Patent application number | Description | Published |
20090015277 | DEVICE FOR TESTING ELECTRONIC COMPONENTS, IN PARTICULAR ICS, HAVING A SEALING BOARD ARRANGED INSIDE A PRESSURE TEST CHAMBER - In a device for testing electronic components, in particular ICs, under particular pressure conditions, the pressure test chamber comprises contact elements ( | 01-15-2009 |
20100206768 | DEVICE AND METHOD FOR ALIGNING AND HOLDING A PLURALITY OF SINGULATED SEMICONDUCTOR COMPONENTS IN RECEIVING POCKETS OF A TERMINAL CARRIER - In a device and a method for aligning and holding a plurality of singulated semi-conductor components in receiving pockets of a terminal carrier ( | 08-19-2010 |
20100290634 | METHOD AND DEVICE FOR TESTING AND CALIBRATING ELECTRONIC SEMICONDUCTOR COMPONENTS WHICH CONVERT SOUND INTO ELECTRICAL SIGNALS - A method for testing and calibrating electronic semiconductor components which convert sound into electrical signals acoustically irradiates the components in a sound chamber whose largest free length is less than half the wavelength of the highest frequency of the sound waves produced during the test. | 11-18-2010 |
20100303589 | PLUNGER FOR HOLDING AND MOVING ELECTRONIC COMPONENTS IN PARTICULAR ICS - A plunger for holding and moving electrical components in particular IC's to and from a contacting device connected to a test bed, comprises a head piece with a fluid distribution chamber through which temperature-controlled fluid flows. A suction head is arranged such that the temperature-controlled fluid flows around the suction head and is diverted along the suction head to the component. | 12-02-2010 |
20110006183 | DEVICE AND METHOD FOR ALIGNING AND HOLDING A PLURALITY OF SINGULATED SEMICONDUCTOR COMPONENTS IN RECEIVING POCKETS OF A TERMINAL CARRIER - In a device and a method for aligning and holding a plurality of singulated semi-conductor components in receiving pockets of a terminal carrier that are separated from each other, the terminal carrier has spring elements, which are part of a spring plate. The spring plate has a plurality of recesses disposed next to each other for forming a corresponding plurality of receiving pockets for the semi-conductor components, wherein the spring elements are formed from the spring plate in one piece. | 01-13-2011 |
20110043231 | SYSTEM FOR POST-PROCESSING OF ELECTRONIC COMPONENTS - A method of post-processing a plurality of electronic components in a post-processing machine after fabrication of the electronic components including providing a carrier with align fixtures, which align fixtures have a clamping mechanism, actuating the clamping mechanism to enlarge a size of receptacles, each of the receptacles is assigned to one of the align fixtures and the enlarged receptacles are larger than the electronic components to be received, positioning the electronic components in the receptacles of the align fixtures, actuating the clamping mechanism to reduce a size of the receptacles so that the electronic components are aligned within the receptacles of the carrier, placing the carrier in the post processing machine, and subjecting the electronic components to operations of the post-processing machine while the electronic components maintain in aligned positions in the receptacles of the carrier. | 02-24-2011 |
20130299386 | DEVICE AND METHOD FOR ALIGNING AND HOLDING A PLURALITY OF SINGULATED SEMICONDUCTOR COMPONENTS IN RECEIVING POCKETS OF A TERMINAL CARRIER - In a device and a method for aligning and holding a plurality of singulated semi-conductor components in receiving pockets of a terminal carrier that are separated from each other, the terminal carrier has spring elements, which are part of a spring plate. The spring plate has a plurality of recesses disposed next to each other for forming a corresponding plurality of receiving pockets for the semi-conductor components, wherein the spring elements are formed from the spring plate in one piece. | 11-14-2013 |
20140167798 | SYSTEM FOR POST-PROCESSSING OF ELECTRONIC COMPONENTS - A method of post-processing a plurality of electronic components in a post-processing machine after fabrication of the electronic components including providing a carrier with align fixtures, which align fixtures have a clamping mechanism, actuating the clamping mechanism to enlarge a size of receptacles, each of the receptacles is assigned to one of the align fixtures and the enlarged receptacles are larger than the electronic components to be received, positioning the electronic components in the receptacles of the align fixtures, actuating the clamping mechanism to reduce a size of the receptacles so that the electronic components are aligned within the receptacles of the carrier, placing the carrier in the post processing machine, and subjecting the electronic components to operations of the post-processing machine while the electronic components maintain in aligned positions in the receptacles of the carrier. | 06-19-2014 |
20140327202 | DEVICE AND METHOD FOR ALIGNING AND HOLDING A PLURALITY OF SINGULATED SEMICONDUCTOR COMPONENTS IN RECEIVING POCKETS OF A TERMINAL CARRIER - In a device and a method for aligning and holding a plurality of singulated semi-conductor components in receiving pockets of a terminal carrier that are separated from each other, the terminal carrier has spring elements, which are part of a spring plate. The spring plate has a plurality of recesses disposed next to each other for forming a corresponding plurality of receiving pockets for the semi-conductor components, wherein the spring elements are formed from the spring plate in one piece. | 11-06-2014 |