Patent application number | Description | Published |
20080238997 | HIGHLY INTEGRATED WAFER BONDED MEMS DEVICES WITH RELEASE-FREE MEMBRANE MANUFACTURE FOR HIGH DENSITY PRINT HEADS - A method of fabricating a MEMS inkjet type print head and the resulting device is disclosed. The method includes providing a driver component and separately providing an actuatable membrane component, the actuatable membrane component being formed in the absence of an acid etch removing a sacrificial layer. The separately provided actuatable membrane component is bonded to the driver component and a nozzle plate is attached to the actuatable membrane component subsequent to the bonding. Separately fabricating the components removes the need for hydrofluoric acid etch removal of a sacrificial layer previously required for forming the actuatable membrane with respect to the driver component. | 10-02-2008 |
20080239002 | CAST-IN PLACE INK FEED STRUCTURE USING ENCAPSULANT - A method of forming an enclosed fluid path in a print head includes providing a die member and a truncated nozzle plate spaced from the upper surface of the die member. The die and nozzle plate are formed on a print head substrate having an aperture formed therein. A sacrificial material is seated over the aperture of the print head substrate and joins a terminal end of the truncated nozzle plate. The sacrificial material is encapsulated from the terminal end of the nozzle plate to a surface of the print head substrate. Removal of the sacrificial material defines the fluid path from the aperture of the print head substrate to the nozzle plate. | 10-02-2008 |
20080242004 | INKJET PRINTED WIREBONDS, ENCAPSULANT AND SHIELDING - A method of connecting a chip to a package in a semiconductor device includes printing an encapsulant to a predetermined thickness on at least a portion of the chip and package and printing a layer of conductive material on the encapsulant in a predetermined pattern between the chip and package. The printed conductive material conforms to an upper surface of the encapsulant such that the encapsulant defines a distance from the printed conductive material to the chip and package. The method further includes printing a second layer of encapsulant over the printed conductive material curing at least the second layer of encapsulant. | 10-02-2008 |
20090014413 | SELF-ALIGNED PRECISION DATUMS FOR ARRAY DIE PLACEMENT - A method and resulting device for accurately positioning an array of die modules in an imaging array, including larger partial width arrays and full page width arrays, is described herein. The method includes forming physical reference datum directly on an individual silicon die module, and positioning the individual die modules on a temporary holder. The temporary holder includes an alignment tool and singulated die are placed onto the temporary holder by abutting the physical reference datum against the alignment tool. A vacuum temporarily secures the die positioned on the temporary holder, and a permanent substrate is then attached to the die of the temporary holder. The temporary holder is released in favor of the permanent substrate having the accurately aligned die modules thereon. | 01-15-2009 |
20090046125 | Maintainable Coplanar Front Face for Silicon Die Array Printhead - A full width array printhead is provided having a continuous maintainable printhead surface and method of forming the same. The printhead includes a substrate and an array of die modules mounted thereon with a front face of each die module exposed. A hardened fill material surrounds the array of die modules to define a continuous surface coplanar with the front face of the array of die modules. | 02-19-2009 |
20090201328 | SELF-ALIGNED PRECISION DATUMS FOR ARRAY DIE PLACEMENT - A method and resulting device for accurately positioning an array of die modules in an imaging array, including larger partial width arrays and full page width arrays, is described herein. The method includes forming physical reference datum directly on an individual silicon die module, and positioning the individual die modules on a temporary holder. The temporary holder includes an alignment tool and singulated die are placed onto the temporary holder by abutting the physical reference datum against the alignment tool. A vacuum temporarily secures the die positioned on the temporary holder, and a permanent substrate is then attached to the die of the temporary holder. The temporary holder is released in favor of the permanent substrate having the accurately aligned die modules thereon. | 08-13-2009 |
20090271979 | CIRCUITRY FOR PRINTER - A printing system includes a print head to deliver ink to an image receptor and at least one ink reservoir to deliver ink to the print head. Driving circuitry provides signals to the print head to control delivery of the ink and a flexible circuit interposed between the print head and the ink reservoirs connects the driving circuitry to the print head. The flexible circuit may include a heater to provide heat to the ink reservoirs. Alternatively, the flexible circuit may be replaced with a rigid substrate having a heater within its layers. | 11-05-2009 |
20090289994 | MAINTAINABLE COPLANAR FRONT FACE FOR SILICON DIE ARRAY PRINTHEAD - A full width array printhead is provided having a continuous maintainable printhead surface and method of forming the same. The printhead includes a substrate and an array of die modules mounted thereon with a front face of each die module exposed. A hardened fill material surrounds the array of die modules to define a continuous surface coplanar with the front face of the array of die modules. | 11-26-2009 |
20100077609 | BURIED TRACES FOR SEALED ELECTROSTATIC MEMBRANE ACTUATORS OR SENSORS - In accordance with the invention, there are micro-electromechanical devices and methods of fabricating them. An exemplary micro-electromechanical device can include a first dielectric layer; a buried conductive trace disposed over the first dielectric layer, such that the buried conductor trace is electrically connected to an outside power source; a second dielectric layer disposed over the buried conductive trace; at least one conductive electrode disposed over the second dielectric layer and electrically connected to the buried conductive trace; and at least one conductive membrane including membrane anchors disposed over the second dielectric layer, such that the at least one conductive membrane is electrically isolated from the at least one conductive electrode and the buried conductor trace, wherein the at least one conductive electrode is electrically connected to the power source through the buried conductive trace. | 04-01-2010 |
20100214361 | CAST-IN PLACE INK FEED STRUCTURE USING ENCAPSULANT - A method of forming an enclosed fluid path in a print head includes providing a die member and a truncated nozzle plate spaced from the upper surface of the die member. The die and nozzle plate are formed on a print head substrate having an aperture formed therein. A sacrificial material is seated over the aperture of the print head substrate and joins a terminal end of the truncated nozzle plate. The sacrificial material is encapsulated from the terminal end of the nozzle plate to a surface of the print head substrate. Removal of the sacrificial material defines the fluid path from the aperture of the print head substrate to the nozzle plate. | 08-26-2010 |
20100238227 | PRINTHEAD DE-PRIME SYSTEM AND METHOD FOR SOLID INK SYSTEMS - A system and method to provide pressure to de-prime a printhead. An image forming device comprises an ink reservoir that contains ink and provides the ink to a printhead. When a fault condition is detected that indicates a likelihood of a solidifying of the ink, the printhead is de-primed by applying pressure to the printhead to purge the ink from the printhead. The fault condition comprises any of a loss of power, a power-down process, or a printhead temperature being less than or equal to a threshold temperature. | 09-23-2010 |
20100265296 | INDEPENDENT ADJUSTMENT OF DROP MASS AND DROP SPEED USING NOZZLE DIAMETER AND TAPER ANGLE - Methods and systems of ejecting ink drops from an inkjet printer are disclosed. The methods and systems can include a printhead with one or more tapered nozzles each with an associated taper angle and exit diameter. Ink can be received into the printhead and formed into ink drops in the tapered nozzles. The ink drops can each have an associated drop mass and drop speed. The tapered nozzles can be provided such that the exit diameter can independently dictate the drop mass and the taper angle can independently dictate the drop speed. As such, the complexity of jet design optimization is reduced. | 10-21-2010 |
20100321432 | INK JET PRINTING SYSTEMS AND METHODS WITH PRE-FILL AND DIMPLE DESIGN - Systems and methods of ejecting ink drops from an inkjet printer are disclosed. The systems and methods can include a printhead with one or more actuators with associated nozzles and membranes A voltage waveform can be applied to the actuators to fill the actuators with a volume of ink and eject the ink through the nozzles as ink drops. The voltage waveform can have associated pre-fill voltage to fill the actuator with ink and a firing voltage to eject the ink. The actuator membranes can have multi-height dimples to protect the membranes from contacting electrodes and reduce the electric field. | 12-23-2010 |
20110175219 | METHOD FOR MODULAR ARRANGEMENT OF A SILICON BASED ARRAY AND MODULAR SILICON BASED ARRAY - A silicon based module, including: a substrate; a first chip assembly fixed to the substrate, the first chip assembly including a first silicon chip and a first driver die having electrical circuitry; and a second chip assembly fixed to the substrate, the second chip assembly including a second silicon chip and a second driver die having electrical circuitry. Portions of the first and second chip assemblies are aligned in a longitudinal direction for the substrate; and portions of the first and second silicon chips are aligned in a width direction orthogonal to the longitudinal direction. Method for forming a silicon based module. | 07-21-2011 |
20110242218 | INDEPENDENT ADJUSTMENT OF DROP MASS AND VELOCITY USING STEPPED NOZZLES - Methods and systems of ejecting ink drops from an inkjet printer are disclosed. The methods and systems can include a printhead with one or more stepped nozzles each with an associated entrance diameter and exit diameter. Ink can be received into the printhead and formed into ink drops in the stepped nozzles. The ink drops can each have an associated drop mass and drop speed. The stepped nozzles can be provided such that the exit diameter can independently dictate the drop mass and the entrance diameter can independently dictate the drop speed. As such, the complexity of jet design optimization is reduced. | 10-06-2011 |
20110254897 | SILICON INTERPOSER FOR MEMS SCALABLE PRINTING MODULES - A print module and a method of forming the same, the print module including a substrate, an ink jet die, and an interposer between the substrate and the ink jet die. The substrate includes an ink channel and an air vent, and the die includes a plurality of ink apertures. The interposer includes etched openings therein of a truncated pyramid shape; the openings of the interposer reconfiguring the ink channel and air vent passages between the substrate and die to allow for greater tolerance in alignment and manufacture of the print head module. | 10-20-2011 |
20110292126 | MOLDED NOZZLE PLATE WITH ALIGNMENT FEATURES FOR SIMPLIFIED ASSEMBLY - An ink jet print head includes a molded nozzle plate, the molded nozzle plate further including molded die alignment features. The molded die alignment features can be registered to the apertures of the print head die. | 12-01-2011 |
20120018838 | METHOD FOR MODULAR ARRANGEMENT OF A SILICON BASED ARRAY AND MODULAR SILICON BASED ARRAY - A silicon based module, including: a substrate; a first chip assembly fixed to the substrate, the first chip assembly including a first silicon chip and a first driver die having electrical circuitry; and a second chip assembly fixed to the substrate, the second chip assembly including a second silicon chip and a second driver die having electrical circuitry. Portions of the first and second chip assemblies are aligned in a longitudinal direction for the substrate; and portions of the first and second silicon chips are aligned in a width direction orthogonal to the longitudinal direction. Method for forming a silicon based module. | 01-26-2012 |
20120242756 | HIGH DENSITY MULTILAYER INTERCONNECT FOR PRINT HEAD - A method for forming an ink jet print head can include attaching a plurality of piezoelectric elements to a diaphragm, dispensing an interstitial layer over the diaphragm, and forming a plurality of patterned conductive traces on the interstitial layer to physically and electrically contact the plurality of piezoelectric elements. The plurality of patterned traces can be formed using, for example, photolithography, a lift-off process, laser ablation, etc. Electrical communication between the plurality of patterned conductive traces and the plurality of piezoelectric elements can be established through surface contact between the two structures, without the requirement of a separate conductor. | 09-27-2012 |
20120242758 | USE OF PHOTORESIST MATERIAL AS AN INTERSTITIAL FILL FOR PZT PRINTHEAD FABRICATION - An ink jet printhead including a plurality of piezoelectric elements and a photosensitive interstitial layer which fills spaces between each adjacent piezoelectric element. The ink jet printhead can be formed using a simplified method to pattern the photosensitive interstitial layer, and to remove a diaphragm attach material which covers a plurality of openings through a diaphragm using laser ablation. | 09-27-2012 |
20120256990 | PATTERNED CONDUCTIVE ARRAY AND SELF LEVELING EPOXY - A method for forming an ink jet print head can include attaching a plurality of piezoelectric elements to a diaphragm, dispensing an interstitial layer over the diaphragm, electrically coupling a plurality of conductive elements to the plurality of piezoelectric elements, and curing the interstitial layer. A plurality of electrically isolated conductive particles within the interstitial layer electrically couple the plurality of conductive elements to the plurality of piezoelectric elements. The conductive particles can be evenly distributed throughout the totality of the interstitial layer dielectric, or they can be localized over a top surface of each piezoelectric element and interposed between the plurality of piezoelectric elements and the plurality of conductive elements. The conductive elements can be part of a flex circuit or printed circuit board. | 10-11-2012 |
20120274708 | HIGH DENSITY ELECTRICAL INTERCONNECT FOR PRINTING DEVICES USING FLEX CIRCUITS AND DIELECTRIC UNDERFILL - A method for forming an ink jet print head can include attaching a plurality of piezoelectric elements to a diaphragm of a jet stack subassembly, electrically attaching a flex circuit to the plurality of piezoelectric elements, then dispensing an dielectric underfill between the flex circuit and the jet stack subassembly. The use of an underfill after attachment of the flex circuit eliminates the need for the patterned removal of an interstitial material from the tops of the piezoelectric elements, and removes the requirement for a patterned standoff layer. In an embodiment, electrical contact between the flex circuit and the piezoelectric elements is established through physical contact between bump electrodes of the flex circuit and the piezoelectric elements, without the use of a separate conductor, thereby eliminating the possibility of electrical shorts caused by misapplication of a conductor. | 11-01-2012 |
20120328784 | METHOD FOR INTERSTITIAL POLYMER PLANARIZATION USING A FLEXIBLE FLAT PLATE - A method and structure for forming an ink jet print head having a dielectric interstitial layer. A flexible top plate attached to a press can be used to apply pressure to an uncured dielectric interstitial layer. The uncured dielectric interstitial layer is cured while contacting the uncured dielectric interstitial layer with the flexible top plate and applying pressure using the press. Using a flexible top plate rather than a rigid top plate has been found to form a cured interstitial layer over an array of piezoelectric elements which has a more uniform or planar upper surface. An interstitial layer so formed can result in decreased processing time, reduced problems with ink communication in the ink jet print head during use, and decreased manufacturing costs. | 12-27-2012 |
20130061469 | IN SITU FLEXIBLE CIRCUIT EMBOSSING TO FORM AN ELECTRICAL INTERCONNECT - A method of forming a structure such as a print head or a printer including the print head having a flex circuit with a plurality of deformed (i.e., contoured, shaped, or embossed) conductive flexible printed circuit (flex circuit) pads. A plurality of flex circuit pads can be aligned with a plurality of piezoelectric elements of an ink jet print head. Within a press such as a stack press, pressure can be applied to deform the plurality of flex circuit pads and to establish electrical contact between the plurality of flex circuit pads and the plurality of piezoelectric elements. Deforming the plurality of flex circuit pads in situ during the press operation can reduce costs by eliminating a separate embossing stage performed during the manufacture or formation of the flex circuit. | 03-14-2013 |
20130076839 | HIGH DENSITY ELECTRICAL INTERCONNECT USING LIMITED DENSITY FLEX CIRCUITS - A method and structure for an ink jet print head which includes the use of two or more flexible circuits and a piezoelectric element array. A first pad array is included on a first flex circuit to power a first portion of the piezoelectric element array of the print head, and a second pad array is included on a second flex circuit to power a second portion of the piezoelectric element array of the print head. Using two flex circuits requires only half as many traces to be formed on each flex circuit, which can relax spacing requirements and design tolerances. | 03-28-2013 |
20130100212 | Process for Adding Thermoset Layer to Piezoelectric Printhead - Disclosed is a process for preparing an ink jet printhead which comprises: (a) providing a diaphragm plate having a plurality of piezoelectric transducers bonded thereto; (b) aligning an electrical circuit board having a fill joint with the piezoelectric transducers and temporarily attaching the electrical circuit board to the piezoelectric transducers, thereby creating a layered structure having interstitial spaces between the diaphragm plate, the piezoelectric transducers, and the electrical circuit board; (c) applying a thermoset polymer through the fill joint and allowing it to fill the interstitial spaces via capillary action; and (d) curing the thermoset polymer to form an interstitial polymer layer. | 04-25-2013 |
20130120505 | BONDED SILICON STRUCTURE FOR HIGH DENSITY PRINT HEAD - A print head including a jet stack can be formed using semiconductor device manufacturing techniques. A blanket metal layer, a blanket piezoelectric element layer, and a blanket conductive layer can be formed over a semiconductor substrate such as a semiconductor wafer or wafer section. The piezoelectric element layer and the blanket conductive layer can be patterned to provide a plurality of transducer piezoelectric elements and top electrodes respectively, while the metal layer forms a bottom electrode for the plurality of transducers. Subsequently, the semiconductor substrate can be patterned to form a body plate for the print head jet stack. Forming a print head jet stack using semiconductor device manufacturing techniques can provide a high resolution device with small feature sizes. | 05-16-2013 |
20130135391 | MULTI-FILM ADHESIVE DESIGN FOR INTERFACIAL BONDING PRINTHEAD STRUCTURES - In accordance with aspects of the present disclosure, a printhead assembly arranged to dispense ultraviolet curable ink or gel ink and method thereof is disclosed. The printhead assembly includes a plurality of functional plates stacked together; a first adhesive layer arranged between adjacent functional plates to provide bonding between the plates; and a second adhesive layer arranged between adjacent function plates to provide chemical resistance to the ultraviolet curable ink or the gel ink. | 05-30-2013 |
20130147881 | POLYMER FILM AS AN INTERSTITIAL FILL FOR PZT PRINTHEAD FABRICATION - A method and structure for an ink jet printhead, and a printer including the ink jet printhead. The printhead can include a polymer as a film spacer which separates an electrical interconnect such as a printed circuit board or a flexible circuit from a printhead diaphragm, such that the film spacer is interposed between the electrical interconnect and the diaphragm. In an embodiment, a piezoelectric actuator is free from contact with the film spacer. Embodiments of a process for forming the printhead may have reduced processing stages requiring fewer manufacturing tools than some other processes. Embodiments of the resulting printhead and printer may have fewer structural components than some other printheads and printers. | 06-13-2013 |
20130162723 | INK JET PRINTING SYSTEMS AND METHODS WITH PRE-FILL AND DIMPLE DESIGN - Systems and methods of ejecting ink drops from an inkjet printer are disclosed. The systems and methods can include a printhead with one or more actuators with associated nozzles and membranes. A voltage waveform can be applied to the actuators to fill the actuators with a volume of ink and eject the ink through the nozzles as ink drops. The voltage waveform can have associated pre-fill voltage to fill the actuator with ink and a firing voltage to eject the ink. The actuator membranes can have multi-height dimples to protect the membranes from contacting electrodes and reduce the electric field. | 06-27-2013 |
20130215185 | LASER TRANSMISSION LAMINATING OF MATERIALS FOR INK JET PRINTHEADS - A method for assembling a printhead such as an ink jet printhead can include the use of a laser to bond two or more printhead layers together. In an embodiment, a laser beam is directed through a transparent layer to an energy-absorbing layer, where the energy-absorbing layer is melted such that after removal of the laser beam the melted layer solidifies to adhere the energy-absorbing layer to the transparent layer. In another embodiment, heating the energy-absorbing layer melts the transparent layer to adhere the energy-absorbing layer to the transparent layer after removal of the laser beam. The laser transmission lamination process described can result in a fluid-tight seal which requires less processing time and materials over an adhesive-based process. | 08-22-2013 |
20130215186 | ULTRASONIC LAMINATING OF MATERIALS FOR INK JET PRINTHEADS - A method for assembling a printhead such as an ink jet printhead can include the use of an ultrasonic bonding process to bond two or more printhead layers together. In an embodiment, an ultrasonic frequency is directed to an interface between a first layer and a second layer to generate heat at the interface. In an embodiment, the heat melts at least one of the first layer and the second layer, and the layers are cooled to cure the melted layer. In another embodiment, the heat generated using the ultrasonic frequency cures an adhesive layer between the first layer and the second layer. The ultrasonic lamination process described can result in a fluid-tight seal which requires less processing time and materials over an adhesive-based process. | 08-22-2013 |
20130215197 | PRINTHEAD FLUID PATHS FORMED WITH SACRIFICIAL MATERIAL PATTERNED USING ADDITIVE MANUFACTURING PROCESSES - A method for forming an ink jet printhead subassembly can include the use of a sacrificial form to fabricate a printhead subassembly having a plurality of ink channels therethrough. The sacrificial form can be manufactured using one or more described techniques. The completed printhead subassembly can include a single solid structure manufactured from a single material, or can include more than one solid structures assembled together. A printhead subassembly according to the present teachings can have a reduced number of parts and cost, simplified manufacture, and increased yields and lifetime compared to some other printhead subassemblies. | 08-22-2013 |
20130222486 | USING SATURATED MESH TO CONTROL ADHESIVE BOND LINE QUALITY - In some aspects of the present application, a printhead assembly is disclosed that comprise a plurality of functional plates stacked together; an adhesive confinement structure comprising an adhesive-coated mesh substrate arranged between adjacent functional plates to provide bonding between the plates. | 08-29-2013 |
20130241999 | Highly Integrated Wafer Bonded MEMS Devices with Release-Free Membrane Manufacture for High Density Print Heads - A method of fabricating a MEMS inkjet type print head and the resulting device is disclosed. The method includes providing a driver component and separately providing an actuatable membrane component, the actuatable membrane component being formed in the absence of an acid etch removing a sacrificial layer. The separately provided actuatable membrane component is bonded to the driver component and a nozzle plate is attached to the actuatable membrane component subsequent to the bonding. Separately fabricating the components removes the need for hydrofluoric acid etch removal of a sacrifical layer previously required for forming the actuatable membrane with respect to the driver component. | 09-19-2013 |
20130265369 | PATTERNED HEATER TRACES FOR INKJET PRINTHEAD - A printhead for an ink jet printer can be formed as a plurality of substructures which are connected subsequent to inspection and/or testing. A substructure can include a semiconductor substrate such as a silicon substrate having a plurality of heater traces which are used to maintain a temperature of melted solid ink within a tolerance of a desired temperature. The traces can be accurately formed using semiconductor processing techniques. Testing and/or inspecting the substructures prior to assembly can reduce rework and scrap, and can allow the formation of printhead structures from a wide variety of materials. | 10-10-2013 |
20130307903 | METHOD FOR FLEX CIRCUIT BONDING WITHOUT SOLDER MASK FOR HIGH DENSITY ELECTRICAL INTERCONNECT - In some aspects of the present application, a print head and a method of forming the print head are disclosed. The print head can include an array of jets formed in a jet stack; at least one ink reservoir operable to deliver ink to the jet stack; an actuator array arranged on the control circuitry formed into an actuator layer to cause the reservoir to deliver ink in response to signals from the control circuitry; a standoff adhesive layer arranged on the actuator layer, the standoff adhesive layer having an array of holes corresponding to the actuators; and a flex circuit layer having an array of bumped contacts pad corresponding to the array of holes of the standoff adhesive layer. | 11-21-2013 |
20130321532 | SCREEN PRINTED JET STACK HEATER - Apparatus and methods for heating a printer jet stack. The apparatus includes a first layer and a second layer disposed generally parallel to the first layer. The apparatus also includes a heating layer including a thermal epoxy configured to generate heat when an electrical current is applied thereto. The heating layer is disposed between and bonds together the first layer and the second layer. | 12-05-2013 |
20130335484 | LASER WELDED BONDING PADS FOR PIEZOELECTRIC PRINT HEADS - An ink jet print head can be formed using a laser to melt a plating layer interposed between a piezoelectric actuator and a circuit layer bump. The plating layer can be formed on the circuit layer bump, the piezoelectric actuator, or both, and a laser beam output by the laser is used to melt the plating layer to provide a laser weld. In another embodiment, the circuit layer bump or the trace itself functions as the plating layer, which is melted using a laser to provide the laser weld. | 12-19-2013 |
20140022320 | MULTIPLE LAYER FILTER - A structure and method including a filter assembly, wherein the structure can be an ink jet printhead including the filter assembly. The filter assembly can include a first filter layer having a plurality of pores therein, wherein the pores have a first pitch, and a second filter layer having a plurality of pores therein, wherein the pores in the second filter layer have a second pitch which is different than the first pitch. The structure can include a fluid path through the filter assembly. An area of overlap of the pores in the first filter layer with the pores in the second filter layer, in a vertical direction perpendicular to a plane of the filter assembly, can include a periodicity. | 01-23-2014 |
20140036005 | DIAPHRAGM FOR AN ELECTROSTATIC ACTUATOR IN AN INK JET PRINTER - Diaphragms for electrostatic actuators for inkjet printers and methods for manufacturing are provided. The method includes electroplating a first layer on a mandrel, and applying a photoresist to the first layer. The method also includes electroplating a second layer on the first layer adjacent the photoresist, such that the first and second layers form a substantially homogenous structure, and separating the photoresist from the first and second layers to expose one or more flexure recesses where the photoresist was positioned, with the diaphragm having a reduced stiffness proximal the flexure recess. | 02-06-2014 |
20140043400 | INTERSTITIAL MATERIAL TO ENABLE ROBUST ELECTRICAL INTERCONNECT FOR HIGH DENSITY PIEZOELECTRIC ARRAYS - An ink jet print head including a plurality of standoff layer supports in an interstitial region between adjacent piezoelectric elements, and method of formation. The plurality of standoff layer supports can be formed from the same layer(s) as the piezoelectric elements, or from a dielectric layer such as a polymer. The standoff layer supports increase an area to which a standoff layer can be attached, thereby forming a more secure attachment of a circuit layer such as a flex circuit or a printed circuit board to a jet stack subassembly. | 02-13-2014 |
20140071208 | HIGH DENSITY THREE-DIMENSIONAL ELECTRICAL INTERCONNECTIONS - Implementations relate to methods, devices produced by the method, and systems using the devices, for forming three-dimensional interconnect structures for ink piezoelectric printheads. | 03-13-2014 |
20140092175 | REDUCED MECHANICAL COUPLING WITH STRUCTURED FLEX CIRCUITS - An actuator assembly including a flexible printed circuit and a method for making such an actuator assembly are provided. The flexible printed circuit includes a body having a top side and a bottom side, with the body defining a plurality of bumps extending from the bottom side. A first bump of the plurality of bumps is disposed adjacent to a second bump of the plurality of bumps, and the body further defines at least one relief configured to reduce movement of the second bump caused by movement of the first bump. The flexible printed circuit also includes a plurality of contact pads disposed on the bottom side of the body at least partially at the plurality of bumps, with the plurality of contacts pads being configured to be electrically coupled to a power source and to a piezoelectric transducer. | 04-03-2014 |
20140178644 | STRUCTURE AND METHOD TO FABRICATE TOOLING FOR BUMPING THIN FLEX CIRCUITS - A structure and method for a post plate of a die set that can be used to emboss a plurality of contact pads of a flexible printed circuit during the formation of a printer printhead. In one embodiment, a plurality of post plate posts can be formed, where each post plate post has a flat upper surface, generally straight sides, and a sharp corner where the flat upper surface and the generally straight sides intersect. Each post can be polished using, for example, a pad and an abrasive polishing compound or an electrochemical polishing process, to round the sharp corners to form a post having a rounded contour. In another embodiment, a plurality of post plate posts each having a rounded contour can be formed using a molding process. | 06-26-2014 |
20140295064 | PRINTHEAD WITH NANOTIPS FOR NANOSCALE PRINTING AND MANUFACTURING - A nanoprinthead including an array of nanotip cantilevers, where each nanotip cantilever includes a nanotip at an end of a cantilever, and a method for forming the nanoprinthead. Each nanotip may be individually addressable through use of an array of piezoelectric actuators. Embodiments for forming a nanoprinthead including an array of nanotip cantilevers can include an etching process from a material such as a silicon wafer, or the formation of a metal or dielectric nanotip cantilever over a substrate. The nanoprinthead may operate to provide uses for technologies such as dip-pen nanolithography, nanomachining, and nanoscratching, among others. | 10-02-2014 |
20150070440 | THERMO-PNEUMATIC ACTUATOR FABRICATED USING SILICON-ON-INSULATOR (SOI) - An ink jet printhead including a thermo-pneumatic actuator array for ejecting ink from an array of nozzles. The actuator array may include the use of a silicon-on-insulator (SOI) semiconductor wafer including a device layer, a handle layer, and a dielectric layer that physically separates the device layer from the handle layer to simplify printhead formation. During an exemplary process, the SOI wafer is attached to a heater wafer and a nozzle plate is attached to the dielectric layer such that, during use of the printhead, the device layer functions as an actuator membrane. Deflection of the device layer during use of the printhead creates a pressure within an ink chamber which causes ejection of ink from one of the nozzles of the array of nozzles. | 03-12-2015 |
20150070441 | THERMO-PNEUMATIC ACTUATOR WORKING FLUID LAYER - An ink jet printhead including a thermo-pneumatic actuator array for ejecting ink from an array of nozzles. The actuator array may include a plurality of channels in fluid communication with a plurality of working fluid chambers. After completing formation of the actuator array, working fluid may be injected into a working fluid inlet on an exterior of the actuator array and into the plurality of working fluid chambers through the plurality of channels. | 03-12-2015 |
20150085019 | DOUBLE SIDED FLEX FOR IMPROVED BUMP INTERCONNECT - A printhead including a plurality of embossed first flex circuit pads and a first plurality of first active traces on a first side of a dielectric substrate, and a plurality of embossed second flex circuit pads on a second side of the dielectric substrate. The plurality of embossed first flex circuit pads are configured to be electrically active as part of an electric circuit during operation of the printhead, while the plurality of embossed second flex circuit pads may be configured to be electrically active or electrically inactive during operation of the printhead. | 03-26-2015 |