Patent application number | Description | Published |
20090010034 | START SIGNAL DETECTOR CIRCUIT - A variation of a threshold of diode-connected transistors is compensated for to maintain a constant rectification efficiency of a rectifier circuit, thereby enabling stable detection of a start signal. A constant voltage is applied to DC bias terminal of cascaded half-wave voltage doubler rectifier circuits (including MOS transistors M | 01-08-2009 |
20090098833 | OPTICAL MODULE - A first frequency generator outputs a signal at first frequency f | 04-16-2009 |
20090146512 | COOLING DEVICE OF ELECTRIC MOTOR FOR VEHICLE - A cooling device of an electric motor for a vehicle for receiving cooling air into the electric motor through a suction port according to the rotation of a rotor shaft on which a rotor core, which is disposed opposite to a stator core, is installed. The cooling device includes an air volume regulating mechanism regulating a cooling air volume received therein through the suction port according to an ambient temperature. Since the cooling air volume received in the cooling device through the suction port is regulated according to the ambient temperature, the cooling of the electric motor can be optimized, and noise generated can be efficiently reduced according to the ambient temperature. | 06-11-2009 |
20090187688 | INFORMATION STORAGE DEVICE, INFORMATION PROCESSING SYSTEM, AND SETTING METHOD OF DATA TRANSFER MODE OF INFORMATION PROCESSING DEVICE - An information storage device includes a storage that stores transfer data from an information processing device, the information storage device being removably connected to the information processing device, a switch unit that switches a data transfer mode of the information processing device in accordance with manipulation by a user, and a controller that controls the information processing device to transfer data in a mode in which data temporarily stored in a data storing area is transferred to the storage or in a mode in which data is transferred to the storage without being temporarily stored in the data storing area in accordance with the selection of the data transfer mode by the switch unit. | 07-23-2009 |
20100060354 | AMPLIFICATION CIRCUIT - The present invention is aimed at realizing an amplifying circuit whose chip size is prevented from being significantly increased even if the number of compatible frequencies increases, and which has a wide dynamic range when it operates under a low voltage. The amplifying circuit includes a plurality of impedance converting circuits connected to each other by a switching circuit of a first type having a signal cutting-off function, a switching circuit of a second type connected to a path branched from an input side of the switching circuit of the first type, the switching circuit of the second type having a signal cutting-off function, amplifiers connected respectively to an output side of one of the impedance converting circuits in a final stage and to an output side of the switching circuit of the second type, and a control signal generating circuit for controlling connection/disconnection between said switching circuit of the first type and said switching circuit of the second type; wherein either one of the paths is selected to input a signal to one of the amplifiers. | 03-11-2010 |
20100171527 | PHASE COMPARATOR AND PHASE-LOCKED LOOP - A phase comparator is provided that solves the problem that a VCO cannot be controlled with high precision. A frequency divider frequency-divides a VCO signal applied as input to an input terminal ( | 07-08-2010 |
20110121864 | START SIGNAL DETECTOR CIRCUIT - The nonlinearity effect of a rectifying element is enhanced, and further a resonant circuit is used to enlarge the input amplitude. Furthermore, the rectifying efficiency of a detection rectifier circuit is enhanced, thereby allowing the gain of an amplifier circuit in the following stage to be set to a low value. Signals having mutually opposite phases are inputted to RF input terminals ( | 05-26-2011 |
20130119795 | TOTALLY-ENCLOSED FAN-COOLED MOTOR - The totally-enclosed fan-cooled motor includes the stator; the rotor; the drive side bracket; the counter drive side bracket; a pair of the bearings; the external fan that sends cooling air to the stator; the internal fan; the heat radiator that is arranged on an outer side of the drive side bracket and is mounted on the rotation shaft; the cover that contains a joint, which connects the rotation shaft extending to an outer side of the drive side bracket of the motor and a reduction gear, and is provided in parallel with the joint; and the ventilation path that is arranged between the drive side bracket and an end of the cover, and includes the outlet causes the cooling air induced by rotation of the heat radiator to flow to the heat radiator and discharges the cooling air outside the motor. | 05-16-2013 |
Patent application number | Description | Published |
20140053398 | ELECTRONIC COMPONENT MOUNTING LINE AND ELECTRONIC COMPONENT MOUNTING METHOD - Disclosed is an electronic component mounting line on which a substrate undergoes solder paste printing, electronic component placements, and then reflow, while being moved from upstream to downstream. The line includes: a substrate feeding machine; a screen printing machine for applying solder paste to the substrate; a resin dispensing machine arranged downstream of the screen printing machine, for dispensing a thermosetting resin onto at least one reinforcement position on the substrate; a second electronic component placement machine arranged adjacent to and downstream of the resin dispensing machine, for placing a second electronic component on the substrate, such that its peripheral edge portion comes in contact with the resin; a first electronic component placement machine arranged downstream of the second electronic component placement machine, for placing a first electronic component on the substrate; and a reflow machine for bonding the electronic components to the substrate, by heating and cooling the resultant. | 02-27-2014 |
20140073088 | ELECTRONIC COMPONENT MOUNTING LINE AND ELECTRONIC COMPONENT MOUNTING METHOD - Disclosed is an electronic component mounting line on which a substrate undergoes solder paste printing, electronic component placements, and then reflow, while being moved from upstream to downstream. The line includes: a substrate feeding machine; a printing machine for applying solder paste to a first placement area of the substrate; a first electronic component placement machine for placing a first electronic component on the first placement area; a second electronic component placement machine for dispensing a thermosetting resin onto a reinforcement position on a peripheral edge portion of a second placement area of the substrate, and for placing on the area the second electronic component having solder bumps; and a reflow machine for bonding the electronic components to the substrate, by heating and cooling the resultant. The second electronic component is placed after the resin is dispensed, such that a peripheral edge portion thereof comes in contact with the resin. | 03-13-2014 |
20140208587 | ELECTRONIC COMPONENT MOUNTING LINE AND ELECTRONIC COMPONENT MOUNTING METHOD - Disclosed is an electronic component mounting line on which a substrate undergoes solder paste printing, electronic component placements, and then reflow, while being moved from upstream to downstream. The line includes: a substrate feeding machine for feeding the substrate; a screen printing machine for applying solder paste to the substrate; a first electronic component placement machine for placing a first electronic component on the substrate; a resin dispensing machine for dispensing a thermosetting resin onto at least one reinforcement position arranged on the substrate; a second electronic component placement machine for placing a second electronic component on the substrate, such that its peripheral edge portion comes in contact with the thermosetting resin; and a reflow machine for bonding the first and second electronic components to the substrate, by heating and cooling the resultant. The second electronic component placement machine is arranged adjacent to and downstream of the resin dispensing machine. | 07-31-2014 |