Patent application number | Description | Published |
20080197414 | METHOD OF FORMING A THIN FILM COMPONENT - Embodiments of methods, apparatuses, devices, and/or systems for forming a thin film component are described. | 08-21-2008 |
20090032890 | MULTILAYER DIELECTRIC - An apparatus and method relating to a first inorganic dielectric layer having a first concentration of defects and a second inorganic dielectric layer in contact with a first layer and having a second lesser concentration of defects are disclosed. | 02-05-2009 |
20090126977 | MULTILAYER FILM - This disclosure describes system(s) and/or method(s) enabling contacts for individual nanometer-scale-thickness layers of a multilayer film. | 05-21-2009 |
20090200541 | MAKING A STRUCTURE - A structure includes a surface and a non-equilibrium two-dimensional semiconductor micro structure on the surface. | 08-13-2009 |
20100089630 | Crossover - A crossover is formed by imprinting a channel, by depositing a first conductor in the channel, by anodizing a surface of the first conductor and by electroforming a second conductor across the first conductor. | 04-15-2010 |
20100279514 | MULTILAYER DIELECTRIC - A method forms a first inorganic dielectric layer having a first concentration of defects and a second inorganic dielectric layer in contact with a first layer and having a second lesser concentration of defects. | 11-04-2010 |
20110050808 | PIEZOELECTRIC PRINTHEAD AND RELATED METHODS - A piezoelectric printhead and related methods provide a first metallic electrode and a second metallic electrode deposited over a top surface and a bottom surface, respectively, of a piezoceramic plate. The second electrode is segmented into a plurality of electrode segments. A diaphragm is positioned over a plurality of pressure chambers, where the diaphragm includes a conductor positioned over each chamber. The piezoceramic plate is attached to the diaphragm such that each conductor on the diaphragm faces multiple electrode segments. | 03-03-2011 |
20110102484 | A DISPLAY - A display includes a plurality of display elements. Each display element includes two opposed electrodes, a first dielectric layer, a fluid including a plurality of colorants, and a second dielectric layer. The first dielectric layer is disposed between the electrodes and has at least one reservoir defined therein. The second dielectric layer exhibits non-linear resistance, and is disposed on at least one of the electrodes and adjacent to the fluid. The fluid is disposed in a space defined between the electrodes, and the plurality of colorants is configured to move in response to an applied electric field. | 05-05-2011 |
20110102516 | Printhead unit - Piezoelectric unit, comprising a fluid chamber, a fluid outlet, an actuator, comprising a thin film piezoceramic element and a membrane, acting as a wall of the fluid chamber, and a support element arranged for preventing a supported portion of the actuator from movement in a main direction of actuation movement of the actuator, while allowing such actuation movement on at least two sides of the supported portion, wherein the support element is connected to a unit portion that extends approximately opposite to the actuator. | 05-05-2011 |
20110310182 | PRINTHEAD AND METHOD OF FABRICATING THE SAME - Disclosed is a printhead having at least one ink drop generator region, which includes an ink chamber, an orifice through which ink drops are ejected, and a heating element positioned below the ink chamber. The heating element includes a resistor defined therein and a nano-structured surface that is exposed to the ink fluid supplied to the ink chamber. The nano-structured surface takes the form of an array of nano-pillars. The printhead is fabricated by a method that includes: forming a heating element having an oxidizable metal layer as the uppermost layer; forming an aluminum-containing layer on the oxidizable metal layer; anodizing the aluminum-containing layer to form porous alumina; anodizing the oxidizable metal layer so as to partially fill the pores in the porous alumina with metal oxide material; and removing the porous alumina by selective etching to produce a nano-structured surface. | 12-22-2011 |
20120013685 | THERMAL INKJET PRINTHEAD WITH HEATING ELEMENT IN RECESSED SUBSTRATE CAVITY - An inkjet printhead includes a substrate having a recessed cavity formed therein. The cavity has a continuous sidewall around the perimeter of the cavity. The printhead includes a heating element formed onto the sidewall of the cavity. | 01-19-2012 |
20120014820 | REPAIRING DEFECTS IN A PIEZOELECTRIC MEMBER - A solution ( | 01-19-2012 |
20120062355 | NANOFLAT RESISTOR - A nanoflat resistor includes a first aluminum electrode ( | 03-15-2012 |
20120102695 | PIEZOELECTRIC PRINTHEAD AND RELATED METHODS - A piezoelectric printhead and related methods provide a first metallic electrode and a second metallic electrode deposited over a top surface and a bottom surface, respectively, of a piezoceramic plate. The second electrode is segmented into a plurality of electrode segments. A diaphragm is positioned over a plurality of pressure chambers, where the diaphragm includes a conductor positioned over each chamber. The piezoceramic plate is attached to the diaphragm such that each conductor on the diaphragm faces multiple electrode segments. | 05-03-2012 |
20120120160 | PIEZOELECTRIC ACTUATOR HAVING EMBEDDED ELECTRODES - A piezoelectric actuator includes a thin film sheet, a first electrode, and a second electrode. The thin film sheet is to physically deform in response to an electric field induced within the thin film sheet. The first electrode is embedded within the thin film sheet. The second electrode is embedded within the thin film sheet, and is interdigitated in relation to the first electrode. The electric field is induced within the thin film sheet via application of a voltage across the first and the second electrodes. | 05-17-2012 |
20120187804 | ARCHITECTURE FOR PIEZOELECTRIC MEMS DEVICES - A piezoelectric thin film device comprises a piezoelectric thin film having upper and lower surfaces and a defined tilted crystal morphology, a top electrode disposed on the upper surface, a substrate having a surface morphology that corresponds to the defined crystallographically tilted morphology, and a bottom electrode disposed between and crystallographically linked to both the lower surface of the piezoelectric thin film and the substrate surface, the bottom and top electrodes having a parallel planar configuration relative to the plane of the substrate and the defined crystallographically tilted morphology having a crystallographic c-axis direction oriented at a >0° angle relative to the normal to the plane of the electrodes; and method of making the device. | 07-26-2012 |
20130105594 | PIEZOELECTRIC MECHANISM HAVING ELECTRODES WITHIN THIN FILM SHEET THAT ARE SUBSTANTIALLY PERPENDICULAR TO SUBSTRATE | 05-02-2013 |
20130153812 | LEAD-FREE PIEZOELECTRIC MATERIALS WITH ENHANCED FATIGUE RESISTANCE - A lead-free piezoelectric ceramic material has the general chemical formula xBi(A | 06-20-2013 |
20130161556 | LEAD-FREE PIEZOELECTRIC MATERIAL BASED ON BISMUTH ZINC TITANATE-BISMUTH POTASSIUM TITANATE-BISMUTH SODIUM TITANATE - A lead-free piezoelectric ceramic material has the general chemical formula xBi(Zn | 06-27-2013 |
20130168253 | NANO-STRUCTURE AND METHOD OF MAKING THE SAME - A nano-structure ( | 07-04-2013 |
20130171418 | METHOD OF FORMING A NANO-STRUCTURE - A method of forming a nano-structure ( | 07-04-2013 |
20130175177 | METHOD OF FORMING A NANO-STRUCTURE - A method of forming a nano-structure ( | 07-11-2013 |
20130177738 | METHOD OF FORMING A MICRO-STRUCTURE - A method of forming a micro-structure ( | 07-11-2013 |
20130186855 | NANO-STRUCTURED SURFACE - A method of forming a nano-structured substrate is provided, the method comprising including forming non-integral nano-pillars on a substrate surface and directionally etching the substrate surface using the non-integral nano-pillars as a mask to form integral nano-structures in the substrate. | 07-25-2013 |
20130189497 | NANO-SCALE STRUCTURES - Nano-scale structures are provided wherein nano-structures are formed on a substrate surface and a base material is applied between the nano-structures. | 07-25-2013 |
20130192992 | ADHESION-PROMOTING SURFACE - An article is provided, the article including a substrate having a surface, a nano-structure array formed on the substrate, the nano-structure array including a plurality of nano-structures extending from the surface of the substrate, and a cover layer formed on and around the nano-structures to anchor the cover layer to the substrate. | 08-01-2013 |
20130192993 | ARTICLE WITH CONTROLLED WETTABILITY - An article is provided, the article including a substrate having a surface with a first wettability characteristic. A nano-structure array is formed on the surface of the substrate to provide a nano-structured surface having a second wettability characteristic. A thin-layer surface coating is formed on the nano-structured surface, the thin-layer surface coating being configured to tune the nano-structured surface to a target wettability characteristic. | 08-01-2013 |
20130286102 | Fluid Ejection Device Having Firing Chamber With Contoured Floor - A fluid ejection device includes a firing chamber having a chamber floor with an orifice opposite the chamber floor and a heating element partially covering the chamber floor, a region of the chamber floor being contoured to define a cavity extending into the chamber floor. | 10-31-2013 |
20130286104 | Thermal Fluid-Ejection Echanism Having Heating Resistor On Cavity Sidewalls - A thermal fluid-ejection mechanism includes a substrate having a top surface. A cavity formed within the substrate has one or more sidewalls and a floor. The angle of the sidewalls from the floor is greater than or equal to nominally ninety degrees. The thermal fluid-ejection mechanism includes a patterned conductive layer on one or more of the substrate's top surface and the cavity's sidewalls. The thermal fluid-ejection mechanism includes a patterned resistive layer on the sidewalls of the cavity. The patterned resistive layer is located over the patterned conductive layer where the patterned conductive layer is formed on the sidewalls of the cavity. The patterned resistive layer is formed as a heating resistor of the thermal-fluid ejection mechanism. The conductive layer is formed as a conductor of the thermal-fluid ejection mechanism, to permit electrical activation of the heating resistor to cause fluid to be ejected from the thermal fluid-ejection mechanism. | 10-31-2013 |
20130292253 | FORMATION OF CAPPED NANO-PILLARS - Formation of an article having capped nano-pillars is provided for herein, the article including a substrate with a nano-structure array formed thereon, the nano-structure array including a plurality of nano-pillars having stem portions of a first thickness and cap portions of a second thickness, different than the first thickness. | 11-07-2013 |
20130293638 | Fluid Ejection Device Having Firing Chamber With Mesa - A fluid ejection device includes a firing chamber having an ejection orifice opposite a chamber floor, a heating element and a mesa projecting from the chamber floor, the mesa is spaced from the heating element to define a passive zone between the mesa and heating element. | 11-07-2013 |
20130321507 | COMPENSATING FOR CAPACITANCE CHANGES IN PIEZOELECTRIC PRINTHEAD ELEMENTS - In an embodiment, a method of compensating for capacitance change in a piezoelectric element of a fluid ejection device includes sensing a current driving a piezoelectric element, determining from the current that capacitance of the piezoelectric element has changed, and altering a rise time of the current driving the piezoelectric element to compensate for the changed capacitance. | 12-05-2013 |
20130321531 | RING-TYPE HEATING RESISTOR FOR THERMAL FLUID-EJECTION MECHANISM - A ring-type heating resistor for a thermal fluid-ejection mechanism includes resistive segments and conductive segments. The resistive segments are rectangular in shape. The resistive segments are separated from one another. The conductive segments are interleaved in relation to the resistive segments such that each conductive segment electrically connects two of the resistive segments. The resistive segments and the conductive segments together form a pseudo-ring that approximates a true ring. | 12-05-2013 |
20130335487 | SHEAR MODE PHYSICAL DEFORMATION OF PIEZOELECTRIC MECHANISM - A piezoelectric mechanism includes first and second electrodes and a thin film sheet of piezoelectric material. The second electrode is interdigitated in relation to the first electrode. The first and the second electrodes are embedded within the thin film sheet. The thin film sheet is polarized in a direction at least substantially perpendicular to a surface of the thin film sheet. The thin film sheet is to physically deform in a shear mode due to polarization of the thin film sheet at least substantially perpendicular to the surface of the thin film sheet, responsive to an electric field induced within the thin film sheet at least substantially parallel to the sheet via application of a voltage across the first and the second electrodes. | 12-19-2013 |
20140104344 | HEATING RESISTOR - A heating element of a fluid ejection device, the heating element including a ring-type body, an inner edge of the body, and an outer edge of the body, wherein at least one of the inner edge and the outer edge defines an undulated surface contour. | 04-17-2014 |
20140174941 | DEPOSITING NANO-DOTS ON A SUBSTRATE - A method of depositing nano-dots on a substrate includes forming a template on the base, the template defining nano-pores, at least partially filling the nano-pores with a pillar material to define nano-pillars, depositing a dot material on the nano-pillars to define nano-dots on the nano-pillars, and contact printing the substrate with the array of nano-dots. | 06-26-2014 |
20140319972 | FILM STACK INCLUDING ADHESIVE LAYER - An example provides an apparatus including a substrate, a metal layer, and an adhesive layer adhered between the substrate and the metal layer, the adhesive layer comprising zinc-gallium oxide, zinc-indium oxide, zinc-gallium-tin oxide, or zinc-indium-tin oxide. | 10-30-2014 |
20140322523 | FILM STACK INCLUDING ADHESIVE LAYER - An example provides an apparatus including a substrate, a metal layer, and an adhesive layer adhered between the substrate and the metal layer, the adhesive layer comprising indium oxide, tin oxide, gallium oxide, indium-tin oxide, indium-gallium oxide, tin-gallium oxide, or indium-tin-gallium oxide. | 10-30-2014 |