Patent application number | Description | Published |
20100243717 | SOLDERING FLUX, SOLDER PASTE COMPOSITION AND SOLDERING METHOD - Provided is a soldering flux in which the volatilized amount in reflowing is reduced to enable soldering with a small environmental load while suppressing the stickiness of the flux residue to ensure a high reliability, as well as a solder paste composition and a soldering method using the same. The soldering flux comprises a base resin, an activating agent, and a solvent, wherein the solvent comprises an organic acid anhydride being liquid form at 20° C. or higher and a polyhydric alcohol being liquid form at 20° C. or higher, and when the acid value and the content of the organic acid anhydride is AV (mgKOH/g) and W | 09-30-2010 |
20100252144 | SOLDERING FLUX AND SOLDER PASTE COMPOSITION - There is provided a soldering flux in which the volatilized amount in reflow is reduced to enable soldering with a smaller environmental load while suppressing the stickiness of the flux residue and ensuring a high reliability. A solder paste composition using the same is also provided. The soldering flux comprises a base resin, an activating agent, and a solvent, wherein the solvent comprises an oil component having an iodine value of 120 to 170. Preferably, the content of the oil component is 22 to 80% by weight relative to the whole flux. Also, the oil component preferably contains at least one of drying oil and semidrying oil, and more preferably contains one or more kinds selected from tung oil, poppy-seed oil, walnut oil, safflower oil, sunflower oil, and soy bean oil. The solder paste composition comprises the soldering flux described above and a solder alloy powder. | 10-07-2010 |
20110036628 | SOLDER BONDING STRUCTURE AND SOLDERING FLUX - Disclosed is a solder bonding structure which is capable of retaining sufficient solder bonding strength and ensuring high bonding reliability even in severe environments having an extremely large temperature difference. In the solder bonding structure, an electronic component | 02-17-2011 |
Patent application number | Description | Published |
20090015135 | LIGHT EMITTING DEVICE - A semiconductor light emitting element which is primarily composed of GaN and which emits blue light is provided with a fluorescent layer, and the fluorescent layer includes fluorescent particles formed of a YAG fluorescent substance. By synthesis between yellow light emitted from the fluorescent particles and the blue light, white light is obtained. Fine particles, such as silica, adhere to the peripheries of the fluorescent particles forming the fluorescent layer, and between the particles, air layers are formed. The air layers each function as a heat insulating layer and can suppress an increase in temperature of the fine particles when an environmental temperature is increased. Hence, luminous efficiency of the fluorescent particles is not likely to vary, and the change in luminescent color can be suppressed. | 01-15-2009 |
20090110017 | SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND METHOD OF MANUFACTURING THE SAME - A semiconductor light-emitting element includes a semiconductor layer including a light-emitting layer, a refractive index gradient layer provided on a light extraction surface of the semiconductor layer, and a holding substrate bounded to an outer surface of the refractive index gradient layer with an adhesion layer interposed therebetween. A refractive index of the refractive index gradient layer is changed continuously or stepwise in a film thickness direction such that a semiconductor-layer-side refractive index is substantially equivalent to a refractive index of the semiconductor layer and a holding-substrate-side refractive index is substantially equivalent to a refractive index of the holding substrate. The refractive index gradient layer is formed by vapor plating. | 04-30-2009 |
20090231857 | ILLUMINATING DEVICE - A recess is formed in a substrate. A bare chip, i.e., a light-emitting diode, is installed in the recess and connected to conductive members on the substrate with leads. A light-guiding layer composed of a light-guiding elastomer is disposed on the surface of the substrate. A light-guiding cover layer is bonded on the surface, and the bare chip and the leads are embedded in the elastomer. Light emitted from the bare chip passes through the light-guiding elastomer and is guided along the surface of the substrate to an illumination portion. Since the bare chip and the leads are embedded in the elastomer, failures such as disconnections of the leads under application of external force are suppressed. | 09-17-2009 |
20100026632 | DISPLAY DEVICE - A reflective display portion includes indication and background portions. A first reflective layer is formed on the indication portion, and a second reflective layer is formed on the background portion on an outer surface of a translucent sheet. Each of the indication and the background portions has a different reflectance value. A light limiting layer is formed on an inner surface of the sheet at an inner side of the second reflective layer so as to reduce a difference of a light transmittance between the indication portion and the background portion. When the external light reflects, the indication portion and the background portion of the reflective display portion are observable owing to the difference of the light reflectance. The light from the light emitting display portion transmits the indication and background portions such that the display content of the light emitting display portion is observable. | 02-04-2010 |
20100118560 | CAPACITANCE-TYPE SENSOR - A plurality of detection electrodes, connection electrodes, and wires are integrally formed on one surface of a light guide to produce a capacitance-type sensor integral with the light guide. The electrodes are partially formed on a curved portion of the light guide. A resin layer allows an outer case and the light guide to be tightly secured to each other. | 05-13-2010 |