Patent application number | Description | Published |
20090009037 | PIEZOELECTRIC VIBRATING PIECES AND PIEZOELECTRIC DEVICES - The piezoelectric vibrating piece ( | 01-08-2009 |
20100033061 | PIEZOELECTRIC DEVICES - In the disclosed piezoelectric devices a piezoelectric frame includes a vibrating piece. An excitation electrode is formed on the vibrating piece. An outer frame portion surrounds the vibrating piece and includes an extraction electrode connected to the excitation electrode. A package base is bonded to one surface of the outer frame portion and includes a connection electrode connected to the extraction electrode. The package base includes an external terminal formed on a surface thereof opposite the surface on which the connection electrodes are formed. Through-hole conductors connected the connection electrodes with respective external terminals. A lid is bonded to an opposing surface of the piezoelectric frame. An exhaust channel is in communication with the extraction electrode adjacent the through-hole conductors. | 02-11-2010 |
20100084086 | MANUFACTURING METHODS OF PIEZOELECTRIC DEVICES - Methods are disclosed for manufacturing piezoelectric devices. An exemplary method comprises the step of bonding a lid wafer, a piezoelectric frame wafer (having a vibrating piece and a outer frame surrounding the vibrating piece), and a base wafer (having at least one wiring through-hole) together. A surface of a unit (typically ball-shaped) of eutectic metal is cleaned and then arranged on the through-hole. The unit of eutectic metal is then melted in a vacuum or inert gas environment to allow the eutectic metal to enter the through-hole. | 04-08-2010 |
20100084949 | TUNING-FORK-TYPE PIEZOELECTRIC VIBRATING PIECE AND METHOD OF MANUFACTURING SAME - Tuning-fork-type crystal vibrating pieces are disclosed that have a base and a pair of vibrating arms extending from one side of the base in a designated longitudinal direction. A root portion is situated between the vibrating arms, and includes a first taper surface. Extending outboard of the vibrating arms from respective sides of the base are respective supporting arms that extend in the designated direction. Between each supporting arm and the respective vibrating arm is a respective supporting-arm root portion. Each supporting-arm root portion has a second taper surface in the thickness direction of the base. | 04-08-2010 |
20100147074 | Piezoelectric Frame, Piezoelectric Device and Manufacturing Method for Same - A piezoelectric frame ( | 06-17-2010 |
20100148634 | Impact-resistant piezoelectric devices - Piezoelectric devices are disclosed that include a chip plate sandwiched between a lid plate and a base plate. The chip plate includes a tuning-fork type piezoelectric vibrating piece surrounded by an outer frame. The lid plate includes a concavity on its inner major surface, and the base plate includes a concavity on its inner major surface. The lid plate, chip plate, and base plate are bonded together to form a package containing the piezoelectric vibrating piece. The tuning-fork type piezoelectric vibrating piece includes a base having an X-direction width and at least pair of vibrating arms extending from the base in a Y-direction. The tuning-fork type piezoelectric vibrating piece is coupled to the outer frame by supporting arms extending in the Y-direction outboard of the vibrating arms. The concavity of the lid plate includes at least one base-movement “buffer” extending in the X-direction at a location corresponding to the base of the vibrating piece. The concavity of the base plate includes at least one base-movement buffer extending in the X-direction at a location corresponding to the base. | 06-17-2010 |
20100156237 | Tuning-Fork Type Piezoelectric Vibrating Piece and Piezoelectric Device - A tuning-fork type piezoelectric vibrating piece ( | 06-24-2010 |
20100201221 | PIEZOELECTRIC DEVICES AND METHODS FOR MANUFACTURING SAME - An exemplary piezoelectric vibrating device includes a piezoelectric frame that supports and surrounds a tuning-fork type piezoelectric vibrating piece having a pair of vibrating arms. The device also includes a lid and a package base that are siloxane-bonded to the frame. The lid defines at least one frequency-adjustment hole extending through the thickness dimension of the lid from an inner major surface thereof (facing the frame) to an outer major surface of the lid. The package base defines at least one through-hole electrode passing via a respective electrode through-hole through the thickness of the base from an inner major surface thereof (facing the frame) to the outer major surface thereof. The electrode is connected to the piezoelectric vibrating piece. The lid and base include external electrodes, made of an electrically conductive material, that cover the through-holes and frequency-adjustment hole(s). | 08-12-2010 |
20110062826 | PIEZOELECTRIC DEVICES EXHIBITING REDUCED CI DEGRADATION - Surface-mounted piezoelectric devices are disclosed that include a package having a base and a lid made of a piezoelectric material or of glass. The package defines an internal cavity containing a tuning-fork type crystal vibrating piece having a pair of vibrating arms. The volume of the cavity is at least twelve times the volume of the pair of vibrating arms. Piezoelectric devices having these characteristics exhibit reduced CI degradation. | 03-17-2011 |
20110062827 | PIEZOELECTRIC DEVICES AND METHODS FOR MANUFACTURING SAME - Methods are disclosed for manufacturing piezoelectric devices. In an exemplary method a base substrate is prepared that defines multiple device bases. Multiple cutting grooves are defined on a surface of the base substrate in a grid pattern to define therebetween the size of the devices. A frame substrate is also prepared from a piezoelectric material. The frame substrate defines multiple frames surrounding respective vibrating pieces and being alignable with respective bases in the base substrate. Also prepared is a lid substrate defining multiple lids being alignable with respective frames and bases. The three substrates are aligned and bonded together such that the frame substrate is between the lid and base substrates and the surface defining the cutting grooves faces outward. The base substrate is mounted on a dicing sheet such that cutting grooves face the dicing sheet. Cutting is performed, using a dicing blade, through the sandwich from the lid substrate to the cutting grooves. | 03-17-2011 |
20110062828 | PIEZOELECTRIC VIBRATING DEVICES AND METHODS FOR MANUFACTURING SAME - In an exemplary method a piezoelectric wafer is prepared on which multiple piezoelectric frames are formed. Each frame has a piezoelectric vibrating piece including excitation electrodes, and a frame portion surrounds the vibrating piece. A lid wafer is prepared on which multiple respective lids are formed, each sized substantially similarly to the respective frames. A base wafer is prepared on which multiple of bases are formed, each sized substantially similarly to the respective frames. Each base has through-holes. Stripes of a first bonding film are formed on both major surfaces of the piezoelectric wafer around the periphery of each frame. Stripes of a second bonding film are formed on the inner major surface of the lid wafer, corresponding to respective stripes of the first bonding film. Stripes of a third bonding film are formed on the inner major surface of the base wafer, corresponding to respective stripes of the first bonding film. A bonding material is placed between the stripes of first bonding film and respective stripes of second bonding film, and between stripes of first bonding film and respective stripes of third bonding film, by which the three wafers are bonded together after being aligned with each other in a sandwich manner. | 03-17-2011 |
20110068659 | PIEZOELECTRIC VIBRATING DEVICES AND METHODS FOR MANUFACTURING SAME - Methods are disclosed for manufacturing piezoelectric vibrating devices. An exemplary method includes preparing a base wafer defining multiple bases each including stripes of a first bonding film extending along respective edges of the bases and first indents adjacent to and contacting respective stripes of the first bonding film. Also prepared is a lid wafer defining multiple lids each including stripes of a second bonding film extending along respective edges of the lids and second indents adjacent to and contacting respective stripes of the second bonding film. A unit of bonding material (e.g., a bonding “ball”) is applied to each of the first indents or to each of the second indents. Bonding together the base wafer and lid wafer is completed by melting the bonding material to flow the bonding material along the stripes, followed by solidifying the bonding material. | 03-24-2011 |
20110140572 | Crystal device - An object is to provide a crystal device that uses a mesa-structure crystal piece in which frequency adjustment is possible. A configuration is such that in a crystal device having: a crystal piece having a thick portion and a thin portion, with an excitation electrode formed on both main faces of the thick portion, and a lead out electrode electrically connected to the excitation electrode, formed on an end portion; a container main body having a concavity for accommodating the crystal piece; and a cover that is connected to an open end face of the container main body and hermetically seals the crystal piece, a frequency adjustment metal film which is electrically isolated from the excitation electrode and made independent, is formed on the thin portion of the crystal piece. | 06-16-2011 |
20110260585 | SURFACE-MOUNTABLE PIEZOELECTRIC DEVICES INCLUDING EUTECTIC-BONDED PACKAGES - Piezoelectric devices are disclosed that are mountable on the surface of a printed circuit board or the like. An exemplary device comprises a piezoelectric vibrating piece enclosed and sealed within a package including at least a cover and a base-substrate formed of glass or piezoelectric material. The package includes frame-shaped metallic films formed in peripheral regions of inner main surfaces of the cover and/or the base substrate. The frame-shaped metallic films are used for sealing the package using a eutectic material (e.g., solder). At least one mounting terminal is provided on the outer (bottom) main surface of the base-substrate. At least one of the frame-shaped metallic films and mounting terminals includes a chromium foundation layer formed on the surface of the glass or piezoelectric material, a middle layer of NiW alloy formed on the surface of the chromium layer, and a gold layer formed on the surface of the middle layer. | 10-27-2011 |
20110316390 | PIEZOELECTRIC VIBRATING DEVICES AND METHODS FOR MANUFACTURING SAME - An exemplary piezoelectric vibrating device includes a piezoelectric vibrating piece that vibrates when electrically energized. A first package plate has a main recess in which the piezoelectric vibrating piece is placed, and a peripheral surface surrounding the recess. A second package plate is bonded to the peripheral surface of the first package plate in airtight manner. A band of adhesive bonds the first package plate to the second package plate. The adhesive band surrounds the peripheral surface. Between the adhesive and the main recess is a band of metal film. The band of metal film prevents gas, generated from the adhesive, from flowing into the recess. The band of metal film surrounds the peripheral surface and is disposed inboard of the band of adhesive. | 12-29-2011 |
20120043860 | PIEZOELECTRIC VIBRATING DEVICES AND METHODS FOR MANUFACTURING SAME - Piezoelectric vibrating devices are disclosed that lack base through-holes and that can be manufactured on a wafer scale. Also disclosed are methods for making same. An exemplary piezoelectric device has a package base having first and second opposing main surfaces. On the second (outer) first main surface is formed a pair of external electrodes. The first (inner) main surface defines a first recess and a peripheral first bonding surface. A pair of connecting electrodes are provided for connecting to the respective external electrodes via respective edge surfaces of the package base that extend between the first and second main surfaces. A piezoelectric vibrating piece is mounted in and contained within the package base. The vibrating piece includes a pair of excitation electrodes electrically connected to respective connecting electrodes. A package lid comprises first and second main surfaces, of which the second (inner) main surface defines a second recess that is larger than the first recess. The second main surface also defines a second bonding surface that peripherally surrounds the second recess. A sealing material is applied, over the width of the second bonding surface, circumferentially between the first bonding surface and the second bonding surface. | 02-23-2012 |
20120306320 | PIEZOELECTRIC DEVICE AND MANUFACTURING METHOD THEREOF - The present disclosure provides the piezoelectric devices in which the bonding condition of devices can be easily observed. The piezoelectric device ( | 12-06-2012 |
20120312097 | ACCELERATION MEASURING APPARATUS - An acceleration measuring apparatus that can easily detect acceleration with high accuracy is provided. In the apparatus, positional displacement of a swingable pendulum member is detected, feedback control is performed to maintain the pendulum member in a stationary state using an actuator, and acceleration is measured by measuring the output of the actuator at this time. A movable electrode is provided to the pendulum member, and a loop is formed in which a fixed electrode provided to oppose the movable electrode, and an oscillating circuit, a crystal unit, and the movable electrode are electrically connected in series. By measuring an oscillating frequency of the oscillating circuit at this time, a change in the size of a variable capacitance formed between the movable electrode and the fixed electrode is detected, and thereby the positional displacement of the pendulum member is detected. | 12-13-2012 |
20120326566 | EXTERNAL FORCE DETECTION APPARATUS AND EXTERNAL FORCE DETECTION SENSOR - In an external force detection apparatus, a crystal plate is cantilevered within a container. Excitation electrodes are formed on the top surface and the bottom surface of the crystal plate. A movable electrode is formed on a distal end on the bottom surface of the crystal plate and is connected to the excitation electrode on the bottom surface via an extraction electrode. A fixed electrode is provided on the bottom of the container to oppose the movable electrode. The excitation electrode on the top surface and the fixed electrode are connected to an oscillating circuit. When an external force acts on the crystal plate to bend it, the capacitance between the movable electrode and the fixed electrode changes, and this capacitance change is captured as a change in the oscillating frequency of the crystal plate. | 12-27-2012 |
20130002096 | PIEZOELECTRIC VIBRATING DEVICE AND METHOD FOR MANUFACTURING SAME - A piezoelectric device includes a piezoelectric vibrating plate, a first plate, a first glass sealing material disposed in a ring shape, and an electrically conductive adhesive. The piezoelectric vibrating plate includes a piezoelectric vibrating piece, a frame body, and a pair of extraction electrodes. The piezoelectric vibrating piece includes a pair of excitation electrodes. The frame body surrounds the piezoelectric vibrating piece. The frame body is formed integrally with the piezoelectric vibrating piece. The first glass sealing material encloses a periphery of the first main surface of the frame body so as to bond the first plate and the first main surface of the frame body together. | 01-03-2013 |
20130119823 | Tuning-Fork Type Piezoelectric Vibrating Piece and Piezoelectric Device - A tuning-fork type piezoelectric vibrating piece ( | 05-16-2013 |
20130207523 | PIEZOELECTRIC DEVICE - A piezoelectric device includes a piezoelectric vibrating piece and a base portion in a square shape. The piezoelectric vibrating piece includes a piezoelectric piece, a pair of excitation electrodes, and a pair of extraction electrodes. The base portion includes a pair of connecting electrodes on a first surface at a side of the piezoelectric vibrating piece and a pair of mounting terminals on a second surface. The base portion has short sides facing one another. The short sides include two pairs of castellations depressed toward a center side of the base portion and two pairs of side surface electrodes on the two pairs of castellations. The two pairs of side surface electrodes connect the first surface and the second surface. One pair of the two pairs of side surface electrodes each connect to the pair of connecting electrodes and the pair of mounting terminals. | 08-15-2013 |
20130241362 | PIEZOELECTRIC DEVICE - A piezoelectric device includes a piezoelectric vibrating piece and a base portion in a square shape with four sides viewed from the first surface. The base portion has two sides that face one another. The two sides include two pairs of castellations depressed toward a center side of the base portion and two pairs of side surface electrodes on the two pairs of castellations. The two pairs of side surface electrodes connect the first surface and the second surface. One pair among the two pairs of side surface electrodes connects to the pair of connecting electrodes and one pair of mounting terminals among the two pairs of mounting terminals. The mounting terminals are formed up to four corners of the base portion. | 09-19-2013 |
20140291011 | ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME - An electronic device includes a substrate and a lid bonded on the substrate with a resin layer to seal an inside of the lid. The resin layer is formed at a part of the substrate to which the lid is mounted. A part where the lid is bonded on the substrate with resin layer forms a sealing portion. A glass layer is formed so as to cover the sealing portion. | 10-02-2014 |
20140292143 | ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME - The disclosure provides an electronic device that includes a substrate and a lid. The lid is bonded on the substrate to seal an inside of the lid using a resin. The lid includes a contact surface in contact with the resin. The contact surface includes a rough surface with an uneven shape. | 10-02-2014 |