Patent application number | Description | Published |
20100283645 | A/D CONVERSION CIRCUIT, ELECTRONIC APPARATUS, AND A/D CONVERSION METHOD - An A/D conversion circuit includes: a sample-and-hold circuit adapted to sample and hold an input signal to output a sampled signal; a control circuit adapted to output successive approximation data; a first D/A conversion circuit adapted to perform D/A conversion on the successive approximation data to output a first D/A output signal; a second D/A conversion circuit adapted to perform D/A conversion on time-varying code data to output a second D/A output signal; and a comparison circuit adapted to perform a process of comparing the first D/A output signal, and an addition signal of the sampled signal and the second D/A output signal, and to output a comparison result signal, wherein the control circuit has a successive approximation register to which register values are set in accordance with the comparison result signal, outputs successive approximation result data after all of the register values of the successive approximation register have been determined, and subtracts the code data from the successive approximation result data to output the result as A/D conversion data of the input signal. | 11-11-2010 |
20150149848 | DETECTION DEVICE, SENSOR, ELECTRONIC APPARATUS, AND MOVING OBJECT - A detection device includes: a detection circuit which carries out detection processing of a physical quantity on the basis of a signal from a physical quantity transducer and outputs detected data of the physical quantity; and a correction unit which carries out correction processing on the detected data and outputs the data after the correction processing as output data. The correction unit carries out the correction processing to reduce an integration error generated in the case where the output data is subjected to integration processing, on the detected data of m bits, and outputs the output data of n bits (n and m being natural numbers, holding n05-28-2015 | |
20150280730 | SUCCESSIVE COMPARISON TYPE ANALOG/DIGITAL CONVERTER, PHYSICAL QUANTITY SENSOR, ELECTRONIC DEVICE, MOVING OBJECT, AND SUCCESSIVE COMPARISON TYPE ANALOG/DIGITAL CONVERSION METHOD - A successive approximation type AD converter includes a charge redistribution type DA conversion circuit, a comparator, and a control circuit. The charge redistribution type DA conversion circuit is configured such that each of k unit elements connects a switch and a unit capacitance in series and includes a unit capacitor array that is connected to a common output line in parallel and a selector that selects one voltage supplied to one input terminal, through m voltage supply lines, among at least three input terminals of switches included in j unit elements which are the targets for dynamic element matching (DEM) in k unit elements based on the DEM. | 10-01-2015 |
Patent application number | Description | Published |
20090201067 | REFERENCE VOLTAGE GENERATING CIRCUIT, INTEGRATED CIRCUIT DEVICE, AND SIGNAL PROCESSING APPARATUS - A reference voltage generating circuit that generates a reference voltage includes: a first pn junction that generates a first voltage; a second pn junction that has a different current density from the first pn junction; a first resistor that generates a first current having a positive temperature coefficient based on a voltage equivalent to a difference between a forward voltage of the first pn junction and a forward voltage of the second pn junction; a second resistor that generates a first voltage having a positive temperature coefficient based on the first current, wherein the first voltage having the positive temperature coefficient and a voltage having a negative temperature coefficient are added to generate the reference voltage; and a third resistor that generates a temperature-dependent voltage based on the first current having the positive temperature coefficient, wherein the reference voltage and the temperature-dependent voltage are outputted in parallel from first and second output nodes, respectively, and a resistance value of the first resistor and a resistance value of the third resistor are adjusted in the same proportion by a trimming signal. | 08-13-2009 |
20120112938 | A/D CONVERTER CIRCUIT, ELECTRONIC APPARATUS AND A/D CONVERSION METHOD - An A/D converter circuit includes a comparison circuit that performs a process to compare an added signal of a sampled signal of an input signal and a code signal with a D/A output signal, or a process to compare the sampled signal with an added signal of the D/A output signal and the code signal, a control circuit that outputs output data obtained based on successive approximation result data and the code data as A/D conversion data of the input signal, a first D/A converter circuit that D/A converts the data for successive approximation, a second D/A converter circuit that D/A converts code data that changes over time, and a correction section that performs a correction process, to correct the successive approximation result data so as not to overflow due to code shifting using the code data. | 05-10-2012 |
20120182166 | A/D CONVERSION CIRCUIT, INTEGRATED CIRCUIT DEVICE, ELECTRONIC APPARATUS - An A/D conversion circuit in which a control circuit that has a successive approximation register storing data updated by a successive approximation operation generates correction data for correcting non-linearity between an input analog signal and an output digital signal, and a comparison unit corrects the non-linearity based on the correction data. An A/D conversion circuit includes a comparison unit which performs comparison operation in successive approximation and a control circuit having a successive approximation register storing successive approximation data updated by the successive approximation. The control circuit outputs correction data for correcting non-linearity between an input signal and output data of the A/D conversion circuit to the comparison unit based on one or plural bits of the successive approximation data. The comparison unit corrects the non-linearity of the A/D conversion circuit based on the correction data. | 07-19-2012 |
20120212357 | D/A CONVERSION CIRCUIT, A/D CONVERSION CIRCUIT AND ELECTRONIC APPARATUS - A D/A conversion circuit includes a first D/A converting section which is connected with an output node, a first serial capacitor which is disposed between the output node and a first node, a second D/A converting section which is connected with the first node, and a control circuit. The first D/A converting section includes a first capacitor array section and a first switch array section. The second D/A converting section includes a second capacitor array section and a second switch array section. The control circuit performs a switch control for dynamically changing allocation of the capacitors to the respective bits of input digital data for the first switch array section of the first D/A converting section. | 08-23-2012 |
20130265181 | A/D CONVERTER CIRCUIT, ELECTRONIC APPARATUS AND A/D CONVERSION METHOD - An A/D converter circuit includes a comparison circuit that performs a process to compare an added signal of a sampled signal of an input signal and a code signal with a D/A output signal, or a process to compare the sampled signal with an added signal of the D/A output signal and the code signal, a control circuit that outputs output data obtained based on successive approximation result data and the code data as A/D conversion data of the input signal, a first D/A converter circuit that D/A converts the data for successive approximation, a second D/A converter circuit that D/A converts code data that changes over time, and a correction section that performs a correction process, to correct the successive approximation result data so as not to overflow due to code shifting using the code data. | 10-10-2013 |
Patent application number | Description | Published |
20080200097 | POLISHING METHOD AND POLISHING APPARATUS - The polishing method of a disk-shaped substrate for polishing an outer circumference | 08-21-2008 |
20080223402 | DISK-SHAPED SUBSTRATE MANUFACTURING METHOD AND WASHING APPARATUS - The disk-shaped substrate manufacturing method is provided with: scrub-washing a first surface and a second surface of a disk-shaped substrate by respectively using a first porous roller and a second porous roller that have a cylindrical shape and are rotationally driven. The process of the scrub-washing determines a distance between axes of the first porous roller and the second porous roller that sandwich the disk-shaped substrate in between, and performs scrub-washing while the determined distance between the axes is under control. | 09-18-2008 |
20080233841 | DISK-SHAPED SUBSTRATE MANUFACTURING METHOD - The disk-shaped substrate manufacturing method is provided with: generating an air stream downward from an upper area during grinding a disk-shaped substrate in a grinding apparatus; arranging the grinding apparatus on an upper floor face of a floor and arranging water on a lower floor face of the floor, the upper floor face being made of a board having penetration holes or a mesh member, and the lower floor face supporting the upper floor face so as to be located above the lower floor face with a distance; and guiding dust made by the grinding apparatus to the water by use of the air stream. | 09-25-2008 |
20110030424 | METHOD OF MANUFACTURING SUBSTRATE FOR MAGNETIC RECORDING MEDIUM - A method of manufacturing a substrate for a magnetic recording medium that is capable of manufacturing a magnetic recording medium substrate having no warping and superior surface smoothness at a high level of productivity and at low cost. The method of manufacturing a substrate for a magnetic recording medium according to the present invention includes a thin glass sheet formation step of heating and softening a sheet-like glass base material ( | 02-10-2011 |
20120045971 | METHOD OF MANUFACTURING GLASS SUBSTRATE FOR MAGNETIC RECORDING MEDIA - The invention provides a method of manufacturing a glass substrate for magnetic recording media. And the glass substrate has high surface smoothness and little waviness. In the primary, secondary and tertiary lapping process, diamond pads | 02-23-2012 |
20120100786 | METHOD OF MANUFACTURING GLASS SUBSTRATE FOR MAGNETIC RECORDING MEDIA - The invention provides a method of manufacturing a glass substrate for magnetic recording media. And the glass substrate has high surface smoothness and little waviness. In the primary, secondary and tertiary lapping process, diamond pads | 04-26-2012 |
20120103937 | METHOD OF MANUFACTURING GLASS SUBSTRATE FOR MAGNETIC STORAGE MEDIUM - A method of manufacturing a glass substrate for a magnetic recording medium, wherein inner and outer circumference end faces of a disk-like glass substrate having a central aperture are at least treated by: a step of grinding, a step of etching, and a step of polishing, wherein the steps are performed in this order. | 05-03-2012 |
20120204603 | METHOD FOR PRODUCING GLASS SUBSTRATE FOR MAGNETIC RECORDING MEDIUM - The object of the present invention is to provide a production method for a glass substrate having a sufficient impact resistance for a magnetic recording medium with high productivity, without using cerium oxide, or by decreasing the amount of cerium oxide used in the polishing step, and the present invention provides a method for producing a glass substrate for a magnetic recording medium including at least a grinding step for inner and outer peripheries of a disc-shaped glass substrate having a center hole, wherein the grinding step includes a first grinding step for inner and outer peripheries of the glass substrate using a metal-bonded diamond grinding stone in which diamond abrasive grains are fixed with a metal binder, and a second grinding step for the inner and outer peripheries of the glass substrate using a resin-bonded diamond grinding stone in which diamond abrasive grains are fixed with a resin binder. | 08-16-2012 |
20120225610 | METHOD OF MANUFACTURING MAGNETIC RECORDING MEDIUM GLASS SUBSTRATE - Provided is a magnetic recording medium glass substrate manufacturing method capable of manufacturing a magnetic recording medium glass substrate having high surface smoothness and low surface waviness with productivity. In a primary lapping process and a secondary lapping process of the manufacturing method, diamond pads ( | 09-06-2012 |
Patent application number | Description | Published |
20090121355 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device includes a semiconductor substrate, an oxygen-containing insulating film disposed above the above-described semiconductor substrate, a concave portion disposed in the above-described insulating film, a copper-containing first film disposed on an inner wall of the above-described concave portion, a copper-containing second film disposed above the above-described first film and filled in the above-described concave portion, and a manganese-containing oxide layer disposed between the above-described first film and the above-described second film. Furthermore, a copper interconnection is formed on the above-described structure by an electroplating method and, subsequently, a short-time heat treatment is conducted at a temperature of 80° C. to 120° C. | 05-14-2009 |
20090146309 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device has a first insulating film formed over a semiconductor substrate, a first opening formed in the first insulating film, a first manganese oxide film formed along an inner wall of the first opening, a first copper wiring embedded in the first opening, and a second manganese oxide film formed on the first copper wiring including carbon. | 06-11-2009 |
20090269925 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD - A process for producing a semiconductor device, comprising the wiring region forming step of forming a wiring region on a semiconductor substrate; the copper wiring layer forming step of forming a copper wiring layer on the formed wiring region by electrolytic plating technique, wherein the copper wiring layer is formed by passing a current of application pattern determined from the relationship between application pattern of current passed at electrolytic plating and impurity content characteristic in the formed copper wiring layer so that the impurity content in the formed copper wiring layer becomes desired one; and the wiring forming step of polishing the formed copper wiring layer into a wiring. | 10-29-2009 |
20090317925 | EVALUATION METHOD OF SEMICONDUCTOR DEVICE - A technology for analyzing and evaluating of a change of impurity content distribution at the heat treatment of electrodeposited copper film. There is provided a method of evaluating a semiconductor device, comprising providing an electrodeposited copper film formed while causing the deposition current to transit between the first state of current density and the second state of current density so as to attain a desired impurity content distribution and carrying out analysis and evaluation of any impurity diffusion from a change of impurity content distribution in the electrodeposited copper film between before and after heat treatment. | 12-24-2009 |
20090321937 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME - A semiconductor device includes an insulating film including oxygen formed over a semiconductor substrate, a recess formed in the insulating film, a refractory metal film formed on the inner wall of the recess, a metal film including copper, manganese, and nitrogen formed on the refractory metal film, and a copper film formed on the metal film to fill in the recess. | 12-31-2009 |
20100009530 | SEMICONDUCTOR DEVICE FABRICATION METHOD - A semiconductor device fabrication method including the steps of: forming an interlayer insulating film on a substrate; forming an opening in the interlayer insulating film; forming an alloy layer containing manganese and copper to cover the inner surface of the opening; forming a first copper layer of a material containing primarily copper on the alloy layer to fill the opening; forming, on the first copper layer, a second copper layer of a material containing primarily copper and a higher concentration of oxygen, carbon or nitrogen than the first copper layer; heating the substrate on which the second copper layer has been formed; and removing the second copper layer. | 01-14-2010 |
20110183515 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device has a first insulating film formed over a semiconductor substrate, a first opening formed in the first insulating film, a first manganese oxide film formed along an inner wall of the first opening, a first copper wiring embedded in the first opening, and a second manganese oxide film formed on the first copper wiring including carbon. | 07-28-2011 |
20120181695 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device includes a semiconductor substrate, an oxygen-containing insulating film disposed above the above-described semiconductor substrate, a concave portion disposed in the above-described insulating film, a copper-containing first film disposed on an inner wall of the above-described concave portion, a copper-containing second film disposed above the above-described first film and filled in the above-described concave portion, and a manganese-containing oxide layer disposed between the above-described first film and the above-described second film. Furthermore, a copper interconnection is formed on the above-described structure by an electroplating method and, subsequently, a short-time heat treatment is conducted at a temperature of 80° C. to 120° C. | 07-19-2012 |
20130207193 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor device including a first insulation film including a first opening reaching a diffusion region of a transistor; a first barrier metal over the diffused region in the first opening; a first conduction layer formed over the first barrier metal in the first opening and formed of a first conductor; a second barrier metal formed over the first conduction layer in the first opening; a second conduction layer formed over the second barrier metal in the first opening and formed of a second conductor; a third barrier metal formed over the first gate electrode in the second opening; a fourth barrier metal formed in the second opening and contacting with the third barrier metal; and a third conduction layer formed of the second conductor contacting with the fourth barrier metal in the second opening. | 08-15-2013 |
Patent application number | Description | Published |
20120032281 | SEMICONDUCTOR DEVICE PRODUCTION METHOD AND SEMICONDUCTOR DEVICE - A semiconductor device production method includes: forming an insulating film on a semiconductor substrate, forming a concave portion in the insulating film, forming a gate insulating film at bottom of the concave portion, the bottom being on the semiconductor substrate; covering an inner wall surface of the concave portion and a top face of the insulating film with a first gate electrode film that is made of an electrically conductive material containing a first metal; covering the first gate electrode film with a covering film of a material having a second melting point higher than a first melting point of the electrically conductive material, leaving part of the side face of the concave portion uncovered; and performing heat treatment following the covering film formation to allow the first gate electrode film to reflow. | 02-09-2012 |
20120256264 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD - A semiconductor device includes a semiconductor substrate including a well having a first conductivity type defined by a device isolation region, a gate insulating film formed on the semiconductor substrate, a gate electrode formed on the gate insulating film and including a first side surface and a second side surface facing the first side surface, and a first side wall insulating film formed on the first side surface and a second side wall insulating film formed on the second side surface. | 10-11-2012 |
20120261760 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE - A semiconductor device includes a semiconductor substrate, a device region including first and second parts, first and second gate electrodes formed in the first and the second parts, first and second source regions, first and second drain regions, first, second, third, and fourth embedded isolation film regions formed under the first source, the first drain, the second source, and the second drain regions, respectively. Further, the first drain region and the second source region form a single diffusion region, the second and the third embedded isolation film regions form a single embedded isolation film region, an opening is formed in a part of the single diffusion region so as to extend to the second and the third embedded isolation film regions, and the opening is filled with an isolation film. | 10-18-2012 |
20140138769 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD - A semiconductor device includes a semiconductor substrate including a well having a first conductivity type defined by a device isolation region, a gate insulating film formed on the semiconductor substrate, a gate electrode formed on the gate insulating film and including a first side surface and a second side surface facing the first side surface, and a first side wall insulating film formed on the first side surface and a second side wall insulating film formed on the second side surface. | 05-22-2014 |
Patent application number | Description | Published |
20140287253 | SLIDE MEMBER AND METHOD OF MANUFACTURING SLIDE MEMBER - A slide member provided with an overlay composed of a Bi-based material. A slide member includes a substrate; and an overlay including Bi or a Bi alloy provided over the substrate. A surface portion (surface-most portion) of the overlay includes an oxide layer in which a bismuth oxide, is scattered. The content of the bismuth oxide in the oxide layer represented by oxygen content is equal to or greater than 0.5% mass % and equal to or less than 8.0 mass %. The orientation intensity ratio of the main orientation plane of Bi or Bi alloy crystals in the overlay is 50% or greater. The main orientation plane of the bismuth oxide crystals in the oxide layer is the (220) plane or the (201) plane. | 09-25-2014 |
20150016766 | SLIDING MEMBER - There is provided a sliding member formed by combining a resin overlay and a soft metal overlay. The sliding member has a soft layer comprising a metallic material with a hardness of less than 40 HV provided under a resin overlay layer comprising a solid lubricant and resin. In the event of contamination by a foreign matter, the soft layer under the resin overlay layer is capable of plastic deformation and the resin overlay layer is capable of partial deformation accompanying the plastic deformation due to the hardness (T1) (μm) of the soft layer and the hardness (T2) (μm) of the resin overlay layer being such that 0.2≦T1/T2≦7.0 and 3.0≦T1≦20.0. Consequently, a foreign matter is desirably embedded and resistance to a foreign matter can be improved. Low friction is maintained by the resin overlay layer even after contamination by a foreign matter. | 01-15-2015 |
20150291904 | SLIDING MEMBER - Provided is a sliding member which has high seizure resistance though an overlay layer comprising Ag as the main component is used therein. The sliding member of an embodiment comprises a base and an overlay layer which is disposed on the sliding-side surface of the base and which comprises Ag as the main component and contains Al. The overlay layer comprising Ag as the main component is relatively soft. Due to this, the overlay layer comprising Ag as the main component can ensure high seizure resistance even when the use of Pb is avoided. Furthermore, the overlay layer comprising Ag as the main component has excellent thermal conductivity. Due to this, frictional heat generating at the sliding part rapidly dissipates to the base side. | 10-15-2015 |
Patent application number | Description | Published |
20120025545 | Bumper reinforcement and bumper device for vehicle - A bumper reinforcement having end portions in a width direction of a vehicle, includes a main wall extending in a first direction perpendicular to the width direction, first and second walls protruding from the main wall in the first direction to extend toward an interior side of the vehicle in a longitudinal direction of the vehicle, flanges protruding from respective ends of the first and second walls along the first direction, the main wall, the first and second walls, and the flanges being integrally formed with one another, and gradually narrowing portions formed, in the width direction, at end portions of each of the first and second walls, wherein respective protruding lengths of the first and second walls in the longitudinal direction gradually decrease from an intermediate portion of the bumper reinforcement to the end portions of the bumper reinforcement in the width direction to form the gradually narrowing portions. | 02-02-2012 |
20120025546 | Bumper device for vehicle - A bumper device for a vehicle, includes a bumper reinforcement extending in a width direction of the vehicle, a connecting member extending in a longitudinal direction of the vehicle and connected to an end portion of the bumper reinforcement, the connecting member including a bottom wall portion that is in contact with the bumper reinforcement, a fitting bore formed in either one of the bottom wall portion and a contact wall portion of the bumper reinforcement, an insertion portion formed at the other one of the bottom wall portion and the contact wall portion and inserted in the fitting bore, and a flange extending from an edge of the insertion portion, wherein the one of the bottom wall portion and the contact wall portion, including the fitting bore is supported by the flange and the other one of the bottom wall portion and the contact wall portion, including the flange. | 02-02-2012 |
20120025547 | Impact absorbing device for vehicle and bumper device for vehicle - An impact absorbing device for a vehicle includes an impact-absorbing portion including an inner wall surface extending smoothly in an axial direction and configured to compressively deform in the axial direction for absorbing an impact energy, a first attaching portion closing an opening end of the impact-absorbing portion closer to a bumper reinforcement and configured to be attached to the bumper reinforcement, a second attaching portion extending from an opening end of the impact-absorbing portion closer to the side member and configured to be attached to a side member, a readily deformable portion provided at the impact-absorbing portion and formed by forming a plate thickness to be thinner in a partial range of the impact-absorbing portion in the axial direction, and an initial peak load restraining portion provided at the first attaching portion and set to be away from the bumper reinforcement in the axial direction, which are integrally formed. | 02-02-2012 |
20120228889 | VEHICLE BUMPER DEVICE - A bumper reinforcement is provided with a front wall portion, an upper wall portion, and a lower wall portion. The front wall portion constitutes the front portion of the bumper reinforcement. The upper wall portion is connected to the upper edge of the front wall portion and constitutes the upper half of the rear portion of the bumper reinforcement. The lower wall portion is connected to the lower edge of the front wall portion and constitutes the lower half of the rear portion of the bumper reinforcement. Outer grooves are formed by denting the front wall portion rearward and extend along the vehicle width direction. The upper wall portion comprises a top wall which constitutes the top of the upper wall portion. Upper grooves are formed by denting the top wall downward, and are located intermittently along the aforementioned width direction. Furthermore, the upper grooves extend in the longitudinal direction. The lower wall portion comprises a bottom wall which constitutes the bottom of the lower wall portion. Lower grooves are formed by denting the lower wall portion upward, and are located intermittently along the aforementioned width direction. Furthermore, the lower grooves extend in the longitudinal direction. | 09-13-2012 |
20130001963 | SHOCK ABSORBER AND BUMPER DEVICE FOR VEHICLE - A shock absorber includes a cylindrical small diameter portion, a cylindrical large diameter portion, and an annular step portion that connects the small diameter portion and the large diameter portion to each other. The shock absorber absorbs load applied thereto through plastic deformation that starts at the annular step portion thereby absorbing impact energy. In the deformation, the small diameter portion is folded back into the large diameter portion. The large diameter portion has protrusions, which extend in the axial direction and protrude radially outward. Therefore, the shock absorber stabilizes turning deformation and is capable of efficiently absorbing impact energy. A bumper device for a vehicle is also provided. | 01-03-2013 |
20140292040 | ROOF RAIL - A roof rail includes a support member configured to be assembled on a roof of a vehicle, a first cover made from synthetic resin material, the first cover including a lengthwise-direction first end portion which is fixed to the support member and a lengthwise-direction second end portion which is supported by the support member to be expandable and contractible in a vehicle front/rear direction, and a second cover made from synthetic resin material, the second cover being supported by the support member to be expandable and contractible in the vehicle front/rear direction, the second cover including a lengthwise-direction end portion which is assembled to the lengthwise-direction second end portion of the first cover, wherein an outer surface of the lengthwise-direction second end portion of the first cover and an outer surface of the lengthwise-direction end portion of the second cover are coplanar with each other. | 10-02-2014 |
Patent application number | Description | Published |
20130042164 | NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE - A non-volatile semiconductor memory device includes: a memory unit including a plurality of memory cells, each of the plurality of memory cells to perform a multi-level storage operation by assigning a value including a plurality of bits to at least four data states defined according to a threshold level; and a controller to control the memory unit, wherein the controller sets at least one of the plurality of bits to an error correction bit that indicates one of a first state and a second state; assigns the first state to the error correction bits that correspond to the data states having a minimum threshold level and a maximum threshold level and the second state to the error correction bits that correspond to the data state having other threshold level; and resets the error correction bit to the first state when the error correction bit indicates the second state. | 02-14-2013 |
20130166857 | STORAGE DEVICE AND METHOD FOR CONTROLLING STORAGE DEVICE - A write DMA includes a write unit, a read unit and a parity generation unit. The read unit reads parity data from one of two NAND flashes storing the parity data therein. The parity generation unit generates parity data based on the read parity data and a plurality of stripes obtained by dividing user data. The write unit writes a stripe into any of a plurality of NAND flashes storing stripes therein, and writes generated parity data into the other NAND flash from which parity data is not read. | 06-27-2013 |
20130246690 | INFORMATION PROCESSING SYSTEM AND DATA-STORAGE CONTROL METHOD - In an information processing system, a processor requests a first transfer control circuit to transfer data to a first memory. In response to the request from the processor, the first transfer control circuit sends the data to a second transfer control circuit. The second transfer control circuit stores in a second memory the data received from the first transfer control circuit, and also stores the data in the first memory through the first transfer control circuit. | 09-19-2013 |
20140006884 | DATA CONVERTING METHOD, DATA CONVERTING APPARATUS, AND COMPUTER PRODUCT | 01-02-2014 |
20140298086 | STORAGE DEVICE, CONTROLLER DEVICE, AND MEMORY DEVICE - A storage device includes a controller device and a memory device. The controller device transmits communication information to which route information is added, the route information indicating a route to a destination of the communication information and including an address of a relay point that the communication information passes through before reaching the destination of the communication information. The memory device receives the communication information, and to transmit the communication information to a next relay point, when the destination of the communication information is not the local memory device, by using the address of the relay point included in the route information of the communication information. | 10-02-2014 |
20150200685 | RECORDING AND REPRODUCING DEVICE, ERROR CORRECTION METHOD, AND CONTROL DEVICE - A recording and reproducing device includes a plurality of data storing units, a control unit, a first error detection-and-correction unit, and a second error detection-and-correction unit. The control unit creates stripe data with a predetermined write capacity, creates a redundant group, associates a plurality of pieces of stripe data, and controls the writing of the associated data into each of the plurality of the data storing units. The first error detection-and-correction unit detects whether an error is present in each of the pieces of the stripe data, and corrects the stripe data. The second error detection-and-correction unit groups the second error correction code and the pieces of the stripe data, creates a plurality of error correction groups, detects whether an error is present in each of the pieces of the split stripe data in the same error correction group, and corrects the split stripe data. | 07-16-2015 |
20150324248 | INFORMATION PROCESSING DEVICE, CONTROL METHOD AND RECORDING MEDIUM FOR RECORDING CONTROL PROGRAM - An information processing device includes: a processor; a first storage device configured to hold data that is read and written by the processor; and a controller configured to control data transfer between the processor and the first storage device, wherein the controller: reads out first data from the first storage device through a path without a data protection function; generates error check information for checking an error of the first data; writes the error check information as first error check information in a storage area bypassing the path; writes the error check information as second error check information in the first storage device through the path; compares the first error check information and the second error check information to each other; and determines, when the first error check information and the second error check information do not match each other, that an error has occurred in the path. | 11-12-2015 |
Patent application number | Description | Published |
20080232064 | COOLING SYSTEM FOR INFORMATION DEVICE - To cool a blade type server disposed in an air-conditioned room, the following arrangements are made. The first is at least one shell having a ventilation passage disposed in the air-conditioned room. The second is, the following are disposed in a ventilation passage: racks, in which blade type servers each composed of a case with slim boards housed therein are stacked; cooling coils each having a coolant passage and a cooling fin and cooling a passing air; and at least one fan unit having axial-flow fans placed therein and producing air currents in one direction. The third is the fan unit forces a cooling air to flow in one direction in the ventilation passage thereby to cool the servers in the racks. The cooling coils and racks are disposed alternately so that warmed cooling air after passing through the rack is cooled by the cooling coil and then cools the next rack. | 09-25-2008 |
20110317357 | COOLING SYSTEM FOR INFORMATION DEVICE - To cool a blade type server disposed in an air-conditioned room, the following arrangements are made. The first is at least one shell having a ventilation passage disposed in the air-conditioned room. The second is, the following are disposed in a ventilation passage: racks, in which blade type servers earch composed of a case with slim boards housed therein are stacked; cooling coils each having a coolant passage and a cooling fin and cooling a passing air; and at least one fan unit having axial-flow fans placed therein and producing air curents in one direction. The third is the fan unit forces a cooling air to flow in one direction in the ventilation passage thereby to cool the servers in the racks. The cooling coils and racks are dispossed alternately so that warmed cooling air after passing through the rack is cooled by the cooling coil and then cools the next rack. | 12-29-2011 |
20120097360 | Air conditioner and air conditioning system - An air conditioner sucks air exhausted from an information processor, and cools down the sucked air. The air conditioner exhausts the cooled air. The air conditioner acquires a cooling state, determines whether a cooling capacity exceeds an upper limit value, and reduces the volume of exhaust air when it is determined that the cooling capacity exceeds the upper limit value. For example, the air conditioner calculates a thermal load as the cooling state by using the volume of exhaust air, a difference between the temperature of exhaust air and the temperature of suction air, and determines that the cooling capacity exceeds the upper limit value when the calculated thermal load exceeds a given threshold. The air conditioner measures the temperature of exhaust air, and determines that the cooling capacity exceeds the upper limit value when the measured temperature exceeds a set value. | 04-26-2012 |
20120100795 | AIR-CONDITIONING SYSTEM - An air-conditioning system includes a ceiling plenum disposed above a ceiling of a room; an air-conditioning machine disposed in an internal space of the room; a plurality of IT apparatus mounting racks disposed in a plurality of rows, with rear faces of the IT apparatus mounting racks in adjacent two rows opposed to each other; a upper partitioning board disposed between an upper face of the plurality of IT apparatus mounting racks and the ceiling; an end-partitioning board disposed between each of ends of a space between adjacent two rows of the plurality of IT apparatus mounting racks and the ceiling; and a ceiling opening portion provided in the ceiling above a warm-air space enclosed by the upper partitioning board and the end-partitioning board. The ceiling opening portion connects the warm-air space with the ceiling plenum. | 04-26-2012 |
Patent application number | Description | Published |
20090062348 | Antifungal Agent Containing Pyridine Derivative - The present invention provides an antifungal agent that has superior antifungal action and is also superior in terms of physical properties, safety and metabolic stability. The present invention discloses a compound represented by the formula (I): | 03-05-2009 |
20090269352 | ANTITUMOR AGENT COMPRISING SULFONAMIDE-CONTAINING HETEROCYCLIC COMPOUND COMBINED WITH AN ANGIOGENESIS INHIBITOR - The present invention provides a composition and a kit for treating tumors, which permits a sulfonamide-containing heterocyclic compound to exhibit its angiogenesis inhibitory activity and antitumor activity more effectively. According to the present invention, the sulfonamide-containing heterocyclic compound can be used in treating cancers more effectively by combination with a VEGF inhibitor/FGF inhibitor. | 10-29-2009 |
20100267754 | INTEGRIN EXPRESSION INHIBITOR - The present invention provides an integrin expression inhibitor, and an agent for treating arterial sclerosis, psoriasis, cancer, retinal angiogenesis, diabetic retinopathy or inflammatory diseases, an anticoagulant, or a cancer metastasis suppressor on the basis of an integrin inhibitory action. Namely, it provides an integrin expression inhibitor comprising, as an active ingredient, a sulfonamide compound represented by the following formula (I), a pharmacologically acceptable salt thereof or a hydrate of them, | 10-21-2010 |
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20130037980 | PROCESS FOR PRODUCTION OF MULTILAYERED STRUCTURE - Provided is a method of producing a multilayered structure, comprising the steps of: obtaining a regrind (C) by grinding a multilayered structure (B) having a layer of a resin composition (A), followed by sieving; and obtaining a multilayered structure (F) having a layer of a resin composition (E) made by melt kneading the regrind (C) and a polyolefin (D), wherein the resin composition (A) contains a polyolefin (G), a saponified ethylene-vinyl acetate copolymer (H) having an ethylene content of from 20 to 65 mol % and having a degree of saponification of vinyl acetate units of 96% or more, a saponified ethylene-vinyl acetate copolymer (I) having an ethylene content of from 68 to 98 mol % and having a degree of saponification of vinyl acetate units of 20% or more, and an antistatic agent (J), and a mass ratio (H/I) is from 0.1 to 10. According to this, using a regrind of a multilayered structure having a resin composition layer containing a polyolefin and an EVOH enables to provide a method of producing a multilayered structure that is suppressed in generation and worsening of uneven cloudiness. | 02-14-2013 |
20130040157 | RESIN COMPOSITION AND MULTILAYERED STRUCTURE USING SAME - A resin composition, containing: (A) polyolefin; (B) a saponified ethylene-vinyl acetate copolymer having an ethylene content of from 20 to 65 mol % and a degree of saponification of vinyl acetate units of 96% or more; (C) a saponified ethylene-vinyl acetate copolymer having an ethylene content of from 68 to 98 mol % and a degree of saponification of vinyl acetate units of 20% or more; and a pigment (E), wherein a mass ratio (A/B) is from 3 to 99.5, a mass ratio (B/C) is from 1 to 100, a mass ratio (E/C) is from 0.04 to 50, and a content of (C) is from 0.01 to 2.4 parts by mass based on 100 parts by mass of (A) and (B). A molded product, in particular a multilayered structure, obtained by melt molding the resin composition has good dispersibility of the pigment, and improved uneven coloration. | 02-14-2013 |
20130244048 | RESIN COMPOSITION AND MULTILAYERED STRUCTURE USING SAME - A resin composition, containing: (A) polyolefin; (B) a saponified ethylene-vinyl acetate copolymer having an ethylene content of from 20 to 65 mol % and a degree of saponification of vinyl acetate units of 96% or more; (C) a saponified ethylene-vinyl acetate copolymer having an ethylene content of from 68 to 98 mol % and a degree of saponification of vinyl acetate units of 20% or more; and a pigment (E), wherein a mass ratio (A/B) is from 3 to 99.5, a mass ratio (B/C) is from 1 to 100, a mass ratio (E/C) is from 0.04 to 50, and a content of (C) is from 0.01 to 2.4 parts by mass based on 100 parts by mass of (A) and (B). A molded product, in particular a multilayered structure, obtained by melt molding the resin composition has good dispersibility of the pigment, and improved uneven coloration. | 09-19-2013 |
Patent application number | Description | Published |
20120310497 | GEAR-SHIFT CONTROL APPARATUS FOR AUTOMATIC TRANSMISSION - A gear-shift control apparatus comprises: a shift-hold-level-calculation unit for calculating, in accordance with operation of a driver, a shift hold level that varies between 0% representing a complete automatic transmission state and 100% representing a complete manual transmission state; and a gear-shift processing unit for performing gear-shift control processing for an automatic transmission in accordance with the shift hold level calculated by the shift-hold-level-calculation unit. | 12-06-2012 |
20140171261 | HYBRID DRIVING APPARATUS - A hybrid driving apparatus includes an engine configured to output a rotation driving force to an output shaft; an input shaft configured to rotate in association with rotation of driving wheels of a vehicle; a clutch that is provided between the output shaft and the input shaft to disengageably connect the output shaft and the input shaft; a clutch actuator configured to operate the clutch; a motor generator configured to rotate in association with rotation of the input shaft; a rust formation determining unit configured to determine whether there is a possibility of a rust formation on the clutch; and a rust formation suppressing unit configured to operate the clutch actuator in a case where the rust formation determining unit determines that there is the possibility of the rust formation on the clutch. | 06-19-2014 |
20140360793 | HYBRID DRIVE DEVICE - A hybrid drive device in which an input shaft is connected to an engine, an output shaft is connected to wheels, and a wheel drive motor is connected between the input shaft and the output shaft. In the hybrid device, a friction engagement element that is provided between the input shaft and the output shaft and of which transfer torque is controllable. A control device controls the friction engagement element. The control device reduces the transfer torque of the friction engagement element during engine starting in a predetermined low temperature environment or during travel on a bad road, compared to the transfer torque of the friction engagement element in an engaged state. | 12-11-2014 |
20150203104 | HYBRID DRIVE DEVICE - A hybrid drive device has a clutch connecting and disconnecting an output shaft and an input shaft, a first motor generator that rotates in conjunction with the rotation of the input shaft, an allowable clutch heat generation amount calculation portion that calculates the allowable clutch heat generation amount, an allowable differential clutch rotation speed calculation portion which calculates the allowable differential clutch rotation speed for when engagement starts, on the basis of the allowable clutch heat generation amount, and a motor generator rotation control portion that controls the rotation speed of the first motor generator such that the differential clutch rotation speed when engagement starts and during engagement is no more than the allowable differential clutch rotation speed when engagement starts. | 07-23-2015 |