED LENS - A method for manufacturing film coated optical lens includes steps: providing a lens array panel including an array of lens units; forming an optical film on opposite surfaces of the lens array panel; cutting the lens array panel into pieces, thereby obtaining a plurality of separated lenses with the optical film formed on opposite surfaces thereof. | 01-15-2009 |
20090038544 | FILM COATING HOLDER AND FILM COATING DEVICE USING SAME - A film coating holder includes a main body, a number of workpiece holders, and a number of driving elements. The main body defines a number of separate openings. The workpiece holders are received in the corresponding separate openings, and rotatably mounted on the main body. The driving elements are fixed to the main body and geared with the corresponding workpiece holders. | 02-12-2009 |
20090053408 | METHOD FOR MANUFACTURING FILM COATED COMPOSITE LENS - In an exemplary embodiment, a method for manufacturing film coated optical lens includes: providing a lens substrate having a first surface and a second surface facing away from the first surface; forming a first lens array on the first surface, the first lens array including a plurality of first lens units; forming a second lens array on the second surface, the second lens array including a plurality of second lens units, the first lens units aligned with the respective second lens units, the first lens array, the lens substrate and the second lens array cooperatively forming a composite lens array; forming an optical film over an outer surface of the first lens array or that of the second lens array; and cutting the composite lens array into a plurality of composite lens units each including one of the first lens units, one of the second lens units, a portion of the lens substrate, and a portion of the optical film. | 02-26-2009 |
20090166185 | ION ASSISTED DEPOSITION METHOD FOR FORMING MULTILAYER FILM - An ion assisted deposition (IAD) method for forming a film on a substrate is disclosed. The film includes a number of layers. The substrate is bombarded by an ion source with a low ion energy at a initial period of forming each of the layers and a high ion energy during a majority period of forming each of the layers after the respective initial period. | 07-02-2009 |
20090277381 | FILM COATING HOLDER - An exemplary film coating holder includes a main body, a plurality of workpiece holders, and a driving module. The main body includes a plurality of through holes defined therein and a central axis. The main body is capable of rotating around the central axis. Each workpiece holder is arranged in each through hole and pivotally connected with the main body by an axle. A rotating guide groove is defined around each axle. The driving module includes a control unit and a shaft. The control unit inserts the shaft in the rotating guide groove of the workpiece holder. When the main body is rotating around the central axis, the shaft can drive the workpiece holder to turn over by the guiding of the rotating guide groove. | 11-12-2009 |
20090288948 | PHYSICAL VAPOR DEPOSITION APPARATUS - A physical vapor deposition apparatus includes a vacuum chamber, a particles producing means, a substrate stand, a correction plate, and an ion source disposed in the vacuum chamber. The physical vapor deposition apparatus further includes a strain gauge adhered on the correction plate for detecting deforming of the correction plate, a controlling circuit electrically coupled to the strain gauge, and an alarm electrically connected to the controlling circuit. The controlling circuit is configured for controlling the alarm to produce an alert signal when the deforming of the correction plate exceeds a predetermined degree. | 11-26-2009 |
20090308314 | VAPOR DEPOSITION DEVICE - A vapor deposition device includes a connecting member, a support member and an inspecting member. The connecting member has a connecting end. The support member has a bottom portion and a top portion positioned on the connecting end. Receiving holes are defined in the support component between the top portion and the bottom portion and configured to receive workpieces. Several pairs of through holes are defined in the support component adjacent to the bottom portion. Each pair of through holes is substantially coaxial with each other and positioned in a horizontal plane. The inspecting component includes a light emitting member and a light receiving member configured to be aligned with one pair of through holes. | 12-17-2009 |
20090316087 | LIQUID CRYSTAL DISPLAY - A liquid crystal display includes a first flat glass substrate, an opposite second flat glass substrate, a liquid crystal layer sandwiched therebetween, a backlight module disposed adjacent to the first flat glass substrate, a color filter disposed adjacent to the second flat glass substrate, a bandpass filter member disposed on the color filter. The bandpass filter member is configured for allowing light of a given spectrum emitted from the backlight module to pass therethrough and blocking light that is not in the given spectrum from passing therethrough, and a touch panel disposed adjacent to the bandpass filter member. | 12-24-2009 |
20090316400 | LIGHT EMITTING DIODE STREET LIGHT - An exemplary light emitting diode (LED) streetlight includes an LED light source and a heat dissipating module. The LED light source includes a circuit board and a plurality of LEDs. The circuit board has a first surface and a second surface. The LEDs are disposed on the first surface and electrically connected to the circuit board. The heat dissipating module includes a heat conducting plate, a plurality of heat pipes containing a working liquid and a plurality of fins. The heat conducting plate has a bonding surface and a heat dissipating surface opposite to the bonding surface. Each heat pipe has a heated section thermally connected to the heat dissipating surface and a condensing section spaced from the heat dissipating plate and penetrate into the plurality of fins. The circuit board is fixed on the bonding surface of the heat conducting plate. | 12-24-2009 |
20110031108 | SPUTTERING DEPOSITION METHOD AND APPARATUS - A sputtering deposition method is utilized by a sputtering deposition apparatus including a first chamber, a second chamber, a first carrier, and a second carrier. Some first substrates are positioned in the first carriers in the first chamber for heating. The first carriers in the first chamber and the second carriers in the second chamber are exchanged. The first substrates in the second chamber are sputtered. The second carriers in the first chamber and the first carriers in the second chamber are exchanged. The first substrates in the first chamber are taken out. | 02-10-2011 |
20110174607 | COLORED DEVICE CASING AND SURFACE-TREATING METHOD FOR FABRICATING SAME - A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. The color layer includes at least one metal layer. A portion of the color layer corresponding to and located over the smooth region has a value for L* in a range from about 70.44 to about 72.44, a value for a* in a range from about −7.84 to about −6.84 and a value for b* in a range from about −8.57 to about −7.57 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided. | 07-21-2011 |
20110174661 | COLORED DEVICE CASING AND SURFACE-TREATING METHOD FOR FABRICATING SAME - A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and the color layer together. The color layer includes at least one metal layer. A portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 40.34 to about 42.34, a value of a* in a range from about 0.11 to about 1.11 and a value of b* in a range from about 2.24 to about 3.24 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided. | 07-21-2011 |
20110174662 | COLORED DEVICE CASING AND SURFACE-TREATING METHOD FOR FABRICATING SAME - A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. The color layer includes at least one metal layer. Portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 17.93 to about 19.93, a value of a* in a range from about 23.74 to about 24.74 and a value of b* in a range from about 2.20 to about 3.20 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided. | 07-21-2011 |
20110174663 | COLORED DEVICE CASING AND SURFACE-TREATING METHOD FOR FABRICATING SAME - A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and the color layer together. The color layer includes at least one metal layer. Portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 57.57 to about 59.57, a value of a* in a range from about 1.04 to about 2.04 and a value of b* in a range from about 6.64 to about 7.64 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided. | 07-21-2011 |
20110174664 | COLORED DEVICE CASING AND SURFACE-TREATING METHOD FOR FABRICATING SAME - A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and the color layer together. The color layer includes at least one metal layer. Portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 81.59 to about 83.59, a value of a* in a range from about −0.55 to about 0.45 and a value of b* in a range from about −0.60 to about 0.40 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided. | 07-21-2011 |
20110174666 | COLORED DEVICE CASING AND SURFACE-TREATING METHOD FOR FABRICATING SAME - A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region, and the color layer is located over the smooth region of the base. The color layer includes titanium, and has a value for L* in the range from 51.55 to 52.55, a value for a* in the range from 13.12 to 14.12 and a value for b* in the range from 6.27 to 7.27 according to the Commission Internationale del'Eclairage, (CIE, International Commission on Illumination) LAB system. The bonding layer is located between the substrate and the color layer, providing adhesion therebetween. A surface-treating method for fabricating the colored casing is also provided. | 07-21-2011 |
20110174667 | COLORED DEVICE CASING AND SURFACE-TREATING METHOD FOR FABRICATING SAME - A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. The color layer includes at least one metal layer. A portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 32.51 to about 34.51, a value of a* in a range from about −8.74 to about −7.74 and a value of b* in a range from about −12.39 to about −11.39 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided. | 07-21-2011 |
20110174668 | COLORED DEVICE CASING AND SURFACE-TREATING METHOD FOR FABRICATING SAME - A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. The color layer includes at least one metal layer. A portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 50.77 to about 52.77, a value of a* in a range from about −0.93 to about 0.07 and a value of b* in a range from about −1.26 to about −0.26 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided. | 07-21-2011 |
20110174669 | COLORED DEVICE CASING AND SURFACE-TREATING METHOD FOR FABRICATING SAME - A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. The color layer includes at least one metal layer. Portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 59.12 to about 61.12, a value of a* in a range from about 0.17 to about 1.17 and a value of b* in a range from about 2.40 to about 3.40 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided. | 07-21-2011 |
20110174670 | COLORED DEVICE CASING AND SURFACE-TREATING METHOD FOR FABRICATING SAME - A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. A portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 81.43 to about 83.43, a value of a* in a range from about 0.30 to about 1.30 and a value of b* in a range from about 2.11 to about 3.11 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided. | 07-21-2011 |
20110174671 | COLORED DEVICE CASING AND SURFACE-TREATING METHOD FOR FABRICATING SAME - A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. A portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 36.54 to about 38.54, a value of a* in a range from about 0.04 to about 1.04 and a value of b* in a range from about 1.88 to about 2.88 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided. | 07-21-2011 |
20110174672 | COLORED DEVICE CASING AND SURFACE-TREATING METHOD FOR FABRICATING SAME - A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. A portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 49.07 to about 51.07, a value of a* in a range from about 0.19 to about 1.19 and a value of b* in a range from about 1.94 to about 2.94 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided. | 07-21-2011 |
20110174673 | COLORED DEVICE CASING AND SURFACE-TREATING METHOD FOR FABRICATING SAME - A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. A portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 81.76 to about 83.76, a value of a* in a range from about −0.63 to about 0.37 and a value of b* in a range from about −1.04 to about −0.04 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided. | 07-21-2011 |
20110174674 | COLORED DEVICE CASING AND SURFACE-TREATING METHOD FOR FABRICATING SAME - A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. A portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 51.00 to about 53.00, a value of a* in a range from about −1.04 to about −0.04 and a value of b* in a range from about 1.88 to about 2.88 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided. | 07-21-2011 |
20110175500 | COLORED DEVICE CASING AND SURFACE-TREATING METHOD FOR FABRICATING SAME - A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. A portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 75.26 to about 77.26, a value of a* in a range from about 0.42 to about 1.42 and a value of b* in a range from about 9.36 to about 10.36 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided. | 07-21-2011 |
20110177351 | COLORED DEVICE CASING AND SURFACE-TREATING METHOD FOR FABRICATING SAME - A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. The color layer includes at least one metal layer. Portion of the color layer corresponding to and located over the smooth region has a value for L* in a range from about 18.14 to about 19.14, a value for a* in a range from about 13.39 to about 14.39 and a value for b* in a range from about −32.46 to about −31.46 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided. | 07-21-2011 |
20110177357 | COLORED DEVICE CASING AND SURFACE-TREATING METHOD FOR FABRICATING SAME - A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. The color layer includes titanium. Portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 39.68 to about 41.68, a value of a* in a range from about 4.80 to about 5.80 and a value of b* in a range from about 6.88 to about 7.88 according to the Commission Internationale del'Eclairage, (CIE, International Commission on Illumination) LAB system. A surface-treating method for fabricating the colored casing is also provided. | 07-21-2011 |
20120242932 | LIQUID CRYSTAL DISPLAY - A liquid crystal display includes a first flat glass substrate, an opposite second flat glass substrate, a liquid crystal layer sandwiched therebetween, a backlight module disposed adjacent to the first flat glass substrate, a color filter disposed adjacent to the second flat glass substrate, a bandpass filter member disposed on the color filter. The bandpass filter member is configured for allowing light of a given spectrum emitted from the backlight module to pass therethrough and blocking light that is not in the given spectrum from passing therethrough, and a touch panel disposed adjacent to the bandpass filter member. | 09-27-2012 |
20130057950 | OPTICAL LENS WITH ANTI-REFLECTION FILM AND LENS MODULE - An optical lens includes a lens body and an anti-reflection film. The lens body includes an optically effective portion and a peripheral portion surrounding the optically effective portion. The optically effective portion is configured for transmitting light therethrough. The optically effective portion has a first surface and an opposite second surface. The first and second surfaces each have a curvature of greater than zero. The anti-reflection film is formed on the first surface of the optically effective portion. A reflectivity of the anti-reflection film to light rays has wavelengths in a range from about 400 nm to about 850 nm being lower than 2%. | 03-07-2013 |
20130286470 | INFRARED-CUT FILTER WITH SAPPHIRE SUBSTRATE AND LENS MODULE - An IR-cut filter includes a substrate and a film. The substrate made of sapphire. The film is covered on the substrate and is configured for increasing reflectivity of infrared lights and filtering the infrared lights. The film includes a plurality of high refractive index layers and a plurality of low refractive index layers alternately stacked on the substrate. The refractive index of the high refractive index layers is greater than about 2.0, and the refractive index of the low refractive index layers is lower than about 1.5. | 10-31-2013 |