Patent application number | Description | Published |
20080206668 | NEGATIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME - A negative resist composition includes: (A) a compound having at least one episulfide structure (a three-membered ring structure comprising two C atoms and one S atom); (B) an alkali-soluble resin; and (C) a compound capable of generating an acid upon irradiation with actinic rays or radiation, and a pattern forming method using the composition. | 08-28-2008 |
20090011362 | PATTERN FORMING METHOD - A pattern forming method performs a multiple exposure process, the multiple exposure process comprising: exposing a resist film with actinic rays or radiation a plurality of times, wherein a contact angle of the resist film for water is 75° or more. | 01-08-2009 |
20090017400 | PATTERN FORMING METHOD - A pattern forming method, includes: exposing a resist film with actinic rays or radiation a plurality of times; and heating the resist film at a first temperature in at least one interval between the exposures. | 01-15-2009 |
20090023096 | POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD - A positive resist composition, includes: (A) a compound capable of generating an acid upon irradiation with actinic rays or radiation; (B) a resin of which solubility in an alkali developer increases under an action of an acid, the resin containing 80 mol % or more of an aromatic group-free copolymerization component; and (C) a compound capable of decomposing under an action of an acid to generate an acid, wherein an absolute value of difference in pKa between the acid generated from the component (A) and the acid generated from the component (C) is 2 or less, and an absolute value of difference in molecular weight between the acid generated from the component (A) and the acid generated from the component (C) is 50 or less. | 01-22-2009 |
20090035692 | POSITIVE RESIST COMPOSITION AND PATTERN FORMING MEHTOD - A positive resist composition, includes: (A) a compound capable of generating an acid upon irradiation with actinic rays or radiation; (B) a resin of which solubility in an alkali developer increases under an action of an acid; (C) a compound capable of decomposing under an action of an acid to generate an acid; and (D) a compound which itself acts as a base for the acids generated from the component (A) and the component (C) but decomposes upon irradiation with actinic rays or radiation to lose a basicity for the acids generated from the component (A) and the component (C). | 02-05-2009 |
20090042124 | RESIST COMPOSITION CONTAINING NOVEL SULFONIUM COMPOUND, PATTERN-FORMING METHOD USING THE RESIST COMPOSITION, AND NOVEL SULFONIUM COMPOUND - A resist composition includes (A) a compound represented by the following formula (I): | 02-12-2009 |
20090075202 | PHOTOSENSITIVE COMPOSITION, COMPOUND FOR USE IN THE PHOTOSENSITIVE COMPOSITION, AND METHOD OF PATTERN FORMATION WITH THE PHOTOSENSITIVE COMPOSITION - A compound which generates a sulfonic acid having one or more —SO | 03-19-2009 |
20100040971 | PATTERN FORMING METHOD, AND RESIST COMPOSITION, DEVELOPER AND RINSING SOLUTION USED IN THE PATTERN FORMING METHOD - A pattern forming method comprising a step of applying a resist composition whose solubility in a negative tone developer decreases upon irradiation with an actinic ray or radiation and which contains a resin having an alicyclic hydrocarbon structure and a dispersity of 1.7 or less and being capable of increasing the polarity by the action of an acid, an exposure step, and a development step using a negative tone developer; a resist composition for use in the method; and a developer and a rinsing solution for use in the method, are provided, whereby a pattern with reduced line edge roughness and high dimensional uniformity can be formed. | 02-18-2010 |
20100040972 | PATTERN FORMING METHOD, AND RESIST COMPOSITION, DEVELOPER AND RINSING SOLUTION USED IN THE PATTERN FORMING METHOD - A pattern forming method comprising a step of applying a resist composition whose solubility in a negative tone developer decreases upon irradiation with an actinic ray or radiation and which contains a resin having an alicyclic hydrocarbon structure and a dispersity of 1.7 or less and being capable of increasing the polarity by the action of an acid, an exposure step, and a development step using a negative tone developer; a resist composition for use in the method; and a developer and a rinsing solution for use in the method, are provided, whereby a pattern with reduced line edge roughness and high dimensional uniformity can be formed. | 02-18-2010 |
20100040975 | POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE POSITIVE RESIST COMPOSITION - A positive resist composition comprises: (A) a compound capable of generating an acid upon irradiation with actinic rays or radiation; (B) a resin of which solubility in an alkali developer increases under action of an acid; and (C) a compound capable of decomposing under action of an acid to generate an acid. | 02-18-2010 |
20100233617 | PHOTOSENSITIVE COMPOSITION, PATTERN FORMING METHOD USING THE PHOTOSENSITIVE COMPOSITION AND COMPOUND FOR USE IN THE PHOTOSENSITIVE COMPOSITION - A photosensitive composition includes: (A) a resin containing a repeating unit corresponding to a compound represented by the following formula (I); the resin being capable of producing an acid group upon irradiation with an actinic ray or radiation: | 09-16-2010 |
20100239978 | PHOTOSENSITIVE COMPOSITION, AND PATTERN-FORMING METHOD AND RESIST FILM USING THE PHOTOSENSITIVE COMPOSITION - A photosensitive composition containing a compound having a specific structure, a pattern-forming method using the photosensitive composition, and a compound having a specific structure used in the photosensitive composition. | 09-23-2010 |
20100330507 | PATTERN FORMING METHOD, RESIST COMPOSITION TO BE USED IN THE PATTERN FORMING METHOD, NEGATIVE DEVELOPING SOLUTION TO BE USED IN THE PATTERN FORMING METHOD AND RINSING SOLUTION FOR NEGATIVE DEVELOPMENT TO BE USED IN THE PATTERN FORMING METHOD - A pattern forming method includes (a) coating a substrate with a resist composition including a resin that includes a repeating unit represented by a following general formula (NGH-1), and, by the action of an acid, increases the polarity and decreases the solubility in a negative developing solution; (b) exposing; and (d) developing with a negative developing solution: | 12-30-2010 |
20110089385 | COMPOSITION FOR OPTICAL MATERIALS - The composition for optical materials includes a polymer obtained from silsesquioxanes which are represented by average composition formula (1): (R | 04-21-2011 |
20110245416 | COMPOSITION - A composition for film formation which can form a film suitable for use as an interlayer dielectric in a semiconductor device, etc. and having an appropriate even thickness and can give a film having excellent characteristics including permittivity and Young's modulus; and a dielectric film obtained from the film-forming composition. The composition contains a compound (X) having a functional group which is partly eliminated by heating, irradiation with light, irradiation with radiation, or a combination thereof to generate volatile matter and yield an unsaturated group in the remaining part of the functional group. | 10-06-2011 |
20110305992 | PATTERN FORMING METHOD, AND RESIST COMPOSITION, DEVELOPER AND RINSING SOLUTION USED IN THE PATTERN FORMING METHOD - A pattern forming method comprising a step of applying a resist composition whose solubility in a negative tone developer decreases upon irradiation with an actinic ray or radiation and which contains a resin having an alicyclic hydrocarbon structure and a dispersity of 1.7 or less and being capable of increasing the polarity by the action of an acid, an exposure step, and a development step using a negative tone developer; a resist composition for use in the method; and a developer and a rinsing solution for use in the method, are provided, whereby a pattern with reduced line edge roughness and high dimensional uniformity can be formed. | 12-15-2011 |
20120003436 | PHOTOSENSITIVE COMPOSITION, PATTERN FORMING MATERIAL, AND PHOTOSENSITIVE FILM, PATTERN FORMING METHOD, PATTERN FILM, LOW REFRACTIVE INDEX FILM, OPTICAL DEVICE AND SOLID-STATE IMAGING DEVICE EACH USING THE SAME - A photosensitive composition contains (A) a hollow or porous particle, (B) a compound capable of generating an active species upon irradiation with an actinic ray or radiation, and (C) a compound capable of changing in the solubility for an alkali developer by the action of the active species. | 01-05-2012 |
20120003437 | PHOTOSENSITIVE COMPOSITION, PATTERN FORMING MATERIAL AND PHOTOSENSITIVE FILM USING THE SAME, PATTERN FORMING METHOD, PATTERN FILM, ANTIREFLECTION FILM, INSULATING FILM, OPTICAL DEVICE, AND ELECTRONIC DEVICE - A photosensitive composition contains (A) a polymer obtained from a silsesquioxane constituted of one or two or more kinds of a cage-shaped silsesquioxane compound represented by the specific formula. | 01-05-2012 |
20120207978 | ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, AND RESIST FILM AND PATTERN FORMING METHOD USING THE SAME COMPOSITION - An object of the present invention is to provide an actinic-ray-sensitive or radiation-sensitive resin composition which is significantly excellent in terms of exposure latitude, is capable of forming a favorable rectangular pattern profile, and exhibits low dissolution of the components into an immersion liquid when performing immersion exposure, and a resist film and a pattern forming method each using the same composition. The actinic-ray-sensitive or radiation-sensitive resin composition contains (A) a compound represented by formula (I) and capable of generating an acid upon irradiation of actinic-rays or radiations, and (B) a resin capable of increasing the solubility in an alkaline developer by the action of an acid. | 08-16-2012 |