Patent application number | Description | Published |
20130134575 | PACKAGED DIE FOR HEAT DISSIPATION AND METHOD THEREFOR - A heat spreader die holder that covers at least 50% of both major sides of a semiconductor die. The heat spreader die holder includes at least one opening. The heat spreader die holder is attached to a substrate. Electrically conductive structures of the die are electrically coupled to electrically conductive structures of the substrate. | 05-30-2013 |
20130221076 | EMBEDDED ELECTRONIC COMPONENT - Forming an embedded electronic component includes attaching an electronic component to a first conductive layer and forming a layer stack with a first partially cured dielectric layer having a first opening and a substrate having a second opening. The partially cured dielectric layer is located over the first conductive layer and the substrate is located over the first partially cured dielectric layer such that the first and second openings surround the electronic component. Heat and pressure are applied to the layer stack such that the first partially cured dielectric layer flows for filling gaps within the first and second openings and becomes fully cured. | 08-29-2013 |
20130221511 | METHOD FOR FORMING DIE ASSEMBLY WITH HEAT SPREADER - A method for forming a molded die assembly includes attaching a first major surface of a semiconductor die onto a package substrate; attaching a heat spreader to a second major surface of the semiconductor die, wherein the second major surface is opposite the first major surface, and wherein the semiconductor die, package substrate, and heat spreader form a die assembly; conforming a die release film to a transfer mold; closing the transfer mold around the die assembly such that the die release film is compressed against the heat spreader and a cavity is formed around the die assembly; transferring a thermoset material into the cavity; and releasing the die assembly from the die release film and the transfer mold. | 08-29-2013 |
20130320548 | INTEGRATED CIRCUIT DIE ASSEMBLY WITH HEAT SPREADER - A packaged semiconductor device comprises a package substrate comprising a first package substrate contact and a second package substrate contact, and a semiconductor die over the package substrate. The semiconductor device further includes electrical connections between signal contact pads of the die and the package substrate, and a heat spreader that comprises a first heat spreader portion which is electrically connected to a first signal contact pad and the first package substrate contact and provides an electrical conduction path and a thermal conduction path. A second heat spreader portion provides an electrical conduction path between a second signal contact pad and the second package substrate contact and a thermal conduction path between the die and package substrate. An insulating layer is positioned between the first and second heat spreader portions. | 12-05-2013 |
20140001632 | SEMICONDUCTOR PACKAGE STRUCTURE HAVING AN AIR GAP AND METHOD FOR FORMING | 01-02-2014 |
20140147975 | SEMICONDUCTOR DEVICE PACKAGE - Forming a packaged semiconductor device includes placing a semiconductor die attached to a carrier into a mold cavity having an injection port, wherein the semiconductor die has an encapsulant exclusion region on a top surface of the semiconductor die within an outer perimeter of the top surface; and flowing an encapsulant over the semiconductor die and carrier from the injection port, wherein the encapsulant flows around the encapsulant exclusion region to surround the encapsulant exclusion region without covering the encapsulant exclusion region. The encapsulant exclusion region has a first length corresponding to a single longest distance across the encapsulant exclusion region, wherein the first length is aligned, within 30 degrees, to a line defined by a shortest distance between an entry point of the injection port into the mold cavity and an outer perimeter of the encapsulant exclusion region. | 05-29-2014 |
20140213018 | METHOD FOR FORMNG A SEMICONDUCTOR DEVICE ASSEMBLY HAVING A HEAT SPREADER - A method includes providing an integrated circuit (IC) die assembly that includes a substrate and an IC die mounted on a portion of a major surface of the substrate, dispensing an interface material on the IC die, positioning a portion of a heat spreader in contact with the interface material, and dispensing an adhesive between one side of the heat spreader facing the IC die assembly and exposed portions of a major surface of an encapsulant on the substrate. | 07-31-2014 |
20140367859 | TIN-BASED WIREBOND STRUCTURES - Tin-based wirebond structures and wirebonds formed thereon. In some embodiments, an electronic package includes a semiconductor die located over a substrate and a wire configured to couple a terminal of the semiconductor die to a bond pad on the substrate. A wire bond between the wire and the bond pad may include an amount of tin originated from a layer of tin alloy formed on the bond pad. In other embodiments, a wirebond structure may include a conductive layer and a layer of tin alloy located over a portion of the conductive layer. The layer of tin alloy may provide a wirebonding contact surface configured to receive a bond wire. | 12-18-2014 |
20140374891 | SEMICONDUCTOR DEVICE WITH HEAT SPREADER AND THERMAL SHEET - A semiconductor device includes a die pad and a semiconductor die having a mounting surface attached to the die pad and an opposite, active surface with die external terminals. The device has package external connectors, each having a bond region selectively electrically coupled to the die external terminals with a bond wire. A heat spreader has a first region that encloses an inner recessed region. A thermally conductive sheet is sandwiched between the inner recessed region of the heat spreader and the active surface of the die. At least the die, die external terminals, and the bond region are covered with an encapsulant. | 12-25-2014 |
20150118791 | METHOD FOR TREATING A BOND PAD OF A PACKAGE SUBSTRATE - A method of making a package substrate having a copper bond pad and a location for receiving a semiconductor die having a remnant of one of a group consisting of HEDP and an HEDP derivative on a top surface of the copper bond pad. The semiconductor die is attached to the substrate. A wirebond connection is attached between the remnant and the semiconductor die. | 04-30-2015 |
20150303169 | SYSTEMS AND METHODS FOR MULTIPLE BALL BOND STRUCTURES - A method for forming a semiconductor device includes forming a first ball bond on a first contact pad, in which the first ball bond has a first wire segment of a bonding wire extending from the ball bond; forming a mid-span ball in the first wire segment at a first distance from the ball bond; and after the forming the mid-span ball, attaching the mid-span ball to a second contact pad to form a second ball bond. | 10-22-2015 |
20150311173 | STRUCTURES AND METHODS FOR REDUCING CORROSION IN WIRE BONDS - A semiconductor structure includes a bond pad and a wire bond coupled to the bond pad. The wire bond includes a bond in contact with the bond pad. The wire bond includes a coating on a surface of the wire bond, and a first exposed portion of the wire bond in a selected location. The wire bond is devoid of the coating over the selected location of the wire bond, and an area of the first exposed portion is at least one square micron. | 10-29-2015 |
20150318240 | ALUMINUM CLAD COPPER STRUCTURE OF AN ELECTRONIC COMPONENT PACKAGE - An electronic component package that includes a package substrate having an aluminum bond pad formed from an aluminum clad copper structure. The aluminum clad copper structure is attached to a dielectric layer. An electronic component is attached to the substrate and includes a conductive structure electrically coupled to the aluminum bond pad. The aluminum bond pad, the electronic component, and at least a portion of the substrate are encapsulated with an encapsulant. | 11-05-2015 |
20150380376 | SURFACE FINISH FOR WIREBONDING - The present disclosure provides embodiments of package devices and methods for making package devices for a semiconductor die. One embodiment includes a die mounting structure having a finished bond pad that includes a copper bond pad and a cobalt-containing layer over a top surface of the copper bond pad, and a wire bond structure that is bonded to a top surface of the cobalt-containing layer of the finished bond pad, where cobalt-containing material of the cobalt-containing layer is located between a bottom surface of the wire bond structure and the top surface of the copper bond pad such that the cobalt-containing material is present under a center portion of the wire bond structure. | 12-31-2015 |
20160064316 | PACKAGE SUBSTRATE WITH IMPROVED RELIABILITY - A packaged semiconductor device having a package substrate that includes a plurality of electrical contacts on a first major surface and a die positioned on a second major surface. Each of the plurality of electrical contacts includes a perimeter portion. A first subset of the electrical contacts have more than fifty percent of the perimeter portion bounded by a solder mask. A second subset of the electrical contacts have less than fifty percent of the perimeter portion bounded by a solder mask. The die is positioned over only the first subset of the electrical contacts. | 03-03-2016 |
Patent application number | Description | Published |
20130100624 | CIRCUIT BOARD CONTACT PADS - The present disclosure provides a circuit board with a first via and a second via, the first and second vias providing an electrical path from a top surface of the circuit board to a bottom surface of the circuit board. The circuit board also includes a first contact pad electrically coupled to the first via and a second contact pad electrically coupled to the second via. The first contact pad is disposed at an angle with respect to a reference line crossing through the center of the first and second vias, and the second contact pad is disposed on an opposite side of the reference line at the angle with respect to the reference line, such that a footprint that encompasses an area between the first and second contact pads does not cover the first and second vias. | 04-25-2013 |
20140325134 | PREARRANGING DATA TO COMMIT TO NON-VOLATILE MEMORY - An apparatus includes a hybrid memory module, and the hybrid memory module includes volatile memory and non-volatile memory. Data is prearranged in the volatile memory. The data is committed to the non-volatile memory, as prearranged, in a single write operation when a size of the prearranged data reaches a threshold. | 10-30-2014 |
20140337589 | PREVENTING A HYBRID MEMORY MODULE FROM BEING MAPPED - A system includes a hybrid memory module. The hybrid memory module includes volatile memory and non-volatile memory. The system further includes a processor coupled to the hybrid memory module. The processor prevents the hybrid memory module from being mapped during a memory initialization routine by misrepresenting a status of the hybrid memory module. | 11-13-2014 |
20150085555 | PACKAGED MEMORY DIES THAT SHARE A CHIP SELECT LINE - An apparatus includes a memory module, and the memory module includes a package. The package contains memory dies, and the memory dies share a chip select line. | 03-26-2015 |
20150127890 | MEMORY MODULE WITH A DUAL-PORT BUFFER - A computer system includes a memory module. The memory module includes volatile memory, a non-volatile memory subsystem, a host port, and a dual-port buffer device. The dual-port buffer device synchronously couples the non-volatile memory subsystem and the host port to the volatile memory. The dual port buffer device includes routing logic to selectably route address information provided by the host port and the non-volatile memory subsystem to the volatile memory. | 05-07-2015 |
Patent application number | Description | Published |
20080225615 | PULSED RING OSCILLATOR CIRCUIT FOR STORAGE CELL READ TIMING EVALUATION - A pulsed ring oscillator circuit for storage cell read timing evaluation provides read strength information. A pulse generator is coupled to a bitline to which the storage cell to be measured is connected. The storage cell thereby forms part of the ring oscillator and the read strength of the storage cell is reflected in the frequency of oscillation. A pulse regeneration circuit is included in the ring so that the storage cell read loading does not cause the oscillation to decay. Alternatively, a counter may be used to count the number of oscillations until the oscillations decay, which also yields a measure of the read strength of the storage cell. The pulse generator may have variable output current, and the current varied to determine a change in current with the storage cell enabled and disabled that produces the same oscillation frequency. The read current is the difference between currents. | 09-18-2008 |
20090116312 | Storage Array Including a Local Clock Buffer with Programmable Timing - A storage array including a local clock buffer with programmable timing provides a mechanism for evaluating circuit timing internal to the storage array. The local clock buffer can independently adjust the pulse width of a local clock that controls the wordline and local bitline precharge pulses and the pulse width of a delayed clock that controls the global bitline precharge, evaulate and read data latching. The delay between the local clock and the delayed clock can also be adjusted. By varying the pulse widths of the local and delayed clock signal, along with the inter-clock delay, the timing margins of each cell in the array can be evaluated by reading and writing the cell with varying pulse width and clock delay. The resulting evaluation can be used to evaluate timing margin variation within a die, as well variation from die-to-die and under varying environments, e.g., voltage and temperature variation. | 05-07-2009 |
20100085823 | Optimizing Sram Performance over Extended Voltage or Process Range Using Self-Timed Calibration of Local Clock Generator - A delay circuit has a fixed delay path at a lower voltage level, a level converter, and an adjustable delay path at a higher voltage level. The fixed delay path includes an inverter chain, and the adjustable delay path includes serially-connected delay elements selectively connected to the circuit output. In an application for a local clock buffer of a static, random-access memory (SRAM), the lower voltage level is that of the local clock buffer, and the higher voltage level is that of the SRAM. These voltages may vary in response to dynamic voltage scaling, requiring re-calibration of the adjustable delay path. The adjustable delay path may be calibrated by progressively increasing the read access time of the SRAM array until a contemporaneous read operation returns the correct output, or by using a replica SRAM path to simulate variations in delay with changes in voltage supply. | 04-08-2010 |
20100102854 | CIRCULAR EDGE DETECTOR - A circular edge detector on an integrated circuit including a plurality of edge detector cells, each of the plurality of edge detector cells having an input select block operable to receive a data signal and a previous cell signal and to generate a present cell signal, and a state capture block operably connected to receive the present cell signal. The present cell signal of each of the plurality of edge detector cells is provided to a next of the plurality of edge detector cells as the previous cell signal for the next of the plurality of edge detector cells, and the present cell signal from a last edge detector cell is provided to a first edge detector cell as the previous cell signal for the first edge detector cell. | 04-29-2010 |
20110018511 | INTEGRATABLE EFFICIENT SWITCHING DOWN CONVERTER - A converter circuit and methods for operating the same. The converter circuit includes a supply voltage, a capacitor, an inductor, and four stacked switching elements. Each switching element is adjustable from a low resistance state to a high resistance state by a control signal. The inductor outputs current to a circuit load. The circuit may be operated in a first mode such that the output is adjustable between the supply voltage and half the supply voltage. Alternatively, in a second mode of operation, the output is adjustable from half the supply voltage to a ground voltage. | 01-27-2011 |
20120043982 | CRITICAL PATH MONITOR HAVING SELECTABLE OPERATING MODES AND SINGLE EDGE DETECTION - A critical path monitor having selectable data output modes provides additional information about critical path delay variation. A pulse is propagated through a synthesized path representing a critical path in a functional logic circuit and a synthesized path delay is measured by a monitoring circuit that detects the arrival of an edge of the pulse at the output of the synthesized delay. The measured delay is provided as a real-time output and a processed result of the measured delay is processed according to a data output mode selected from multiple selectable output modes, thereby providing different information describing the real-time data about critical path delay, such as a range of edge positions corresponding to a variation of the critical path delay. | 02-23-2012 |
20120124669 | Hindering Side-Channel Attacks in Integrated Circuits - A mechanism is provided for protecting a layer of functional units from side-channel attacks. A determination is made as to whether one or more subsets of functional units in a set of functional units in the layer of functional units is performing operations of a critical nature. Responsive to a determination that there is one or more subsets of functional units that are performing the operations of the critical nature, at least one concealing pattern is generated in a concealing layer in order to conceal the operations of the critical nature being performed by each of the subset of functional units. The concealing layer is electrically and physically coupled to the layer of functional units. | 05-17-2012 |
20120200285 | WIRE MANAGEMENT METHOD WITH CURRENT AND VOLTAGE SENSING - A wire management method using a wire manager including current sensing features provides input for power measurement and management systems. The wire manager may be a single wire or single bundle retaining device with a current sensor such as a hall effect sensor integrated therein, or may be a multi-wire management housing with multiple current sensing devices disposed inside for measuring the current through multiple wires. The wires may be multiple branch circuits in a power distribution panel or raceway, and the wire manager may be adapted for mounting in such a panel or raceway. Voltage sensing may also be incorporated within the sensors by providing an electrically conductive plate, wire or other element that capacitively couples to the corresponding wire. | 08-09-2012 |
20120200291 | NON-CONTACT CURRENT AND VOLTAGE SENSOR - A detachable current and voltage sensor provides an isolated and convenient device to measure current passing through a conductor such as an AC branch circuit wire, as well as providing an indication of an electrostatic potential on the wire, which can be used to indicate the phase of the voltage on the wire, and optionally a magnitude of the voltage. The device includes a housing that contains the current and voltage sensors, which may be a ferrite cylinder with a hall effect sensor disposed in a gap along the circumference to measure current, or alternative a winding provided through the cylinder along its axis and a capacitive plate or wire disposed adjacent to, or within, the ferrite cylinder to provide the indication of the voltage. | 08-09-2012 |
20120200293 | NON-CONTACT CURRENT AND VOLTAGE SENSING METHOD - A method of measurement using a detachable current and voltage sensor provides an isolated and convenient technique for to measuring current passing through a conductor such as an AC branch circuit wire, as well as providing an indication of an electrostatic potential on the wire, which can be used to indicate the phase of the voltage on the wire, and optionally a magnitude of the voltage. The device includes a housing that contains the current and voltage sensors, which may be a ferrite cylinder with a hall effect sensor disposed in a gap along the circumference to measure current, or alternative a winding provided through the cylinder along its axis and a capacitive plate or wire disposed adjacent to, or within, the ferrite cylinder to provide the indication of the voltage. | 08-09-2012 |
20120203481 | WIRE MANAGER WITH CURRENT AND VOLTAGE SENSING - A wire manager including current sensing features provides input for power measurement and management systems. The wire manager may be a single wire or single bundle retaining device with a current sensor such as a hall effect sensor integrated therein, or may be a multi-wire management housing with multiple current sensing devices disposed inside for measuring the current through multiple wires. The wires may be multiple branch circuits in a power distribution panel or raceway, and the wire manager may be adapted for mounting in such a panel or raceway. Voltage sensing may also be incorporated within the sensors by providing an electrically conductive plate, wire or other element that capacitively couples to the corresponding wire. | 08-09-2012 |
20130055185 | VERTICAL POWER BUDGETING AND SHIFTING FOR 3D INTEGRATION - A method is provided for managing power distribution on a 3D chip stack having two or more strata, a plurality of vertical power delivery structures, and multiple stack components. At least two stack components are on different strata. Operating modes are stored that respectively have different power dissipations. A respective effective power budget is determined for each of the at least two stack components based on respective ones of the operating modes targeted therefor, and power characteristics and thermal characteristics of at least some of the stack components inclusive or exclusive of the at least two stack components. The respective ones of the plurality of operating modes targeted for the at least two stack components are selectively accepted or re-allocated based on the respective effective power budget for each of the at least two stack components, power constraints, and thermal constraints. The power constraints include vertical structure electrical constraints. | 02-28-2013 |
20130076343 | NON-CONTACT CURRENT AND VOLTAGE SENSING CLAMP - A clamping current and voltage sensor provides an isolated and convenient technique for measuring current passing through a conductor such as an AC branch circuit wire, as well as providing an indication of an electrostatic potential on the wire, which can be used to indicate the phase of the voltage on the wire, and optionally a magnitude of the voltage. The device includes a body formed from two handle portions that contain the current and voltage sensors within an aperture at the distal end, which may be a ferrite cylinder with a hall effect sensor disposed in a gap along the circumference to measure current, or alternatively a winding provided through the cylinder along its axis and a capacitive plate or wire disposed adjacent to, or within, the ferrite cylinder to provide the indication of the voltage. When the handles are compressed the aperture is opened to permit insertion of a wire for measurement. | 03-28-2013 |
20130113448 | COIL INDUCTOR FOR ON-CHIP OR ON-CHIP STACK - A coil inductor and buck voltage regulator incorporating the coil inductor are provided which can be fabricated on a microelectronic element such as a semiconductor chip, or on an interconnection element such as a semiconductor, glass or ceramic interposer element. When energized, the coil inductor has magnetic flux extending in a direction parallel to first and second opposed surfaces of the microelectronic or interconnection element, and whose peak magnetic flux is disposed between the first and second surfaces. In one example, the coil inductor can be formed by first conductive lines extending along the first surface of the microelectronic or interconnection element, second conductive lines extending along the second surface of the microelectronic or interconnection element, and a plurality of conductive vias, e.g., through silicon vias, extending in direction of a thickness of the microelectronic or interconnection element. A method of making the coil inductor is also provided. | 05-09-2013 |
20130307656 | Stacked Through-Silicon Via (TSV) Transformer Structure - A distributed active transformer is provided comprising a primary and a secondary winding. The primary winding comprises a first set of conductive vias extending in a direction between a first surface and a second surface of an element, a first set of first electrically conductive lines extending along the first surface, and a first set of second electrically conductive lines extending along the second surface. The secondary winding comprises a second set of conductive vias extending in a direction between the first surface and the second surface, a second set of first electrically conductive lines extending along the first surface, and a second set of second electrically conductive lines extending along the second surface. When energized, the primary winding generates magnetic flux extending in a direction parallel to the first surface and the second surface. The secondary winding receives energy transferred by the magnetic flux generated by the primary winding. | 11-21-2013 |
20140136786 | ASYNCHRONOUS PERSISTENT STORES FOR TRANSACTIONS - A processor includes a processor core, a cache, and a tracker. The processor core is configured to execute persistent write instructions and receive notifications of completed persistent write instructions. The tracker is configured to track the completion state of a persistent write instruction. | 05-15-2014 |
20140312895 | NON-CONTACT CURRENT AND VOLTAGE SENSOR - A detachable current and voltage sensor provides an isolated and convenient device to measure current passing through a conductor such as an AC branch circuit wire, as well as providing an indication of an electrostatic potential on the wire, which can be used to indicate the phase of the voltage on the wire, and optionally a magnitude of the voltage. The device includes a housing that contains the current and voltage sensors, which may be a ferrite cylinder with a hall effect sensor disposed in a gap along the circumference to measure current, or alternative a winding provided through the cylinder along its axis and a capacitive plate or wire disposed adjacent to, or within, the ferrite cylinder to provide the indication of the voltage. | 10-23-2014 |
Patent application number | Description | Published |
20090031085 | Directory for Multi-Node Coherent Bus - A method for maintaining cache coherency for a multi-node system using a specialized bridge which allows for fewer forward progress dependencies. A look-up of a local node directory is performed if a request received at a multi-node bridge of the local node is a system request. If a directory entry indicates that data specified in the request has a local owner or local destination, the request is forwarded to the local node. If the local node determines that the request is a local request, a look-up of the local node directory is performed. If the directory entry indicates that data specified in the request has a local owner and local destination, the coherency of the data on the local node is resolved and a transfer of the request data is performed if required. Otherwise, the request is forwarded to all remote nodes in the multi-node system. | 01-29-2009 |
20090031086 | Directory For Multi-Node Coherent Bus - A method for maintaining cache coherency for a multi-node system using a specialized bridge which allows for fewer forward progress dependencies. A local node makes a determination whether a request is a local or system request. If the request is a local request, a look-up of a directory in the local node is performed. If an entry in the directory of the local node indicates that data in the request does not have a remote owner and that the request does not have a remote destination, the coherency of the data is resolved on the local node, and a transfer of the data specified in the request is performed if required and if the request is a local request. If the entry indicates that the data has a remote owner or that the request has a remote destination, the request is forwarded to all remote nodes in the multi-node system. | 01-29-2009 |
20120266125 | BONDING CONTROLLER GUIDED ASSESSMENT AND OPTIMIZATIONFOR CHIP-TO-CHIP STACKING - A method, system, and computer program product for performance-based chip-to-chip stacking are provided in the illustrative embodiments. A first candidate chip is selected from a set of candidate chips for stacking, each candidate chip in the set of candidate chips including an integrated circuit. A part of a | 10-18-2012 |
20120313647 | INFRASTRUCTURE FOR PERFORMANCE BASED CHIP-TO-CHIP STACKING - A method and system for an infrastructure for performance-based chip-to-chip stacking are provided in the illustrative embodiments. A critical path monitor circuit (infrastructure) is configured to launch a signal from a launch point in a first layer, the first layer being a first circuit. The infrastructure is further configured to create an electrical path to a capture point. The signal is launched from the launch point in the first layer. A performance characteristic of the electrical path is measured, resulting in a measurement, wherein the measurement is indicative of a performance of the first layer when stacked with a second layer in a 3D stack without actually stacking the first and the second layers in the 3D stack, the second layer being a second circuit. | 12-13-2012 |
Patent application number | Description | Published |
20120083331 | CONVERTIBLE IN-REVENUE AND OUT-OF-REVENUE GAMING SYSTEM AND METHOD WITH A REAL-TIME STREAMING VIDEO FEED AND DISPLAY - A convertible in-revenue and out-of-revenue gaming system is disclosed that includes a server connected to automatically convert operating modes and control in-revenue and out-of-revenue operation of one or more banks of gaming machines. Additionally disclosed are gaming machines with video cameras connected to provide live video feed to one or more displays, such as during tournament play when live video feed of the players and the player tournament positions may be driven in real-time to an overhead display by the server operating in a tournament controller mode. | 04-05-2012 |
20120083908 | CONVERTIBLE IN-REVENUE AND OUT-OF-REVENUE GAMING SYSTEM AND METHOD WITH A REAL-TIME PLAYER DASHBOARD DISPLAY - A convertible in-revenue and out-of-revenue gaming system is disclosed that includes a server connected to automatically convert operating modes and control in-revenue and out-of-revenue operation of one or more banks of gaming machines wherein each of the gaming machines includes a video camera connected to capture live player video feed during competition or tournament operating mode, and each of the gaming machines is operable to display a tournament game presentation simultaneously with a player dashboard. The player dashboard includes a display of the live player video, the player position, the player score, and remaining time in the competition or tournament. | 04-05-2012 |
20120083909 | TOURNAMENT GAME, GAMING MACHINE, GAMING SYSTEM AND METHOD WITH A PLAYER-INTERACTIVE BONUS FEATURE - A tournament game, gaming machine, gaming system and method are disclosed wherein a player-interactive bonus feature is triggered and displayed simultaneously with a tournament game presentation and a bonus award is paid responsive to a player selecting a displayed bonus target, such as a balloon. The bonus award is paid in addition to any award payable based on the tournament game outcome. | 04-05-2012 |
20130065659 | TOURNAMENT GAME, GAMING MACHINE, GAMING SYSTEM AND METHOD WITH A PLAYER-INTERACTIVE BONUS FEATURE - A tournament game, gaming machine, gaming system and method are disclosed wherein a player-interactive bonus feature is triggered and displayed simultaneously with a tournament game presentation and a bonus award is paid responsive to a player selecting a displayed bonus target, such as a balloon. The bonus award is paid in addition to any award payable based on the tournament game outcome. The award may be non-credit prizes redeemed in various ways such as printing a coupon at the player machine. | 03-14-2013 |
20130065693 | MULTI-SITE TOURNAMENT GAMING METHOD AND SYSTEM - A multi-site tournament gaming system and method are disclosed wherein multiple casino operators are engaged to initiate a series of player qualifying events and to hold a multi-session tournament of the qualified players to determine the site winners; and, a final tournament is operated wherein the site winners are provided prizes and compete to be named the ultimate champion. | 03-14-2013 |
20130116031 | CONVERTIBLE IN-REVENUE AND OUT-OF-REVENUE GAMING SYSTEM AND METHOD WITH A REAL-TIME PLAYER DASHBOARD DISPLAY - A convertible in-revenue and out-of-revenue gaming system is disclosed that includes a server connected to automatically convert operating modes and control in-revenue and out-of-revenue operation of one or more banks of gaming machines wherein each of the gaming machines includes a video camera connected to capture live player video feed during competition or tournament operating mode, and each of the gaming machines is operable to display a tournament game presentation simultaneously with a player dashboard. The player dashboard includes a display of the live player video, the player position, the player score, and remaining time in the competition or tournament. | 05-09-2013 |
20130281197 | CONVERTIBLE IN-REVENUE AND OUT-OF-REVENUE GAMING SYSTEM AND METHOD WITH A REAL-TIME STREAMING VIDEO FEED AND DISPLAY - A convertible in-revenue and out-of-revenue gaming system is disclosed that includes a server connected to automatically convert operating modes and control in-revenue and out-of-revenue operation of one or more banks of gaming machines. Additionally disclosed are gaming machines with video cameras connected to provide live video feed to one or more displays, such as during tournament play when live video feed of the players and the player tournament positions may be driven in real-time to an overhead display by the server operating in a tournament controller mode. | 10-24-2013 |
20140148250 | Multi-Site Tournament Gaming Method and System - A multi-site tournament gaming system and method are disclosed wherein multiple casino operators are engaged to initiate a series of player qualifying events and to hold a multi-session tournament of the qualified players to determine the site winners; and, a final tournament is operated wherein the site winners are provided prizes and compete to be named the ultimate champion. | 05-29-2014 |
20140162787 | Tournament Gaming System and Method with a Bulk Reader - A tournament gaming system includes a control center and user interface connected to operate a tournament program with menu-driven selectable parameters enabling a user to program, initiate, and operate one or more tournaments in a gaming system. The user interface further includes a bulk data reader for populating a tournament player database and/or enrolling players in one or more tournaments. | 06-12-2014 |
Patent application number | Description | Published |
20090005333 | REDUCING CULLING IN HERD ANIMALS GROWTH HORMONE RELEASING HORMONE (GHRH) - One aspect of the current invention is a method of decreasing an involuntary cull rate in farm animals, wherein the involuntary cull results from infection, disease, morbidity, or mortality. Additionally, milk production, animal welfare, and body condition scores are improved by utilizing methodology that administers the isolated nucleic acid expression construct encoding a GHRH or functional biological equivalent to an animal through a parenteral route of administration. Following a single dose of nucleic acid expression vector, animals are healthier and effects are demonstrated long term without additional administration(s) of the expression construct. | 01-01-2009 |
20090117206 | Preservative and Additive for Food and Feed - A preservative and additive for food and feed. One aspect of the invention concerns various acidified clays and minerals as food or feed additive to kill, or inhibit the growth of, harmful microorganisms and to inactivate mycotoxins, such as aflatoxins, present as contaminants in human foods and animal feeds. Another aspect of the present invention relates to a clay of hydrated sodium calcium aluminosilicate with relatively uniform particle size distribution. | 05-07-2009 |
20090170748 | Plasmid mediated supplementation for treating chronically ill subjects - The present invention pertains to compositions and methods for plasmid-mediated supplementation. The compositions and methods are useful for treating anemia and other effects that are commonly associated in cancer bearing animals. Overall, the embodiments of the invention can be accomplished by delivering an effective amount of a nucleic acid expression construct that encodes a GHRH or functional biological equivalent thereof into a tissue of an animal and allowing expression of the encoded gene in the animal. For example, when such a nucleic acid sequence is delivered into the specific cells of the animal tissue specific constitutive expression is achieved. | 07-02-2009 |
20160073662 | PRESERVATIVE AND ADDITIVE FOR FOOD AND FEED - A preservative and additive for food and feed. One aspect of the invention concerns various acidified clays and minerals as food or feed additive to kill, or inhibit the growth of, harmful microorganisms and to inactivate mycotoxins, such as aflatoxins, present as contaminants in human foods and animal feeds. Another aspect of the present invention relates to a clay of hydrated sodium calcium aluminosilicate with relatively uniform particle size distribution. | 03-17-2016 |
Patent application number | Description | Published |
20080238009 | VOIP CAPABILITIES FOR MEDIA ENHANCED SHOPPING SYSTEMS - A media enhanced shopping cart system comprises a shopping cart comprising a frame, a basket, a handle, a base tray, a plurality of wheels, a read component for performing a proximity scan of the shopping cart, a locationing component for determining a location of the shopping cart within a store based on the scan, and a display component for displaying at least one advertisement for a product based on the location of the shopping cart within the store, wherein the locationing component is further operable to determine a location of the product within the store relative to the shopping cart based on the scan, and wherein the display component is further operable to display an indication of the location of the advertised product relative to the location of the shopping cart. | 10-02-2008 |
20080238615 | MEDIA ENHANCED SHOPPING SYSTEMS WITH ELECTRONIC QUEUING - A media enhanced shopping cart system comprises a shopping cart comprising a frame, a basket, a handle, a base tray, a plurality of wheels, a read component for performing a proximity scan of the shopping cart, a locationing component for determining a location of the shopping cart within a store based on the scan, and a display component for displaying at least one advertisement for a product based on the location of the shopping cart within the store, wherein the locationing component is further operable to determine a location of the product within the store relative to the shopping cart based on the scan, and wherein the display component is further operable to display an indication of the location of the advertised product relative to the location of the shopping cart. | 10-02-2008 |
20150073899 | Media Enhanced Shopping Systems with Data Mining Functionalities - A media enhanced shopping cart system comprises a shopping cart, a locationing component, and a display component for displaying at least one advertisement for a product based on the location of the shopping cart within the store, wherein the locationing component is further operable to determine a location of the product within the store relative to the shopping cart, and wherein the display component is further operable to display an indication of the location of the advertised product relative to the location of the shopping cart. | 03-12-2015 |