Patent application number | Description | Published |
20080197370 | LIGHT EMITTING DIODE STRUCTURE AND MANUFACTURING METHOD THEREOF - A light emitting diode structure has a silicon substrate, a conductive layer, and a light emitting diode. The top surface of the silicon substrate has a cup-structure like paraboloid, and the bottom of the cup-structure has a plurality of through-holes penetrating the silicon substrate. The conductive layer fills up the through-holes and protrudes out from the through-holes. The light emitting diode is disposed on the top of the conductive layer protruding out from the through-holes and is located at the focus of the cup-structure. | 08-21-2008 |
20080210963 | LIGHT EMITTING DIODE PACKAGE STRUCTURE AND METHOD OF MAKING THE SAME - A light emitting diode package structure has a silicon substrate, a plurality of cup-structures on the silicon substrate, a plurality of conductive patterns disposed on the silicon substrate, one of a plurality of light emitting diodes respectively disposed on each cup-structure and a plurality of wires electrically connected to the light emitting diodes and the conductive patterns. The light emitting diodes are electrically connected in series through the conductive wires and the conductive patterns. | 09-04-2008 |
20090032832 | LIGHT EMITTING DIODE STRUCTURE - A light emitting diode structure has a silicon substrate, a conductive layer, and a light emitting diode. The top surface of the silicon substrate has a cup-structure like paraboloid, and the bottom of the cup-structure has a plurality of through-holes penetrating the silicon substrate. The conductive layer fills up the through-holes and protrudes out from the through-holes. The light emitting diode is disposed on the top of the conductive layer protruding out from the through-holes and is located at the focus of the cup-structure. | 02-05-2009 |
20100047942 | METHOD OF MAKING WHITE LED PACKAGE STRUCTURE HAVING A SILICON SUBSTRATE - A method of making a white LED package structure having a silicon substrate comprises providing a silicon substrate and performing an etching process to form a plurality of cup-structures on a top surface of the silicon substrate. Next, a reflective layer on the top surface of the silicon substrate is formed, and a transparent insulating layer on the reflective layer is formed. Subsequently, a plurality of blue LEDs are respectively bonded in each cup-structure, wherein the blue LEDs have various wavelengths. Last, a plurality of kinds of phosphor powders corresponding to the wavelengths of the blue LEDs are mixed with each other and added to a sealing material, and a sealing process is performed to form a phosphor structure on the cup-structures. | 02-25-2010 |
Patent application number | Description | Published |
20110150791 | CALCIUM PHOSPHATE COMPLEX FOR ORAL CARE APPLICATIONS, ITS PREPARATION METHOD, AND COMPOSITIONS CONTAINING THE SAME - The invention is directed to a calcium phosphate complex and the composition containing the same for oral care applications, in which the calcium phosphate complex is formed by chelating the γ-polyglutamic acid (γ-PGA) with amorphous calcium phosphate (ACP). This complex can prevent crystallization of ACP and maintain its high solubility. The calcium phosphate complex has superior mucoadhesion properties, allowing it to remain in the mouth longer and offering effective buffering, by which dental caries can be alleviated and prevented. | 06-23-2011 |
20110229547 | PROCESS FOR PRODUCING INORGANIC INTERCONNECTED 3D OPEN CELL BONE SUBSTITUTES - The present invention relates to a process of using a heat responsive mixture to produce inorganic interconnected 3D open-cell bone substitutes which can be applied in the orthopedic or dental field for treatment of bone damage. The invention provides a simple and easily-controlled process of preparing porous inorganic bone substitute materials. | 09-22-2011 |
20120189683 | COMPOSITE OF AMORPHOUS CALCIUM PHOSPHATE/CALCIUM SULFATE HEMIHYDRATE (CSH/ACP) FOR BONE IMPLANTATION AND PROCESS FOR PRODUCING THE SAME - The invention provides a composite of α-calcium sulfate (CS) hemihydrate/amorphous calcium phosphate (α-CSH/ACP), comprising α-CSH and ACP at a weight ratio of about 10:90 to about 90:10. Particularly, the composite of the invention has a resorption period of 3-6 months. The invention also provides a one-pot process for producing α-CSH/ACP composite of the invention. The one-pot process of the invention can produce α-CSH and ACP in a single process and easily obtain α-CSH/ACP composite. | 07-26-2012 |
20120301436 | POLYELECTROLYTE COMPLEX GELS AND SOFT TISSUE AUGMENTATION IMPLANTS COMPRISING THE SAME - The invention provides a polyelectrolyte complex gel comprising a chitosan and a γ-polyglutamic acid (γ-PGA) having a molecular weight from about 1 kDa to about 400 kDa or the salt thereof, wherein the chitosan and the γ-PGA are swollen with an aqueous solution. Also provided is a soft tissue augmentation implant, comprising a polyelectrolyte complex gel of the invention as a carrier or a filler and an optional additive. The polyelectrolyte complex gel and the soft tissue augmentation implant containing the same has long degradation time and better supportability so as to provide good maintenance for soft tissue. | 11-29-2012 |