Patent application number | Description | Published |
20090013801 | Physical quantity sensor element - A physical quantity sensor element includes a strain sensitive resistor and an electrically insulating material. The strain sensitive resistor has an electrical resistance value changeable in response to a change of a strain level generated by application of a stress. The electrically insulating material is bonded to the strain sensitive resistor, the electrically insulating material having an electrically insulating property. The strain sensitive resistor includes (a) a matrix including a glass and (b) electrically conductive particles that are dispersed in the glass. The glass is free of lead and includes bismuth. | 01-15-2009 |
20100288636 | Laminated gas sensor and method of producing the same - A laminated gas sensor for exhaust gases improving thermal shock resistance, durability and reliability without permitting characteristics of the exhaust gas sensor to be particularly lowered is provided. A laminated gas sensor comprising a solid electrolyte layer ( | 11-18-2010 |
20100307255 | Physical quantity sensor device and method of manufacturing the same - A physical quantity sensor device ( | 12-09-2010 |
20110034031 | Manufacturing method of semiconductor device including etching step - A manufacturing method of a semiconductor device includes: irradiating a laser beam on a single crystal silicon substrate, and scanning the laser beam on the substrate so that a portion of the substrate is poly crystallized, wherein at least a part of a poly crystallized portion of the substrate is exposed on a surface of the substrate; and etching the poly crystallized portion of the substrate with an etchant. In this case, a process time is improved. | 02-10-2011 |
20110034032 | Method of formation or thermal spray coating - A method of formation of a thermal spray coating which forms a thermal spray coating on a coating-forming surface, characterized by comprising a thermal spraying step of thermally spraying feedstock powder on the coating-forming surface and a deposition and coating forming step of having the thermally sprayed feedstock powder deposit on the coating-forming surface and solidify to form a coating, in the deposition and coating forming step, when deposited on the coating-forming surface by thermal spraying, the feedstock powder deposits in the solid phase state in 50 to 90%, preferably 70 to 80%, of the whole so as to raise the ratio of the crystallite remaining in the feedstock powder and secure a high heat conductivity. | 02-10-2011 |
20120107994 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - In a manufacturing method of a semiconductor device, a substrate including single crystalline silicon is prepared, a reformed layer that continuously extends is formed in the substrate, and the reformed layer is removed by etching. The forming the reformed layer includes polycrystallizing a portion of the single crystalline silicon by irradiating the substrate with a pulsed laser beam while moving a focal point of the laser beam in the substrate. | 05-03-2012 |
20150129794 | SOFT MAGNETIC MEMBER AND MANUFACTURING METHOD OF SOFT MAGNETIC MEMBER - In a manufacturing method of a soft magnetic member, a material powder that includes ferrous particles and an organic layer formed on a surface of each of the ferrous particles is prepared. The organic layer contains at least one element selected from the group consisting of Si, Mg, Ti, and V. The material powder is compacted to form a green compact, and the green compact is induction-heated with a frequency of 100 kHz or higher to form an insulation layer made of an oxide containing the element on the surface of each of the ferrous particles. | 05-14-2015 |