Patent application number | Description | Published |
20090009559 | LIQUID EJECTION HEAD AND METHOD FOR MANUFACTURING LIQUID EJECTION HEAD - The present invention provides liquid ejection head enables a reduction in the distance between a print medium and an ejection port formation face of the liquid ejection head on which an ejection port is formed, improving the landing accuracy of droplets ejected from the liquid ejection head. A print head according to the present invention includes an element substrate and a supporting member. A supporting portion is located in the space between the element substrate and the supporting member. Connection wiring is formed on the supporting portion. The connection wiring is provided which connects wiring inside of the supporting member provided in the supporting member to the heat generating element. | 01-08-2009 |
20090080142 | ACTIVATED CARBON AND PROCESS OF MAKING THE SAME - An activated carbon having the highest peak D within the range of 1.0 nm to 1.5 nm, in which the peak D is from 0.012 to 0.050 cm | 03-26-2009 |
20090135547 | ELECTRIC DOUBLE-LAYERED CAPACITOR - The invention relates to a coin-type electric double-layered capacitor, including activated carbon electrode layers, an electrolytic solution, and a separator between a metal-made top vessel and a metal-made bottom vessel, and obtained by caulking and sealing the top vessel and the bottom vessel with a gasket and a sealing agent, wherein the edges of the top and bottom vessels overlap each other by 0.1 to 0.5 mm. Preferably, the injection amount of the electrolytic solution is in a range of 0.1 to 10% of the void volume in the electrode. | 05-28-2009 |
20090154061 | ELECTRIC DOUBLE LAYER CAPACITOR - An electric double layer capacitor comprising: activated carbon electrode layers comprising an activated carbon, conductive adhesive layers, a separator, and electrolytic solution comprising non-aqueous solvent and electrolyte between a top vessel and a bottom vessel; in which the top vessel and the bottom vessel are sealed by being caulked with a gasket; in which the activated carbon layers are 0.3 mm or more in a thickness per a layer, not less than 0.55 g/cm | 06-18-2009 |
20090166414 | COMMODITY SALES PROCESSING SYSTEM - A commodity sales processing system in which when a handy terminal receives membership number data that is sent from a membership card reader in the case of a valid membership card, the handy terminal transmits an optical signal (lock release signal), and a customer cradle receives the lock release signal from the handy terminal and releases the lock of the handy terminal. | 07-02-2009 |
20090318618 | POLYMER COMPOSITION FOR AQUEOUS BINDER - A polymer composition for aqueous binders includes (1) a polymer obtained by emulsion polymerization of (b) a first monomer having one ethylenically unsaturated bond in the molecule and (c) a second monomer having two or more ethylenically unsaturated bonds in the molecule in the presence of (a) an emulsifier, and (2) a wax. | 12-24-2009 |
20100136188 | FROZEN NON-WATER-WASHED OR WATER-WASHED AT LOW LEVEL MINCED FISH MEAT - Providing a frozen non-water-washed or water-washed at low level fish meat with suppressed freezing denaturation, from a fish species generally never used without water-wash. Biological iron, iron-containing substances and/or biological reducing substances in the fish meat are oxidized. A frozen non-water-washed or water-washed at low level fish meat made from minced fish meat or the dehydrated minced fish meat, where one or more cryoprotectants have been added and the decomposition of trimethylamine-N-oxide is suppressed through oxidation. Preferably, the fish meat is put in contact to oxygen under agitation of the fish meat, to thereby suppress trimethylamine-N-oxide decomposition, to which are added cryoprotectants for freezing. A frozen product of non-water-washed or water-washed at low level fish meat, where salts have been added for such agitation, followed by agitation. A fish paste product from the frozen product as the raw material. | 06-03-2010 |
20100233632 | SILICON-CONTAINING FILM-FORMING COMPOSITION, SILICON-CONTAINING FILM, AND PATTERN FORMING METHOD - A silicon-containing film-forming composition includes a polysiloxane and organic solvent. The polysiloxane includes a first structural unit, a second structural unit, and a third structural unit. The first structural unit is derived from a tetraalkoxysilane. The second structural unit is derived from a compound shown by a formula (1), wherein R | 09-16-2010 |
20100296226 | ELECTRIC DOUBLE LAYER CAPACITOR - Disclosed is an electric double layer capacitor having a positive polarizable electrode and a negative polarizable electrode, each of the positive and negative polarizable electrodes having a polarizable electrode layer, the positive polarizable electrode layer containing carbon fibers P and activated carbon P, the negative polarizable electrode layer containing carbon fibers N and activated carbon N, wherein at least one of the carbon fibers P and carbon fibers N has at least one peak in the range of | 11-25-2010 |
20120129352 | SILICON-CONTAINING FILM, RESIN COMPOSITION, AND PATTERN FORMATION METHOD - A pattern-forming method includes forming a silicon-containing film on a substrate, the silicon-containing film having a mass ratio of silicon atoms to carbon atoms of 2 to 12. A shape transfer target layer is formed on the silicon-containing film. A fine pattern is transferred to the shape transfer target layer using a stamper that has a fine pattern to form a resist pattern. The silicon-containing film and the substrate are dry-etched using the resist pattern as a mask to form a pattern on the substrate in nanoimprint lithography. According to another aspect of the invention, a silicon-containing film includes silicon atoms and carbon atoms. A mass ratio of silicon atoms to carbon atoms is 2 to 12. The silicon-containing film is used for a pattern-forming method employed in nanoimprint lithography. | 05-24-2012 |
20120183908 | RESIST PATTERN-FORMING METHOD - A resist pattern-forming method includes applying a resist underlayer film-forming composition to a substrate to form a resist underlayer film. The resist underlayer film-forming composition includes (A) a polysiloxane. A radiation-sensitive resin composition is applied to the resist underlayer film to form a resist film. The radiation-sensitive resin composition includes (a1) a polymer that changes in polarity and decreases in solubility in an organic solvent due to an acid. The resist film is exposed. The exposed resist film is developed using a developer that includes an organic solvent. | 07-19-2012 |
20130101942 | METHOD FOR FORMING RESIST PATTERN, AND COMPOSITION FOR FORMING RESIST UNDERLAYER FILM - A resist pattern-forming method capable of forming a resist pattern excellent in pattern collapse resistance in the case of development with the organic solvent in multilayer resist processes. The method has the steps of: (1) providing a resist underlayer film on a substrate using a composition for forming a resist underlayer film; (2) providing a resist film on the resist underlayer film using a photoresist composition; (3) exposing the resist film; and (4) developing the exposed resist film using a developer solution containing no less than 80% by mass of an organic solvent, in which the composition for forming a resist underlayer film contains (A) a component that includes a polysiloxane chain and that has a carboxyl group, a group that can generate a carboxyl group by an action of an acid, an acid anhydride group or a combination thereof. | 04-25-2013 |
20130130179 | POLYSILOXANE COMPOSITION AND PATTERN-FORMING METHOD - A polysiloxane composition includes a polysiloxane, and a first compound. The first compound includes a nitrogen-containing heterocyclic ring structure, and a polar group, an ester group or a combination thereof. A pattern-forming method includes coating the polysiloxane composition on a substrate to be processed to provide a silicon-containing film. A resist composition is coated on the silicon-containing film to provide a resist coating film. The resist coating film is selectively irradiated with a radioactive ray through a photomask to expose the resist coating film. The exposed resist coating film is developed to form a resist pattern. The silicon-containing film and the substrate to be processed are sequentially dry etched using the resist pattern as a mask. | 05-23-2013 |
20130174767 | Fastener Stringer Provided with Knit Tape - The present invention provides a fastener stringer comprising a knit fastener tape of a warp knit structure having an element mounting portion and a tape main portion, and a coiled plastic element row sewed on the element mounting portion wherein, two needle yarns for sewing the element row on the element-mounting portion are so arranged that they interpose a wale whereby two sewing lines, are formed, and any one of knitting yarns that straddle an inside sewing line of the two sewing lines has a fineness of 72-330 dTex and substantially all of the other knitting yarns have a fineness of 56-167 dTex, provided that the one of the knitting yarns that straddle the inside sewing line of the two sewing lines is thicker than substantially all of the other knitting yarns. The fastener stringer has both a light weight and a high strength. | 07-11-2013 |
20130177734 | Woven Tape for Slide Fastener - A woven tape for a slide fastener comprising an element mounting portion and a tape main portion, wherein the tape portion includes warp having a fineness of 30-100 dTex and a weaving density of 100-220 yarns/inch (2.54 cm), weft having a fineness of 60-180 dTex and a weaving density of 30-80 yarns/inch (2.54 cm), and a ratio of the number of yarns in the warp constituting a plain weave structure to the total number of yarns in the warp in the tape main portion is at least 40%. The woven tape for a slide fastener has a low weight and yet a high strength. | 07-11-2013 |
20140030660 | MULTILAYER RESIST PROCESS PATTERN-FORMING METHOD AND MULTILAYER RESIST PROCESS INORGANIC FILM-FORMING COMPOSITION - A multilayer resist process pattern-forming method includes providing an inorganic film over a substrate. A protective film is provided on the inorganic film. A resist pattern is provided on the protective film. A pattern is provided on the substrate by etching that utilizes the resist pattern as a mask. A multilayer resist process inorganic film-forming composition includes a compound, an organic solvent, and a crosslinking accelerator. The compound includes a metal compound that includes a hydrolyzable group, a hydrolysate of a metal compound that includes a hydrolyzable group, a hydrolysis-condensation product of a metal compound that includes a hydrolyzable group, or a combination thereof. The compound includes at least one metal element belonging to Group 6, Group 12, or Group 13 of the Periodic Table of the Elements. | 01-30-2014 |
20140134544 | RESIST PATTERN-FORMING METHOD - A resist pattern-forming method includes applying a resist underlayer film-forming composition to a substrate to form a resist underlayer film. The resist underlayer film-forming composition includes (A) a polysiloxane. A radiation-sensitive resin composition is applied to the resist underlayer film to form a resist film. The radiation-sensitive resin composition includes (a1) a polymer that changes in polarity and decreases in solubility in an organic solvent due to an acid. The resist film is exposed. The exposed resist film is developed using a developer that includes an organic solvent. | 05-15-2014 |
20140220783 | PATTERN-FORMING METHOD AND RESIST UNDERLAYER FILM-FORMING COMPOSITION - A pattern-forming method includes providing a resist underlayer film on a substrate using a resist underlayer film-forming composition. The resist underlayer film-forming composition includes a first polymer having a glass transition temperature of 0 to 180° C. A silicon-based oxide film is provided on a surface of the resist underlayer film. A resist pattern is provided on a surface of the silicon-based oxide film using a resist composition. The silicon-based oxide film and the resist underlayer film are sequentially dry-etched using the resist pattern as a mask. The substrate is dry-etched using the dry-etched resist underlayer film as a mask. | 08-07-2014 |
20150048046 | METHOD FOR FORMING PATTERN, AND POLYSILOXANE COMPOSITION - A pattern-forming method in which processibility of a silicon-containing film in etching with a fluorine gas and resistance against etching with an oxygen gas can be together improved in a multilayer resist process to form a finer pattern. Provided is a pattern-forming method that includes the steps of (1) providing a silicon-containing film on the upper face side of a substrate to be processed using a polysiloxane composition; (2) forming a resist pattern on the silicon-containing film; (3) dry-etching the silicon-containing film using the resist pattern as a mask to form a silicon-containing pattern; and (4) dry-etching the substrate to be processed using the silicon-containing pattern as a mask to form a pattern, in which the polysiloxane composition includes (A) a polysiloxane containing a fluorine atom, and (B) a crosslinking accelerator. | 02-19-2015 |
20150050600 | RESIST PATTERN-FORMING METHOD - A resist pattern-forming method includes applying a resist underlayer film-forming composition to a substrate to form a resist underlayer film. The resist underlayer film-forming composition includes (A) a polysiloxane. A radiation-sensitive resin composition is applied to the resist underlayer film to form a resist film. The radiation-sensitive resin composition includes (a1) a polymer that changes in polarity and decreases in solubility in an organic solvent due to an acid. The resist film is exposed. The exposed resist film is developed using a developer that includes an organic solvent. | 02-19-2015 |