Patent application number | Description | Published |
20090014750 | RESIN FOR OPTICAL SEMICONDUCTOR ELEMENT ENCAPSULATION CONTAINING POLYBOROSILOXANE - The present invention relates to a resin for optical semiconductor element encapsulation containing a polyborosiloxane obtained by reacting a silicon compound with a boron compound; and an optical semiconductor device containing the resin and an optical semiconductor element encapsulated with the resin. The resin for optical semiconductor element encapsulation according to the invention exhibits an excellent advantage that it is excellent in all of heat resistance, transparency, and light resistance. | 01-15-2009 |
20090018307 | RESIN FOR OPTICAL SEMICONDUCTOR ELEMENT ENCAPSULATION CONTAINING POLYIMIDE - The present invention relates to a resin for optical semiconductor element encapsulation containing a polyimide which is obtained by an imidation of a polyimide precursor obtained by a polycondensation of an aliphatic acid dianhydride with an aliphatic or aromatic diamine compound; and an optical semiconductor device containing the resin and an optical semiconductor element encapsulated with the resin. The resin for optical semiconductor element encapsulation according to the present invention exhibits excellent advantages that it has a high light-transmitting property, is excellent in heat resistance, and shows an excellent light resistance even against short-wavelength light. | 01-15-2009 |
20090121255 | RESIN FOR OPTICAL-SEMICONDUCTOR-ELEMENT ENCAPSULATION CONTAINING POLYIMIDE AND OPTICAL SEMICONDUCTOR DEVICE OBTAINED WITH THE SAME - The present invention relates to a resin for optical-semiconductor-element encapsulation containing a polyimide which is produced by imidizing a polyimide precursor obtained by subjecting 5-norbornene-2,3-dicarboxylic anhydride or maleic anhydride, an aliphatic tetracarboxylic dianhydride, and an aliphatic diamine compound to a condensation polymerization reaction. The resin of the invention has excellent heat resistance and excellent light-transmitting properties. In addition, the present invention also relates to an optical semiconductor device containing an optical semiconductor element encapsulated with the resin. | 05-14-2009 |
20090134426 | RESIN FOR OPTICAL-SEMICONDUCTOR-ELEMENT ENCAPSULATION AND OPTICAL SEMICONDUCTOR DEVICE OBTAINED WITH THE SAME - The present invention relates to a resin for optical-semiconductor-element encapsulation obtained by reacting a silicon compound with a boron compound or an aluminum compound, wherein the silicon compound is represented by the following formula (I): | 05-28-2009 |
20090146323 | RESIN FOR OPTICAL-SEMICONDUCTOR-ELEMENT ENCAPSULATION CONTAINING POLYALUMINOSILOXANE AND OPTICAL SEMICONDUCTOR DEVICE OBTAINED WITH THE SAME - The present invention relates to a resin for optical-semiconductor-element encapsulation which comprises a polyaluminosiloxane obtained by reacting a silicon compound with an aluminum compound, and an optical semiconductor device obtained with the resin. The resin has satisfactory light-transmitting properties and low hygroscopicity and suffers no discoloration when used at a high temperature. | 06-11-2009 |
20090283719 | THERMOSETTING COMPOSITION - A thermosetting composition containing an aluminosiloxane and an epoxy silicone. The thermosetting composition of the present invention is suitably used for, for example, photosemiconductor devices mounted with blue or white LED elements (backlights for liquid crystal displays, traffic lights, outdoor big displays, advertisement sign boards, and the like). | 11-19-2009 |
20100053960 | MICROLENS ARRAY - The present invention provides a microlens array produced by molding a resin obtained by reacting a silicon compound with a boron compound or an aluminum compound, in which the silicon compound is represented by the following formula (I): | 03-04-2010 |
20100059788 | THERMOSETTING COMPOSITION - A thermosetting composition containing an aluminosiloxane, a silicone oil containing silanol groups at both ends, and a silicone alkoxy oligomer. The thermosetting composition of the present invention can be used for, for example, encapsulating materials, coating materials, molding materials, surface-protecting materials, adhesive agents, bonding agents, and the like. Especially, in a case where the thermosetting composition of the present invention is used as an encapsulating material, the thermosetting composition is suitably used for, for example, photosemiconductor devices mounted with blue or white LED elements (backlights for liquid crystal displays, traffic lights, outdoor big displays, advertisement sign boards, and the like). | 03-11-2010 |
20100075158 | THERMOSETTING COMPOSITION - A thermosetting composition containing an aluminosiloxane, a silicone oil containing silanol groups at both ends, an epoxy silicone, and a silicone elastomer. The thermosetting composition of the present invention can be used for, for example, encapsulating materials, coating materials, molding materials, surface-protecting materials, adhesive agents, bonding agents, and the like. Especially, in a case where the thermosetting composition of the present invention is used as an encapsulating material, the thermosetting composition is suitably used for, for example, photosemiconductor devices mounted with blue or white LED elements (backlights for liquid crystal displays, traffic lights, outdoor big displays, advertisement sign boards, and the like). | 03-25-2010 |