Patent application number | Description | Published |
20080207848 | Organopolysiloxane and Curable Silicone Composition that Contains Aforementioned Organopolysiloxane - A curable silicone composition containing an organopolysiloxane that contains in one molecule at least one epoxy-containing organic group, has a polystyrene-referenced weight-average molecular weight at least 500, and is expressed by the following general unit formula: (RSiO | 08-28-2008 |
20080262158 | Curable Organopolysiloxane Composition, Method of Curing Thereof, Semiconductor Device, and Adhesion Promoter - A curable organopolysiloxane composition comprising an organopolysiloxane containing alkenyl groups and phenyl groups, an organohydrogenpolysiloxane, a copolymer of a vinyl monomer and a vinyl monomer with hydrosilyl groups, and a platinum catalyst; a curing process that consists of two or more stages of thermal curing; an optical semiconductor device that has a light-transmitting portion made from a cured body of the aforementioned composition; and an adhesion promoter that consists of a copolymer of a vinyl monomer and a vinyl monomer with hydrosilyl groups. | 10-23-2008 |
20080319144 | Silicone Resin Composition, Curable Resin Composition, and Cured Resin - A silicone resin composition comprising a mixture or a reaction mixture of (A) a silicone resin having a softening point above 25° C. and represented by the following average unit formula: (R | 12-25-2008 |
20090214870 | Curable Silicone Composition And Electronic Device Produced Therefrom - A curable silicone composition comprising: (A) a diorganosiloxane represented by the following general formula: A-R | 08-27-2009 |
20090247681 | Curable Silicone Composition And Cured Product Therefrom - A curable silicone composition comprising: (A) an organopolysiloxane that is represented by the average unit formula: (R | 10-01-2009 |
20090294796 | Adhesive-Promoting Agent, Curable Organopolysiloxane Composition, and Semiconductor Device - An adhesion-promoting agent represented by the following average formula: R | 12-03-2009 |
20100022704 | Curable Silicone Composition And Cured Body Thereof - A curable silicone composition comprising at least the following components: (A) a diorganopolysiloxane represented by the following general formula: X—R | 01-28-2010 |
20100144928 | Curable Epoxy Resin Composition, Cured Body Thereof, and Use Thereof - A curable epoxy resin composition comprising at least the following components: (I) an epoxy resin; (II) a curing agent for an epoxy resin; (III) a diorganosiloxane having on both molecular terminals siloxane residual radicals represented by the following average unit formula: (XR | 06-10-2010 |
20100209707 | CROSS-LINKED SILICONE PARTICLES AND METHOD OF MANUFACTURING THEREOF - Cross-linked silicone particles, which have secondary amino groups represented by general formula: R | 08-19-2010 |
20100213404 | Curable Silicone Composition And Cured Product Thereof - A curable silicone composition comprising: (A) a liquid organopolysiloxane having in one molecule at least two epoxy groups; (B) a compound containing groups react to the epoxy groups; (C) a thermally conductive filler; and (D) a silicone powder, preferably, an epoxy-containing silicone powder; possesses excellent handleability and workability in combination with low viscosity and that, when cured, forms a cured body of excellent elasticity, adhesiveness, and thermal conductivity. | 08-26-2010 |
20100213623 | Method Of Manufacturing A Semiconductor Device And A Semiconductor Device Produced Thereby - A method of manufacturing a semiconductor device sealed in a cured silicone body by placing an unsealed semiconductor device into a mold and subjecting a curable silicone composition which is fed into the space between the mold and the unsealed semiconductor device to compression molding, the method being characterized by the fact that the aforementioned curable silicone composition comprises at least the following components: (A) an epoxy-containing silicone and (B) a curing agent for an epoxy resin; can reduce warping of the semiconductor chips and circuit board, and improve surface resistance to scratching. | 08-26-2010 |
20100216913 | Curable Epoxy Resin Composition and Cured Product Thereof - A curable epoxy resin composition comprising: (I) a curable epoxy resin; (II) an epoxy-resin curing agent; and (III) a silicone rubber powder obtained by curing a condensation-curable silicone rubber composition in a dispersed state in water, the powder having an epoxy equivalent measured by titration equal to or lower than 3,000 and an average particle size in the range of 0.1 to 100 μm, possesses excellent flowability and which, when cured, forms a cured product that in spite of low modulus of elasticity possesses high strength. | 08-26-2010 |
20100234520 | Curable Epoxy Resin Composition and Cured Body Thereof - A curable epoxy resin composition comprising: (I) an epoxy resin; (II) a curing agent for the epoxy-resin; (III) cross linked silicone particles characterized by having secondary amino groups represented by the following general formula: R | 09-16-2010 |
20100292400 | Curable Liquid Epoxy Resin Composition and Cured Product Thereof - A curable liquid epoxy resin composition comprising: (I) a liquid epoxy resin; (II) an acid anhydride; (III) a diorganosiloxane represented by the following general formula: A-R | 11-18-2010 |