Shigetomi
Shigetomi Michimata, Kanagawa JP
Patent application number | Description | Published |
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20090008641 | Probe resistance measurement method and semiconductor device with pads for probe resistance measurement - A probe resistance measuring method includes measuring first resistances at three or more nodes by making contact at least a part of a plurality of probes of a probe unit with three or more pads for resistance measurement based on a first correspondence relation. The measured resistances are stored as a first measurement result and contact resistances of the plurality of probes of the probe unit are calculated based on the first measurement result. | 01-08-2009 |
20130001551 | PROBE RESISTANCE MEASUREMENT METHOD AND SEMICONDUCTOR DEVICE WITH PADS FOR PROBE RESISTANCE MEASUREMENT - A probe resistance measuring method includes measuring first resistances at three or more nodes by making contact at least a part of a plurality of probes of a probe unit with three or more pads for resistance measurement based on a first correspondence relation. The measured resistances are stored as a first measurement result and contact resistances of the plurality of probes of the probe unit are calculated based on the first measurement result. | 01-03-2013 |
Shigetomi Morita, Atsugi-Shi JP
Patent application number | Description | Published |
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20100206487 | ULTRASONIC VIBRATION WELDER - The present invention solves the problem that a connecting portion between a horn and a vibration transmission rod has a tendency to get damaged and the problem associated with the structure in which a chip is attached to an end of the vibration transmission rod, which occur with the known ultrasonic vibration welder. A vibration transmission rod has an end surface serving as a vibration-and-pressure application surface, and a polygonal cross section. The vibration transmission rod is disposed at an end of a horn in such a manner that they vibrate together. The vibration transmission rod and a mass are formed separately. The mass applies pressure to a projection formed at a nodal point of the vibration transmission rod. | 08-19-2010 |
Shigetomi Tokunaga, Shiga JP
Patent application number | Description | Published |
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20100200290 | ELECTRONIC CIRCUIT DEVICE FOR COMPRESSOR - Including a storage box for accommodating a printed circuit board having a heat sink, an aluminum plate for closing an opening part of the storage box, and a rubber bush for supporting the printed circuit board from an opposite side of the opening part, the heat sink and the aluminum plate are brought to contact with each other by way of the insulating sheet, so that the heat of the heat sink may be transmitted to the aluminum plate, and released. | 08-12-2010 |