Patent application number | Description | Published |
20080207848 | Organopolysiloxane and Curable Silicone Composition that Contains Aforementioned Organopolysiloxane - A curable silicone composition containing an organopolysiloxane that contains in one molecule at least one epoxy-containing organic group, has a polystyrene-referenced weight-average molecular weight at least 500, and is expressed by the following general unit formula: (RSiO | 08-28-2008 |
20080262158 | Curable Organopolysiloxane Composition, Method of Curing Thereof, Semiconductor Device, and Adhesion Promoter - A curable organopolysiloxane composition comprising an organopolysiloxane containing alkenyl groups and phenyl groups, an organohydrogenpolysiloxane, a copolymer of a vinyl monomer and a vinyl monomer with hydrosilyl groups, and a platinum catalyst; a curing process that consists of two or more stages of thermal curing; an optical semiconductor device that has a light-transmitting portion made from a cured body of the aforementioned composition; and an adhesion promoter that consists of a copolymer of a vinyl monomer and a vinyl monomer with hydrosilyl groups. | 10-23-2008 |
20080319144 | Silicone Resin Composition, Curable Resin Composition, and Cured Resin - A silicone resin composition comprising a mixture or a reaction mixture of (A) a silicone resin having a softening point above 25° C. and represented by the following average unit formula: (R | 12-25-2008 |
20090118441 | Curable Silicone Composition - A curable silicone composition comprising at least the following components: (A) a diorganopolysiloxane having in one molecule at least two alkenyl groups; (B) at least two resin-like organopolysiloxanes that have different mass-average molecular weights as reduced into standard polystyrene measured gel permeation chromatography and that are composed of SiO | 05-07-2009 |
20090179180 | Curable Organopolysiloxane Composition and Semiconductor Device - A curable organopolysiloxane composition comprises at least the following components: an organopolysiloxane (A) represented by the following general formula: R | 07-16-2009 |
20090203837 | Curable Silicone Composition And Electronic Components - A curable silicone composition comprising: (A) an organopolysiloxane that is represented by a specific average unit formula and that has at least two of the aforementioned epoxy-functional monovalent organic groups in each molecule; (B) a diorganosiloxane represented by the general formula: A-R | 08-13-2009 |
20090214870 | Curable Silicone Composition And Electronic Device Produced Therefrom - A curable silicone composition comprising: (A) a diorganosiloxane represented by the following general formula: A-R | 08-27-2009 |
20090247681 | Curable Silicone Composition And Cured Product Therefrom - A curable silicone composition comprising: (A) an organopolysiloxane that is represented by the average unit formula: (R | 10-01-2009 |
20090294796 | Adhesive-Promoting Agent, Curable Organopolysiloxane Composition, and Semiconductor Device - An adhesion-promoting agent represented by the following average formula: R | 12-03-2009 |
20100022704 | Curable Silicone Composition And Cured Body Thereof - A curable silicone composition comprising at least the following components: (A) a diorganopolysiloxane represented by the following general formula: X—R | 01-28-2010 |
20100063185 | Curable Silicone Composition and Electronic Component - A curable silicone composition comprising at least the following components: (A) an epoxy-containing organopolysiloxane; (B) a curing agent for epoxy resin; and (C) an epoxy compound represented by the specific general formula; is characterized by excellent handleability and reduced oil-bleeding, and, when cured, forms a cured body of excellent flexibility and adhesion. | 03-11-2010 |
20100113667 | Curable Silicone Composition and Electronic Component - A curable silicone composition comprising at least the following components: (A) an epoxy-containing organopolysiloxane; (B) a curing agent for an epoxy resin; (C) a thermally conductive metal powder; and (D) a thermally conductive nonmetal powder; exhibits low viscosity, excellent handleability and curability and, when cured, forms a cured body of flexibility, low specific gravity, and excellent thermal conductivity. An electronic component sealed or adhesively bonded with use of a cured body obtained by curing the aforementioned composition provides high reliability. | 05-06-2010 |
20100113730 | Diorganopolysiloxane And Method Of Manufacturing Thereof - A novel diorganopolysiloxane represented by the following general formula: X—R | 05-06-2010 |
20100140537 | Curable Silicone Composition - A curable silicone composition comprising at least the following components: (A) an organopolysiloxane that contains epoxy groups and, preferably, has a branched molecular structure; (B) a phenolic-type curing agent such as an organosiloxane having in one molecule at least two phenolic hydroxyl groups; and (C) an acidic-anhydride type curing agent such as a methylhexahydrophthalic anhydride, as well as an arbitrary components such as (D) a curing accelerator, (E) a filler, or (F) an organic epoxy compound; is characterized by excellent handleability and reduced oil-bleeding during curing, and, when cured, forms a cured body of excellent flexibility and adhesion. | 06-10-2010 |
20100144928 | Curable Epoxy Resin Composition, Cured Body Thereof, and Use Thereof - A curable epoxy resin composition comprising at least the following components: (I) an epoxy resin; (II) a curing agent for an epoxy resin; (III) a diorganosiloxane having on both molecular terminals siloxane residual radicals represented by the following average unit formula: (XR | 06-10-2010 |
20100209707 | CROSS-LINKED SILICONE PARTICLES AND METHOD OF MANUFACTURING THEREOF - Cross-linked silicone particles, which have secondary amino groups represented by general formula: R | 08-19-2010 |
20100213404 | Curable Silicone Composition And Cured Product Thereof - A curable silicone composition comprising: (A) a liquid organopolysiloxane having in one molecule at least two epoxy groups; (B) a compound containing groups react to the epoxy groups; (C) a thermally conductive filler; and (D) a silicone powder, preferably, an epoxy-containing silicone powder; possesses excellent handleability and workability in combination with low viscosity and that, when cured, forms a cured body of excellent elasticity, adhesiveness, and thermal conductivity. | 08-26-2010 |
20100213623 | Method Of Manufacturing A Semiconductor Device And A Semiconductor Device Produced Thereby - A method of manufacturing a semiconductor device sealed in a cured silicone body by placing an unsealed semiconductor device into a mold and subjecting a curable silicone composition which is fed into the space between the mold and the unsealed semiconductor device to compression molding, the method being characterized by the fact that the aforementioned curable silicone composition comprises at least the following components: (A) an epoxy-containing silicone and (B) a curing agent for an epoxy resin; can reduce warping of the semiconductor chips and circuit board, and improve surface resistance to scratching. | 08-26-2010 |
20100216913 | Curable Epoxy Resin Composition and Cured Product Thereof - A curable epoxy resin composition comprising: (I) a curable epoxy resin; (II) an epoxy-resin curing agent; and (III) a silicone rubber powder obtained by curing a condensation-curable silicone rubber composition in a dispersed state in water, the powder having an epoxy equivalent measured by titration equal to or lower than 3,000 and an average particle size in the range of 0.1 to 100 μm, possesses excellent flowability and which, when cured, forms a cured product that in spite of low modulus of elasticity possesses high strength. | 08-26-2010 |
20100216952 | Silicone Rubber Powder And Method Of Manufacturing Thereof - A silicone rubber powder obtained by curing a condensation-curable silicone rubber composition in a dispersed state in water, having an epoxy equivalent measured by a titration method equal to or lower than 3,000 and an average particle size in the range of 0.1 to 100 μm; and a method of manufacturing a silicone rubber powder comprising the steps of dispersing in water a silicone rubber composition comprising at least components (A) through (C) listed below; adding component (D); and curing the mixture: (A) a diorganopolysiloxane capped at both molecular terminals with silanol groups and having in one molecule 30 or less silicon atoms; (B) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms; (C) an epoxy-containing alkoxysilane; and (D) a condensation-reaction catalyst. The silicone rubber powder has low epoxy equivalent and possesses excellent dispersibility in organic resins, and the method is efficient in manufacturing of the aforementioned powder. | 08-26-2010 |
20100234520 | Curable Epoxy Resin Composition and Cured Body Thereof - A curable epoxy resin composition comprising: (I) an epoxy resin; (II) a curing agent for the epoxy-resin; (III) cross linked silicone particles characterized by having secondary amino groups represented by the following general formula: R | 09-16-2010 |
20100276721 | Light Emitting Device Encapsulated with Silicones and Curable Silicone Compositions for Preparing the Silicones - A composition includes: (I) an alkenyl functional, phenyl-containing polyorganosiloxane, an Si—H functional phenyl-containing polyorganosiloxane, or a combination thereof; (II) a hydrogendiorganosiloxy terminated oligodiphenylsiloxane having specific molecular weight, an alkenyl-functional, diorganosiloxy-terminated oligodiphenylsiloxane having specific molecular weight, or a combination thereof; and (III) a hydrosilylation catalyst. A light emitting device is made by applying the composition onto a light source followed by curing. The composition provides a cured material with mechanical properties suited for use as an encapsulant for a light emitting device. | 11-04-2010 |
20100292400 | Curable Liquid Epoxy Resin Composition and Cured Product Thereof - A curable liquid epoxy resin composition comprising: (I) a liquid epoxy resin; (II) an acid anhydride; (III) a diorganosiloxane represented by the following general formula: A-R | 11-18-2010 |